Seco Come-c55-ct6 User manual

COMe-C55

CT6

COM-Express Type 6 Module with the

Intel®8th generation Core and Celeron 4000CPUs

COMe-C55-CT6

Unauthorised use, duplication, modification or disclosure of the information to a third-party by any means without prior consent of SECO S.p.A. is prohibited.

Every effort has been made to ensure the accuracy of this manual. However, SECO S.p.A. accepts no responsibility for any inaccuracies, errors or omissions herein.

SECO S.p.A. reserves the right to change precise specifications without prior notice to supply the best product possible.

For further information on this module or other SECO products, but also to get the required assistance for any and possible issues, please contact us using the

dedicated web form available at http://www.seco.com (registration required).

Our team is ready to assist you.

Revision

Date

Note

Rif

1.0

25 May 2020

First Official Release

REVISION HISTORY

 
 COMe-C55-CT6 
COMe-C55-CT6 User Manual - Rev. First Edition: 1.0 - Last Edition: 1.0 - Author: S.B. - Reviewed by L.V. Copyright © 2020 SECO S.p.A. 

INDEX 
 INTRODUCTION.......................................................................................................................................................................... 4 
1 Warranty...............................................................................................................................................................................................................................5 
2 Information and assistance.....................................................................................................................................................................................................6 
3 RMA number request.............................................................................................................................................................................................................6 
4 Safety...................................................................................................................................................................................................................................7 
5 Electrostatic Discharges.........................................................................................................................................................................................................7 
6 RoHS compliance .................................................................................................................................................................................................................7 
7 Terminology and definitions ....................................................................................................................................................................................................8 
8 Reference specifications......................................................................................................................................................................................................10 
 OVERVIEW ................................................................................................................................................................................11 
1 Introduction.........................................................................................................................................................................................................................12 
2 Technical Specifications.......................................................................................................................................................................................................13 
3 Electrical Specifications........................................................................................................................................................................................................14 
3.1 Power Rails meanings..................................................................................................................................................................................................14 
3.2 Power Consumption ....................................................................................................................................................................................................14 
4 Mechanical Specifications....................................................................................................................................................................................................16 
5 Block Diagram.....................................................................................................................................................................................................................17 
 CONNECTORS..........................................................................................................................................................................18 
1 Introduction.........................................................................................................................................................................................................................19 
2 Connectors description........................................................................................................................................................................................................20 
2.1 FAN Connectors..........................................................................................................................................................................................................20 
2.2 SO-DIMM DDR4 Slots .................................................................................................................................................................................................20 
2.3 microSD Card Slot.......................................................................................................................................................................................................21 
2.4 BIOS Restore switch....................................................................................................................................................................................................21 
2.5 COM Express®Module connectors...............................................................................................................................................................................22 
2.6 BOOT Strap Signals.....................................................................................................................................................................................................47 
 Appendices ...............................................................................................................................................................................48 
1 Thermal Design...................................................................................................................................................................................................................49 
 
 

COMe-C55-CT6

•Warranty

•Information and assistance

•RMA number request

•Safety

•Electrostatic Discharges

•RoHS compliance

•Terminology and definitions

•Reference specifications

COMe-C55-CT6

1.1 Warranty

This product is subject to the Italian Law Decree 24/2002, acting European Directive 1999/44/CE on matters of sale and warranties to consumers.

The warranty on this product lasts 1 year.

Under the warranty period, the Supplier guarantees the buyer assistance and service for repairing, replacing or credit of the item, at the Supplier’s own discretion.

Shipping costs that apply to non-conforming items or items that need replacement are to be paid by the customer.

Items cannot be returned unless previously authorised by the supplier.

The authorisation is released after completing the specific form available on the web-site http://www.seco.com/en/prerma (RMA Online). The RMA authorisation

number must be put both on the packaging and on the documents shipped with the items, which must include all the accessories in their original packaging, with

no signs of damage to, or tampering with, any returned item.

