Seco Smarc sm-c93 User manual

SM-C93

SMARC®Rel. 2.1.1 compliant module with

the Intel®Atom x6000E Series and Intel®

Pentium®and Celeron®N and J Series

processors (formerly Elkhart Lake) for FuSa

applications

SM-C93

Unauthorised use, duplication, modification or disclosure of the information to a third-party by any means without prior consent of SECO S.p.A. is prohibited.

Every effort has been made to ensure the accuracy of this manual. However, SECO S.p.A. accepts no responsibility for any inaccuracies, errors or omissions herein.

SECO S.p.A. reserves the right to change precise specifications without prior notice to supply the best product possible.

For further information on this module or other SECO products, but also to get the required assistance for any and possible issues, please contact us using the

dedicated web form available at http://www.seco.com (registration required).

Our team is ready to assist.

Revision

Date

Note

Rif

1.0

19th April 2021

First official release

REVISION HISTORY

 
 SM-C93 
SM-C93 User Manual - Rev. First Edition: 1.0 - Last Edition: 1.0 - Author: A.R - Reviewed by M.B. - Copyright © 2021 SECO S.p.A. 

INDEX 
 INTRODUCTION.......................................................................................................................................................................... 4 
1 Warranty...............................................................................................................................................................................................................................5 
2 Information and assistance.....................................................................................................................................................................................................6 
3 RMA number request.............................................................................................................................................................................................................6 
4 Safety...................................................................................................................................................................................................................................7 
5 Electrostatic Discharges.........................................................................................................................................................................................................7 
6 RoHS compliance .................................................................................................................................................................................................................7 
7 Terminology and definitions ....................................................................................................................................................................................................8 
8 Reference specifications......................................................................................................................................................................................................11 
 OVERVIEW ................................................................................................................................................................................13 
1 Introduction.........................................................................................................................................................................................................................14 
2 Technical Specifications.......................................................................................................................................................................................................15 
3 Electrical Specifications........................................................................................................................................................................................................17 
3.1 Power Consumption ....................................................................................................................................................................................................17 
3.2 Power Rails meanings..................................................................................................................................................................................................18 
4 Mechanical Specifications....................................................................................................................................................................................................19 
5 Supported Operating Systems..............................................................................................................................................................................................19 
6 Block Diagram.....................................................................................................................................................................................................................20 
 CONNECTORS..........................................................................................................................................................................21 
1 Introduction.........................................................................................................................................................................................................................22 
2 Connectors description........................................................................................................................................................................................................23 
2.1 SMARC Connector......................................................................................................................................................................................................23 
 Appendices ...............................................................................................................................................................................50 
1 Thermal Design...................................................................................................................................................................................................................51 
 
 

SM-C93

•Warranty

•Information and assistance

•RMA number request

•Safety

•Electrostatic Discharges

•RoHS compliance

•Terminology and definitions

•Reference specifications

SM-C93

1.1Warranty

This product is subject to the Italian Law Decree 24/2002, acting European Directive 1999/44/CE on matters of sale and warranties to consumers.

The warranty on this product lasts for 1 year.

Under the warranty period, the Supplier guarantees the buyer assistance and service for repairing, replacing or credit of the item, at the Supplier’s own discretion.

Shipping costs that apply to non-conforming items or items that need replacement are to be paid by the customer.

Items cannot be returned unless previously authorised by the supplier.

The authorisation is released after completing the specific form available on the web-site https://www.seco.com/us/support/online-rma.html (RMA Online). The RMA

authorisation number must be put both on the packaging and on the documents shipped with the items, which must include all the accessories in their original

packaging, with no signs of damage to, or tampering with, any returned item.

The error analysis form identifying the fault type must be completed by the customer and has must accompany the returned item.

If any of the above-mentioned requirements for RMA is not satisfied, the item will be shipped back and the customer will have to pay any and all shipping costs.

Following a technical analysis, the supplier will verify if all the requirements, for which a warranty service applies, are met. If the warranty cannot be applied, the

Supplier will calculate the minimum cost of this initial analysis on the item and the repair costs. Costs for replaced components will be calculated separately.

