Seco Q7-a29 User manual

Q7-A29

Qseven®Rel. 2.0 Compliant Module with the

AMD Embedded G-series family SOCs

Q7-A29

Unauthorised use, duplication, modification or disclosure of the information to a third-party by any means without prior consent of SECO S.r.l. is prohibited.

Every effort has been made to ensure the accuracy of this manual. However, SECO S.r.l. accepts no responsibility for any inaccuracies, errors or omissions herein.

SECO S.r.l. reserves the right to change precise specifications without prior notice to supply the best product possible.

Some of the information found in the BIOS SETUP Chapter has been extracted from the following copyrighted Insyde Software Corp. documents:

InsydeH2O Setup Utility - User Reference Guide

For further information on this module or other SECO products, but also to get the required assistance for any and possible issues, please contact us using the

dedicated web form available at http://www.seco.com (registration required).

Our team is ready to assist you.

Revision

Date

Note

Rif

1.0

18th February 2016

First official release

REVISION HISTORY

Q7-A29

INDEX

INTRODUCTION.......................................................................................................................................................................... 5Chapter 1.

1.1 Warranty........................................................................................................................................................................................................................................ 6

1.2 Information and assistance............................................................................................................................................................................................................. 7

1.3 RMA number request..................................................................................................................................................................................................................... 7

1.4 Safety............................................................................................................................................................................................................................................ 8

1.5 Electrostatic Discharges................................................................................................................................................................................................................. 8

1.6 RoHS compliance.......................................................................................................................................................................................................................... 8

1.7 Terminology and definitions ............................................................................................................................................................................................................ 9

1.8 Reference specifications ..............................................................................................................................................................................................................11

OVERVIEW ............................................................................................................................................................................... 13Chapter 2.

2.1 Introduction..................................................................................................................................................................................................................................14

2.2 Technical Specifications...............................................................................................................................................................................................................15

2.3 Electrical Specifications................................................................................................................................................................................................................16

2.3.1 Power Rails meanings..........................................................................................................................................................................................................16

2.3.2 Power Consumption ............................................................................................................................................................................................................16

2.4 Mechanical Specifications............................................................................................................................................................................................................17

2.5 Block Diagram .............................................................................................................................................................................................................................18

CONNECTORS......................................................................................................................................................................... 19Chapter 3.

3.1 Introduction..................................................................................................................................................................................................................................20

3.2 Connectors description................................................................................................................................................................................................................21

3.2.1 VGA Connector ...................................................................................................................................................................................................................21

3.2.2 FAN Connector....................................................................................................................................................................................................................22

3.2.3 Qseven®Connector.............................................................................................................................................................................................................23

3.2.4 BOOT Strap Signals.............................................................................................................................................................................................................43

BIOS SETUP............................................................................................................................................................................. 44Chapter 4.

4.1 Introduction..................................................................................................................................................................................................................................45

4.2 Main setup menu.........................................................................................................................................................................................................................46

4.2.1 System Time / System Date.................................................................................................................................................................................................46

4.3 Advanced menu ..........................................................................................................................................................................................................................47

Q7-A29

4.3.1 Boot configuration submenu................................................................................................................................................................................................. 47

4.3.2 Peripheral configuration submenu......................................................................................................................................................................................... 48

4.3.3 SATA configuration submenu ...............................................................................................................................................................................................48

4.3.4 Video configuration submenu ...............................................................................................................................................................................................49

4.3.5 Chipset configuration submenu............................................................................................................................................................................................ 49

4.3.6 ACPI Table/features submenu..............................................................................................................................................................................................51

4.3.7 CPU related setting submenu...............................................................................................................................................................................................51

4.3.8 Memory configurations submenu..........................................................................................................................................................................................52

4.3.9 SDIO Configuration submenu...............................................................................................................................................................................................52

4.4 Security menu..............................................................................................................................................................................................................................53

4.5 Power menu................................................................................................................................................................................................................................54

