Seco Qseven Q7-B03 User manual

Q7-B03
Qseven®Rel. 2.1 Compliant Module
with the Intel®Atom E39xx family, Intel®Celeron®
N3350 and Intel®Pentium®N4200 (formerly code
name Apollo Lake) SoCs

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All rights reserved. All information contained in this manual is proprietary and confidential material of SECO S.r.l.
Unauthorised use, duplication, modification or disclosure of the information to a third-party by any means without prior consent of SECO S.r.l. is prohibited.
Every effort has been made to ensure the accuracy of this manual. However, SECO S.r.l. accepts no responsibility for any inaccuracies, errors or omissions herein.
SECO S.r.l. reserves the right to change precise specifications without prior notice to supply the best product possible.
For further information on this module or other SECO products, but also to get the required assistance for any and possible issues, please contact us using the
dedicated web form available at http://www.seco.com (registration required).
Our team is ready to assist.
Revision
Date
Note
Rif
1.0
15th September 2017
First Official Release
SB
1.1
20th October 2017
Minor corrections
S-ATA example schematics added
Pull-up resistor added in PCIe-WAKE# signal specification, Pull-up value
changed for GP0_I2C, PWR_BTN# and RST_BTN# signals
SB
REVISION HISTORY

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INDEX
INTRODUCTION.......................................................................................................................................................................... 5Chapter 1.
1.1 Warranty........................................................................................................................................................................................................................................ 6
1.2 Information and assistance............................................................................................................................................................................................................. 7
1.3 RMA number request..................................................................................................................................................................................................................... 7
1.4 Safety............................................................................................................................................................................................................................................ 8
1.5 Electrostatic Discharges.................................................................................................................................................................................................................8
1.6 RoHS compliance..........................................................................................................................................................................................................................8
1.7 Terminology and definitions ............................................................................................................................................................................................................9
1.8 Reference specifications ..............................................................................................................................................................................................................11
OVERVIEW ............................................................................................................................................................................... 13Chapter 2.
2.1 Introduction..................................................................................................................................................................................................................................14
2.2 Technical Specifications...............................................................................................................................................................................................................15
2.3 Electrical Specifications................................................................................................................................................................................................................16
2.3.1 Power Rails meanings.......................................................................................................................................................................................................... 16
2.3.2 Power Consumption ............................................................................................................................................................................................................16
2.4 Mechanical Specifications............................................................................................................................................................................................................18
2.5 Block Diagram .............................................................................................................................................................................................................................19
CONNECTORS......................................................................................................................................................................... 20Chapter 3.
3.1 Introduction..................................................................................................................................................................................................................................21
3.2 Connectors description................................................................................................................................................................................................................22
3.2.1 Qseven®Connector............................................................................................................................................................................................................. 22
BIOS SETUP............................................................................................................................................................................. 44Chapter 4.
4.1 Aptio setup Utility .........................................................................................................................................................................................................................45
4.2 Main setup menu.........................................................................................................................................................................................................................46
4.2.1 System Date / System Time.................................................................................................................................................................................................46
4.3 Advanced menu ..........................................................................................................................................................................................................................47
4.3.1 Intel®I210 Gigabit Network Connection - MAC Address #1 submenu....................................................................................................................................47
4.3.2 Trusted computing submenu................................................................................................................................................................................................48
4.3.3 ACPI Settings ...................................................................................................................................................................................................................... 49

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4.3.4 Serial Port Console Redirection submenu .............................................................................................................................................................................49
4.3.5 CPU Configuration submenu................................................................................................................................................................................................51
4.3.6 AMI graphic Output Protocol Policy submenu........................................................................................................................................................................52
4.3.7 Network Stack configuration submenu..................................................................................................................................................................................52
4.3.8 CSM configuration submenu................................................................................................................................................................................................ 53
4.3.9 NVMe configuration submenu............................................................................................................................................................................................... 53
4.3.10 SDIO configuration submenu................................................................................................................................................................................................53
4.3.11 LVDS Configuration submenu...............................................................................................................................................................................................54
4.3.12 SuperI/O configuration submenu ..........................................................................................................................................................................................55
4.3.13 USB configuration submenu.................................................................................................................................................................................................56
4.3.14 Platform Trust technology submenu......................................................................................................................................................................................56
4.3.15 Embedded Controller submenu............................................................................................................................................................................................57
4.3.16 Thermal submenu................................................................................................................................................................................................................58
4.4 Chipset menu..............................................................................................................................................................................................................................59
4.4.1 South Bridge submenu ........................................................................................................................................................................................................ 59
4.4.2 Uncore Configuration submenu............................................................................................................................................................................................60
4.4.3 South Cluster Configuration submenu................................................................................................................................................................................... 61
4.5 Security menu..............................................................................................................................................................................................................................67
4.5.1 Secure Boot submenu......................................................................................................................................................................................................... 67
4.6 Boot menu ..................................................................................................................................................................................................................................69
4.7 Save & Exit menu......................................................................................................................................................................................................................... 70
Appendices.............................................................................................................................................................................. 71Chapter 5.
5.1 Thermal Design............................................................................................................................................................................................................................72

