Seco Sm-c12 User manual

SM-C12

SMARC Rel. 2.0 compliant module with

NXP i.MX 8M Applications Processors

SM-C12

Unauthorised use, duplication, modification or disclosure of the information to a third-party by any means without prior consent of SECO S.p.A. is prohibited.

Every effort has been made to ensure the accuracy of this manual. However, SECO S.p.A. accepts no responsibility for any inaccuracies, errors or omissions herein.

SECO S.p.A. reserves the right to change precise specifications without prior notice to supply the best product possible.

For further information on this module or other SECO products, but also to get the required assistance for any and possible issues, please contact us using the

dedicated web form available at http://www.seco.com (registration required).

Our team is ready to assist.

Revision

Date

Note

Rif

1.0

14th May 2019

First official release

REVISION HISTORY

 
 SM-C12 
SM-C12 User Manual - Rev. First Edition: 1.0 - Last Edition: 1.0 - Authors: S.B. and L.G - Reviewed by N.P. - Copyright © 2019 SECO S.p.A. 

INDEX 
 INTRODUCTION.......................................................................................................................................................................... 4 
1 Warranty........................................................................................................................................................................................................................................ 5 
2 Information and assistance............................................................................................................................................................................................................. 6 
3 RMA number request..................................................................................................................................................................................................................... 6 
4 Safety............................................................................................................................................................................................................................................ 7 
5 Electrostatic Discharges.................................................................................................................................................................................................................7 
6 RoHS compliance.......................................................................................................................................................................................................................... 7 
7 Terminology and definitions ............................................................................................................................................................................................................ 8 
8 Reference specifications .............................................................................................................................................................................................................. 10 
 OVERVIEW ............................................................................................................................................................................... 11 
1 Introduction.................................................................................................................................................................................................................................. 12 
2 Technical Specifications...............................................................................................................................................................................................................13 
3 Electrical Specifications................................................................................................................................................................................................................14 
3.1 Power Consumption ...........................................................................................................................................................................................................14 
3.2 Power Rails meanings.......................................................................................................................................................................................................... 14 
4 Mechanical Specifications............................................................................................................................................................................................................15 
5 Supported Operating Systems .....................................................................................................................................................................................................15 
6 Block Diagram ............................................................................................................................................................................................................................. 16 
 CONNECTORS......................................................................................................................................................................... 17 
1 Introduction.................................................................................................................................................................................................................................. 18 
2 Connectors description................................................................................................................................................................................................................19 
2.1 SMARC Connector..............................................................................................................................................................................................................19 
 Appendices.............................................................................................................................................................................. 34
1 Thermal Design............................................................................................................................................................................................................................35 
 
 

SM-C12

•Warranty

•Information and assistance

•RMA number request

•Safety

•Electrostatic Discharges

•RoHS compliance

•Terminology and definitions

•Reference specifications

SM-C12

1.1Warranty

This product is subject to the Italian Law Decree 24/2002, acting European Directive 1999/44/CE on matters of sale and warranties to consumers.

The warranty on this product lasts for 1 year.

Under the warranty period, the Supplier guarantees the buyer assistance and service for repairing, replacing or credit of the item, at the Supplier’s own discretion.

Shipping costs that apply to non-conforming items or items that need replacement are to be paid by the customer.

Items cannot be returned unless previously authorised by the supplier.

The authorisation is released after completing the specific form available on the web-site https://www.seco.com/us/support/online-rma.html (RMA Online). The RMA

authorisation number must be put both on the packaging and on the documents shipped with the items, which must include all the accessories in their original

packaging, with no signs of damage to, or tampering with, any returned item.

The error analysis form identifying the fault type must be completed by the customer and has must accompany the returned item.

If any of the above-mentioned requirements for RMA is not satisfied, the item will be shipped back and the customer will have to pay any and all shipping costs.