The error analysis form identifying the fault type must be completed by the customer and must accompany the returned item.

If any of the above mentioned requirements for RMA is not satisfied, the item will be shipped back and the customer will have to pay any and all shipping costs.

Following a technical analysis, the supplier will verify if all the requirements for which a warranty service applies are met. If the warranty cannot be applied, the Supplier

will calculate the minimum cost of this initial analysis on the item and the repair costs. Costs for replaced components will be calculated separately.

Warning!

All changes or modifications to the equipment notexplicitly approved by SECO S.p.A. could impair the equipment and could void

the warranty

COMe-C55-CT6

1.2 Information and assistance

What do I have to do if the product is faulty?

SECO S.p.A. offers the following services:

•SECO website: visit http://www.seco.com to receive the latest information on the product. In most cases it is possible to find useful information to solve the

problem.

•SECO Sales Representative: the Sales Rep can help to determine the exact cause of the problem and search for the best solution.

•SECO Help-Desk: contact SECO Technical Assistance. A technician is at disposal to understand the exact origin of the problem and suggest the correct

solution. E-mail: technical.service@seco.com

Fax (+39) 0575 340434

•Repair centre: it is possible to send the faulty product to the SECO Repair Centre. In this case, follow this procedure:

oReturned items must be accompanied by a RMA Number. Items sent without the RMA number will be not accepted.

oReturned items must be shipped in an appropriate package. SECO is not responsible for damages caused by accidental drop, improper usage, or

customer neglect.

Note: Please have the following information before asking for technical assistance:

-Name and serial number of the product;

-Description of Customer’s peripheral connections;

-Description of Customer’s software (operating system, version, application software, etc.);

-A complete description of the problem;

-The exact words of every kind of error message encountered.

1.3 RMA number request

To request a RMA number, please visit SECO’s web-site. On the home page, please select “RMA Online”and follow the procedure described.

A RMA Number will be sent within 1 working day (only for on-line RMA requests).

COMe-C55-CT6

1.4 Safety

The COMe-C55-CT6 module uses only extremely-low voltages.

While handling the board, please use extreme caution to avoid any kind of risk or damages to electronic components.

1.5 Electrostatic Discharges

The COMe-C55-CT6 module, like any other electronic product, is an electrostatic sensitive device: high voltages caused by static electricity could damage some or

all the devices and/or components on-board.

1.6 RoHS compliance

The COMe-C55-CT6 module is designed using RoHS compliant components and is manufactured on a lead-free production line. It is therefore fully RoHS compliant.

Always switch the power off, and unplug the power supply unit, before handling the board and/or connecting cables or other boards.

Avoid using metallic components - like paper clips, screws and similar - near the board when connected to a power supply, to avoid

short circuits due to unwanted contacts with other board components.

If the board has become wet, never connect it to any external power supply unit or battery.

Check carefully that all cables are correctly connected and that they are not damaged.

Whenever handling a COMe-C55-CT6 module, ground yourself through an anti-static wrist strap. Placement of the board on an anti-

static surface is also highly recommended.

COMe-C55-CT6

1.7 Terminology and definitions

ACPI Advanced Configuration and Power Interface, an open industrial standard for the board’s devices configuration and power management

AHCI Advanced Host Controller Interface, a standard which defines the operation modes of SATA interface

API Application Program Interface, a set of commands and functions that can be used by programmers for writing software for specific Operating

Systems

BIOS Basic Input / Output System, the Firmware Interface that initializes the board before the OS starts loading

CRT Cathode Ray Tube. Initially used to indicate a type of monitor, this acronym has been used over time to indicate the analog video interface used to

drive them.

