Seco Qseven q7-c26 User manual

Q7-C26

Qseven®Rel. 2.1 Compliant Module

with NXP i.MX 8 Applications Processors

Q7-C26

Unauthorised use, duplication, modification or disclosure of the information to a third-party by any means without prior consent of SECO S.p.A. is prohibited.

Every effort has been made to ensure the accuracy of this manual. However, SECO S.p.A. accepts no responsibility for any inaccuracies, errors or omissions herein.

SECO S.p.A. reserves the right to change precise specifications without prior notice to supply the best product possible.

For further information on this module or other SECO products, but also to get the required assistance for any and possible issues, please contact us using the

dedicated web form available at http://www.seco.com (registration required).

Our team is ready to assist.

Revision

Date

Note

Rif

1.0

04 May 2020

First Release

REVISION HISTORY

 
 Q7-C26 
Q7-C26 User Manual - Rev. First Edition: 1.0 - Last Edition: 1.0 Author: A.R - Reviewed by S.R. - Copyright © 2020 SECO S.p.A 

INDEX 
 INTRODUCTION.................................................................................................................................................................................5 
1 Warranty........................................................................................................................................................................................................................................ 6 
2 Information and assistance............................................................................................................................................................................................................. 7 
3 RMA number request..................................................................................................................................................................................................................... 7 
4 Safety............................................................................................................................................................................................................................................ 8 
5 Electrostatic Discharges.................................................................................................................................................................................................................8 
6 RoHS compliance.......................................................................................................................................................................................................................... 8 
7 Terminology and definitions ............................................................................................................................................................................................................9 
8 Reference specifications ..............................................................................................................................................................................................................11 
 OVERVIEW.......................................................................................................................................................................................12 
1 Introduction..................................................................................................................................................................................................................................13 
2 Technical Specifications...............................................................................................................................................................................................................14 
3 Electrical Specifications................................................................................................................................................................................................................15 
3.1 Power Consumption ............................................................................................................................................................................................................15 
3.2 Power Rails meanings..........................................................................................................................................................................................................16 
4 Mechanical Specifications............................................................................................................................................................................................................17 
5 Block Diagram .............................................................................................................................................................................................................................18 
 CONNECTORS................................................................................................................................................................................19 
1 Introduction..................................................................................................................................................................................................................................20 
2 Connectors description................................................................................................................................................................................................................21 
2.1 CSI Camera Connector........................................................................................................................................................................................................21 
2.2 FAN Connector....................................................................................................................................................................................................................23 
2.3 JTAG connector ..................................................................................................................................................................................................................23 
2.4 .....................................................................................................................................................................................................................23 
2.5 Qseven®Connector.............................................................................................................................................................................................................24 
2.6 PCI Express interface signals................................................................................................................................................................................................28 
2.7 UART interface signals .........................................................................................................................................................................................................29 
2.8 Gigabit Ethernet signals........................................................................................................................................................................................................30 
2.9 USB interface signals...........................................................................................................................................................................................................31 
2.10 Audio interface signals .........................................................................................................................................................................................................33 

Q7-C26

3.2.11 LVDS / eDP Flat Panel signals..............................................................................................................................................................................................33

3.2.12 HDMI / DP interface signals..................................................................................................................................................................................................34

3.2.13 SPI interface signals.............................................................................................................................................................................................................38

3.2.14 GPIO interface signals..........................................................................................................................................................................................................38

3.2.15 CAN interface signals...........................................................................................................................................................................................................38

3.2.16 SATA interface signals..........................................................................................................................................................................................................38

3.2.17 SD interface signals ............................................................................................................................................................................................................. 39

3.2.18 Power Management and Control signals...............................................................................................................................................................................39

3.2.19 Miscellaneous, Thermal Management and Fan control signals...............................................................................................................................................40

3.2.20 Manufacturing signals ..........................................................................................................................................................................................................41

Appendices .....................................................................................................................................................................................42

4.1 Thermal Design............................................................................................................................................................................................................................43

Q7-C26

•Warranty

•Information and assistance

•RMA number request

•Safety

•Electrostatic Discharges

•RoHS compliance

•Terminology and definitions

•Reference specifications

Q7-C26

1.1Warranty

This product is subject to the Italian Law Decree 24/2002, acting European Directive 1999/44/CE on matters of sale and warranties to consumers.

The warranty on this product lasts for 1 year.

