Seco Sbc-c23 User manual

Cn62

SBC-C23

Single Board Computer

with NXP i.MX6SoloX Processor

SBC-C23

Unauthorized use, duplication, modification or disclosure of the information to a third-party by any means without prior consent of SECO S.p.A. is prohibited.

Every effort has been made to ensure the accuracy of this manual. However, SECO S.p.A. accepts no responsibility for any inaccuracies, errors or omissions herein.

SECO S.p.A. reserves the right to change precise specifications without prior notice to supply the best product possible.

For further information on this module or other SECO products, but also to get the required assistance for any and possible issues, please contact us using the

dedicated web form available at http://www.seco.com (registration required).

Our team is ready to assist.

Revision

Date

Note

Ref

1.0

21 March 2019

First Official Release.

1.1

12 March 2020

Update to Rev. C of the PCB

microSIM and eSIM paragraph updated (par. 3.3.6)

Modem section updated (par. 3.3.15)

REVISION HISTORY

 
 SBC-C23 
SBC-C23 User Manual - Rev. First Edition: 1.0 - Last Edition: 1.1 - Author: S.B. - Reviewed by L.B. -Copyright © 2020 SECO S.p.A. 

INDEX 
 INTRODUCTION.................................................................................................................................................................................5 
1 Warranty........................................................................................................................................................................................................................................6 
2 Information and assistance............................................................................................................................................................................................................. 7 
3 RMA number request.....................................................................................................................................................................................................................7 
4 Safety............................................................................................................................................................................................................................................ 8 
5 Electrostatic discharges ................................................................................................................................................................................................................. 8 
6 RoHS compliance..........................................................................................................................................................................................................................8 
7 Terminology and definitions ............................................................................................................................................................................................................ 9 
8 Reference specifications ..............................................................................................................................................................................................................11 
 OVERVIEW.......................................................................................................................................................................................12 
1 Introduction..................................................................................................................................................................................................................................13 
2 Technical specifications ...............................................................................................................................................................................................................14 
3 Electrical specifications ................................................................................................................................................................................................................15 
3.1RTC Battery.........................................................................................................................................................................................................................15 
3.2 Power rails...........................................................................................................................................................................................................................16 
4 Mechanical specifications............................................................................................................................................................................................................. 17 
5 Block diagram..............................................................................................................................................................................................................................18 
 CONNECTORS................................................................................................................................................................................19 
1 Introduction..................................................................................................................................................................................................................................20 
2 Connectors overview ...................................................................................................................................................................................................................21 
2.1 Jumper List.......................................................................................................................................................................................................................... 21 
3 Connectors description................................................................................................................................................................................................................22 
3.1 LVDS + backlight connector................................................................................................................................................................................................. 22 
3.2 USB ports............................................................................................................................................................................................................................23 
3.3 Ethernet connectors.............................................................................................................................................................................................................24 
3.4 μSD card slot ......................................................................................................................................................................................................................24 
3.5 M.2 WWAN Slot: Socket 2 Key B type 2242 ........................................................................................................................................................................25 
3.6 Optional microSIM Card Slot and eSIM.................................................................................................................................................................................26 
3.7 M.2 Connectivity Slot: Key E Socket 1.................................................................................................................................................................................. 27 
3.8 Debug UART Connector ......................................................................................................................................................................................................28 

SBC-C23

3.3.9 UART #5 Connector ............................................................................................................................................................................................................28

3.3.10 Factory reset button connector.............................................................................................................................................................................................29

3.3.11 Boot Mode Selection jumper JP7.........................................................................................................................................................................................29

3.3.12 Boot Selection jumper JP8................................................................................................................................................................................................... 29

3.3.13 Expansion connectors..........................................................................................................................................................................................................30

3.3.14 On-board optional modems .................................................................................................................................................................................................31

3.3.15 On-board WiFi + BT Modules...............................................................................................................................................................................................31

APPENDICES...................................................................................................................................................................................32

4.1 Thermal Design............................................................................................................................................................................................................................33

SBC-C23

•Warranty

•Information and assistance

•RMA number request

•Safety

•Electrostatic discharges

•RoHS compliance

•Terminology and definitions

•Reference specifications

SBC-C23

1.1Warranty

This product is subject to the Italian Law Decree 24/2002, acting European Directive 1999/44/CE on matters of sale and warranties to consumers.