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Chapter 1.
Warranty
Information and assistance
RMA number request
Safety
Electrostatic Discharges
RoHS compliance
Terminology and definitions
Reference specifications

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1.1Warranty
This product is subject to the Italian Law Decree 24/2002, acting European Directive 1999/44/CE on matters of sale and warranties to consumers.
The warranty on this product lasts 1 year.
Under the warranty period, the Supplier guarantees the buyer assistance and service for repairing, replacing or credit of the item, at the Supplier’s own discretion.
Shipping costs that apply to non-conforming items or items that need replacement are to be paid by the customer.
Items cannot be returned unless previously authorised by the supplier.
The authorisation is released after completing the specific form available on the web-site http://www.seco.com/en/prerma (RMA Online). The RMA authorisation
number must be put both on the packaging and on the documents shipped with the items, which must include all the accessories in their original packaging, with
no signs of damage to, or tampering with, any returned item.
The error analysis form identifying the fault type must be completed by the customer and must accompany the returned item.
If any of the above mentioned requirements for RMA is not satisfied, the item will be shipped back and the customer will have to pay any and all shipping costs.
Following a technical analysis, the supplier will verify if all the requirements for which a warranty service applies are met. If the warranty cannot be applied, the
Supplier will calculate the minimum cost of this initial analysis on the item and the repair costs. Costs for replaced components will be calculated separately.
Warning!
All changes or modifications to the equipment not explicitly approved by SECO S.r.l. could impair the equipment’s functionality and
could void the warranty

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1.2Information and assistance
What do I have to do if the product is faulty?
SECO S.r.l. offers the following services:
SECO website: visit http://www.seco.com to receive the latest information on the product. In most of the cases it is possible to find useful information to
solve the problem.
SECO Sales Representative: the Sales Rep can help to determine the exact cause of the problem and search for the best solution.
SECO Help-Desk: contact SECO Technical Assistance. A technician is at disposal to understand the exact origin of the problem and suggest the correct
solution. E-mail: technical.se[email protected]
Fax [phone]
Repair centre: it is possible to send the faulty product to the SECO Repair Centre. In this case, follow this procedure:
oReturned items must be accompanied by a RMA Number. Items sent without the RMA number will be not accepted.
oReturned items must be shipped in an appropriate package. SECO is not responsible for damages caused by accidental drop, improper usage, or
customer neglect.
Note: Please have the following information before asking for technical assistance:
-Name and serial number of the product;
-Description of Customer’s peripheral connections;
-Description of Customer’s software (operating system, version, application software, etc.);
-A complete description of the problem;
-The exact words of every kind of error message encountered.
1.3RMA number request
To request a RMA number, please visit SECO’s web-site. On the home page, please select “RMA Online”and follow the procedure described.
A RMA Number will be sent within 1 working day (only for on-line RMA requests).

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Whenever handling a Q7-B03 module, ground yourself through an anti-static wrist strap. Placement of the board on an anti-static
surface is also highly recommended.
1.4Safety
The Q7-B03 module uses only extremely-low voltages.
While handling the board, please use extreme caution to avoid any kind of risk or damages to electronic components.
1.5 Electrostatic Discharges
The Q7-B03 module, like any other electronic product, is an electrostatic sensitive device: high voltages caused by static electricity could damage some or all the
devices and/or components on-board.
1.6 RoHS compliance
The Q7-B03 module is designed using RoHS compliant components and is manufactured on a lead-free production line. It is therefore fully RoHS compliant.
Always switch the power off, and unplug the power supply unit, before handling the board and/or connecting cables or other boards.
Avoid using metallic components - like paper clips, screws and similar - near the board when connected to a power supply, to avoid
short circuits due to unwanted contacts with other board components.
If the board has become wet, never connect it to any external power supply unit or battery.
Check carefully that all cables are correctly connected and that they are not damaged.