Under the warranty period, the Supplier guarantees the buyer assistance and service for repairing, replacing or credit of the item, at the Supplier’s own discretion.

Shipping costs that apply to non-conforming items or items that need replacement are to be paid by the customer.

Items cannot be returned unless previously authorised by the supplier.

The authorisation is released after completing the specific form available on the web-site https://www.seco.com/us/support/online-rma.html (RMA Online). The RMA

authorisation number must be put both on the packaging and on the documents shipped with the items, which must include all the accessories in their original

packaging, with no signs of damage to, or tampering with, any returned item.

The error analysis form identifying the fault type must be completed by the customer and has must accompany the returned item.

If any of the above-mentioned requirements for RMA is not satisfied, the item will be shipped back and the customer will have to pay any and all shipping costs.

Following a technical analysis, the supplier will verify if all the requirements, for which a warranty service applies, are met. If the warranty cannot be applied, the Supplier

will calculate the minimum cost of this initial analysis on the item and the repair costs. Costs for replaced components will be calculated separately.

Warning!

All changes or modifications to the equipment not explicitly approved by SECO S.r.l. could impair the equipment’s functionality and

could void the warranty

Q7-C26

1.2Information and assistance

What do I have to do if the product is faulty?

SECO S.p.A. offers the following services:

•SECO website: visit http://www.seco.com to receive the latest information on the product. In most of the cases it is possible to find useful information to

solve the problem.

•SECO Sales Representative: the Sales Rep can help to determine the exact cause of the problem and search for the best solution.

•SECO Help-Desk: contact SECO Technical Assistance. A technician is at disposal to understand the exact origin of the problem and suggest the correct

solution. E-mail: technical.se[email protected]

Fax (+39) 0575 350210

•Repair center: it is possible to send the faulty product to the SECO Repair Centre. In this case, follow this procedure:

oReturned items must be accompanied by a RMA Number. Items sent without the RMA number will be not accepted.

oReturned items must be shipped in an appropriate package. SECO is not responsible for damages caused by accidental drop, improper usage, or

customer neglect.

Note: Please have the following information before asking for technical assistance:

-Name and serial number of the product;

-Description of Customer’s peripheral connections;

-Description of Customer’s software (operating system, version, application software, etc.);

-A complete description of the problem;

-The exact words of every kind of error message encountered.

1.3RMA number request

To request a RMA number, please visit SECO’s web-site. On the home page, please select “RMA Online”and follow the procedure described.

A RMA Number will be sent within 1 working day (only for on-line RMA requests).

Q7-C26

1.4Safety

The Q7-C26 module uses only extremely low voltages.

While handling the board, please use extreme caution to avoid any kind of risk or damages to electronic components.

1.5 Electrostatic Discharges

The Q7-C26 module, like any other electronic product, is an electrostatic sensitive device: high voltages caused by static electricity could damage some or all the

devices and/or components on-board.

1.6 RoHS compliance

The Q7-C26 module is designed using RoHS compliant components and is manufactured on a lead-free production line. It is therefore fully RoHS compliant.

Always switch the power off, and unplug the power supply unit, before handling the board and/or connecting cables or other boards.

Avoid using metallic components - like paper clips, screws and similar - near the board when connected to a power supply, to avoid

short circuits due to unwanted contacts with other board components.

If the board has become wet, never connect it to any external power supply unit or battery.

Check carefully that all cables are correctly connected and that they are not damaged.

Whenever handling a Q7-C26 module, ground yourself through an anti-static wrist strap. Placement of the board on an anti-static

surface is also highly recommended.

Q7-C26

1.7 Terminology and definitions

API Application Program Interface, a set of commands and functions that can be used by programmers for writing software for specific Operating

Systems

CAN Bus Controller Area network, a protocol designed for in-vehicle communication

CEC Consumer Electronics Control, an HDMI feature which allows controlling more devices connected together by using only one remote control

CSI2 MIPI Camera Serial Interface, 2nd generation standard regulating communication between a peripheral device (camera) and a host processor

DDC Display Data Channel, a kind of I2C interface for digital communication between displays and graphics processing units (GPU)

DDR Double Data Rate, a typology of memory devices which transfer data both on the rising and on the falling edge of the clock.