Following a technical analysis, the supplier will verify if all the requirements, for which a warranty service applies, are met. If the warranty cannot be applied, the

Supplier will calculate the minimum cost of this initial analysis on the item and the repair costs. Costs for replaced components will be calculated separately.

Warning!

All changes or modifications to the equipment not explicitly approved by SECO S.p.A. could impair the equipment’s functionality

and could void the warranty

SM-C12

1.2Information and assistance

What do I have to do if the product is faulty?

SECO S.p.A. offers the following services:

•SECO website: visit http://www.seco.com to receive the latest information on the product. In most of the cases it is possible to find useful information to

solve the problem.

•SECO Sales Representative: the Sales Rep can help to determine the exact cause of the problem and search for the best solution.

•SECO Help-Desk: contact SECO Technical Assistance. A technician is at disposal to understand the exact origin of the problem and suggest the correct

solution. E-mail: technical.se[email protected]

Fax (+39) 0575 350210

•Repair center: it is possible to send the faulty product to the SECO Repair Centre. In this case, follow this procedure:

oReturned items must be accompanied by a RMA Number. Items sent without the RMA number will be not accepted.

oReturned items must be shipped in an appropriate package. SECO is not responsible for damages caused by accidental drop, improper usage, or

customer neglect.

Note: Please have the following information before asking for technical assistance:

-Name and serial number of the product;

-Description of Customer’s peripheral connections;

-Description of Customer’s software (operating system, version, application software, etc.);

-A complete description of the problem;

-The exact words of every kind of error message encountered.

1.3RMA number request

To request an RMA number, please visit SECO’s web-site. On the home page, please select “RMA Online”and follow the procedure described.

An RMA Number will be sent within 1 working day (only for on-line RMA requests).

SM-C12

1.4Safety

The SM-C12 module uses only extremely low voltages.

While handling the board, please use extreme caution to avoid any kind of risk or damages to electronic components.

1.5 Electrostatic Discharges

The SM-C12 module, like any other electronic product, is an electrostatic sensitive device: high voltages caused by static electricity could damage some or all the

devices and/or components on-board.

1.6 RoHS compliance

The SM-C12 module is designed using RoHS compliant components and is manufactured on a lead-free production line. It is therefore fully RoHS compliant.

Always switch the power off, and unplug the power supply unit, before handling the board and/or connecting cables or other boards.

Avoid using metallic components - like paper clips, screws and similar - near the board when connected to a power supply, to avoid

short circuits due to unwanted contacts with other board components.

If the board has become wet, never connect it to any external power supply unit or battery.

Check carefully that all cables are correctly connected and that they are not damaged.

Whenever handling a SM-C12 module, ground yourself through an anti-static wrist strap. Placement of the board on an anti-static

surface is also highly recommended.

SM-C12

1.7 Terminology and definitions

API Application Program Interface, a set of commands and functions that can be used by programmers for writing software for specific Operating

Systems

CAN Bus Controller Area network, a protocol designed for in-vehicle communication

CSI2 MIPI Camera Serial Interface, 2nd generation standard regulating communication between a peripheral device (camera) and a host processor

DDC Display Data Channel, a kind of I2C interface for digital communication between displays and graphics processing units (GPU)

DDR Double Data Rate, a typology of memory devices which transfer data both on the rising and on the falling edge of the clock.

DVI Digital Visual interface, a type of display video interface

FFC/FPC Flexible Flat Cable / Flat Panel Cable

GBE Gigabit Ethernet

Gbps Gigabits per second

GND Ground

GPI/O General purpose Input/Output

HDMI High Definition Multimedia Interface, a digital audio and video interface

I2C Bus Inter-Integrated Circuit Bus, a simple serial bus consisting only of data and clock line, with multi-master capability

I2S Inter-Integrated Circuit Sound, an audio serial bus protocol interface developed by Philips (now NXP) in 1986

LPDDR4 Low-Power Double Data Rate Synchronous Dynamic Random Access Memory, 4th generation

LVDS Low Voltage Differential Signalling, a standard for transferring data at very high speed using inexpensive twisted pair copper cables, usually used

for video applications

Mbps Megabits per second

MIPI Mobile Industry Processor Interface alliance

MMC/eMMC MultiMedia Card / embedded MMC, a type of memory card, having the same interface as the SD card. The eMMC is the embedded version of

the MMC. They are devices that incorporate the flash memories on a single BGA chip.