DDC Display Data Channel, a kind of I2C interface for digital communication between displays and graphics processing units (GPU)

DDR Double Data Rate, a typology of memory devices which transfer data both on the rising and on the falling edge of the clock

DDR4 DDR, 4th generation

DP Display Port, a type of digital video display interface

DVI Digital Visual interface, a type of digital video display interface

ECC Error Correcting Code, a peculiar type of memory module with 72-bit of data instead of 64, where the additional 8 bit are used to detect and correct

possible errors on the remaining 64-bit data bus

eDP embedded Display Port, a type of digital video display interface specifically developed for the internal connections between boards and digital

displays

GbE Gigabit Ethernet

Gbps Gigabits per second

GND Ground

GPI/O General purpose Input/Output

HD Audio High Definition Audio, most recent standard for hardware codecs developed by Intel®in 2004 for higher audio quality

HDMI High Definition Multimedia Interface, a digital audio and video interface

I2C Bus Inter-Integrated Circuit Bus, a simple serial bus consisting only of data and clock line, with multi-master capability

LPC Bus Low Pin Count Bus, a low speed interface based on a very restricted number of signals, deemed to management of legacy peripherals

LVDS Low Voltage Differential Signaling, a standard for transferring data at very high speed using inexpensive twisted pair copper cables, usually used

for video applications

Mbps Megabits per second

N.A. Not Applicable

N.C. Not Connected

COMe-C55-CT6

OS Operating System

OTG On-the-Go, a specification that allows to USB devices to act indifferently as Host or as a Client, depending on the device connected to the port

PCH Platform Controller Hub

PCI-e Peripheral Component Interface Express

PSU Power Supply Unit

PWM Pulse Width Modulation

PWR Power

PXE Preboot Execution Environment, a way to perform the boot from the network ignoring local data storage devices and/or the installed OS

SATA Serial Advance Technology Attachment, a differential half duplex serial interface for Hard Disks

SD Secure Digital, a memory card type

SDIO Secure Digital Input/Output, an evolution of the SD standard that allows the use of the same SD interface to drive different Input/Output devices,

like cameras, GPS, Tuners and so on

SM Bus System Management Bus, a subset of the I2C bus dedicated to communication with devices for system management, like a smart battery and

other power supply-related devices

SPI Serial Peripheral Interface, a 4-Wire synchronous full-duplex serial interface which is composed of a master and one or more slaves, individually

enabled through a Chip Select line

TBM To be measured

TMDS Transition-Minimized Differential Signaling, a method for transmitting high speed serial data, normally used on DVI and HDMI interfaces

TTL Transistor-transistor Logic

UEFI Unified Extensible Firmware Interface, a specification defining the interface between the OS and the board’s firmware. It is meant to replace the

original BIOS interface

USB Universal Serial Bus

V_REF Voltage reference Pin

VGA Video Graphics Array. An analog computer display standard, commonly referred to also as CRT.

xHCI eXtensible Host Controller Interface, Host controller for USB 3.0 ports, which can also manage USB 2.0 and USB1.1 ports

COMe-C55-CT6

1.8 Reference specifications

Here below it is a list of applicable industry specifications and reference documents.

Reference

Link

ACPI

http://www.acpi.info

AHCI

http://www.intel.com/content/www/us/en/io/serial-ata/ahci.html

Com Express

https://www.picmg.org/openstandards/com-express/

Com Express Carrier Design Guide

http://picmg.org//wp-content/uploads/PICMG_COMDG_2.0-RELEASED-2013-12-061.pdf

DDC

http://www.vesa.org

DP, eDP

http://www.vesa.org

Gigabit Ethernet

http://standards.ieee.org/about/get/802/802.3.html

HD Audio

http://www.intel.com/content/dam/www/public/us/en/documents/product-specifications/high-definition-audio-specification.pdf