The warranty on this product lasts for 1 year.

Under the warranty period, the Supplier guarantees the buyer assistance and service for repairing, replacing or credit of the item, at the Supplier’s own discretion.

Shipping costs that apply to non-conforming items or items that need replacement are to be paid by the customer.

Items cannot be returned unless previously authorized by the supplier.

The authorization is released after completing the specific form available on the web-site https://www.seco.com/it/support/online-rma.html (RMA Online). The RMA

authorization number must be put both on the packaging and on the documents shipped with the items, which must include all the accessories in their original

packaging, with no signs of damage to, or tampering with, any returned item.

The error analysis form identifying the fault type must be completed by the customer and has must accompany the returned item.

If any of the above-mentioned requirements for RMA is not satisfied, the item will be shipped back and the customer will have to pay any and all shipping costs.

Following a technical analysis, the supplier will verify if all the requirements, for which a warranty service applies, are met. If the warranty cannot be applied, the

Supplier will calculate the minimum cost of this initial analysis on the item and the repair costs. Costs for replaced components will be calculated separately.

Warning!

All changes or modifications to the equipment not explicitly approved by SECO S.p.A. could impair the equipment’s functionalities and could

void the warranty

SBC-C23

1.2Information and assistance

What do I have to do if the product is faulty?

SECO S.p.A. offers the following services:

•SECO website: visit http://www.seco.com to receive the latest information on the product. In most of the cases it is possible to find useful information to

solve the problem.

•SECO Sales Representative: the Sales Rep can help to determine the exact cause of the problem and search for the best solution.

•SECO Help-Desk: contact SECO Technical Assistance. A technician is at disposal to understand the exact origin of the problem and suggest the correct

solution. E-mail: technical.servic[email protected]

Fax (+39) 0575 350210

•Repair center: it is possible to send the faulty product to the SECO Repair Centre. In this case, follow this procedure:

oReturned items must be accompanied by an RMA Number. Items sent without the RMA number will be not accepted.

oReturned items must be shipped in an appropriate package. SECO is not responsible for damages caused by accidental drop, improper usage, or

customer neglect.

Note: Please have the following information before asking for technical assistance:

•Name and serial number of the product;

•Description of Customer’s peripheral connections;

•Description of Customer’s software (operative system, version, application software, etc.);

•A complete description of the problem;

•The exact words of every kind of error message encountered.

1.3RMA number request

To request an RMA number, please visit SECO’s web-site. On the home page, please select “RMA Online”and follow the procedure described.

An RMA Number will be sent within 1 working day (only for on-line RMA requests).

SBC-C23

1.4Safety

The SBC-C23 board uses only extremely-low voltages.

While handling the board, please use extreme caution to avoid any kind of risk or damages to electronic components.

1.5 Electrostatic discharges

The SBC-C23 board, like any other electronic product, is an electrostatic sensitive device: high voltages caused by static electricity could damage some or all the

devices and/or components on-board.

1.6 RoHS compliance

The SBC-C23 board is designed using RoHS compliant components and is manufactured on a lead-free production line. It is therefore fully RoHS compliant.

Always switch the power off, and unplug the power supply unit, before handling the board and/or connecting cables or other boards.

Avoid using metallic components - like paper clips, screws and similar - near the board when connected to a power supply, to avoid

short circuits due to unwanted contacts with other board components.

If the board has become wet, never connect it to any external power supply unit or battery.

Check carefully that all cables are correctly connected and that they are not damaged.

Whenever handling an SBC-C23 board, ground yourself through an anti-static wrist strap. Placement of the board on an anti-static

surface is also highly recommended.

SBC-C23

1.7 Terminology and definitions

API Application Program Interface, a set of commands and functions that can be used by programmers for writing software for specific Operating

Systems

CAN Bus Controller Area network, a protocol designed for in-vehicle communication

DDR Double Data Rate, a typology of memory devices which transfer data both on the rising and on the falling edge of the clock

DDR3L DDR, 3rd generation, Low Voltage

GND Ground

GPI/O General purpose Input/Output

I2C Bus Inter-Integrated Circuit Bus, a simple serial bus consisting only of data and clock line, with multi-master capability

LVDS Low Voltage Differential Signaling, a standard for transferring data at very high speed using inexpensive twisted pairs copper cables, usually used

for video applications

MAC Medium Access Controller, the hardware implementing the Data Link Layer of ISO/OSI-7 model for communication systems

Mbps Megabits per second

MMC/eMMC MultiMedia Card / embedded MMC, a type of memory card, having the same interface of SD. The eMMC are the embedded version of the MMC.