N.A. Not Applicable

N.C. Not Connected

OpenGL Open Graphics Library, an Open Source API dedicated to 2D and 3D graphics

OpenVG Open Vector Graphics, an Open Source API dedicated to hardware accelerated 2D vector graphics

OTG On-the-Go, a specification that allows to USB devices to act indifferently as Host or as a Client, depending on the device connected to the port.

PCI-e Peripheral Component Interface Express

SM-C12

PWM Pulse Width Modulation

PWR Power

RGMII Reduced Gigabit Reduced Media Independent Interface, a standard interface between the Ethernet Media Access Control (MAC) and the Physical

Layer (PHY)

SD Secure Digital, a memory card type

SDIO Secure Digital Input/Output, an evolution of the SD standard that allows the use of the same SD interface to drive different Input/Output devices,

like cameras, GPS, Tuners and so on.

SM Bus System Management Bus, a subset of the I2C bus dedicated to communication with devices for system management, like a smart battery and

other power supply-related devices.

SPI Serial Peripheral Interface, a 4-Wire synchronous full-duplex serial interface which is composed of a master and one or more slaves, individually

enabled through a Chip Select line.

TBM To be measured

TMDS Transition-Minimized Differential Signalling, a method for transmitting high speed serial data, normally used on DVI and HDMI interfaces

TTL Transistor-transistor Logic

USB Universal Serial Bus

uSDHC Ultra Secure Digital Host Controller

SM-C12

1.8 Reference specifications

Here below it is a list of applicable industry specifications and reference documents.

Reference

Link

CAN Bus

http://www.bosch-semiconductors.de/en/ubk_semiconductors/safe/ip_modules/can_literature/can_literature.html

CSI

http://www.mipi.org/specifications/camera-interface

DDC

http://www.vesa.org

FasEthernet

http://standards.ieee.org/about/get/802/802.3.html

HDMI

http://www.hdmi.org/index.aspx

I2C

http://www.nxp.com/documents/other/UM10204_v5.pdf

I2S

https://www.sparkfun.com/datasheets/BreakoutBoards/I2SBUS.pdf

LVDS

http://www.ti.com/ww/en/analog/interface/lvds.shtml and http://www.ti.com/lit/ml/snla187/snla187.pdf

MIPI

http://www.mipi.org

MMC/eMMC

http://www.jedec.org/committees/jc-649

NXP i.MX 8M processor

https://www.nxp.com/products/processors-and-microcontrollers/arm-based-processors-and-mcus/i.mx-applications-processors/i.mx-

8-processors/i.mx-8m-family-armcortex-a53-cortex-m4-audio-voice-video:i.MX8M

OpenGL

http://www.opengl.org

OpenVG

http://www.khronos.org/openvg

PCI Express

http://www.pcisig.com/specifications/pciexpress

SMARC Design Guide 2.0

https://www.sget.org/fileadmin/user_upload/SMARC_DG_V2.pdf

SMARC Hardware Specification

2.0

https://sget.org/wp-content/uploads/2018/09/SMARC_Hardware_Specification_V200_Errata.zip