Warning!

All changes or modifications to the equipment not explicitly approved by SECO S.p.A. could impair the equipment’s functionality

and could void the warranty

SM-C93

1.2Information and assistance

What do I have to do if the product is faulty?

SECO S.p.A. offers the following services:

•SECO website: visit http://www.seco.com to receive the latest information on the product. In most of the cases it is possible to find useful information to

solve the problem.

•SECO Sales Representative: the Sales Rep can help to determine the exact cause of the problem and search for the best solution.

•SECO Help-Desk: contact SECO Technical Assistance. A technician is at disposal to understand the exact origin of the problem and suggest the correct

solution. E-mail: technical.service@seco.com

Fax (+39) 0575 350210

•Repair center: it is possible to send the faulty product to the SECO Repair Centre. In this case, follow this procedure:

oReturned items must be accompanied by a RMA Number. Items sent without the RMA number will be not accepted.

oReturned items must be shipped in an appropriate package. SECO is not responsible for damages caused by accidental drop, improper usage, or

customer neglect.

Note: Please have the following information before asking for technical assistance:

-Name and serial number of the product;

-Description of Customer’s peripheral connections;

-Description of Customer’s software (operating system, version, application software, etc.);

-A complete description of the problem;

-The exact words of every kind of error message encountered.

1.3RMA number request

To request an RMA number, please visit SECO’s web-site. On the home page, please select “RMA Online”and follow the procedure described.

An RMA Number will be sent within 1 working day (only for on-line RMA requests).

SM-C93

1.4Safety

The SM-C93 module uses only extremely low voltages.

While handling the board, please use extreme caution to avoid any kind of risk or damages to electronic components.

1.5Electrostatic Discharges

The SM-C93 module, like any other electronic product, is an electrostatic sensitive device: high voltages caused by static electricity could damage some or all the

devices and/or components on-board.

1.6RoHS compliance

The SM-C93 module is designed using RoHS compliant components and is manufactured on a lead-free production line. It is therefore fully RoHS compliant.

Always switch the power off, and unplug the power supply unit, before handling the board and/or connecting cables or other boards.

Avoid using metallic components - like paper clips, screws and similar - near the board when connected to a power supply, to avoid

short circuits due to unwanted contacts with other board components.

If the board has become wet, never connect it to any external power supply unit or battery.

Check carefully that all cables are correctly connected and that they are not damaged.

Whenever handling a SM-C93 module, ground yourself through an anti-static wrist strap. Placement of the board on an anti-static

surface is also highly recommended.

SM-C93

1.7Terminology and definitions

ACPI Advanced Configuration and Power Interface, an open industrial standard for the board’s devices configuration and power management

AHCI Advanced Host Controller Interface, a standard which defines the operation modes of SATA interface

API Application Program Interface, a set of commands and functions that can be used by programmers for writing software for specific Operating

Systems

AVC Advanced Video Coding, a video compression standard, also known as H.264

BIOS Basic Input / Output System, the Firmware Interface that initializes the board before the OS starts loading

CAN Bus Controller Area network, a protocol designed for in-vehicle communication

DDC Display Data Channel, a kind of I2C interface for digital communication between displays and graphics processing units (GPU)

DDR Double Data Rate, a typology of memory devices which transfer data both on the rising and on the falling edge of the clock.

DP Display Port, a type of digital video display interface

eDP embedded Display Port, a type of digital video display interface developed especially for internal connections between boards and digital displays

GBE Gigabit Ethernet

Gbps Gigabits per second

GND Ground

GPI/O General purpose Input/Output

HEVC High Efficiency Video Coding, a video compression standard, also known as H.265

HD Audio High Definition Audio, most recent standard for hardware codecs developed by Intel®in 2004 for higher audio quality

HDMI High Definition Multimedia Interface, a digital audio and video interface

I2C Bus Inter-Integrated Circuit Bus, a simple serial bus consisting only of data and clock line, with multi-master capability

