SanDisk SSD UATA 5000 1.8" User manual

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Analysis & Simulation Ltd.
Thermal Analysis
SSD UATA 5000 1.8”
with ZIF connector
"Flash Disk Module"
For:
SanDisk
October 2006
(Ref: w06e048b.doc)

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Table of contents
ABSTRACT
1 SCOPE................................................................................................................................4
2 APPLICABLE DOCUMENTS ..........................................................................................4
3 THE FLASH DISK DESCRIPTION .................................................................................4
3.1 THE FLASH DISK DESCRIPTION.............................................................................................................. 4
4 BOUNDARY CONDITION AND ASSUMPTIONS......................................................10
4.1 BOUNDARY CONDITION....................................................................................................................... 10
4.2 MATERIALS ......................................................................................................................................... 10
5 THE THERMAL MODEL............................................................................................... 11
5.1 CFD AND FINITE VOLUME MODEL ..................................................................................................... 11
5.2 THE THERMAL MODEL STRUCTURE .................................................................................................... 12
6 ANALYSIS RESULTS ....................................................................................................17
7 CONCLUSIONS ..............................................................................................................23

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Abstract
The document summarizes thermal analysis for the mSSD UATA 5000 1.8” CG with
ZIF connector - "Flash Disk Module"
The main aim is to check whether the current design meets thermal design requirements.
The analysis results are temperatures distribution figures and components case and
junction temperatures.
The analysis results shows that all the components checked, are below the maximum
allowable temperatures based on the thermal demand Twell=70 oC

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1Scope
The document summarized thermal analysis for the "Flash Disc module", based on the
customer design data.
It includes the base design data, description of the thermal model, the solution process
and graphical and numerical representation of the results (temperature distribution and
components case and junction temperatures).
2Applicable Documents
1. J. P. Holman ,Heat Transfer, McGraw Hill, 1989.
2. D. S. Steinberg, Cooling Techniques for Electronic Equipment, Wily Inter
Science, 1980.
3. Kraus A. D. and Bar-Cohen A., Thermal Analysis and Control of
Electronic Equipment, McGraw Hill, 1983.
4. Coolit user manual, DAAT Crop., 2005.
3The Flash Disk Description
3.1 The Flash Disk description
The Flash disk module is built from a plastic structure. At the 2 side mounted 2
PCBs : the Memory PCB and the CPU PCB.
The structure is covered by two stainless steel covers connected by 4 screws.
The "sandwich" structure contains thermal pad between the 2 PCBs and between
the Memory PCB and the cover.

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Table 3.1-1: Power dissipations
Component
Name
Designation
Number Quantity
Power
Total
Power
[W] [W]
1 Flash U5-U12, U105-U112
16 0.04 0.64
2 E3 U3 1 0.162 0.162
3 TI-transceiver U1-U4, U101-U104 8 0.0025 0.02
4 DC-DC U2 1 0.006 0.010
5 Oscillator Y1 1 0.018 0.018
TOTAL 0.850
Notes:
a. Flash, transceiver and E3 are working in 100% duty-cycle in high performance .
Figure 3.1-1: The general mechanical description – top side

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Figure 3.1-2: The general mechanical description – Bottom side
Figure 3.1-3: The Memory card (PS) from bottom side

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Figure 3.1-4: The CPU card ( CS) from bottom side
Figure 3.1-5: The CPU card pad from top side

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Figure 3.1-6: The CPU card (PS) from top side
Figure 3.1-7: The memory card CS and PS placement

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Figure 3.1-8: The CPU card CS and PS placement

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4Boundary Condition and Assumptions
4.1 Boundary condition
Boundary conditions:
•Temperature : Tw=70 oC (measured on the top-cover, at the
center.)
•Altitude : 3048m
4.2 Materials
•body - Plastic: K=0.29 W/m C
•Covers - stainless-steel K=37 W/m C
•Thermal Pad ( T-global H48-2) K=2 W/m C

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5The Thermal Model
5.1 CFD and Finite Volume Model
The models were solved with Coolit a CFD (Computational Fluid Dynamics) finite
volume, object oriented software.
CFD software is a general technique for modeling and solving the fluid flow and heat
transfer; Coolit specializes in electronic packaging equipment. CFD is the only
technology, which provides correctly, coupled and non-linear modeling of convection,
conduction, and radiation in electronic systems.
The Coolit model is built from an enclosure, which represents the mathematical control
volume. This volume is divided to a finite volume number, for which all the 5 coupled
mathematical equations are solved. The solution of those equations gives the
temperature field, the air velocity field, and the pressure field for every cell (finite
volume) in the enclosure.
The model includes packed objects (such as fans, vents, porous volumes, heat
generation sources etc.) that are placed as part of the model. The software uses the
mathematical equation of those objects in the solution of the model.
The thermal analysis was implemented by building the module body and to the internal
PCBs and components. The power was distributed at each of the different components,
based on the customer data

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5.2 The Thermal Model Structure
Figure 5.2-1: The thermal model - general isometric view – from top
Figure 5.2-2: The CPU card PS side and the Mylar layer – view from top side

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Figure 5.2-3: The CPU card PS side – view from top side
Figure 5.2-4: The Memory card CS and the plastic frame – view from top side
(CPU card hidden)

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Figure 5.2-5: The Memory card CS– view from top side
(CPU card and plastic frame are hidden)
Figure 5.2-6: The thermal model - general isometric view – from bottom

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Figure 5.2-7: The Memory card PS and the thermal Pad – view from bottom side
Figure 5.2-8: The Memory card PS – view from bottom side

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Figure 5.2-9: The CPU card CS and thermal Pad – view from bottom side
Figure 5.2-10: The CPU card CS and the plastic frame – view from bottom side

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6Analysis Results
The analysis results are shown in this paragraph. Each figure shows the
temperature distribution in 0C, the legends shows the different temperatures .
Figure 6.1-1: Temperature distribution – isometric view – Top side

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Figure 6.1-2: Temperature distribution – isometric view – bottom side

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Figure 6.1-3: Temperature distribution – isometric view – Memory card CS

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Figure 6.1-4: Temperature distribution – isometric view – Memory card PS