Seco Sbc-c31 User manual

SBC-C31

Single Board Computer

with Rockchip RK3399 SoC

on 3.5”form factor

SBC-C31

Unauthorised use, duplication, or modification by any means without prior consent of SECO S.p.A. is prohibited.

Every effort has been made to ensure the accuracy of this manual. However, SECO S.p.A. accepts no responsibility for any inaccuracies, errors or omissions herein.

SECO S.p.A. reserves the right to change precise specifications without prior notice to supply the best product possible.

For further information on this module or other SECO products, but also to get the required assistance for any and possible issues, please contact us using the

dedicated web form available at http://www.seco.com (registration required).

Our team is ready to assist.

Revision

Date

Note

Ref

1.0

18th October 2021

First Official Release.

REVISION HISTORY

SBC-C31

INDEX

INTRODUCTION.......................................................................................................................................................................... 5

1.1 Warranty...............................................................................................................................................................................................................................6

1.2 Information and assistance.....................................................................................................................................................................................................7

1.3 RMA number request.............................................................................................................................................................................................................7

1.4 Safety...................................................................................................................................................................................................................................8

1.5 Electrostatic discharges.........................................................................................................................................................................................................8

1.6 RoHS compliance .................................................................................................................................................................................................................8

1.7 Safety Policy.........................................................................................................................................................................................................................9

1.8 Terminology and definitions ..................................................................................................................................................................................................10

1.9 Reference specifications......................................................................................................................................................................................................12

OVERVIEW ................................................................................................................................................................................13

2.1 Introduction.........................................................................................................................................................................................................................14

2.2 Technical specifications .......................................................................................................................................................................................................15

2.3 Electrical specifications........................................................................................................................................................................................................16

2.3.1 RTC Battery ................................................................................................................................................................................................................16

2.3.2 Power rails..................................................................................................................................................................................................................17

2.3.3 Power consumption.....................................................................................................................................................................................................18

2.4 Mechanical specifications.....................................................................................................................................................................................................20

2.5 Block diagram.....................................................................................................................................................................................................................21

CONNECTORS..........................................................................................................................................................................22

3.1 Introduction.........................................................................................................................................................................................................................23

3.2 Connectors overview...........................................................................................................................................................................................................24

3.2.1 Connector List.............................................................................................................................................................................................................24

3.2.2 Jumpers List ...............................................................................................................................................................................................................24

3.3 Connectors description........................................................................................................................................................................................................25

3.3.1 Gigabit Ethernet connectors..........................................................................................................................................................................................25

3.3.2 On board optional modem............................................................................................................................................................................................26

3.3.3 On board WiFi + BT module .........................................................................................................................................................................................26

3.3.4 LVDS connector..........................................................................................................................................................................................................27

3.3.5 eDP Connector ...........................................................................................................................................................................................................29

3.3.6 HDMI Connector..........................................................................................................................................................................................................30

3.3.7 USB Connectors.........................................................................................................................................................................................................31

SBC-C31

3.3.8 MIPI-CSI2 Connectors..................................................................................................................................................................................................33

3.3.9 microSD Card Slot.......................................................................................................................................................................................................34

3.3.10 Audio interface ............................................................................................................................................................................................................34

3.3.11 I2C T/S Connector.......................................................................................................................................................................................................35

3.3.12 CAN Connectors.........................................................................................................................................................................................................35

3.3.13 I/O Connectors............................................................................................................................................................................................................36

3.3.14 LED Driver Connector...................................................................................................................................................................................................38

3.3.15 Serial Ports Connector .................................................................................................................................................................................................38

3.3.16 Power and Reset Header .............................................................................................................................................................................................38

3.3.17 SPI Connector.............................................................................................................................................................................................................39

3.3.18 RECOVERY MODE connectors.....................................................................................................................................................................................39

APPENDICES.............................................................................................................................................................................40

4.1 Thermal Design...................................................................................................................................................................................................................41

SBC-C31

•Warranty

•Information and assistance

•RMA number request

•Safety

•Electrostatic discharges

•RoHS compliance

•Safety Policy

•Terminology and definitions

•Reference specifications

SBC-C31

1.1 Warranty

This product is subject to the Italian Law Decree 24/2002, acting European Directive 1999/44/CE on matters of sale and warranties to consumers.

The warranty on this product lasts for 1 year.

Under the warranty period, the Supplier guarantees the buyer assistance and service for repairing, replacing or credit of the item, at the Supplier’s own discretion.