I2S Inter-Integrated Circuit Sound, an audio serial bus protocol interface developed by Philips (now NXP) in 1986

JPEG/MJPEG Joint Photographic Experts Group, standard method for lossy compression of digital images. Motion JPEG is a video compression format

LAN Local Area Network

LPDDR4 Low-Power Double Data Rate Synchronous Dynamic Random Access Memory, 4th generation

LVDS Low Voltage Differential Signalling, a standard for transferring data at very high speed using inexpensive twisted pair copper cables, usually used

for video applications

Mbps Megabits per second

MIPI Mobile Industry Processor Interface alliance

MMC/eMMC MultiMedia Card / embedded MMC, a type of memory card, having the same interface as the SD card. The eMMC is the embedded version of

SM-C93

the MMC. They are devices that incorporate the flash memories on a single BGA chip.

MPEG2 Standard for the generic coding of moving pictures and associated audio information

MVC Multiview Video Coding, a stereoscopic video coding standard for video compression

N.A. Not Applicable

N.C. Not Connected

OpenCL Open Computing Language, specifies programming languages for programming different devices and API

OpenGL Open Graphics Library, an Open Source API dedicated to 2D and 3D graphics

OpenVG Open Vector Graphics, an Open Source API dedicated to hardware accelerated 2D vector graphics

OS Operating System

PCI-e Peripheral Component Interface Express

PHY Abbreviation of Physical, it is the device implementing the Physical Layer of ISO/OSI-7 model for communication systems

PWM Pulse Width Modulation

PWR Power

RGMII Reduced Gigabit Media Independent Interface, a standard interface between the Ethernet Media Access Control (MAC) and the Physical Layer

(PHY)

SATA Serial Advance Technology Attachment, a differential full duplex serial interface for Hard Disks

SD Secure Digital, a memory card type

SDIO Secure Digital Input/Output, an evolution of the SD standard that allows the use of the same SD interface to drive different Input/Output devices,

like cameras, GPS, Tuners and so on.

SGET Standardization Group for Embedded Technologies

SMARC Smart Mobility Architecture, a computer Module standard maintained by the SGET

SM Bus System Management Bus, a subset of the I2C bus dedicated to communication with devices for system management, like a smart battery and

other power supply-related devices.

SOC System-on-a-chip

SPI Serial Peripheral Interface, a 4-Wire synchronous full-duplex serial interface which is composed of a master and one or more slaves, individually

enabled through a Chip Select line.

TBM To be measured

TMDS Transition-Minimized Differential Signalling, a method for transmitting high speed serial data, normally used on DVI and HDMI interfaces

UART Universal Asynchronous Receiver-Transmitter, is an asynchronous serial interface where data format and transmission speed are configurable

UEFI Unified Extensible Firmware Interface, a specification defining the interface between the OS and the board’s firmware. It is meant to replace the

original BIOS interface

SM-C93

USB Universal Serial Bus

VP8 Open video compression format, a traditional block-based transform coding format

VP9 Successor to VP8, customized for video greater than 1080p

WMV9 Series 9 of Windows Media Video, a video compression format inlcuding native support for interlaced video, non-square pixels, and frame

interpolation

SM-C93

1.8Reference specifications

Here below it is a list of applicable industry specifications and reference documents.

Reference

Link

ACPI

https://uefi.org/specifications

AHCI

http://www.intel.com/content/www/us/en/io/serial-ata/ahci.html

CAN Bus

http://www.bosch-semiconductors.de/en/ubk_semiconductors/safe/ip_modules/can_literature/can_literature.html

DDC

http://www.vesa.org

DP, eDP

http://www.vesa.org

FastEthernet

http://standards.ieee.org/about/get/802/802.3.html

Gigabit Ethernet

https://standards.ieee.org/standard/802_3-2018.html

HD Audio

http://www.intel.com/content/dam/www/public/us/en/documents/product-specifications/high-definition-audio-specification.pdf