4.5.1 Advanced CPU control submenu .........................................................................................................................................................................................55

4.5.2 Thermal Zone configuration submenu ...................................................................................................................................................................................55

4.5.3 Clocks And Voltages Optimizations submenu .......................................................................................................................................................................56

4.5.4Watchdog Configuration submenu .......................................................................................................................................................................................56

4.6 Boot menu ..................................................................................................................................................................................................................................57

4.6.1 Legacy submenu.................................................................................................................................................................................................................58

4.7 Exit menu ....................................................................................................................................................................................................................................59

Appendices.............................................................................................................................................................................. 60Chapter 5.

5.1 Thermal Design............................................................................................................................................................................................................................61

5.2 Accessories.................................................................................................................................................................................................................................64

5.2.1 VGA Adapter module M908 .................................................................................................................................................................................................64

Q7-A29

Chapter 1.

Warranty

Information and assistance

RMA number request

Safety

Electrostatic Discharges

RoHS compliance

Terminology and definitions

Reference specifications

Q7-A29

1.1Warranty

This product is subject to the Italian Law Decree 24/2002, acting European Directive 1999/44/CE on matters of sale and warranties to consumers.

The warranty on this product lasts 1 year.

Under the warranty period, the Supplier guarantees the buyer assistance and service for repairing, replacing or credit of the item, at the Supplier’s own discretion.

Shipping costs that apply to non-conforming items or items that need replacement are to be paid by the customer.

Items cannot be returned unless previously authorised by the supplier.

The authorisation is released after completing the specific form available on the web-site http://www.seco.com/en/prerma (RMA Online). The RMA authorisation

number must be put both on the packaging and on the documents shipped with the items, which must include all the accessories in their original packaging, with

no signs of damage to, or tampering with, any returned item.

The error analysis form identifying the fault type must be completed by the customer and must accompany the returned item.

If any of the above mentioned requirements for RMA is not satisfied, the item will be shipped back and the customer will have to pay any and all shipping costs.

Following a technical analysis, the supplier will verify if all the requirements for which a warranty service applies are met. If the warranty cannot be applied, the

Supplier will calculate the minimum cost of this initial analysis on the item and the repair costs. Costs for replaced components will be calculated separately.

Warning!

All changes or modifications to the equipment not explicitly approved by SECO S.r.l. could impair it and could void the warranty.

Q7-A29

1.2Information and assistance

What do I have to do if the product is faulty?

SECO S.r.l. offers the following services:

SECO website: visit http://www.seco.com to receive the latest information on the product. In most cases it is possible to find useful information to solve the

problem.

SECO Sales Representative: the Sales Rep can help determine the exact cause of the problem and search the best solution.

SECO Help-Desk: contact SECO Technical Assistance. A technician is at disposal to understand the exact origin of the problem and suggest the correct

solution. E-mail: technical.se[email protected]

Fax (+39) 0575 340434

Repair centre: it is possible to send the faulty product to the SECO Repair Centre. In this case, follow this procedure:

oReturned items must be accompanied by a RMA Number. Items sent without the RMA number will be not accepted.

oReturned items must be shipped in an appropriate package. SECO is not responsible for damages caused by accidental drop, improper usage, or

customer neglect.

Note: Please have the following information before asking for technical assistance:

-Name and serial number of the product;

-Description of Customer’s peripheral connections;

-Description of Customer’s software (operating system, version, application software, etc.);

-A complete description of the problem;

-The exact words of every kind of error message encountered.

1.3RMA number request

To request a RMA number, please visit SECO’s web-site. On the home page, please select “RMA Online”and follow the procedure described.

A RMA Number will be released within 1 working day (only for on-line RMA requests).

Q7-A29

Whenever handling a Q7-A29 module, ground yourself through an anti-static wrist strap. Placement of the board on an anti-static

surface is also highly recommended.

1.4Safety

The Q7-A29 module uses only extremely-low voltages.

While handling the board, please use extreme caution to avoid any kind of risk or damages to electronic components.

