Siemens SXG75 User manual

Release 1.1
Technical Documentation 11/2005
TD_Repair_L1-L3_SXG75_R1.1.pdf Page 1 of 61
Service Manual
SXG 75
Level 1 - 3
Release Date Department Notes to change
R 1.0 29.11.2005 BenQ Mobile CC S CES New document
R 1.1 22.02.2006 BenQ Mobile CC S CES SWU Process modified
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Table of Content
1Key Features..............................................................................................................................3
2SXG75 Interface to Accessories ..............................................................................................5
3Unit Description of SXG75........................................................................................................6
4Exploded View of SXG75..........................................................................................................7
5Disassembly of SXG75 .............................................................................................................8
6Assembly of SXG75 ................................................................................................................18
7BenQ Service Equipment User Manual.................................................................................27
8GRT Software: Functionality Configuration........................................................................28
9GRT Software: Regular Usage ...............................................................................................30
10 JPICS (Java based Product Information Controlling System)............................................35
11 International Mobile Equipment Identity, IMEI......................................................................41
12 General Testing Information...................................................................................................42
13 Introduction of Service Repair Documentation Level 3 – SXG75....................................49
14 List of available level 2.5light parts.......................................................................................50
15 Hardware requirements ..........................................................................................................50
16 SXG75 Board layout................................................................................................................51
17 SIM Card Problems .................................................................................................................52
18 IO Connector Problems ..........................................................................................................53
19 B to B connector Problems....................................................................................................55
20 Battery connector Problems ..................................................................................................56
21 Camera Connector Problems.................................................................................................57
22 IRDA Problems ........................................................................................................................58
23 Display Problems ....................................................................................................................59
24 MMC Connector Problems......................................................................................................60
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1 Key Features
Battery •Li – Ion Battery Pack
•Nominal Capacity: 1000 mAh
•GSM Capacity: 980 mAh
Stand – by Time •Up to 420h
Talk Time •GSM: Up to 3,6hr
•WCDMA: Up to 3,1hr
SIM Card •Small (“Plug In”) 1,8 V or 3 V -SIM card (Phase II)
Speech Coder •Half Rate, Full Rate, Enhanced Full Rate and Adaptive
Multi Rate speech coders are available as standard
Temperature Range •-10°C to + 55°C (Normal operation)
•-30°C to + 85°C (Storage capability)
Display •Type: Full graphic
•Resolution: 240 x 320 Pixel
•Technology: TFT (Epson)
•No of colours: 256k
•Frame Rate: 15 frames/sec
•Pixel size / mm: 0.141 mm x 0.141 mm
•Active area / mm: 33,84 mm x 45.12 mm
•Illumination: White (4LEDs in series integrated)
3x4 Block Keypad •Front side decorated
•Partly bridgeless keypad (i.e. horizontally bridgeless)
•12 – key – block (o-9,#,*)
•tactile finder on key “5”
•colour adapted to u-shaped aluminium brushed sheet
metal piece
•Four blue LED’s for keypad
Function block with
Operator key
•Five – way Navikey
•Chrome plated navi key ring with center push button,
operator logo can be printed on the button which is clipped
on the navi key.
•Four keys, functions: Back, Web access, Left & right soft
key
•All keys except navi have front side decoration
•Four blue LED’s for Navikey
Edge Keys •ON/OFF key combined with the END key; the symbol ¢(I
inside O) is used as a symbol for ON/OFF.
•Viedeo telephony key
•Task key
•Two LED’s for edge keys, one red, one green
•Front side decorated
Side keys •No illumination
•Three side keys, functions: PoC, Volume, Camera
•Side keys galvanized
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Acoustics •Combined handsfree/ringer speaker at rear side of phone,
next to camera
•Dedicated ear piece speaker, allowing small dimensions
as not needed as handfree speaker
•Uni - directional microphone
•Poliphonic ringer tones (parallel to GPRS data transfer: 16
voices; all other Use Cases: 40 voices)
•Hands free mode
•Different selectable volume levels for handsfree, handset
and ringer mode (for the amount see SW product
description)
Antenna •Integrated Quad band antenna
Receiver
Sensitivity
•Compliant with 3GPP specification TS34.121, Rel.99
Transmitter Power •Compliant with 3GPP specification TS34.121, Rel.99
The transmitter output power is compliant to following
Power classes:
UMTS: nominal 0,25W -> power class 4
GSM 900: nominal 2W -> power class 4
GSM 1800/GSM 1900: nominal 1W -> power class 1
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2 SXG75 Interface to Accessories
The phone has the following compatible interfaces to accessories:
-electrically by the Lumberg I/O connector (Lumberg slim)
-antenna connection by courtesy of RF connector
-IR and Bluetooth interface is implemented
-Slot wit reader for additional reduced size MultiMediaCard (exchangeable) is
available
-car holder interface is implemented
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3 Unit Description of SXG75
The SXG75 is a brick phone with 2 integrated cameras for video telephony and photo
applications. The phone has two different acoustic modules one for receiver mode on the
topside and one for sound ringer and hands free mode with separate hole on the bottom
side. Additional speciality is a slot for exchangeable RS MultiMediaCard at the side of the
phone.