HDMI

http://www.hdmi.org/index.aspx

I2C

http://www.nxp.com/documents/other/UM10204_v5.pdf

I2S

https://www.sparkfun.com/datasheets/BreakoutBoards/I2SBUS.pdf

Intel®Atom Elkhart Lake family

https://ark.intel.com/content/www/us/en/ark/products/codename/80644/Elkhart-lake.html#@Embedded

LVDS

http://www.ti.com/ww/en/analog/interface/lvds.shtml and http://www.ti.com/lit/ml/snla187/snla187.pdf

MIPI

http://www.mipi.org

MMC/eMMC

http://www.jedec.org/committees/jc-649

OpenGL

http://www.opengl.org

OpenVG

http://www.khronos.org/openvg

PCI Express

http://www.pcisig.com/specifications/pciexpress

SATA

https://www.sata-io.org

SMARC Design Guide 2.0

https://sget.org/wp-content/uploads/2018/09/SMARC_DG_V2.pdf

SMARC Hardware Specification

2.1.1

https://sget.org/wp-content/uploads/2020/05/SMARC_V211.pdf

SD Card Association

https://www.sdcard.org/home

SM-C93

SDIO

https://www.sdcard.org/developers/overview/sdio

SM Bus

http://www.smbus.org/specs

TMDS

http://www.siliconimage.com/technologies/tmds

UEFI

http://www.uefi.org

USB 2.0 and USB OTG

http://www.usb.org/developers/docs/usb_20_070113.zip

USB 3.0

https://usb.org.10-1-108-210.causewaynow.com/sites/default/files/usb_32_20191024.zip

SM-C93

•Introduction

•Technical Specifications

•Electrical Specifications

•Mechanical Specifications

•Supported Operating Systems

•Block Diagram

SM-C93

2.1Introduction

The SM-C93 is a SMARC Rel. 2.1.1 compliant module based on the Intel®Atom®x6000E Series and Intel®Pentium®and Celeron®N and J Series processors

(formerly Elkhart Lake) for FuSa applications, a series of Dual / Quad SOCs with 64-bit instruction set.

These new family of processors offers different use conditions, such as PC Client, Embedded and Industrial targets and is optimized for usage in vertical applications

for IOT including Industrial, Office Automation, Retail, Gaming, Healthcare, Transportation.

New features introduced by Elkhart Lake are, but not limited to the following: Time Sensitive Network (TSN) and Time Coordinate Computing (TCC) for real-time and

responsive applications, Scalability and consolidation of temporally deterministic workloads, In band and OOB remote manageability (reboot/power-on/power-off),

Platform Trust Technology (PTT), Dynamic Application Loader (DAL) and Secure Guard Extension (SGX), Intel Programmable Service Engine, Intel UHD Graphics,

media, and display supporting, Fully Integrated Voltage Regulator (FIVR). Last but not least, this is the first Intel product designed with functional safety capabilities,

made available by Intel® Safety Island (SI), a functional safety IP integrated into the Elkhart Lake Platform Control Hub (PCH), intended to raise the safety level of the

platform with a single source for managing the safety faults of the SOC.

These SOCs embed all the features usually obtained by combination of CPU + platform Controller hubs, all in one single IC, which allows, therefore, the system

minimisation and performance optimisation, which is essential for boards with sizes so reduced as for

the computing abilities of a standard board, with the possibilities of combining with a ready-to-use carrier board like the SECO CSM-B79 or customised carrier board.

The Embedded Memory Controller allows the integration of up to 16GB of LPDDR4 Memory directly soldered onboard with In-Band Error Correction Code supported

(Safety related feature) and speed up to 4267MT/s on single rank and 3733MT/s on dual rank.

All SOCs embed an Intel®Gen11 UHD Graphics controller with up to 32 Execution Units, which offer high graphical performances, with support for Microsoft®

DirectX12.1, OpenGL 4.5, OpenCLTM 1.2, OpenGL ES 3.1, Vulkan 1.1 and HW acceleration for video encoding and decoding of HEVC (H.265), H.264, VP8, VP9,

JPEG/MJPEG. It is also possible the HW video decoding only of MPEG2, VC-1.