1.5 Electrostatic Discharges

The Q7-A29 module, like any other electronic product, is an electrostatic sensitive device: high voltages caused by static electricity could damage some or all the

devices and/or components on-board.

1.6 RoHS compliance

The Q7-A29 module is designed using RoHS compliant components and is manufactured on a lead-free production line. It is therefore fully RoHS compliant.

Always switch the power off, and unplug the power supply unit, before handling the board and/or connecting cables or other boards.

Avoid using metallic components - like paper clips, screws and similar - near the board when connected to a power supply, to avoid

short circuits due to unwanted contacts with other board components.

If the board has become wet, never connect it to any external power supply unit or battery.

Check carefully that all cables are correctly connected and that they are not damaged.

Q7-A29

1.7 Terminology and definitions

ACPI Advanced Configuration and Power Interface, an open industrial standard for the board’s devices configuration and power management

AHCI Advanced Host Controller Interface, a standard which defines the operation modes of SATA interface

API Application Program Interface, a set of commands and functions that can be used by programmers for writing software for specific Operating

Systems

BIOS Basic Input / Output System, the Firmware Interface that initializes the board before the OS starts loading

CEC Consumer Electronics Control, an HDMI feature which allows controlling more devices connected together by using only one remote control

CRT Cathode Ray Tube. Initially used to indicate a type of monitor, this acronym has been used over time to indicate the analog video interface used

to drive them.

DDC Display Data Channel, a kind of I2C interface for digital communication between displays and graphics processing units (GPU)

DDR Double Data Rate, a typology of memory devices which transfer data both on the rising and on the falling edge of the clock

DDR3 DDR, 3rd generation

DP Display Port, a type of digital video display interface

DVI Digital Visual interface, a type of digital video display interface

eDP embedded Display Port, a type of digital video display interface specifically developed for the internal connections between boards and displays

EHCI Enhanced Host Controller interface, a high-speed controller for USB ports, able to support USB2.0 standard

FFC/FPC Flexible Flat Cable / Flat Panel Cable

GBE Gigabit Ethernet

Gbps Gigabits per second

GND Ground

GPI/O General purpose Input/Output

HD Audio High Definition Audio, most recent standard for hardware codecs developed by Intel®in 2004 for higher audio quality

HDMI High Definition Multimedia Interface, a digital audio and video interface

I2C Bus Inter-Integrated Circuit Bus, a simple serial bus consisting only of data and clock line, with multi-master capability

JTAG Joint Test Action Group, common name of IEEE1149.1 standard for testing printed circuit boards and integrated circuits through the Debug port

LPC Bus Low Pin Count Bus, a low speed interface based on a very restricted number of signals, deemed to management of legacy peripherals

LVDS Low Voltage Differential Signalling, a standard for transferring data at very high speed using inexpensive twisted pair copper cables, usually used

for video applications

MAC Medium Access Controller, the hardware implementing the Data Link Layer of ISO/OSI-7 model for communication systems

Q7-A29

Mbps Megabits per second

N.A. Not Applicable

N.C. Not Connected

OpenCL Open Computing Language, a software library based on C99 programming language, conceived explicitly to realise parallel computing using

Graphics Processing Units (GPU)

OpenGL Open Graphics Library, an Open Source API dedicated to 2D and 3D graphics

OS Operating System

PCI-e Peripheral Component Interface Express

PSU Power Supply Unit

PWM Pulse Width Modulation

PWR Power

PXE Preboot Execution Environment, a way to perform the boot from the network ignoring local data storage devices and/or the installed OS

SATA Serial Advance Technology Attachment, a differential half duplex serial interface for Hard Disks