They are devices that incorporate both the memory controller and the flash memories on a single BGA chip

N.A. Not Applicable

N.C. Not Connected

OpenGL Open Graphics Library, an Open Source API dedicated to 2D and 3D graphics

OpenVG Open Vector Graphics, an Open Source API dedicated to hardware accelerated 2D vector graphics

OS Operating System

OTG On-the-Go, a specification that allows to USB devices to act indifferently as Host or as a Client, depending on the device connected to the port

PHY Abbreviation of Physical, it is the device implementing the Physical Layer of ISO/OSI-7 model for communication systems

PSU Power Supply Unit

PWM Pulse Width Modulation

PWR Power

RGMII Reduced Gigabit Media Independent Interface, a particular interface defining the communication between an Ethernet MAC and a PHY

SD Secure Digital, a memory card type

SM Bus System Management Bus, a subset of the I2C bus dedicated to communication with devices for system management, like a smart battery and

other power supply-related devices

SBC-C23

SPI Serial Peripheral Interface, a 4-Wire synchronous full-duplex serial interface which contemplates a master and one or more slaves, individually

enabled through a Chip Select line

TBM To be measured

TTL Transistor-transistor Logic

USB Universal Serial Bus

uSDHC Ultra Secure Digital Host Controller

V_REF Voltage reference Pin

SBC-C23

1.8 Reference specifications

Here below it is a list of applicable industry specifications and reference documents.

Reference

Link

ACPI

http://www.acpi.info

CAN Bus

http://www.bosch-semiconductors.de/en/ubk_semiconductors/safe/ip_modules/can_literature/can_literature.html

Gigabit Ethernet

http://standards.ieee.org/about/get/802/802.3.html

I2C

http://www.nxp.com/documents/other/UM10204_v5.pdf

LVDS

http://www.ti.com/ww/en/analog/interface/lvds.shtml

http://www.ti.com/lit/ml/snla187/snla187.pdf

M.2 Specifications

https://pcisig.com/specifications/pciexpress/M.2_Specification/

MMC/eMMC

http://www.jedec.org/committees/jc-649

OpenGL

http://www.opengl.org

OpenVG

http://www.khronos.org/openvg

PCI Express

http://www.pcisig.com/specifications/pciexpress

SD Card Association

https://www.sdcard.org/home

SM Bus

http://www.smbus.org/specs

USB 2.0 and USB OTG

http://www.usb.org/developers/docs/usb_20_070113.zip

NXP i.MX6 SoloX processor

https://www.nxp.com/products/processors-and-microcontrollers/applications-processors/i.mx-applications-processors/i.mx-6-

processors/i.mx-6solox-processors-heterogeneous-processing-with-arm-cortex-a9-and-cortex-m4-cores:i.MX6SX

SBC-C23

•Introduction

•Technical specifications

•Electrical specifications

•Mechanical specifications

•Block diagram

SBC-C23

2.1Introduction

SBC-C23 is a Single Board Computer, measuring just 89.5 x 87 mm (3.52”x 3.43”) based on embedded NXP i.MX6SoloX processors, a Single Core ARM®Cortex®-

A9 processor, with frequencies up to 1GHz, which is ideal for applications requiring low power consumptions, security features and connectivity, like i.e. IoT

applications.

Graphics features of the board are managed directly by NXP i.MX6SoloX processor, which integrate a Vivante GC400T 2D/3D GPU, supporting OpenGL®ES2.0.

The board is completed with up to 1GB DDR3L directly soldered on board, and one eMMC Flash Drive, directly accessible like any standard Drive, with up to 8GB

of capacity. Mass storage capabilities are completed by a microSD Card slot.

The two RGMII i.MX6 native interfaces are internally carried to as many Micrel KSZ8091 Ethernet Transceiver, allowing the implementation of up to 10/100 Gigabit

Ethernet interfaces (one of them optional).

The communication / networking capabilities of the board are completed by an M.2 Key B Slot, which allows plugging WWAN USB modules, by an M.2 Key E Slot,

for the connection of modules with PCI-e interface, by an optional WiFi + BT LE embedded module (Single Band or Dual Band) and by an optional modem soldered

on-board (supporting GSM/GPRS, LTE Cat. 1 or LTE Cat. M1 / NB).