This embedded GPU is able to drive three independent displays, by using the interfaces available on SMARC connector: one DP++ 1.4, one HMDI 1.4 or DP++ 1.4

and one eDP 1.3 or Dual Channel 18/24bit LVDS (factory alternatives).

Mass Storage capabilities of the board include one external S-ATA Gen3 channel, a standard 4-bit SD interface and one optional eMMC 5.1 Drive soldered on board

(Safety related), with up to 128GB capabilities.

Other than the interfaces already discussed previously, on SMARC connector there are the signals necessary for the implementation of 2x GbE, up to 6 ports in

USB2.0 only and up to 2 Super Speed (SS) ports (i.e. USB 3.1 Gen2 compliant), 4 x PCI-Express Gen3 lanes, HD and I2S Audio interfaces, CAN, I2C, SPI and SM

buses, up to 14 GPIOs, HS-UART and UART interfaces.

Interfacing to the board comes through a single card edge connector, whose pinout is defined by SMARC specifications Rel.2.1. For external interfacing to standard

devices, a carrier board with a 230-pin MXM connector is needed. This board will implement all the routing of the interface signals to external standard connectors,

as well as integration of other peripherals/devices not already included in SM-C93 CPU module.

Please refer to following chapter for a complete list of all peripherals integrated and characteristics.

SM-C93

2.2Technical Specifications

Processors

Intel®

13849 requirements for Functional Safety and Safety Integrity Levels:

•TCC, FuSa Certified - Ind. Temp. Range

•IHS and TCC, FuSa Certified- Ind. Temp. Range

entium®and Celeron®N and J Series CPUs:

•Celeron®J6413 Quad Core @ 1.8GHz (3.0GHZ Turbo) 10W TDP - Comm. Temp.

Range

•Celeron®N6211 Dual Core @1.2GHz (3.0GHZ Turbo) 6.5W TDP - Comm. Temp.

Range

•Pentium®J6426 Quad Core @2GHz (3.0GHZ Turbo) 10W TDP - Comm. Temp.

Range

•Pentium®N6415 Quad Core @1.2GHz (3.0GHZ Turbo) 6.5W TDP - Comm. Temp.

Range

•3GHz (3.0GHZ Turbo) 6W TDP w/ IBECC and IHS -

Ind. Temp. Range

•-

Ind. Temp. Range

•2GHz (3.0GHZ Turbo) 12W TDP w/ IBECC and IHS -

Ind. Temp. Range

•.2GHz (no Turbo) 6W TDP w/ IBECC, IHS and TCC

- Ind. Temp. Range

•w/ IBECC, IHS and TCC

- Ind. Temp. Range

•TCC - Ind. Temp. Range

(*) IHS: Integrated Heatspreader; TCC: Time Coordinated Computing

Memory

32-bit LPDDR4x Soldered Down Memory

Up to 16GB Quad Channel with In-Band Error Correction Code (IBECC, Safety

Related feature) supported

4GB Dual Channel, 8GB or 16GB Quad Channel

Speed:4267MT/s single rank (1GB/2GB/4GB/8GB), 3733MT/s dual rank (16GB)

Graphics

Up to 3 independent displays

Integrated Gen11 UHD Graphics controller with up to 32 EU

4K HW decoding and encoding of HEVC (H.265), H.264, VP8/ VP9, WMV9/VC1

(decoding only)

Video Interfaces

eDP 1.3 or Dual Channel 18/24bit LVDS interface (factory options)

2 x DP++ 1.4 or 1x DP++ 1.4 and 1x HDMI 1.4 interfaces

Video Resolution

Up to 4096 x 2160 @60Hz

Mass Storage

1 x external S-ATA Gen3 Channel

SDIO interface

Optional eMMC 5.1 drive soldered on-board (Safety Related)

PCI Express

Up to 4 x PCI-e Gen3 Lanes

Networking

2x Gigabit Ethernet PHY with precision clock synchronization and synchronous

Ethernet clock output for IEEE 1588 (Safety Related Black channel).