Shipping costs that apply to non-conforming items or items that need replacement are to be paid by the customer.

Items cannot be returned unless previously authorized by the supplier.

The authorization is released after completing the specific form available on the website http://www.seco.com/en/prerma (RMA Online). The RMA authorization

number must be put both on the packaging and on the documents shipped with the items, which must include all the accessories in their original packaging, with

no signs of damage to, or tampering with, any returned item.

The error analysis form identifying the fault type must be completed by the customer and has must accompany the returned item.

If any of the above-mentioned requirements for the RMA is not satisfied, the item will be shipped back and the customer will have to pay any and all shipping costs.

Following a technical analysis, the supplier will verify if all the requirements, for which a warranty service applies, are met. If the warranty cannot be applied, the

Supplier will calculate the minimum cost of this initial analysis on the item and the repair costs. Costs for replaced components will be calculated separately.

Warning!

All changes or modifications to the equipment not explicitly approved by SECO S.p.A. could impair the equipment’s functionalities and could

void the warranty.

SBC-C31

1.2 Information and assistance

What do I have to do if the product is faulty?

SECO S.p.A. offers the following services:

•SECO website: visit http://www.seco.com to receive the latest information on the product. In most cases it is possible to find useful information to solve the

problem.

•SECO Sales Representative: the Sales Rep can help to determine the exact cause of the problem and search for the best solution.

•SECO Help-Desk: contact SECO Technical Assistance. A technician is at disposal to understand the exact origin of the problem and suggest the correct

solution. E-mail: technical.service@seco.com

Fax (+39) 0575 340434

•Repair centre: it is possible to send the faulty product to the SECO Repair Centre. In this case, follow this procedure:

oReturned items must be accompanied by a RMA Number. Items sent without the RMA number will be not accepted.

oReturned items must be shipped in an appropriate package. SECO is not responsible for damages caused by accidental drop, improper usage, or

customer neglect.

Note: Please have the following information before asking for technical assistance:

•Name and serial number of the product;

•Description of Customer’s peripheral connections;

•Description of Customer’s software (operating system, version, application software, etc.);

•A complete description of the problem;

•The exact words of every kind of error message encountered.

1.3 RMA number request

To request a RMA number, please visit SECO’s web-site. On the home page, please select “RMA Online”and follow the procedure described.

A RMA Number will be sent within 1 working day (only for on-line RMA requests).

SBC-C31

1.4 Safety

The SBC-C31 board uses only extremely low voltages.

While handling the board, please use extreme caution to avoid any kind of risk or damages to electronic components.

1.5 Electrostatic discharges

The SBC-C31 board, like any other electronic product, is an electrostatic sensitive device: high voltages caused by static electricity could damage some or all the

devices and/or components on-board.

1.6 RoHS compliance

The SBC-C31 board is designed using RoHS compliant components and is manufactured on a lead-free production line. It is therefore fully RoHS compliant.

Always switch the power off, and unplug the power supply unit, before handling the board and/or connecting cables or other boards.

Avoid using metallic components - like paper clips, screws and similar - near the board when connected to a power supply, to avoid

short circuits due to unwanted contacts with other board components.

If the board has become wet, never connect it to any external power supply unit or battery.

Check carefully that all cables are correctly connected and that they are not damaged.

Whenever handling a SBC-C31 board, ground yourself through an anti-static wrist strap. Placement of the board on an anti-static

surface is also highly recommended.

SBC-C31

1.7Safety Policy

In order to meet the safety requirements of EN62368-1:2014 standard for Audio/Video, information and communication technologyequipment, the SBC-C31 Module

shall be:

•used exclusively inside a fire enclosure made of non-combustible material or V-1 material (the fire enclosure is not necessary if the maximum power supplied

to the board never exceeds 100 W, even in worst-case fault);

•used inside an enclosure provided with the symbol IEC 60417-5041 (element 1a according to clause 9.5.2 of the IEC 62368-1) on the external part;

•used inside an enclosure compliant with all applicable IEC 62368-1 requirements

•used along with CPUHeatspreader/heatsinksdesigned according to the thermal characteristics indicated in the par. 2.2 and to the mechanicalcharacteristics

indicated in par. 2.4. The board in its enclosure must be evaluated for temperature and airflow considerations.