The M.2 Key B Slot and the embedded modem can rely on an on-board microSIM slot or e-SIM soldered on-board.

The i.MX6 SoloX offers up to three USB interface. The first USB OTG port is carried out to a USB micro-AB connector, while the second USB port is carried to an

USB 2.0Hub controller, which allows the management of an USB 2-0Type A port, of twoUSB 2.0 ports on M.2 Key B andM.2 KeyE slots andfor the communication

with the optional 2G / LTE Cat.1 / LTE Cat. M1/NB1 modem.

The standard functionalities of this board are then completed by two 10-pin expansion connectors, which carry out two PWM ports, an I2C interface, four A/D inputs,

an RS-232 port, am RS-485 port and two CAN Bus interfaces.

Please refer to following chapter for a complete list of all peripherals integrated and characteristics. Not all combinations of these features are offered simultaneously;

please visit SECO’s website for a description of standard configuration modules offered. Configurations different from the standard offered must be evaluated

singularly; please contact a SECO’s sales representative / distributor for this.

SBC-C23

2.2 Technical specifications

Processors

NXP i.MX6SX SoloX, Single ARM®CORTEX®-A9 core processor @ 1GHz +

Cortex®-M4 core @ 227MHz

Memory

32-bit soldered down DDR3L memory, up to 1GB

Graphics

Integrated Graphics Vivante GC400T

Dedicated 2D and 3D Hardware accelerator

Supports OpenGL®ES2.0 / 1.1, OpenVG 11.1, DirectFB

Video Interfaces

Optional Single-Channel 18-/24-bit LVDS connector with Touch Screen

dedicated signals

Video Resolution

Up to 1366x768 @ 60Hz, 24bpp

Mass Storage

Optional onboard eMMC Disk, up to 8GB *

microSD card slot

Networking

Up to two FastEthernet RJ-45 connectors

Optional WiFi (802.11 b / g / n) +BT LE combo module + antenna on-board

2G, LTE-CatM1 or LTE Cat1 Modem embedded on-board, with up to 3 external

antennas

microSIM slot + electronic SIM soldered on-board for the Modem

M.2 Socket 1 Key E 2230 + M.2 Socket 2 Key B 2242 Slot for connectivity

USB

1 x USB 2.0 Type-A socket

1 x USB 2.0 OTG on micro-AB connector

Audio

On-board buzzer

* Please consider that for HDD and Flash Disk manufacturers, 1GB = 10^9 Byte. Some

OS (like, for example, Windows) intends 1GB = 1024^3 byte, so global capacity

shown for Disk Properties will be less than expected. Please also consider that a

portion of disk capacity will be used by internal Flash Controller for Disk management,

so final capacity will be lower

Serial Ports

Expansion connector with:

-1 x RS-232 port

-1x RS-485 port

-2 x CAN port

Other interfaces

3x Multicolor Signalling LEDs

Reset Button

Programmable (*) expansion PCB terminal block with:

-1x RS-232 port

-1x RS-485 port

-2x CAN port

-4x analog inputs

-I2C

-2x PWM

(*) Please note that some of these interfaces are factory options, other configurations are made via SW

using the pin multiplexing possibilities of the i.MX6SX processor.

Power supply voltage: +12VDC

DC power jack and 2-poles PCB terminal block for voltage supply

Optional Li-Ion Rechargeable battery

Operating temperature: 0°C ÷ +60°C** (commercial version)

-40°C ÷ +85°C** (industrial version)

Dimensions: 89.5 x 153 mm (3.52”x 6.02”).

Supported Operating Systems:

Wind River Linux

** Measured at any point of SECO standard heatspreader for this product,

during any and all times (including start-up). Actual temperature will widely

depend on application, enclosure and/or environment. Upon customer to

consider application-specific cooling solutions for the final system to keep the

heatspreader temperature in the range indicated.

Please also check paragraph 4.1

SBC-C23

2.3Electrical specifications

SBC-C23 needs to be supplied only with an external 12VDC ± 10% power supply, with a minimal 20W power rating (SBC-

C23 power consumption by itself is around 5W, more power is required for the possible attached devices).