Optional SERDES (SGMII) Interface for additional third Gigabit Ethernet (factory

option, alternative to fourth PCI-e lane)

USB

6 x USB 2.0 Host Ports

2 x USB 3.1 Gen2 Ports

Audio

HD Audio interface

SM-C93

Serial ports

2 x HS-UARTs (Safety Related)

2 x UARTs

CAN Bus

2 x CAN interfaces

Other Interfaces

Up to 14x GPIOs

SM Bus

Power Management Signals

I2C Bus

1x SPI interface for boot

1x General Purpose SPI or eSPI (Factory Alternatives)

Functional Safety Features

FuSa Interface signals for IEC 61508 and ISO 13849

Power supply voltage: +5VDC and +3.3V_RTC

Operating System

Microsoft®Windows 10 Enterprise (64 bit)

Linux Yocto 64-bit

Operating temperature:

Commercial version 0°C ÷ +60°C **.

Industrial version -40°C ÷ +85°C **.

Dimensions: 50 x82 mm (1.97”x 3.23”)

** Measured at any point of SECO standard heatspreader for this product,

during any and all times (including start-up). Actual temperature will widely

depend on application, enclosure and/or environment. Upon customer to

consider application-specific cooling solutions for the final system to keep the

heatspreader temperature in the range indicated.

Please also check paragraph 4.1

SM-C93

2.3Electrical Specifications

According to SMARC specifications, the SM-C93 module needs to be supplied only with an external +5VDC power supply.

For Real Time Clock working and CMOS memory data retention, it is also needed a backup battery voltage. All these voltages are supplied directly through card

edge fingers (see connector’s pinout). All remaining voltages needed for board’s working are generated internally from +5VDC power rail.

2.3.1 Power Consumption

SM-C93 module, like all SMARC modules, needs a carrier board for its normal working. All connections with the external world come through this carrier board,

which provide also the required voltage to the board, deriving it from its power supply source. Anyway, it has been possible to measure power consumption directly

on VDD_IN power rail (5VDC) that supplies the board. Power consumption must be intended as average value (30 seconds acquisition).

Status

Configuration

16GB LPDDR4

128GB eMMC

4 x PCI-e

LVDS and 2x DP++

TPM 2.0

Comm Temp Range

Intel Pentium®J6425

8GB LPDDR4

128GB eMMC

4 x PCI-e

LVDS and 2x DP++

TPM 2.0

Comm Temp Range

Intel RE

16GB LPDDR4

128GB eMMC

4 x PCI-e

eDP and 2x DP++

TPM 2.0

Ind Temp Range

Intel 7FE

8GB LPDDR4

64GB eMMC

4 x PCI-e

LVDS and 2x DP++

TPM 2.0

FuSa

Ind Temp Range

Avg Value

Peak Value

Avg Value

Peak Value

Avg Value

Peak Value

Avg Value

Peak Value

Idle (Win10)

power saving

configuration

3.5W

0.7A

6.22W

1.24A

2.46W

0.49A

6.79W

1.35A

1.2A

6.3W

1.26A

6.97W

1.39A

9.71W

1.94A

OS Boot (Win10)

5.68W

1.13A

12.63W

2.52A

6.28W

1.25A

9.41W

1.88A

7.85W

1.57A

13.6W

2.72A

6.83W

1.36A

12.61W

2.52A

Video reproduction

@1080p

4.34W

0.54A

9.96W

4.27W

0.85A

11W

2.2A

6.53W

1.31A

9.12W

1.82A

7.38W

1.47A

9.49W

1.9A

Video reproduction

6.71W

1.34A

10.64W

2.12A

1.2A

11.83W

2.36A

7.76W

1.55A

10.47W

2.09A

7.76W

1.55A

10.47A

2.09A

Intel PTU (package

power limit and

TURBO Enabled)