SD Secure Digital, a memory card type

SDHC Secure Digital Host Controller

SDIO Secure Digital Input/Output, an evolution of the SD standard that allows the use of the same SD interface to drive different Input/Output devices,

like cameras, GPS, Tuners and so on

SM Bus System Management Bus, a subset of the I2C bus dedicated to communication with devices for system management, like a smart battery and

other power supply-related devices

SPI Serial Peripheral Interface, a 4-Wire synchronous full-duplex serial interface which is composed of a master and one or more slaves, individually

enabled through a Chip Select line

TBM To be measured

TMDS Transition-Minimized Differential Signaling, a method for transmitting high speed serial data, normally used on DVI and HDMI interfaces

TTL Transistor-transistor Logic

UEFI Unified Extensible Firmware Interface, a specification defining the interface between the OS and the board’s firmware. It is meant to replace the

original BIOS interface

UHCI Unified Host Controller Interface, Host Controller for USB 1.0 and 1.1 ports

USB Universal Serial Bus

V_REF Voltage reference Pin

VGA Video Graphics Array, an analog computer display standard, commonly referred to also as CRT

xHCI eXtensible Host Controller Interface, Host controller for USB 3.0 ports, which can also manage USB 2.0 and USB1.1 ports

Q7-A29

1.8 Reference specifications

Here below it is a list of applicable industry specifications and reference documents.

Reference

Link

ACPI

http://www.acpi.info

AHCI

http://www.intel.com/content/www/us/en/io/serial-ata/ahci.html

DDC

http://www.vesa.org

DP, eDP

http://www.vesa.org

EHCI

http://www.intel.com/content/www/us/en/io/universal-serial-bus/ehci-specification.html

Gigabit Ethernet

http://standards.ieee.org/about/get/802/802.3.html

HD Audio

http://www.intel.com/content/dam/www/public/us/en/documents/product-specifications/high-definition-audio-specification.pdf

HDMI

http://www.hdmi.org/index.aspx

I2C

http://www.nxp.com/documents/other/UM10204_v5.pdf

LPC Bus

http://www.intel.com/design/chipsets/industry/lpc.htm

LVDS

http://www.ti.com/ww/en/analog/interface/lvds.shtml

http://www.ti.com/lit/ml/snla187/snla187.pdf

OpenCL

http://www.khronos.org/opencl

OpenGL

http://www.opengl.org

PCI Express

http://www.pcisig.com/specifications/pciexpress

Qseven®specifications

http://www.sget.org/uploads/media/Qseven-Spec_2.0_SGET.pdf

SATA

https://www.sata-io.org

SD Card Association

https://www.sdcard.org/home

SM Bus

http://www.smbus.org/specs

TMDS

http://www.siliconimage.com/technologies/tmds

USB 2.0 and USB OTG

http://www.usb.org/developers/docs/usb_20_070113.zip

USB 3.0

http://www.usb.org/developers/docs/usb_30_spec_070113.zip

Q7-A29

xHCI

http://www.intel.com/content/www/us/en/io/universal-serial-bus/extensible-host-controler-interface-usb-xhci.html?wapkw=xhci

AMD GX SOC

http://www.amd.com/US/PRODUCTS/EMBEDDED/PROCESSORS/Pages/g-series.aspx

Q7-A29

Chapter 2.

Introduction

Technical Specifications

Electrical Specifications

Mechanical Specifications

Block Diagram

Q7-A29

2.1Introduction

Q7-A29 is a CPU module, in Qseven®format, based on the AMD Embedded G-Series System on Chip (SOC), a family of Dual/Quad Core x86 CPU with

integrated discrete-class GPU and I/O controller on a single Chip.

This single chip solution includes the memory controller, which gives support for up to 8GB of DDR3 Single Channel ECC Memory soldered onboard.

Graphic section is embedded in the SOC; which offers an embedded AMD HD Radeon GPU, able to support dual independent displays using native LVDS /

embedded Display Port, CRT or HDMI/ Display Port interfaces. Any combinations of these video interfaces are supported. GPUs embedded in the SOC also

support DirectX®11.1, OpenGL®rel.4.2 and OpenCL rel. 1.2.