•installed in a way that prevents the access to the board from children

The manufacturer which include a SBC-C31 module in his end-user product shall:

•verify the compliance with all applicable clauses of the IEC 62368-1 in its own final operating condition;

•check that all connections from or to the board are compliant to ES1 requirements;

•provide an instructional safeguard against thermal injuries, according to clause 9.4.2 of the above mentioned standard. This instructional safeguard must be

placed both on end-

The board shall be powered by a Power Supply Unit separately approved and classified ES1/PS2 according to the requirements of IEC EN 62368-1.

SBC-C31

1.8 Terminology and definitions

API Application Program Interface, a set of commands and functions that can be used by programmers for writing software for specific Operating

Systems

CAN Bus Controller Area network, a protocol designed for in-vehicle communication.

CEC Consumer Electronics Control, an HDMI feature which allows controlling more devices connected together by using only one remote control

CSI2 MIPI Camera Serial Interface, 2nd generation standard regulating communication between a peripheral device (camera) and a host processor

DDC Display Data Channel, a kind of I2C interface for digital communication between displays and graphics processing units (GPU)

DDR Double Data Rate, a typology of memory devices which transfer data both on the rising and on the falling edge of the clock.

eDP embedded Display Port, a type of digital video display interface developed especially for internal connections between boards and digital displays.

FFC/FPC Flexible Flat Cable / Flat Panel Cable

GBE Gigabit Ethernet

Gbps Gigabits per second

GND Ground

GPI/O General purpose Input/Output

GPU Graphics Processing Unit

HDMI High Definition Multimedia Interface, a digital audio and video interface

I2C Bus Inter-Integrated Circuit Bus, a simple serial bus consisting only of data and clock line, with multi-master capability

I2S Inter-Integrated Circuit Sound, an audio serial bus protocol interface developed by Philips (now NXP) in 1986

LPDDR4 Low Power DDR, 4th generation

LVDS Low Voltage Differential Signaling, a standard for transferring data at very high speed using inexpensive twisted pair copper cables, usually used for

video applications

Mbps Megabits per second

MMC/eMMC MultiMedia Card / embedded MMC, a type of memory card, having the same interface as the SD card. The eMMC is the embedded version of the

MMC. They are devices that incorporate the flash memories on a single BGA chip.

N.A. Not Applicable

N.C. Not Connected

OpenCL Open Computing Language, a software library based on C99 programming language, conceived explicitly to realise parallel computing using

Graphics Processing Units (GPU)

OpenVG Open Vector Graphics, an Open Source API dedicated to hardware accelerated 2D vector graphics

SBC-C31

OS Operating System

OTG On-the-Go, a specification that allows to USB devices to act indifferently as Host or as a Client, depending on the device connected to the port.

PCI-e Peripheral Component Interface Express

PHY Abbreviation of Physical, it is the device implementing the Physical Layer of ISO/OSI-7 model for communication systems

PSU Power Supply Unit

PWM Pulse Width Modulation

PWR Power

RGMII Reduced Gigabit Reduced Media Independent Interface, a standard interface between the Ethernet Media Access Control (MAC) and the Physical

Layer (PHY)

SD Secure Digital, a memory card type

SIM Subscriber Identity Module, a card which stores all data of the owner necessary to allow him accessing to mobile communication networks

SPI Serial Peripheral Interface, a 4-Wire synchronous full-duplex serial interface which is composed of a master and one or more slaves, individually

enabled through a Chip Select line

TBM To be measured

TMDS Transition-Minimized Differential Signalling, a method for transmitting high speed serial data, normally used on DVI and HDMI interfaces

TTL Transistor-transistor Logic

UIM User Identity Module, an extension of SIM modules.

USB Universal Serial Bus

uSDHC Ultra Secure Digital Host Controller

V_REF Voltage reference Pin

SBC-C31

1.9 Reference specifications

Here below it is a list of applicable industry specifications and reference documents.