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1.7 Terminology and definitions
ACPI Advanced Configuration and Power Interface, an open industrial standard for the board’s devices configuration and power management
AHCI Advanced Host Controller Interface, a standard which defines the operation modes of SATA interface
API Application Program Interface, a set of commands and functions that can be used by programmers for writing software for specific Operating
Systems
BIOS Basic Input / Output System, the Firmware Interface that initializes the board before the OS starts loading
CEC Consumer Electronics Control, an HDMI feature which allows controlling more devices connected together by using only one remote control
CRT Cathode Ray Tube. Initially used to indicate a type of monitor, this acronym has been used over time to indicate the analog video interface used
to drive them.
DDC Display Data Channel, a kind of I2C interface for digital communication between displays and graphics processing units (GPU)
DDR Double Data Rate, a typology of memory devices which transfer data both on the rising and on the falling edge of the clock
DDR3 DDR, 3rd generation
DP Display Port, a type of digital video display interface
DVI Digital Visual interface, a type of digital video display interface
eDP embedded Display Port, a type of digital video display interface developed especially for internal connections between boards and digital displays
EHCI Enhanced Host Controller interface, a high-speed controller for USB ports, able to support USB2.0 standard
GbE Gigabit Ethernet
Gbps Gigabits per second
GND Ground
GPI/O General purpose Input/Output
HD Audio High Definition Audio, most recent standard for hardware codecs developed by Intel®in 2004 for higher audio quality
HDMI High Definition Multimedia Interface, a digital audio and video interface
I2C Bus Inter-Integrated Circuit Bus, a simple serial bus consisting only of data and clock line, with multi-master capability
JTAG Joint Test Action Group, common name of IEEE1149.1 standard for testing printed circuit boards and integrated circuits through the Debug port
LPC Bus Low Pin Count Bus, a low speed interface based on a very restricted number of signals, deemed to management of legacy peripherals
LVDS Low Voltage Differential Signalling, a standard for transferring data at very high speed using inexpensive twisted pairs copper cables, usually used
for video applications
MAC Medium Access Controller, the hardware implementing the Data Link Layer of ISO/OSI-7 model for communication systems
Mbps Megabits per second

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MMC/eMMC MultiMedia Card / embedded MMC, a type of memory card having the same interface of SD cards. The eMMC is the embedded version of the
MMC. They are devices that incorporate both the memory controller and the flash memories on a single BGA chip.
N.A. Not Applicable
N.C. Not Connected
OpenCL Open Computing Language, a software library based on C99 programming language, conceived explicitly to realise parallel computing using
Graphics Processing Units (GPU)
OpenGL Open Graphics Library, an Open Source API dedicated to 2D and 3D graphics
OS Operating System
PCI-e Peripheral Component Interface Express
PHY Abbreviation of Physical, it is the device implementing the Physical Layer of ISO/OSI-7 model for communication systems
PSU Power Supply Unit
PWM Pulse Width Modulation
PWR Power
PXE Preboot Execution Environment, a way to perform the boot from the network ignoring local data storage devices and/or the installed OS
SATA Serial Advance Technology Attachment, a differential half duplex serial interface for Hard Disks
SD Secure Digital, a memory card type
SDHC Secure Digital Host Controller or Secure Digital High Capacity
SM Bus System Management Bus, a subset of the I2C bus protocol dedicated to communication with devices for system management, like a smart
battery and other power supply-related devices
SPI Serial Peripheral Interface, a 4-Wire synchronous full-duplex serial interface which is composed of a master and one or more slaves, individually
enabled through a Chip Select line
TBM To be measured
TMDS Transition-Minimized Differential Signaling, a method for transmitting high speed serial data, normally used on DVI and HDMI interfaces
TTL Transistor-transistor Logic
UEFI Unified Extensible Firmware Interface, a specification defining the interface between the OS and the board’s firmware. It is meant to replace the
original BIOS interface
USB Universal Serial Bus
V_REF Voltage reference Pin
VGA Video Graphics Array. An analog computer display standard, commonly referred to also as CRT.
xHCI eXtensible Host Controller Interface, Host controller for USB 3.0 ports, which can also manage USB 2.0 and USB1.1 ports