DP Display Port, a type of digital video display interface

DVI Digital Visual interface, a type of display video interface

eDP embedded Display Port, a type of digital video display interface developed especially for internal connections between boards and digital displays

FFC/FPC Flexible Flat Cable / Flat Panel Cable

GBE Gigabit Ethernet

Gbps Gigabits per second

GND Ground

GPI/O General purpose Input/Output

HDMI High Definition Multimedia Interface, a digital audio and video interface

I2C Bus Inter-Integrated Circuit Bus, a simple serial bus consisting only of data and clock line, with multi-master capability

I2S Inter-Integrated Circuit Sound, an audio serial bus protocol interface developed by Philips (now NXP) in 1986

JTAG Joint Test Action Group, common name of IEEE1149.1 standard for testing printed circuit boards and integrated circuits through the Debug port

LPDDR4 Low-Power Double Data Rate Synchronous Dynamic Random Access Memory, 4th generation

LVDS Low Voltage Differential Signalling, a standard for transferring data at very high speed using inexpensive twisted pair copper cables, usually used

for video applications

Mbps Megabits per second

MIPI Mobile Industry Processor Interface alliance

MMC/eMMC MultiMedia Card / embedded MMC, a type of memory card, having the same interface as the SD card. The eMMC is the embedded version of

the MMC. They are devices that incorporate the flash memories on a single BGA chip.

N.A. Not Applicable

N.C. Not Connected

Q7-C26

OpenGL Open Graphics Library, an Open Source API dedicated to 2D and 3D graphics

OpenVG Open Vector Graphics, an Open Source API dedicated to hardware accelerated 2D vector graphics

OTG On-the-Go, a specification that allows to USB devices to act indifferently as Host or as a Client, depending on the device connected to the port.

PCI-e Peripheral Component Interface Express

PHY Abbreviation of Physical, it is the device implementing the Physical Layer of ISO/OSI-7 model for communication systems

PWM Pulse Width Modulation

PWR Power

RGMII Reduced Gigabit Reduced Media Independent Interface, a standard interface between the Ethernet Media Access Control (MAC) and the Physical

Layer (PHY)

SATA Serial Advance Technology Attachment, a differential half duplex serial interface for Hard Disks

SD Secure Digital, a memory card type

SDIO Secure Digital Input/Output, an evolution of the SD standard that allows the use of the same SD interface to drive different Input/Output devices,

like cameras, GPS, Tuners and so on.

SM Bus System Management Bus, a subset of the I2C bus dedicated to communication with devices for system management, like a smart battery and

other power supply-related devices.

SPI Serial Peripheral Interface, a 4-Wire synchronous full-duplex serial interface which is composed of a master and one or more slaves, individually

enabled through a Chip Select line.

TBM To be measured

TMDS Transition-Minimized Differential Signalling, a method for transmitting high speed serial data, normally used on DVI and HDMI interfaces

TTL Transistor-transistor Logic

USB Universal Serial Bus

uSDHC Ultra Secure Digital Host Controller

Q7-C26

1.8 Reference specifications

Here below it is a list of applicable industry specifications and reference documents.

Reference

Link

CAN Bus

http://www.bosch-semiconductors.de/en/ubk_semiconductors/safe/ip_modules/can_literature/can_literature.html

CSI

http://www.mipi.org/specifications/camera-interface

DDC

http://www.vesa.org

DP, eDP

http://www.vesa.org

FasEthernet

http://standards.ieee.org/about/get/802/802.3.html

Gigabit Ethernet

http://standards.ieee.org/about/get/802/802.3.html

HDMI

http://www.hdmi.org/index.aspx

I2C

http://www.nxp.com/documents/other/UM10204_v5.pdf

I2S

https://www.sparkfun.com/datasheets/BreakoutBoards/I2SBUS.pdf

LVDS

http://www.ti.com/ww/en/analog/interface/lvds.shtml and http://www.ti.com/lit/ml/snla187/snla187.pdf

MIPI

http://www.mipi.org

MMC/eMMC

http://www.jedec.org/committees/jc-649

NXP i.MX8 processor

https://www.nxp.com/products/processors-and-microcontrollers/arm-processors/i-mx-applications-processors/i-mx-8-processors/i-mx-8-family-arm-cortex-a53-cortex-