SD Card Association

https://www.sdcard.org/home

SDIO

https://www.sdcard.org/developers/overview/sdio

SM Bus

http://www.smbus.org/specs

TMDS

http://www.siliconimage.com/technologies/tmds

USB 2.0 and USB OTG

http://www.usb.org/developers/docs/usb_20_070113.zip

SM-C12

•Introduction

•Technical Specifications

•Electrical Specifications

•Mechanical Specifications

•Supported Operating Systems

•Block Diagram

SM-C12

2.1Introduction

The SM-C12 is a SMARC Rel. 2.0 compliant module with NXP i.MX 8M Applications Processors. Featuring multicore processing (Dual or Quad ARM Cortex®-A53

cores + general purpose Cortex®-M4 processor) and 4Kp60 HEVC decoding with HDR, it is a scalable solution designed by SECO for home automation,

transportation, digital signage and vending machines, and applicable to scenarios requiring advanced security, connectivity, multimedia and real-time response.

The module offers a very high level of integration, both for all most common used peripherals in the ARM domain and for bus interfaces typically used in the x86

domain, like PCI-Express

Presented in the SMARC (“Smart Mobility ARChitecture”) form factor, offering the computing abilities of a standard board, with the possibilities of combining with a

ready-to-use carrier board like the SECO CSM-B79 or customised carrier board.

For external interfacing to standard devices, a carrier board with a 314-pin MXM connector is needed. This board will implement all the routing of the interface signals

to external standard connectors, as well as the integration of other peripherals/devices not already included in SM-C12 module.

2.2Technical Specifications

Processors

NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose

Cortex®-M4 processor:

-i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz

-i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz

-i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU

Memory

Soldered Down LPDDR4-3200 memory, 32-bit interface, up to 4GB

Graphics

Integrated Graphics Processing Unit, supports 2 independent displays.

Embedded VPU (not available on QuadLite), supports H/W decoding of HEVC,

H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG

Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 2.X, Vulkan, DirectX, Open VG

1.1

Video Interfaces

1 x HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4

1 x LVDS 18/24-bit Dual Channel or 1 x MIPI-DSI interface (factory alternatives)

Video Resolution

HDMI, resolution up to 4096x2160 @ 60Hz

MIPI-DSI, LVDS, resolution up to 1920x1080 @ 60Hz

Mass Storage

eMMC 5.0 Drive soldered on-board

Optional SD 4-bit interface

8MB QuadSPI Flash

PCI Express

2 x PCI-e x1 Gen2 ports

Networking

1 x Gigabit Ethernet interface

Optional WiFi + BT LE module onboard

USB

1 x USB 2.0 OTG port

USB 3.0 Hub onboard, makes available

-2 x USB 2.0 ports

-2 x USB 3.0 Superspeed ports

Audio

I2S Audio interface

Serial ports

Up to 2x UART Tx/Rx/RTS/CTS

2x UART Tx/Rx

1x CAN Bus

Other Interfaces

1x 4-lanes + 1x 2-lanes CSI camera interfaces

I2C Bus

SM Bus

2x SPI interfaces

QuadSPI interface

12 x GPI/Os

Boot select signals

Power Management Signals

Power supply voltage: +5VDC

RTC voltage: 3.3V

Operating temperature:

Commercial version 0°C ÷ +60°C **.

Industrial version -40°C ÷ +85°C **.

Dimensions: 50 x82 mm (1.97”x 3.23”)

** Measured at any point of SECO standard heatspreader for this product,

during any and all times (including start-up). Actual temperature will widely

depend on application, enclosure and/or environment. Upon customer to

consider application-specific cooling solutions for the final system to keep the

heatspreader temperature in the range indicated.

Please also check paragraph 4.1

2.3Electrical Specifications

According to SMARC specifications, the SM-C12 module needs to be supplied only with an external +5VDC power supply.

For Real Time Clock working and CMOS memory data retention, it is also needed a backup battery voltage. All these voltages are supplied directly through card

edge fingers (see connector’s pinout).

All remaining voltages needed for board’s working are generated internally from +5VDC power rail.

2.3.1 Power Consumption

SM-C12 module, like all SMARC modules, needs a carrier board for its normal working. All connections with the external world come through this carrier board,

which provide also the required voltage to the board, deriving it from its power supply source.