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1.8 Reference specifications
Here below it is a list of applicable industry specifications and reference documents.
Reference
Link
ACPI
http://www.acpi.info
AHCI
http://www.intel.com/content/www/us/en/io/serial-ata/ahci.html
DDC
http://www.vesa.org
DP, eDP
http://www.vesa.org
Gigabit Ethernet
http://standards.ieee.org/about/get/802/802.3.html
HD Audio
http://www.intel.com/content/dam/www/public/us/en/documents/product-specifications/high-definition-audio-specification.pdf
HDMI
http://www.hdmi.org/index.aspx
I2C
http://www.nxp.com/documents/other/UM10204_v5.pdf
JTAG
http://standards.ieee.org/develop/wg/Boundary_Scan_Architecture.html
LPC Bus
http://www.intel.com/design/chipsets/industry/lpc.htm
LVDS
http://www.ti.com/ww/en/analog/interface/lvds.shtml
http://www.ti.com/lit/ml/snla187/snla187.pdf
MMC/eMMC
http://www.jedec.org/committees/jc-649
OpenCL
http://www.khronos.org/opencl
OpenGL
http://www.opengl.org
PCI Express
http://www.pcisig.com/specifications/pciexpress
Qseven®Design Guide
https://www.sget.org/fileadmin/_migrated/content_uploads/Qseven_Design_Guide_2_0.pdf
Qseven®specifications
https://www.sget.org/fileadmin/file_management/SDT02/Qseven-Spec_2.1.pdf
SATA
https://www.sata-io.org
SD Card
https://www.sdcard.org/home
SM Bus
http://www.smbus.org/specs
TMDS
http://www.siliconimage.com/technologies/tmds

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UEFI
http://www.uefi.org
USB 2.0 and USB OTG
http://www.usb.org/developers/docs/usb_20_070113.zip
USB 3.0
http://www.usb.org/developers/docs/usb_30_spec_070113.zip
Intel®Atom , Pentium ®and Celeron®
Apollo Lake family
http://ark.intel.com/products/codename/80644/Apollo-Lake#@Embedded

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Chapter 2.
Introduction
Technical Specifications
Electrical Specifications
Mechanical Specifications
Block Diagram

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2.1Introduction
Q7-B03 is a CPU module, in Qseven®format, based on the Intel®Atom , Pentium®and Celeron®family of System-on-Chips (SOCs) formerly coded as Apollo
Lake, a series of Single/ Dual / Quad SOCs with 64-bit instruction set.
These SOCs embed all the features usually obtained by combination of CPU + platform Controller hubs, all in one single IC, which allows, therefore, the system
minimisation and performance optimisation, which is essential for boards with sizes so reduced as for Qseven®boards, which offers all functionalities of standard
PC boards in just 70x70mm.
The board is also available in EXTREME configuration, with all the components mounted onboard certified for industrial temperature ranges (this configuration is not
available with the Celeron®processors).
The embedded memory controller allows the integration of up to 8GB of DDR3L Memory directly soldered onboard, speed up to 1866MHz.
All SOCs embed an Intel®HD Graphics 500 series controller, which offer high graphical performances, with support for Microsoft® DirectX12, OpenGL 4.3,
OpenCL 1.2, OpenGLES 3.0 and HW acceleration for video encoding and decoding of HEVC (H.265), H.264, JPEG/MJPEG. It is also possible the HW video
decoding only of VP9, MPEG2, VC-1 and WMV9.
This embedded GPU is able to drive two independent displays, by using the interfaces available on Qseven®golden finger connector: eDP or LVDS (factory
alternatives), HDMI or DP++ (factory alternatives).
Mass Storage capabilities of the board include two external S-ATA Gen3 channels, a standard 4-bit SD interface and one optional eMMC Drive soldered on board.
Other than the interfaces already discussed previously, on Qseven®golden finger connector there are the signals necessary for the implementation of Gigabit
Ethernet, two USB 3.0 ports, 6 x USB 2.0 ports, 3 x PCI-Express x 1 lanes, HD Audio interface, I2C, SPI, LPC and SM buses, UART interface.
Interfacing to the board comes through a single card edge connector, whose pinout is defined by Qseven®specifications Rel.2.1. For external interfacing to
standard devices, a carrier board with a 230-pin MXM connector is needed. This board will implement all the routing of the interface signals to external standard
connectors, as well as integration of other peripherals/devices not already included in Q7-B03 CPU module.
Please refer to following chapter for a complete list of all peripherals integrated and characteristics.