HDMI

http://www.hdmi.org

I2C

https://www.nxp.com/docs/en/user-guide/UM10204.pdf

LPC Bus

http://www.intel.com/design/chipsets/industry/lpc.htm

LVDS

http://www.ti.com/lit/an/snla165/snla165.pdf

http://www.ti.com/lit/ug/snla187/snla187.pdf?&ts=1589555859279

PCI Express

http://www.pcisig.com/specifications/pciexpress

SATA

https://www.sata-io.org

SM Bus

http://www.smbus.org/specs

UEFI

http://www.uefi.org

USB 2.0 and USB OTG

https://www.usb.org/document-library/usb-20-specification

USB 3.0

https://www.usb.org/document-library/usb-32-specification-released-september-22-2017-and-ecns

xHCI

http://www.intel.com/content/www/us/en/io/universal-serial-bus/extensible-host-controler-interface-usb-xhci.html?wapkw=xhci

Intel®8th generatio

4000 series processor

https://ark.intel.com/content/www/us/en/ark/products/codename/135883/whiskey-lake.html#@Embedded

COMe-C55-CT6

•Introduction

•Technical Specifications

•Electrical Specifications

•Mechanical Specifications

•Block Diagram

COMe-C55-CT6

2.1 Introduction

The COMe-C55-CT6 is a COM Express®Type 6, Compact Form Factor, based on the Intel®8th generation Core or Celeron 4000 series processor, formerly

coded as Whiskey Lake. A complete list of CPUs available is detailed in the next chapter.

All the supported CPUs offer a 64-bit Instruction set. Hyper Threading capabilities are also available on all CPUs, except for Celeron CPUs.

The CPUs have direct access to the memory, which is available on two SODIMM DDR4 memory modules. Depending on the CPU, memory frequencies up to

2400MHz are supported, with a maximum capacity up to 64GB. Please notice that total amount of memory available is OS dependant.

All CPUs integrate an Intel®UHD 620 /610 Graphics Controller, which offers an advanced 2D and 3D graphic engine and it is able to manage up to 3 independent

displays (any combination possible between HDMI, DVI, DP++, eDP, LVDS and VGA). It makes available three Digital Display Interfaces that can be used to drive

external Display Port, HDMI or DVI displays; the DDI interface #0 can be carried out on COM Express connector AB directly for the use as eDP interface or used to

realise a Dual Channel LVDS 18/24bit interface. In the same way, SoC’s DDI interface #2 can be carried out directly on COM Express connector CD or used to

realise a VGA interface by using a dedicated DP-to-VGA bridge.

The SoC’s embedded PCH (Intel®300 Series PCH) completes the functionalities of the board offering HD Audio Interface, 9 x PCI Express ports (one of them used

to manage a Gigabit Ethernet controller, up to four of them can be grouped to offer a PEG x4 interface), up to 3x Serial ATA channels, eMMC interface, 8 USB 2.0

ports, 4 USB 3.0 ports, Real Time Clock, SPI interfaces, LPC and SM Bus.

The module can be offered with an optional additional TPM module.

Please refer to following chapter for a complete list of all peripherals integrated and characteristics.

The product is COM Express®Rel.3.0 standard compliant, an open industry standard defined specifically for COMs (computer on modules). Its definition provides

the ability to make a smooth transition from legacy parallel interfaces to the newest technologies based on serial buses available. Specifically, COMe-C55-CT6 is a

COM Express®module, Compact Form factor, Type 6 (95mm x 95mm).

COM Express®module integrates all the core components and has to be mounted onto an application-specific carrier board; carrier board designers can utilize as

little or as many of the I/O interfaces as deemed necessary. The carrier board can therefore provide all the interface connectors required to attach the system to the

application specific peripherals. This versatility allows the designer to create a dense and optimised package, which results in a more reliable product while simplifying

system integration. Most important, COM Express®modules are scalable, which means that once an application has been created there is the ability to diversify the

product range using different performance class or form factor size modules. Simply unplug one module and replace it with another, no redesign is necessary.

The robust thermal and mechanical concept, combined with extended power-management capabilities, is perfectly suited for all applications.