Reference

Link

AzureWave AW-CM276NF

AW-CM276NF_DS_0B_A_STD.pdf (azurewave.com)

CAN Bus

https://www.iso.org/standard/63648.html

CSI

http://www.mipi.org/specifications/camera-interface

DDC

http://www.vesa.org

DP, eDP

http://www.vesa.org

FastEthernet

http://standards.ieee.org/about/get/802/802.3.html

Gigabit Ethernet

https://www.ieee802.org/3/

HDMI

http://www.hdmi.org/spec/index

I2C

https://www.nxp.com/docs/en/user-guide/UM10204.pdf

I2S

https://www.sparkfun.com/datasheets/BreakoutBoards/I2SBUS.pdf

LVDS

https://www.ti.com/lit/an/snla165/snla165.pdf and https://www.ti.com/lit/ug/snla187/snla187.pdf

MMC/eMMC

https://www.jedec.org/committees/jc-64

OpenGL

http://www.opengl.org

OpenVG

http://www.khronos.org/openvg

PCI Express

http://www.pcisig.com/specifications/pciexpress

Quectel EG25 Modem

https://www.quectel.com/UploadFile/Product/Quectel_EG25-G_LTE_Specification_V1.1.pdf

Rockchip RK3399

RK3399 - Rockchip Wiki (wikidot.com)

SD Card Association

https://www.sdcard.org/home

SDIO

https://www.sdcard.org/developers/overview/sdio

TMDS

http://www.siliconimage.com/technologies/tmds

USB 2.0 and USB OTG

https://www.usb.org/sites/default/files/usb_20_20190524.zip

USB 3.0

https://usb.org.10-1-108-210.causewaynow.com/sites/default/files/usb_32_20191024.zip

SBC-C31

•Introduction

•Technical specifications

•Electrical specifications

•Mechanical specifications

•Block diagram

SBC-C31

2.1 Introduction

SBC-C31 is a Single Board Computer in 3.5”form factor (which is 146 x 102mm) based on embedded Rockchip RK3399 processor, featuring Dual-core ARM®

Cortex®-A72 MPCore processor and Quad-core ARM Cortex®-A53 MPCore processor, with frequencies up to 1.8GHz, which are ideal for applications requiring

multimedia capabilities.

Graphics features of the board are managed directly by Rockchip RK3399 processor, which integrate a 4-Core Mali-T860MP4 GPU, supporting OpenGL ES

1.1/2.0/3.0/3.1, OpenVG 1.1, OpenCL, DirectX11.1.

HW video decoding of the most common coding standard (i.e., H.265 10-bit, H.264 10-bit, VP9 8-bit, MPEG-4, MPEG-2, VP8 and others) is supported. Also

H.264, VP8 encoding is supported.

The board is completed with up to 4GB LPDDR4 64-bit bus memory directly soldered on board and one eMMC 5.1 Flash Drive with up to 64GB of capacity. Mass

storage capabilities are completed by a microSD Card slot.

The board can support 24 bit Single/Dual Channel LVDS interface, one eDP interface, one HDMI standard interface for HDMI1.4 / 2.0a compliant displays and one

DP 1.2 interface on USB Type-C connector (alternate mode).

The processor offers an RGMII interface which, through a dedicated TI DP83867 Ethernet Transceiver, allows the implementation of a Gigabit Ethernet interface.

Another additional GbE interface (optional) is possible using an Intel®I210 Gigabit Ethernet controller, managed through the processor’s PCI-e interface.

The networking capabilities of this module are extended by an optional WiFi 802.11 a/b/g/n/ac + BT 5.0 NGFF module soldered on-board.

An LTE Cat4 module, Quectel EG-25, with dedicated micro-SIM slot is also available as a factory option

The SBC-C31 board offers two USB 3.0, one on standard Type-C connector and one on standard Type-A connector, two USB 2.0 on standard Dual Type-A

connector, an internal header with up to two additional USB 2.0 Host ports (one of this is shared with the optional modem).

The audio functionalities of this board are realised by an I2S audio codec, which manages Line out and Mic In interfaces on a combo TRRS audio jack.

Two internal connectors extend the functionalities of this board. On these connectors, managed as factory options, it is possible to found up to 2x RS-232 or RS-

485 or 4xGPIOs + 1x RS-232, plus given by default 3x GPIOs, 1x Open-Drain Output, 1x I2C and 1x PWM.

The features on SBC-C31 are completed , as factory options, by 1x CAN or SPI flash on-board or SPI external interface, plus by 1x CAN or Ultra Low Power RTC

on-board. Last but not least, SBC-C31 can offer up to two MIPI CSI serial camera interfaces.

The board is available both in commercial and extended temperature range.

Please refer to following chapter for a complete list of all peripherals integrated and characteristics.