2.2Technical Specifications
System-On-Chips
Intel®Atom x7-E3950, Quad Core @1.6GHz, 2MB L2 Cache, 12W TDP
Intel®Atom x5-E3940, Quad Core @1.6GHz, 2MB L2 Cache, 9.5W TDP
Intel®Atom x5-E3930, Dual Core @1.3GHz, 2MB L2Cache, 6.5W TDP
Intel®Pentium®N4200, Quad Core @1.1GHz, 2MB L2 Cache, 6W TDP
Intel®Celeron®N3350, Dual Core @1.1GHz, 2MB L2Cache, 6W TDP
Memory
Dual Channel Soldered Down DDR3L-1866 memory, up to 8GB
Graphics
Integrated Intel®HD Graphics 500 series (Gen9 LP) controller with 18 Execution
Units
Dual independent display support
4K HW decoding and encoding of HEVC(H.265), H.264, VP8, MVC
Video Interfaces
HDMI or Multimode Display Port (DP++) interface
Embedded Display Port or 18/24 bit dual channel LVDS interface
Video Resolutions
HDMI, eDP: Up to 3840x2160 (4K)
DP++: Up to 4096x2160
LVDS: Up to 1920x1200
Mass Storage
2 x external S-ATA Gen3 channels
SD interface
Optional eMMC Drive soldered onboard
USB
2 x USB 3.0 Host Port
6 x USB2.0 Host ports
Networking
Gigabit Ethernet interface
Intel®I210 or I211 Controller (MAC + PHY)
Audio
HD Audio interface
PCI Express
4 x PCI-e x1 root ports (including the PCI-e port used for Gigabit Ethernet
controller)
Serial Ports
1 x UART (TTL interface)
Other Interfaces
I2C bus
LPC Bus
SM Bus
SPI interface
Watchdog Timer
Thermal / FAN management
Power Management Signals
Power supply voltage: +5VDC and +5VSB (optional)
Operating temperature: 0°C ÷ +60°C (commercial version) **
-40°C ÷ +85°C (industrial version) **
Dimensions: 70 x70 mm (2.76”x 2.76”)
** Temperatures indicated are the minimum and maximum temperature that
the heatspreader / heatsink can reach in any of its parts. This means that it is
customer ’
s responsibility to use any passive cooling solution along with an
application-dependent cooling system, capable to ensure that the
heatspreader / heatsink temperature remains in the range above indicated.
Please also check paragraph 5.1

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2.3Electrical Specifications
According to Qseven®specifications, Q7-B03 board needs to be supplied only with an external +5VDC power supply.
5Volts standby voltage needs to be supplied to allow Suspend to RAM and Soft Off functionalities in ATX mode.
For Real Time Clock working and CMOS memory data retention, it is also needed a backup battery voltage. All these voltages are supplied directly through card
edge fingers (see connector’s pinout).
All remaining voltages needed for board’s working are generated internally from +5V_S power rail.
2.3.1 Power Rails meanings
In all the tables contained in this manual, Power rails are named with the following meaning:
_S: Switched voltages, i.e. power rails that are active only when the board is in ACPI’s S0 (Working) state. Examples: +3.3V_S, +5V_S.
_A: Always-on voltages, i.e. power rails that are active both in ACPI’s S0 (Working), S3 (Standby) and S5 (Soft Off) state. Examples: +5V_A, +3.3V_A.
_U: unswitched ACPI S3 voltages, i.e. power rails that are active both in ACPI’s S0 (Working) and S3 (Standby) state. Examples: +1.5V_U
2.3.2 Power Consumption
Q7-B03 module, like all Qseven®modules, needs a carrier board for its normal working. All connections with the external world come through this carrier board,
which provide also the required voltage to the board, deriving it from its power supply source.
Anyway, power consumption has been measured on +5V_S power rail that supplies the board. For this reason, the values indicated in the table below are real
average power consumptions of the board, and are independent from those of the peripherals connected to the Carrier Board.
Power consumption in Suspend and Soft-Off States have been measured on +5V_A power rail. RTC power consumption has been measured on carrier board’s
backup battery when the system is not powered.
The current consumptions, written in the table of this page, have been measured using the following setups:
Intel®Atom x5-E3930 SoC, 4GB DDR3L, 32GB eMMC soldered onboard
Intel®Atom x5-E3940 SoC, 4GB DDR3L, 32GB eMMC soldered onboard
Intel®Atom x7-E3950 SoC, 4GB DDR3L, 32GB eMMC soldered on-board
Intel®Pentium®N4200 SoC, 8GB DDR3L, 32GB eMMC soldered onboard
Intel®Celeron®N3350 SoC, 8GB DDR3L, 32GB eMMC soldered onboard
O.S. Windows 10 64-bit
Bios 1.00 RC09
USB Mouse and Keyboard connected
HDMI Display connected