2.2 Technical Specifications

CPU

Intel®Core i7-8665UE, Quad Core @ 1.7GHz (Turbo Boost 4.4GHz) with HT, 8MB

Cache, 15W TDP (12.5W..25W cTDP)

Intel®Core i5-8365UE, Quad Core @ 1.6GHz (Turbo Boost 4.1GHz) with HT, 6MB

Cache, 15W TDP (12.5W..25W cTDP)

Intel®Core i3-8145UE, Dual Core @ 2.2GHz (Turbo Boost 3.9GHz) with HT, 4MB

Cache, 15W TDP (12.5W..25W cTDP)

Intel®Celeron®4305UE, Dual Core @ 2.0GHz, 2MB Cache, 15W TDP

Memory

Two DDR4 SO-DIMM Slots supporting DDR4-2400 (non-ECC)

Graphics

Intel®UHD Graphics 620(Core processors), 610 (Celeron processors)

Up to 3 independent displays supported

DirectX®12, OpenGL 4.5, and OpenCL 2.1 support

HW accelerated video decode MPEG2, VC1 / WMV9, AVC / H.264, VP8, JPEG / MJPEG,

HEVC / H.265 (8-/10- bit), VP9

HW accelerated video encode MPEG2, AVC / H.264, VP8, JPEG, HEVC / H.265, VP9

Video Interfaces

Up to 2 x Digital Display Interfaces (DDIs), supporting DP1.2, eDP 1.4, DVI and HDMI 1.4

eDP 1.4 or 18/24 bit single/dual channel LVDS interface

Optional VGA interface, alternative to the second DDI interface

Video Resolutions

eDP, DP: up to 4096x2304 @60Hz

HDMI: up to 4096x2160 @30/24Hz

LVDS: up to 1920x1200 @ 60Hz

VGA: up to 2048x1536 @ 50Hz (reduced blanking)

Mass Storage

Optional eMMC 5.1 drive on-board

Up to 3 x S-ATA Gen3 channels

microSD card slot on-board

USB

8 x USB 2.0 Host Ports

4 x USB 3.1 Host ports

Networking

Gigabit Ethernet interface

Intel®I219-LM GbE Controller

Audio

HD Audio interface

PCI Express

Up to 8 x PCI-e x1 Gen3 lanes

Optional PCI Express Graphics (PEG) Gen3 x2 or x4 interface

Serial Ports

2 x serial ports (Tx/Rx only, TTL interface)

Other Interfaces

SPI

I2C

SM Bus

LPC bus

FAN management

4 x GPI, 4 x GPO

LID# / SLEEP# / PWRBTN#, Watchdog

Optional TPM 2.0 on-board

Power supply voltage: +12VDC ± 10% and + 5VSB (optional)

Operating temperature: 0°C ÷ +60°C (commercial version) **

Dimensions: 95 x 95 mm (3.74”x 3.74”)

** Temperatures indicated (minimum and maximum) are those measured at any point

of SECO standard heat-spreader for this product, during any and all times (including

start-up). Actual temperature will widely depend on application, enclosure and/or

environment. Upon customer to consider application-specific cooling solutions for the

final system tokeep the heat-spreader temperature in the range indicated. Please also

check paragraph 4.1

COMe-C55-CT6

2.3 Electrical Specifications

According to COM Express®specifications, the COMe-C55-CT6 board needs to be supplied only with an external +12VDC power supply.

5 Volts standby voltage needs to be supplied for working in ATX mode.

For Real Time Clock working and CMOS memory data retention, it is also needed a backup battery voltage. All these voltages are supplied directly through COM

Express Connectors CN6-AB and CN6-CD.

All remaining voltages needed for board’s working are generated internally from +12VDC power rail.

2.3.1 Power Rails meanings

In all the tables contained in this manual, Power rails are named with the following meaning:

_RUN: Switched voltages, i.e. power rails that are active only when the board is in ACPI’s S0 (Working) state. Examples: +3.3V_RUN, +5V_RUN.