16.12W

3.22A

19.96W

3.98A

11.22W

2.24A

16.29W

3.25A

13.68W

2.73A

14.52W

2.9A

13.39W

2.68A

14.03W

2.8A

Intel PTU (without

power limits and

TURBO Enabled)

22.91W

4.58A

24.2W

4.83A

17.36W

3.47A

18.92W

3.98A

14.46W

2.89A

15.74W

3.15A

14.39W

2.87A

15.6W

3.12A

SM-C93

Independently by the SOC mounted onboard, the following power consumptions are common to all boards:

Battery Backup power consumption: 3.11μA

Soft-Off State power consumption: 174mA

Suspend State power consumption: 176mA

2.3.2 Power Rails meanings

In all the tables contained in this manual, Power rails are named with the following meaning:

VDD_IN: Module power input voltage. +5V voltage directly coming from the card edge connector, internally named as 5V_DSW.

VDD_RTC: Low current RTC circuit backup power. 3V coin cell voltage coming from the edge card for supplying the RTC clock on the Elkhart Lake SOCs.

+3.3V_DSW: +3.3 Deep Sleep Well, derived internally from 5V_DSW

+3.3V_RUN: +3.3 Switched voltage, derived internally from +3.3V_DSW

+3.3V_ALW: +3.3 Always-on voltage, derived internally from +3.3V_DSW

+1.8V_ALW: +1.8 Always-on voltage, derived internally from 5V_DSW

+1.8V_RUN: +1.8 Switched voltage, derived internally from +1.8V_ALW

+1.8V_DSW: +1.8 Deep sleep well, derived internally from +3.3V_DSW

SM-C93

2.4Mechanical Specifications

According to SMARC®specifications, the board dimensions are: 50 x 82 mm (1.97”x

3.23”) including the pin numbering and edge finger pattern.

Printed circuit of the board is made of twelve layers, some of them are ground planes, for

disturbance rejection.

The MXM connector accommodates various connector heights for different carrier board

applications needs.

When using different connector heights, please consider that, according to SMARC

specifications, components placed on bottom side of SM-C93 will have a maximum

height of 1.3mm. Keep this value in mind when choosing the MXM connector’s height, if

there is the need to place components on the carrier board in the zone below the SMARC

module.

2.5Supported Operating Systems

SM-C93 module supports the following operating systems:

•Microsoft®Windows 10 Enterprise (64 bit)

•Linux Yocto 64-bit

SECO will offer the BSP (Board Support Package) for these O.Ss, to reduce at minimum SW development of the board, supplying all the drivers and libraries needed

for use both with the SMARC board and the Carrier Board, assuming that the Carrier Board is designed following SECO SMARC Design Guide, with the same IC’s.

For further details, please visit https://www.seco.com.

MEC1705 EC

eMMC 5.1 Drive

2x GbEthernet PHY

w/ IEEE1588 support

LPDDR4x System

Memory w/ IBECC

LPDDR4x System

Memory w/ IBECC

Power section

VDD_IN (5.0 V), V_RTC (3.0 V)

1x RGMII

FACTORY

ALTERNATIVES

NXP PTN3460

eDP-to-LVDS

2x CAN

SM Bus

Gigabit Ethernet #0

Gigabit Ethernet #1

eSPI

HD Audio

2x USB 3.0

6x USB 2.0

PCI-e #[A..C]

eMMC

1x SDIO

2x DP++

eDP

LVDS Ch. B

LVDS Ch. A

GP_I2C

Not Safety Related features

Safety Status

HW Power

Sequencing

Voltage

Supervisors

1x RGMII

Safety Related Black-Channel features

1x SATA

Safety Related features

2x HS-UARTs

2x UARTs

Safety Mgmt

Power Mgmt

Not for FuSa

FACTORY OPTIONS

14x GPIOs

FAN Management

PCI-e #D

SERDES

FACTORY

ALTERNATIVES

I2C

EEPROM

SPI 0

BIOS Flash

Intel®

Elkhart Lake

SoC

SPI 1

Gate Island

Safety Island

FACTORY

ALTERNATIVES

2.6Block Diagram

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