2.2 Technical specifications

Processors

Rockchip RK3399 processor, 2x Cortex®-A72 MP cores + 4x Cortex®-A53

MPCores, up to 1.8GHz, 64-bit architecture

Memory

Soldered-down LPDDR4 memory, up to 4GB total, 64-bit interface

Graphics

4-Core Mali-T860MP4 GPU

OpenGL ES 1.1/2.0/3.0/3.1, OpenVG 1.1, OpenCL, DX11 support

Embedded VPU, able to offer:

•H.265 10-bit, H.264 10-bit, VP9 8-bit 4Kx2K@60fps HW Decoding

•MPEG-4/MPEG-2/VP8 1080p@60fps HW Decoding

•H.264, VP8 1080p@30fps HW encoding

Supports 2 independent video outputs

Video Interfaces

LVDS Single / Dual Channel interface

eDP 1.3 interface

HDMI 4K interface

DP 1.2 interface on USB Type-C connector (alternate mode)

Video Resolution

HDMI, DP: Up to 4K x 2K @60Hz

eDP: Up to 4096 x 2160 (4K)

LVDS: Up to 1920 x 1080 @60Hz

Mass Storage

SPI Flash (alternative to CAN Controller #1)

eMMC 5.1 Drive soldered on-board

microSD slot

Networking

Up to 2 x Gigabit Ethernet ports

Optional soldered onboard M.2 1216 WLAN 802.11 a/b/g/n/ac + BT 5.0 module

Optional on-board LTE Modem

USB

1x USB 3.0 Type-C port (Alternate mode with DP)

1x USB 3.0 Host port on Type-A socket

2x USB 2.0 Host ports on Dual Type-A socket

Up to 2x USB 2.0 Host ports on internal pin header

Audio

Optional I2S Audio Codec w/ TRSS Jack (MicIn / Lineout)

Serial ports

1x Debug UART

Up to 2x RS-232 (factory options)

Up to 2x RS-485 (factory options)

Up to 2x CAN ports (factory options)

Other Interfaces

Optional 2x MIPI-CSI Camera connectors, 4-lanes CSI input each one

miniSIM slot or eSIM for on-board optional modem

I/O Connector #1 with I2C interface + 1x Open-Drain + (RS-232 or RS-485 -

factory alternatives)

I/O Connector #2 with 3x GPIOs + 1x PWM + (RS-232 or RS-485 or TTL UART -

factory alternatives)

Dedicated connector for I2C Touch Screen Controller Support

Optional Ultra-low Power RTC (Alternative to CAN Controller #2)

Optional SPI external interface (alternative to CAN Controller #1)

Optional LED Driver

Optional Trust Secure Element on-board

Power supply voltage: +12VDC ÷ +24VDC

Operating temperature:

Commercial version: 0°C ÷ +60°C

Extended version: -20°C ÷ +85°C

Dimensions: 146 x 102 mm ( )

Supported Operating Systems:

Linux Yocto

Android (under development)

** Measured at any point of SECO standard heatsink for this product, during

any and all times (including start-up). Actual temperature will widely depend

on application, enclosure and/or environment. Upon customer to consider

application-specific cooling solutions for the final system to keep the

heatspreader temperature in the range indicated. Please also check

paragraph 4.1

2.3 Electrical specifications

SBC-C31 board needs to be supplied with any voltage in the range +12VDC ÷ +24VDC range. All the other voltages necessary for the working

of the board and of the connected peripherals are derived from the main VIN power rail.

It is possible to supply the module by using two different power connectors (factory alternatives).

The first possible power connector for VIN voltage is a standard 5.9mm (internal pin, diameter 2.5 mm) DC Power Jack, locking type, CN1.

As an alternative, the board can be equipped with a 2-pin PCB Terminal Block with front spring-

cage connection type PHOENIX CONTACT p/n 1990973 or equivalent, which can be used for the connection of an

external PSU.

2.3.1 RTC Battery

For the occurrences when the module is not powered with an external power supply, on board there is a cabled coin Lithium Battery to supply, with a 3V voltage,

the Real Time Clock present on-board. Battery used is a cabled CR2032-LD Lithium coin-cell battery, with a nominal capacity of 210mAh.

The battery is not rechargeable and can be connected to the board using dedicated connector CN15 which is a

2-pin p1.27 mm type MOLEX p/n 53261-0271 or equivalent, with pinout shown in the table on the left.

Mating connector: MOLEX 51021-0200 receptacle with MOLEX 50079-8000 female crimp terminals.

In case of exhaustion, the battery should only be replaced with devices of the same type. Always check the

orientation before inserting and make sure that they are aligned correctly and are not damaged or leaking.