a72-virtualization-vision-3d-graphics-4k-video:i.MX8

OpenGL

http://www.opengl.org

OpenVG

http://www.khronos.org/openvg

PCI Express

http://www.pcisig.com/specifications/pciexpress

Qseven®Design Guide

https://sget.org/wp-content/uploads/2018/09/Qseven_Design_Guide_2_0.pdf

Qseven®specifications

https://sget.org/wp-content/uploads/2018/09/Qseven-Spec_2.1.pdf

SATA

https://www.sata-io.org

SD Card Association

https://www.sdcard.org/home

SDIO

https://www.sdcard.org/developers/overview/sdio

SM Bus

http://www.smbus.org/specs

TMDS

http://www.siliconimage.com/technologies/tmds

USB 2.0 and USB OTG

http://www.usb.org/developers/docs/usb_20_070113.zip

USB 3.0

http://www.usb.org/developers/docs/usb_30_spec_070113.zip

Q7-C26

•Introduction

•Technical Specifications

•Electrical Specifications

•Mechanical Specifications

•Block Diagram

Q7-C26

2.1Introduction

The Q7-C26 is a Q7 Rel. 2.1 compliant module with NXP i.MX 8 Applications Processors. Featuring multicore processing (Single or Dual ARM Cortex®-A72 cores

+ Quad ARM Cortex®-A53 cores + Dual general purpose Cortex®-M4 processor) and 4Kp60 HEVC decoding, it is a scalable solution designed by SECO for home

automation, transportation, digital signage and vending machines, and applicable to scenarios requiring advanced security, connectivity, multimedia and real-time

response.

The module offers a very high level of integration, both for all most common used peripherals in the ARM domain and for bus interfaces typically used in the x86

domain, like PCI-Express.

Presented in the Q7 form factor, offering the computing abilities of a standard board, with the possibilities of combining with a ready-to-use carrier board like the

SECO CQ7-A42 or customised carrier board.

For external interfacing to standard devices, a carrier board with a 230-pin MXM connector is needed. This board will implement all the routing of the interface signals

to external standard connectors, as well as the integration of other peripherals/devices not already included in Q7-C26 module.

2.2Technical Specifications

Processors

NXP i.MX 8 Family based on ARM Cortex®-A72 cores + general purpose

Cortex®-M4F processor:

-i.MX 8QuadMax - 2x Cortex®-A72 cores + 4x Cortex®-A53 cores + 2x

Cortex®-M4F cores

-i.MX 8QuadPlus - 1x Cortex®-A72 cores + 4x Cortex®-A53 cores + 2x

Cortex®-M4F cores

Memory

Soldered down LPDDR4-3200 memory, 64-bit interface, up to 8GB

Graphics

Integrated Graphics Processing Unit, supports 2 independent displays.

Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264, MPEG-2,

VC-1, RV9, VP8, H.263 and MPEG4 part, HW encoding of AVC/H.264

Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 3.x, DirectX 11

Video Interfaces

HDMI 2.0a / DP 1.3 or eDP 1.4 interface, supporting HDCP 2.2

Dual Channel or 2 x Single Channel 18- / 24-bit LVDS interface (1 x Single

Channel in case of eDP interface available)

Video Resolution

HDMI / DP / eDP resolution up to 4096x2160 @ 60Hz

LVDS, resolution up to 1920x1080 @ 60Hz

Mass Storage

1x SATA Gen3 interface

eMMC 5.1 drive soldered on-board, up to 64GB

SD 4-bit interface

4MB QSPI Flash soldered-on-board

PCI Express

2 x PCI-e x1 Gen3 ports

Networking

1 x Gigabit Ethernet interface

USB

4 x USB 2.0 Host Ports

1 x USB 3.0 Host Port

1 x USB 2.0 OTG port

Audio

I2S Audio interface

Serial ports

1x UART Tx/Rx/RTS/CTS

1x CAN Bus (TTL level)

Other Interfaces

CSI camera connector

2x I2C Bus

SPI interface

8 x GPI/Os

Boot select signal

Power Management Signals

Watchdog

Power supply voltage: +5VDC ±5% and

RTC voltage: +3V_RTC

Operating System

Linux

Yocto

Android

Operating temperature:

Commercial version 0°C ÷ +60°C **.

Industrial version -40°C ÷ +85°C **.

Dimensions: 70 x 70 mm (2.76”x 2.76”)

** Measured at any point of SECO standard heatspreader for this product,

during any and all times (including start-up). Actual temperature will widely

depend on application, enclosure and/or environment. Upon customer to

consider application-specific cooling solutions for the final system to keep the

heatspreader temperature in the range indicated.

Please also check paragraph 4.1

Q7-C26

2.3Electrical Specifications

According to Qseven®specifications, Q7-C26 board needs to be supplied only with an external +5VDC power supply.