Anyway, it has been possible to measure power consumption directly on VDD_IN power rail (5VDC)that supplies the board.

Please consider that power consumption is strongly dependent on the board’s configuration, on number of processor cores active and from the interfaces that are

SW enabled.

2.3.2 Power Rails meanings

In all the tables contained in this manual, Power rails are named with the following meaning:

VDD_IN: Module power input voltage. +5V voltage directly coming from the card edge connector.

VDD_RTC: Low current RTC circuit backup power. 3V coin cell voltage coming from the edge card for supplying the RTC clock on the I.MX 8M

+3.3V_S: +3.3 switched voltage, derived internally.

+1.8V_S: +1.8 switched voltage, derived internally.

Status

Processor

i.MX8M Quad

2GB LPDDR4

8GB eMMC

i.MX8M QuadLite

1GB LPDDR4

8GB eMMC

i.MX8M Dual

Idle

3.2W

3.4W

TBM

GPU working at full load, video output on LVDS

4.5W

TBM

VPU working, video reproduction of a 1080p 60fps video on HDMI

3.7W

N.A.

TBM

RTC Power consumption on VDD_RTC (when VDD_IN off)

270nA

SM-C12

2.4 Mechanical Specifications

According to SMARC®specifications, the board dimensions are: 50 x 82 mm (1.97”x 3.23”)

including the pin numbering and edge finger pattern.

Printed circuit ofthe board is made of ten layers, some of themare ground planes, for disturbance

rejection.

The MXM connector accommodates various connector heights for different carrier board

applications needs.

When using different connector heights, please consider that, according to SMARC

specifications, components placed on bottom side of SM-C12 will have a maximum height of

1.3mm. Keep this value in mind when choosing the MXM connector’s height, if there is the need

to place components on the carrier board in the zone below the SMARC module.

2.5 Supported Operating Systems

SM-C12 module supports the following operating systems:

•Linux

•Android

SECO will offer the BSP (Board Support Package) for these O.Ss, to reduce at minimum SW development of the board, supplying all the drivers and libraries needed

for use both with the SMARC board and the Carrier Board, assuming that the Carrier Board is designed following SECO SMARC Design Guide, with the same IC’s.

For further details, please visit https://www.seco.com.

SM-C12

2.6 Block Diagram

Factory

Alternatives

Factory

Alternatives

Factory

Alternatives

1x SD

WiFi + BTLE

Module

eMMC Drive

NXP i.MX8M

Application

processor

DSI-to-LVDS

Bridge

LPDDR4 Memory

Power section

+3.3V_RTC

LVDS

1x USB 2.0

Boot Select Signals

QSPI Flash

Watchdog

Power Mgmt

+5V_S

Embedded

Controller

2x USB 2.0

USB 3.0 Hub

1 x Gigabit

Ethernet

Transceiver

GbEthernet

2x USB 3.0

UART #2

Mipi-DSI

UART #0 #1 #3

HDMI

2x CSI

2x PCI-e

I2S

12x GPIO

GP & PM I2C

ESPI

CAN Controller

Low Power RTC

ECSPI1

CAN

USB_2

USB_1

RGMII

I2C_1

SPI0

SM-C12

•Introduction

•Connectors description

SM-C12

3.1Introduction

According to SMARC specifications, all interfaces to the board are available through a single card edge connector.

TOP SIDE

Card edge golden

finger, pin P1

Card edge golden

finger, pin P156

Card edge golden

finger, pin S158

Card edge golden

finger, pin S1

BOTTOM SIDE

SM-C12

3.2 Connectors description

3.2.1 SMARC Connector

According to SMARC Rel 2.0 specification, all interface signals are reported on the card edge connector, which is a 314-pin Card Edge that can be inserted into

standard low profile 314 pin 0.5mm right pitch angle connector that was originally defined for use with MXM3 graphics cards.