Never allow the batteries to become short-circuited during handling.

Batteries supplied with SBC-C31 are compliant to requirements of European Directive 2006/66/EC regarding batteries and accumulators. When putting out of order

SBC-C31, remove the batteries from the board in order to collect and dispose them according to the requirement of the same European Directive above mentioned.

Even when replacing the batteries, the disposal has to be made according to these requirements.

Power IN PCB terminal block - CN2

Signal

VIN

GND

Battery connector CN15

Signal

VRTC

GND

CAUTION: handling batteries incorrectly or replacing with not-approved devices may present a risk of fire or explosion.

SBC-C31

2.3.2 Power rails

In all the tables contained in this manual, the power rails are named with the following meaning:

VIN: Power In voltage (in the range +12VDC ..+24VDC) directly coming from the Power Supply connectors CN1 or CN2

VRTC: 3V power rail for supplying the optional Ultra Low Power RTC

+12V_ALW: +12V power rail, directly generated from VIN power rail, immediately available when VIN voltage is applied

+5V_ALW: +5V power rail, directly generated from VIN power rail, immediately available when VIN voltage is applied

+3V3_ALW: +3.3V power rail, directly generated from VIN power rail, immediately available when VIN voltage is applied and 5V_ALW voltage is stable

+5V_RUN: main +5V power rail generated by the +5V_ALW power rail and enabled by the on-board PMIC

+3V3_RUN: main +3.3V power rail generated by the +3V3_ALW power rail and enabled by the on-board PMIC

+1V8_RUN: main +1.8V power rail generated and enabled by the on-board PMIC

+3V3_OUT: 3.3V power rail specific for I/O connectors, derived from +3.3V_ALW power rail upon SW enabling.

SBC-C31

2.3.3 Power consumption

The power consumption has been measured on VIN power rail using a 19VDC source. For measurement, three different configurations have been considered.

Configuration #1

Processor Rockchip RK3399K;

RAM: 4GB LPDDR4;

Storage: 32GB eMMC;

Video Interface: HDMI + LVDS + eDP + LED Driver;

Networking: 2x Gigabit LAN + Modem LTE with eSIM + WiFi / BT with PCB Antenna;

Expansion interfaces: 1x RS-485 + 4x GPIOs

Other: SPI Flash on-board, Audio Codec

Linux OS

Extended Temperature range

eDP panel type BOE connected

Configuration #2

Processor Rockchip RK3399;

RAM: 4GB LPDDR4;

Storage: 64GB eMMC;

Video Interface: HDMI + LVDS + eDP + LED Driver;

Networking: 2x Gigabit LAN + Modem LTE with eSIM + WiFi / BT with PCB Antenna;

Expansion interfaces: 2x RS-232

Other: SPI Flash on-board, Audio Codec, RTC battery

Linux OS

Commercial Temperature range

21.5”LVDS display type AUO P215HVN01.0 connected

Configuration #3

Processor Rockchip RK3399;

RAM: 4GB LPDDR4;

Storage: 64GB eMMC;

Video Interface: HDMI + LVDS + eDP + LED Driver;

Networking: 2x Gigabit LAN + Modem LTE with eSIM + WiFi / BT with PCB Antenna;

Expansion interfaces: 1x RS-485 + 1x RS-232

Other: SPI Flash on-board, Audio Codec, RTC battery

SBC-C31

Linux OS

Commercial Temperature range

HDMI Panel connected

Status

Configuration #1

Configuration #2

Configuration #3

Average Value

(30s)

Peak Value

Average Value

(30s)

Peak Value

Average Value

(30s)

Peak Value

Idle (same for all configurations)

2.09W

0.11A

2.28W

0.12A

2.09W

0.11A

2.28W

0.12A

2.09W

0.11A

2.28W

0.12A

OS BOOT

8.36W

0.44A

11.97W

0.63A

17.1W

0.9A

20.9W

1.1A

3.8W

0.2A

0.37A

Stress Test

11.4W

0.6A

12.92W

0.68A

22.61W

1.19A

23.56W

1.24A

8.17W

0.43A

9.5W

0.5A

SBC-C31

2.4 Mechanical specifications

According to 3.5”form factor, board dimensions are: 146 x 101.6 mm (5.75”x 4.02”).

The printed circuit of the board is made of twelve layers, some of them are ground planes, for disturbance rejection.

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