_ALW: Always-on voltages, i.e. power rails that are active both in ACPI’s S0 (Working), S3 (Standby) and S5 (Soft Off) state. Examples: +5V_ALW, +3.3V_ALW.

_SUS: unswitched ACPI S3 voltages, i.e. power rails that are active both in ACPI’s S0 (Working) and S3 (Standby) state. Examples: +1.5V_SUS.

2.3.2 Power Consumption

COMe-C55-CT6 module, like all COM Express modules, needs a carrier board for its normal working. All connections with the external world come through this

carrier board, which provide also the required voltage to the board, deriving it from its power supply source.

Therefore, power consumptions of the board are measured using a CCOMe-965 Carrier board on +12V_RUN power rail that supplies the board. For this reason, the

values indicated in the table below are real power consumptions of the board, and are independent from those of the peripherals connected to the Carrier Board.

Power consumption in Suspend and Soft-Off States have been measured on +5V_ALW power rail. RTC power consumption has been measured on carrier board’s

backup battery when the system is not powered (VCC_RTC power rail). For the measurements, it has been used a DC Power Analyzer Keysight N6700B.

The current consumptions, written in the table of next page, have been measured using the following setup:

•O.S. Windows 10

•32GB DDR4 (2 x 16GB SO-DIMM DDR4 2400MHz modules, p/n APACER 75.DA4GJ.G010B)

•USB mouse and keyboard connected

•HDMI display connected.

COMe-C55-CT6

Status

CPU & board configuration

i7-8665UE

32GB eMMC,

4PCIE+ PEGx4,

LVDS, VGA, TPM

i5-8365U

32GB eMMC,

6PCIe + PEGx2,

eDP + DP on

DDI2

i3-8145UE

64GB eMMC,

8PCI-e, eDP +

DP on DDI2

4305UE

Average

Peak

Average

Peak

Average

Peak

Average

Peak

Idle, power saving configuration

0.36A

0.73A

0.32A

0.55A

0.29A

0.49A

TBM

OS Boot, power saving configuration

0.96A

3.66A

0.96A

3.04A

0.76A

2.22A

TBM

Video reproduction@720p, power saving configuration

0.56A

0.68A

0.45A

0.59A

0.45A

1.07A

TBM

Video reproduction@1080p, power saving configuration

0.64A

1.01A

0.49A

0.73A

0.53A

0.74A

TBM

Video reproduction@4K, power saving configuration

0.56A

0.61A

0.49A

0.73A

0.43A

0.61A

TBM

Intel Thermal Analysis Tool, high performance

1.79A

1.88A

1.71A

1.95A

1.68A

1.83A

TBM

Suspend to RAM (typical)

113mA

105mA

142mA

Soft Off (typical)

63mA

52mA

86mA

RTC Power consumption (typical)

COMe-C55-CT6

2.4 Mechanical Specifications

The COMe-C55-CT6 is a COM Express board, Compact form Factor type;

therefore its dimensions are 95 mm x 95 mm (3.74”x 3.74”).

Printed circuit of the board is made of twelve layers, some of them are ground

planes, for disturbance rejection.

According to COM Express specifications, the carrier board plug can be of two

different heights, 5mm and 8mm.

Whichever connector’s height is chosen, in designinga custom carrier board please

remember that the SO-DIMMconnector on bottom side of COMe-C55-CT6 is 4mm

high (it is the component with the maximum height).

This value mustbe kept in high consideration when choosing the carrier boardplugs’

height, if it is necessary to place components on the carrier board in the zone under

the COM Express®module.