Not all signals contemplated in the SMARC Rel 2.0 are implemented on card edge connector, therefore, please refer to the following table for a list of effective signals

reported on the card edge connector.

For accurate signals description, please consult the following paragraphs.

SMARC Golden Finger Connector - CN4

TOP SIDE

BOTTOM SIDE

SIGNAL GROUP

Type

Pin name

Pin nr.

Pin name

Type

SIGNAL GROUP

I2C_CAM1_CK

I/O

CAMERA

MANAGEMENT

SMB_ALERT_1V8#

I2C_CAM1_DAT

I/O

CAMERA

GND

CAMERA

CSI1_CK+

RSVD

CAMERA

CSI1_CK-

I2C_CAM0_CK

I/O

CAMERA

N.C.

CAM_MCK

CAMERA

N.C

I2C_CAM0_DAT

I/O

CAMERA

CSI1_RX0+

CSI0_CK+

CAMERA

CSI1_RX0-

CSI0_CK-

CAMERA

GND

S10

GND

CAMERA

CSI1_RX1+

P10

S11

CSI0_RX0+

CAMERA

CSI1_RX1-

P11

S12

CSI0_RX0-

CAMERA

GND

P12

S13

GND

CAMERA

CSI1_RX2+

P13

S14

CSI0_RX1+

CAMERA

CSI1_RX2-

P14

S15

CSI0_RX1-

CAMERA

GND

P15

S16

GND

CAMERA

CSI1_RX3+

P16

S17

N.C.

SM-C12

CAMERA

CSI1_RX3-

P17

S18

N.C.

GND

P18

S19

N.C.

GBE

I/O

GBE0_MDI3-

P19

S20

N.C.

GBE

I/O

GBE0_MDI3+

P20

S21

N.C.

GBE

GBE0_LINK100#

P21

S22

N.C.

GBE

GBE0_LINK1000#

P22

S23

N.C.

GBE

I/O

GBE0_MDI2-

P23

S24

N.C.

GBE

I/O

GBE0_MDI2+

P24

S25

GND

GBE

GBE0_LINK_ACT#

P25

S26

N.C.

GBE

I/O

GBE0_MDI1-

P26

S27

N.C.

GBE

I/O

GBE0_MDI1+

P27

S28

N.C.

P28

S29

N.C.

GBE

I/O

GBE0_MDI0-

P29

S30

N.C.

GBE

I/O

GBE0_MDI0+

P30

S31

N.C.

SPI_INTERFACE

SPI0_CS1#

P31

S32

N.C.

GND

P32

S33

N.C.

SDIO_CARD

SDIO_WP

P33

S34

GND

SDIO_CARD

I/O

SDIO_CMD

P34

S35

USB4+

I/O

USB

SDIO_CARD

SDIO_CD#

P35

S36

USB4-

I/O

USB

SDIO_CARD

SDIO_CK

P36

S37

N.C.

SDIO_CARD

SDIO_PWR_EN

P37

S38

AUDIO_MCK

AUDIO

GND

P38

S39

I2S0_LRCK

I/O

AUDIO

SDIO_CARD

I/O

SDIO_D0

P39

S40

I2S0_SDOUT

AUDIO

SDIO_CARD

I/O

SDIO_D1

P40

S41

I2S0_SDIN

AUDIO

SDIO_CARD

I/O

SDIO_D2

P41

S42

I2S0_CK

I/O

AUDIO

SDIO_CARD

I/O

SDIO_D3

P42

S43

ESPI_ALERT0#

SPI_INTERFACE

SPI0_CS0#

P43

S44

N.C.

SPI_INTERFACE

SPI0_CK

P44

S45

RSVD

SPI_INTERFACE

SPI0_DIN

P45

S46

RSVD

SPI_INTERFACE

SPI0_DO

P46

S47

GND

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