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Status
SOC
x5-E3930
x5-E3940
x7-E3950
N4200
N3350
Average
Peak
Average
Peak
Average
Peak
Average
Peak
Average
Peak
Idle, power saving configuration
0.316A
0.678A
0.342A
0.914A
0.449A
1.030A
0.320A
0.914A
0.319A
0.674A
OS Boot, power saving configuration
1.032A
2.194A
1.077A
2.357A
1.042A
2.312A
1.128A
3.036A
1.168A
2.870A
Video reproduction@720p, power saving configuration
0.604A
1.048A
0.589A
0.966A
0.830A
1.875A
0.782A
1.52A
0.656A
1.195A
Video reproduction@1080p, power saving configuration
0.523A
1.003A
0.786A
1.394A
0.807A
1.662A
0.908A
1.876A
0.918A
1.947A
Video reproduction@4K, power saving configuration
0.942A
1.523A
1.033A
1.629A
0.929A
1.790A
1.443A
2.301A
0.815A
1.603A
Internal Stress Test Tool, maximum performance
2.315A
2.534A
3.203A
3.395A
4.621A
5.007A
5.389A
5.953A
3.635A
3.873A
Suspend to RAM (typical)
55mA
Soft Off (typical)
40.6mA
RTC Power consumption (typical)

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2.4 Mechanical Specifications
According to Qseven®specifications, board dimensions are: 70 x 70 mm (2.76”x 2.76”).
Printed circuit of the board is made of twelve layers, some of them are ground planes, for
disturbance rejection.
The MXM connector accommodates various connector heights for different carrier board
applications needs. Qseven®specification suggests two connector heights, 7.8mm and
7.5mm, but it is also possible to use different connector heights, also remaining compliant
to the standard.
When using different connector heights, please consider that, according to Qseven®
specifications, components placed on bottom side of Q7-B03 will have a maximum height
of 2.2mm ± 0.1. Keep this value in mind when choosing the MXM connector’s height, if it is
needed to place components on the carrier board in the zone below the Qseven®module.

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Power management
2 x SATA
I2C
SPI
LPC Bus
HD Audio
SD interface
UART interface
HDMI or DP++
eDP or LVDS
Gigabit Ethernet
PCI-e interface
6 x USB 2.0 ports
STMicroelectronics
STM32F100R4
microcontroller
eMMC Drive
Intel®Apollo
Lake family
SOC
Intel®Ethernet
Controller I21x
DDR3L System
Memory
DDR3L System
Memory
DDI #0
Power section
+5V_S, +5V_A
External FAN interface
DDI #2
2 x USB 3.0 ports
SM Bus
PCI-e #4
FACTORY
ALTERNATIVES
PCI-e #0 ÷ 3
FACTORY
ALTERNATIVES
SATA #0 #1
NXP PTN3460 eDP-
to-LVDS bridge
2.5 Block Diagram

Q7-B03
Q7-B03 User Manual - Rev. First Edition: 1.0 - Last Edition: 1.1 - Author: S.B. - Reviewed by G.G. Copyright © 2017 SECO S.r.l.
20
Chapter 3.
Introduction
Connectors description