This voltage can be supplied through a standard 6.3mm (internal pin, diameter 2.0 mm) Power Jack. Internal pin is VIN

power line. DC mating plug diameter 5.5mmm, internal hole 2.1

As an alternative, +12VDC can also be supplied using dedicated PCB Terminal block

CN76, which is a Phoenix Connector p/n MC 1,5/ 2-GF-3,81.

Please check Phoenix

needed.

The board can also be supplied by an optional 3.7V 2200mAh rechargeable battery (factory option), which can be an EEMB LIR18650 or a cabled RRC 100587 battery pack (3.6V

2200 mAh) with NTC reading.

2.3.1 RTC Battery

The SBC-C23 board can be equipped with an optional low-power Real Time Clock embedded on the module (which is a NXP PCF2123).

If the board is not equipped with the optional rechargeable battery, then it will be available a soldered horizontal 3V coin cell lithium battery to supply the RTC.

The battery used is a not-rechargeable CR1225 Lithium coin-cell battery, with a nominal capacity of 48mAh.

In case of exhaustion, the battery should only be replaced with devices of the same type. Always check the orientation before inserting and make sure that they are

aligned correctly and are not damaged or leaking.

Never allow the batteries to become short-circuited during handling.

Batteries supplied with SBC-C23 are compliant to requirements of European Directive 2006/66/EC regarding batteries and accumulators. When putting out of order

SBC-C23, remove the batteries from the board in order to collect and dispose them according to the requirement of the same European Directive above mentioned.

Even when replacing the batteries, the disposal has to be made according to these requirements.

Power In Connector CN76

Signal

+12VIN

GND

CAUTION: handling batteries incorrectly or replacing with not-approved devices may present a risk of fire or explosion.

SBC-C23

2.3.2 Power rails

In all the tables contained in this manual, Power rails are named with the following meaning:

VIN: +12VDC voltage directly coming from the Power Supply connectors CN1 or CN76

3V3_ALW: +3.3V Always voltage, derived from VCC_SW voltage

VRTC: +3V external voltage for supplying the RTC clock

VCC_SW: +5V switched voltage directly derived from VIN voltage

NVCC_3V0: +3.3V switched voltage derived from VCC_SW voltage

NVCC_1V8: +1.8V Switched voltage generated by the PMIC

SW2_3V0 switched 3.3V voltage, derived by 3V3_ALW Power rail

SBC-C23

2.4 Mechanical specifications

Board dimensions are 89.5 x 153 mm (3.52”x 6.02”).

The printed circuit of the board is made of ten layers, some of them are ground planes, for disturbance rejection.

SBC-C23

2.5 Block diagram

WiFi + BT LE

module

2 x Ethernet PHY

Power section

VIN

5V 500mA

Optional 2G / LTE-

Cat1 Modem

USB OTG

micro-AB slot

Expansion PCB

terminal block #2

M.2 Key-E Slot

2G / LTE External

Antennas

USB 2.0 type-A

Slot

NXP i.MX6

SoloX

processor

M.2 Key-B Slot

DDR3L System

Memory

Switch-mode

charger

SD Card slot

2 x FastEthernet

interface

USB OTG #1

RGMII #1 ÷ #2

LVDS

I2C1

GPIO

3V Cabled Coin cell

battery

USB 2.0 Hub

uSDHC3

UART6

SPI5

VRTC

uSDHC2

1-cell Backup

battery

On-board Antenna

microSIM Slot

PCI-e x1

USB OTG #2

Soldered SIM

Buzzer

USB 2.0

2 x CAN

Transceiver

RS-232 Transceiver

RS-485 Transceiver

FlexCAN [1..2]

UART2 + UART 5

UART3

USB 2.0

SPI Flash

QSPI2

LVDS connector

PWM #3

UART4

Expansion PCB

terminal block #1

PCF2123 Ultra Low

Power RTC

Antenna U/FL

connectors

USB 2.0

eMMC

uSDHC4

SBC-C23

•Introduction

•Connectors overview

•Connectors description

SBC-C23

3.1Introduction

On SBC-C23 board, there are several connectors located on the upper plane. Standard connectors are placed on the same side of PCB, so that it is possible to

place them on a panel of an eventual enclosure.

TOP SIDE

BOTTOM SIDE

Please be aware that, depending on the configuration purchased, the appearance of the board can be significantly different from the following pictures.

USB OTG

USB 2.0

Host

Ethernet #1

Ethernet #2

microSD

slot

Debug

UART

Opt. Battery

pack

connector