COMe-C55-CT6

2.5 Block Diagram

COM Express connector C-D

Intel®SoC

“Whiskey

Lake U”

NXP PTN3460

eDP-to-LVDS

bridge

+12V_S, +5V_A

2 x FACTORY ALTERNATIVES

DDR4 SO-DIMM

Slot

DDR4 SO-DIMM

Slot

+12V_S

Power section

MEC1705H

embedded

controller

SPI

GPIO

SD Card

Opt. TPM

USB 2.0 ports #0 ÷ #7

COM Express connector A-B

DDI #2

Intel®Ethernet

Controller I219

PCI-e ports #0 ÷#2

PCI-e #9

eDP

SATA ports #0 ÷ #1

ACPI Signals

HD Audio

LPC Bus

FAN

I2C

Watchdog

Temperature

monitor

Voltage

monitor

DDI #1

Gigabit Ethernet

SM Bus

DDI Port #2

DDI Port #1

PEG lanes #0 #1

LVDS

DDI #0

USB 3.1 Gen3 ports #0 ÷ #3

USB 2.0 P.[1..8]

USB SS P.[1..4]

SPI Flash

NXP PTN3356 DP-

to-VGA bridge

VGA

2 x FACTORY ALTERNATIVES

SATA port #2

PEG lanes #2 #3

4x Possible Configurations:

PCI-e #[0..7]

PCI-e #[0..5] + PEG #[0..1]

PCI-e #[0..4] + PEG #[0..3]

PCI-e #[0..3] + PEG #[0..3] + SATA #2

PCI-e ports #6 #7

2 x FACTORY ALTERNATIVES

Optional eMMC

drive

PCI-e ports #4 #5

PCI-e port #3

2x UART

FACTORY ALTERNATIVES

microSD Card Slot

COMe-C55-CT6

•Introduction

•Connectors description

COMe-C55-CT6

3.1 Introduction

According to COM Express®specifications, all interfaces to the board are available through two 220 pin connectors, for a total of 440 pin. Simplifying the terminology

in this documentation, the primary connector is called A-B and the secondary C-D, since each one consists of two rows.

In addition, a Fan connector has been placed on one side of the board, in order to allow an easier connection of active heatsinks to the module.

TOP SIDE

BIOS restore

switch

COM Express

connector C-D

BOTTOM SIDE

SO-DIMM Slots

COM Express

connector A-B

Ext. FAN

Connector

microSD card

slot

COMe-C55-CT6

3.2 Connectors description

3.2.1 FAN Connectors

Depending on the usage model of COMe-C55-CT6 module, for critical applications/environments on the module itself

it is available a 4-pin dedicated connector for an external +12VDC FAN.

The default FAN Connector is a 4-pin single line SMT connector, type MOLEX 53261-0471 or equivalent, with pinout

shown in the table on the left.

Mating connector: MOLEX 51021-0400 receptacle with MOLEX 50079-8000 female crimp terminals.

Alternatively, as a factory option, the COMe-C55-CT6 module can be equipped with a 3-pin single line SMT

connector, type MOLEX 53261-0371 or equivalent, with pinout shown in the table on the left.

Mating connector: MOLEX 51021-0300 receptacle with MOLEX 50079-8000 female crimp terminals.

Please be aware that the use of an external fan depends strongly on customer’s application/installation.

Please refer to chapter 4.1 for considerations about thermal dissipation.

FAN_POWER: +12V_RUN derived power rail for FAN.

FAN_PWM: PWM output from the embedded microcontroller to the FAN (4-pin connector only).

FAN_TACHO_IN: tachometric input from the FAN to the embedded microcontroller, +3.3V_RUN electrical level signal with 10kΩpull-up resistor and Schottky series

diode.

3.2.2 SO-DIMM DDR4 Slots

CPUs used on the COMe-C55-CT6 board provide support to DDR4-2400 SO-DIMM memory modules. Only non-ECC modules are supported.

For use of this memories, on board there are two SO-DIMM DDR4 slots.

The socket placed on top side (CN1) is type LOTES p/n ADDR0208-P003A or equivalent, a right angle, low profile, reverse type socket, used for high speed

system memory applications.

The socketplaced on bottom side (CN2) is type LOTES p/n ADDR0106-P003A or equivalent,and isa socket with performancessimilar to the other, only it is standard