5 Volts standby voltage needs to be supplied for working in ATX mode.

For Real Time Clock working and CMOS memory data retention, it is also needed a backup battery voltage. All these voltages are supplied directly through card

edge fingers (see connector’s pinout).

All remaining voltages needed for board’s working are generated internally from +5V_RUN power rail.

2.3.1 Power Consumption

Q7-C26 module, like all Qseven modules, needs a carrier board for its normal working. All connections with the external world come through this carrier board, which

provide also the required voltage to the board, deriving it from its power supply source.

Anyway, it has been possible to measure power consumption directly on VCC power rail (5VDC)that supplies the board.

The power consumption has been measured in a Q7-C26 module with the following configuration on the commercial version:

-CPU iMX8 QuadMax 1.6GHz

-RAM LPDDR4 4GB, eMMC 8 GB

-LVDS + HDMI/DP video outputs

Status

Average value

Peak Value

Idle at U-Boot

3.28W, 0.66A

3.33W, 0.67A

Boot to OS

4.64W, 0.93A

8.69W, 1.74A

Idle

4.75W, 0.95A

5.23W, 1.05A

Video 1080p 60fps

6.85W, 1.37A

8.65W, 1.73A

Playing internal demo tutorial

5.95W, 1.19A

8.65W, 1.73A

Internal Stress Test tool

13.8W, 2.76A

14.2W, 2.84A

Q7-C26

Please consider that power consumption is strongly dependent on the board’s configuration, on number of processor cores active and from the interfaces that are

SW enabled.

2.3.2 Power Rails meanings

In all the tables contained in this manual, Power rails are named with the following meaning:

VCC: Power Supply +5VDC ±5%

VCC_5V_SB: Standby Power Supply +5VDC ±5%

VCC_RTC: 3V backup cell input. VCC_RTC is connected to a 3V backup cell for RTC operation and storage register non-volatility in the absence of system power

_RUN: Switched voltages, i.e. power rails that are active only when the board is in ACPI’s S0 (Working) state. Examples: +3.3V_RUN, +5V_RUN.

_ALW: Always-on voltages, i.e. power rails that are active both in ACPI’s S0 (Working), S3 (Standby) and S5 (Soft Off) state. Examples: +5V_ALW, +3.3V_ALW.

Suspend to RAM (typical)

TBD

Soft Off (typical)

30mA

RTC Power consumption (typical)

230nA

Q7-C26

2.4Mechanical Specifications

According to Qseven®specifications, board dimensions are: 70 x 70 mm (2.76”x 2.76”).

Printed circuit of the board is made of twelve layers, some of them are ground planes, for disturbance

rejection.

The MXM connector accommodates various connector heights for different carrier board applications

needs. Qseven®specification suggests two connector heights, 7.8mm and 7.5mm, but it is also

possible to use different connector heights, also remaining compliant to the standard.

When using different connector heights, please consider that, according to Qseven®specifications,

components placed on bottom side of Q7-C26 will have a maximum height of 2.2mm ± 0.1. Keep

this value in mind when choosing the MXM connector’s height, if it is needed to place components on

the carrier board in the zone below the Qseven®module.

Q7-C26

FACTORY

ALTERNATIVES

eMMC Drive

NXP i.MX8

Application

processor

LPDDR4 Memory

Power section

1x SATA

1x USB 2.0 OTG

Boot Select Signals

Watchdog

Power Mgmt

+5V_RUN, +5V_ALW

Embedded Controller

4x USB 2.0

USB HSIC Hub

1 x Gigabit Ethernet

Transceiver

GbEthernet

1x USB 3.0

GP & PM I2C

CAN

I2S

8 GPIO

LVDS

HDMI/DP or eDP

Low Power RTC

QSPI Flash

2x PCI-e x1

CSI Camera

connector

+3.3V_RTC

1x UART

SPI

2.5Block Diagram

Q7-C26

•Introduction

•Connectors description

Q7-C26

3.1Introduction

According to Qseven®specifications, all interfaces to the board are available through a single card edge connector.

Moreover, an additional CSI Camera connector, a JTAG connector, a FAN connector and micro SD slot have been placed.

TOP SIDE

Card edge golden

finger, pin 228

Fan

connector

Card edge golden

finger, pin 2

Card edge golden

finger, pin 1

Card edge golden

finger, pin 229

BOTTOM SIDE

CSI Camera

connector

JTAG

connector

Slot

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