The board can offer one optional SATA Flash Drive, directly accessible like any standard Hard Disk (SATA Flash Drive is alternative to second SATA Channel on

Qseven®connector).

This high level of integration allows an extremely reduced consumption of spaces, that is essential for boards with sizes so reduced as for Qseven®boards, which

offers all functionalities of standard PC boards in just 70x70mm.

Interface to the board comes through the single card edge connector, as defined by Qseven®specifications Rel. 2.0: on this connector, signals are available for

Gigabit Ethernet, SD interface, up to 2 x SATA Channels, one USB 3.0 Host port, six USB 2.0 Host ports, optional 24-bit Single/Dual Channel LVDS, HDMI or

Display Port interface, up to 4 x PCI-Express x 1 lanes, HD Audio interface, I2C, SPI and SM Bus, and other features, like optional UART and SPI interfaces.

Interfacing to the board comes through a single card edge connector, as defined by Qseven®specifications Rel.2.0, where are carried out all interfaces previously

described (except CRT interface, which has a dedicated connector). For external interfacing to standard devices, a carrier board with a 230-pin MXM connector is

needed. This board will implement all the routing of the interface signals to external standard connectors, as well as integration of other peripherals/devices not

already included in Q7-A29 CPU module.

Some module’s configurations are also available in industrial temperature range.

Please refer to following chapter for a complete list of all peripherals integrated and characteristics.

2.2Technical Specifications

SOC

AMD GX-415GA, Quad Core @ 1.5GHz, 2MB L2 Cache, TDP 15W

AMD GX-217GA, Dual Core @ 1.65GHz, 1MB L2 Cache, TDP 15W

AMD GX-210HA, Dual Core @ 1.0GHz, 1MB L2 Cache, TDP 9W

AMD GX-210JA, Dual Core @ 1.0GHz, 1MB L2 Cache, TDP 6W

AMD GX-411GA, Quad Core @1.1GHz, 2MB L2 Cache, TDP 15W, industrial

grade temperature

AMD GX-209HA, Dual Core @ 1.0GHz, 1MB L2 Cache, TDP 9W, industrial

grade temperature

Memory

up to 8GB DDR3 1600MHz Single-Channel with ECC soldered onboard (*)

(1333MHz memory with GX-210HA;1066MHz memory with GX-411GA,

GX-210JA and GX-209HA)

* Please notice that total amount of 8GB would be usable only with 64-bit OS. Total

amount of memory available with a 32-bit OS depends on the OS itself (it will be less

than 4GB, however).

Graphics

Embedded AMD HD RADEON GPUs

HD8330E @500MHz (GX-415GA), HD8280E @450MHz (GX-217GA)

HD8210E @300MHz (GX-210HA, GX-411GA)

HD8180 @225MHz (GX-210JA, GX-209HA)

Dual independent display support

Supports DirectX®11.1, OpenGL rel. 4.2 and OpenCL rel. 1.2

Video Interfaces

HDMI or Display Port interface

Embedded Display Port or 18/24 bit single/dual channel LVDS interface

Additional VGA interface (optional external adapter is required)

Video Resolutions

HDMI: Up to 1920x1200 @ 60Hz

Display Port, eDP: Up to 2560x1600 @ 60Hz

CRT: Up to 2048x1536 @ 60Hz

Optional LVDS interface: Up to 1920x1200 @ 60 Hz

USB

1 x USB3.0 Host port

6 x USB2.0 Host port

Mass Storage

Up to 2 x external S-ATA channels

SD interface

Optional SATA Flash Drive soldered onboard

Networking

Gigabit Ethernet interface

Audio

HD Audio interface

PCI Express

Up to 4 x PCI-e x1 groupable lanes

3 x PCI-e x1 lanes with GX-210JA

Serial Ports

1 x Optional Serial port (TTL interface)

Other Interfaces

I2C / LPC / SM Bus

Thermal / FAN management

Optional UART and SPI

Power Management Signals

Power supply voltage: +5VDC ± 5%

Operating temperature: 0°C ÷ +60°C (commercial version) ***

-40°C ÷ +85°C (industrial version)