The keypad is new for a Siemens brick phone and has beside the usual navigation and
number key block beneath the display and the 2 side keys on both side surfaces further 4
edge keys (2 on each side) beside the LCD module for extended UMTS related
functionality. Special design element on the rear side is a prominent area with a grid of
holes for the loudspeaker.
There will be one colour variant, white/silver.
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4 Exploded View of SXG75
Side
-
Cover
Side - Keys
Vibramotor
U
pp
er Case
Keypad
Flexible PCB
Dis
p
la
y
- Module
PCB
Microphone
Lower Case
Disassembled Camera Cover
Earphone
MMC - Holde
r
UMTS
–
Camera Cover
Camera
UMTS - Camera
Screws
Rear Cover
Battery
Battery Cover
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5 Disassembly of SXG75
All repairs as well as disassembling and assembling have to be carried out in an ESD
protected environment and with ESD protected equipment/tools. For all activities the
international ESD regulations have to be considered.
For more details please check information in c – market
https://market.benqmobile.com/SO/welcome.lookup.asp
There you can find the document “ESD Guideline”.
Step 1
Remove Battery Cover and Battery.
Step 2
Remove Rear Cover by pushing it with both
thumbs forwards.
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Step 3
Remove screws with Torque -
Screwdriver.
Screws size: T5+
Step 4
Remove Side – Cover by using
Alternative Opening Tool carefully.
Step 5
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Step 6
Remove Upper Case by using Alternative
Opening Tool carefully.
Step 7
Step 8
Disconnect Flex Cable from PCB by using
Tweezers carefully.
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Step 9
Remove MMC Holder by pushing it with
Alternative Opening Tool outside the frame.
Step 10
Use Alternative Opening Tool to remove
PCB from Lower Case carefully.
Step 11
To avoid scratches it is mandatory to place
a Protection Foil onto the Display.
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Step 12
Remove Flexible PCB with Alternative
Opening Tool carefully.
The Loudspeaker is not removable.
Step 13
Step 14
Remove Side keys by using Tweezers.
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Step 15
Step 16
Use Tweezers to remove Keypad.
Step 17
Remove Microphone by using Tweezers
carefully.
Be careful with the spring contacts of the
Microphone!
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Step 18
Remove Vibramotor by using Tweezers
carefully.
Step 19
Remove Earphone by using Tweezers
carefully.
Step 20
Use Alternative Opening Tool to remove
Camera Cover carefully.
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Step 21
Step 22
Step 23
Disconnect Flex Cable from PCB with
Tweezers.
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Step 24
Remove Display from PCB by using
Alternative Opening Tool very carefully.
Step 25
Put the Camera Ejector Jig professional
through the four edges between the Camera
and the Camera Connector. Now push the
Ejector Jig and pull out the Camera
carefully.
Step 26
Remove UMTS Camera Cover by using
Tweezers carefully.
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Step 27
Step 28
Remove UMTS Camera with Alternative
Opening Tool very carefully.
Overview Lower Parts
Overview Upper Parts
Flexible PCB
Side - Cover
Upper Case Dis
p
la
y
PCB
Battery Rear Cover
Lower Case
Microphone
Vibramotor
Ear
p
hone
MMC - Holder
Camera Cover
Ke
yp
ad
Disassembled
Camera Cove Camera
Battery cover
UMTS - Camera
Sideke
y
s
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6 Assembly of SXG75
Step 1
Assemble UMTS - Camera by using
Tweezers.
Step 2
Connect the UMTS – Camera with PCB by
using Tweezers.
Step 3
Use Tweezers to assemble Camera Cover.
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Step 4
Assemble Camera by using Camera Ejector
Jig.
Step 5
Assemble Display by fixing it in the given
frame.
Take care of the Display!
Step 6
Assemble Camera Cover.
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Step 7
Step 8
Assemble Earphone by using Tweezers
carefully.
Step 9
Assemble Vibramotor by using Tweezers
carefully.
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