Dimensions: 70 x70 mm (2.76”x 2.76”)

Supported Operative Systems

Microsoft®Windows 7 32/64 bit / Microsoft®Windows 8 32/64 bit

Microsoft®Windows 8.1 32/64 bit / Microsoft®WES7 32/64 bit

Linux 32/64 bit

*** Temperatures indicated are the minimum and maximum temperature that

the heatspreader / heatsink can reach in any of its parts. This means that it is

customer

’

s responsibility to use any passive cooling solution along with an

application-dependent cooling system, capable to ensure that the

heatspreader / heatsink temperature remains in the range above indicated.

Please also check paragraph 5.1.

Q7-A29

2.3Electrical Specifications

According to Qseven®specifications, Q7-A29 board needs to be supplied only with an external +5VDC power supply.

5 Volts standby voltage needs to be supplied for working in ATX mode.

For Real Time Clock working and CMOS memory data retention, it is also needed a backup battery voltage. All these voltages are supplied directly through card

edge fingers (see connector’s pinout).

All remaining voltages needed for board’s working are generated internally from +5V_S power rail.

2.3.1 Power Rails meanings

In all the tables contained in this manual, Power rails are named with the following meaning:

_S: Switched voltages, i.e. power rails that are active only when the board is in ACPI’s S0 (Working) state. Examples: +3.3V_S, +5V_S.

_A: Always-on voltages, i.e. power rails that are active both in ACPI’s S0 (Working), S3 (Standby) and S5 (Soft Off) state. Examples: +5V_A, +3.3V_A.

_U: unswitched ACPI S3 voltages, i.e. power rails that are active both in ACPI’s S0 (Working) and S3 (Standby) state. Examples: +1.5V_U

2.3.2 Power Consumption

TBM

Q7-A29

2.4 Mechanical Specifications

According to Qseven®specifications, board dimensions are: 70 x 70 mm (2.76”x 2.76”).

Printed circuit of the board is made of twelve layers, some of them are ground planes, for

disturbance rejection.

The MXM connector accommodates various connector heights for different carrier board

applications needs. Qseven®specification suggests two connector heights, 7.8mm and

7.5mm, but it is also possible to use different connector heights, also remaining compliant to

the standard.

When using different connector heights, please consider that, according to Qseven®

specifications, components placed on bottom side of Q7-A29 will have a maximum height of

2.2mm ± 0.1. This value must be kept in mind when choosing the MXM connector’s height,

if it is necessary to place components on the carrier board in the zone below the Qseven®

module.

Q7-A29

Power management

SATA #1

SATA #0

I2C

SD interface

LPC Bus

HD Audio

USB 3.0 port

USB 2.0 ports

HDMI or DP

LVDS

SM bus

Gigabit Ethernet

PCI-e interface

STMicroelectronics

STM32F100R4

microcontroller

Embedded SATA

Drive

Internal FAN

connector

VGA connector

AMD

G-Series

SOC

Intel®Ethernet

Controller I210-IT

DDR3L System

Memory

DDR3L System

Memory

FACTORY

ALTERNATIVES

DDI0

GFX PCI-e

GPP PCI-e

Power section

+5V_S, +5V_A

External FAN interface

DDI1

UART

SPI

USB #6

FACTORY

ALTERNATIVES

FACTORY

ALTERNATIVES

SPI

Watchdog

eDP-to-LVDS

bridge

USB to UART

bridge

eDP

FACTORY

OPTION

DDR3L ECC

Memory

2.5 Block Diagram

Q7-A29

Chapter 3.

Introduction

Connectors description

Q7-A29

3.1Introduction

According to Qseven®specifications, all interfaces to the board are available through a single card edge connector. In addition, a CRT FFC/FPC connector card

slot is present on the left side of the board to take advantage of the native CRT interface of AMD G-Series SOCs. Moreover, an additional FAN connector has been