Sierra Wireless AirPrime HL77 Series User manual

Product Technical Specification
AirPrime HL77xx
41110555
1.0
November 01, 2017

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Product Technical Specification
Important Notice
Due to the nature of wireless communications, transmission and reception of data can never be
guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant
delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used
in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used
in situations where failure to transmit or receive data could result in damage of any kind to the user or
any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless
accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or
received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or
receive such data.
Safety and Hazards
Do not operate the Sierra Wireless modem in areas where cellular modems are not advised without
proper device certifications. These areas include environments where cellular radio can interfere such
as explosive atmospheres, medical equipment, or any other equipment which may be susceptible to
any form of radio interference. The Sierra Wireless modem can transmit signals that could interfere
with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is
on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED OFF. When
operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard
systems.
Note: Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door
is open. Sierra Wireless modems may be used at this time.
The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of
a vehicle. Doing so will detract from the driver or operator’s control and operation of that vehicle. In
some states and provinces, operating such communications devices while in control of a vehicle is an
offence.
Limitations of Liability
This manual is provided “as is”. Sierra Wireless makes no warranties of any kind, either expressed or
implied, including any implied warranties of merchantability, fitness for a particular purpose, or
noninfringement. The recipient of the manual shall endorse all risks arising from its use.
The information in this manual is subject to change without notice and does not represent a
commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES
SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL,
GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING,
BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR
REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS
PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY
THIRD PARTY.
Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability
arising under or in connection with the Sierra Wireless product, regardless of the number of events,
occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the
Sierra Wireless product.

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Product Technical Specification
Patents
This product may contain technology developed by or for Sierra Wireless Inc.
This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents
licensed from MMP Portfolio Licensing.
Copyright
© 2017 Sierra Wireless. All rights reserved.
Trademarks
Sierra Wireless®, AirPrime®, AirLink®, AirVantage®, WISMO®, ALEOS® and the Sierra Wireless and
Open AT logos are registered trademarks of Sierra Wireless, Inc. or one of its subsidiaries.
Watcher® is a registered trademark of NETGEAR, Inc., used under license.
Windows® and Windows Vista® are registered trademarks of Microsoft Corporation.
Macintosh® and Mac OS X® are registered trademarks of Apple Inc., registered in the U.S. and other
countries.
QUALCOMM® is a registered trademark of QUALCOMM Incorporated. Used under license.
Other trademarks are the property of their respective owners.
Contact Information
Sales information and technical support,
including warranty and returns
Web: sierrawireless.com/company/contact-us/
Global toll-free number: 1-877-687-7795
6:00 am to 5:00 pm PST
Corporate and product information
Web: sierrawireless.com

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Product Technical Specification
Document History
Version
Date
Updates
1.0
November 01, 2017
Creation

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Contents
1. INTRODUCTION ................................................................................................ 10
1.1. Common Flexible Form Factor (CF3) ................................................................................ 10
1.2. Physical Dimensions ......................................................................................................... 11
1.3. General Features ............................................................................................................... 11
1.4. Architecture........................................................................................................................ 13
1.5. Interfaces ........................................................................................................................... 13
1.6. Connection Interface ......................................................................................................... 14
1.7. ESD ................................................................................................................................... 15
1.8. Environmental and Certifications ....................................................................................... 15
1.8.1. Environmental Specifications ................................................................................... 15
1.8.2. Regulatory ................................................................................................................ 16
1.8.3. RoHS Directive Compliant ....................................................................................... 16
1.8.4. Disposing of the Product .......................................................................................... 16
1.9. References ........................................................................................................................ 16
2. PAD DEFINITION ............................................................................................... 17
2.1. Pad Types .......................................................................................................................... 21
2.2. Pad Configuration (Top View, Through Module) ............................................................... 22
3. DETAILED INTERFACE SPECIFICATIONS ..................................................... 23
3.1. Power Supply..................................................................................................................... 23
3.2. Current Consumption ........................................................................................................ 24
3.3. VGPIO ............................................................................................................................... 25
3.4. USIM Interface ................................................................................................................... 25
3.4.1. UIM1_DET ............................................................................................................... 26
3.5. USB Interface .................................................................................................................... 26
3.6. Electrical Information for Digital I/O ................................................................................... 27
3.7. General Purpose Input/Output (GPIO) .............................................................................. 28
3.8. Main Serial Link (UART1) .................................................................................................. 28
3.9. Power On Signal (PWR_ON_N) ........................................................................................ 29
3.10. Reset Signal (RESET_IN_N) ............................................................................................. 30
3.11. Analog to Digital Converter (ADC)..................................................................................... 31
3.12. Clock Interface ................................................................................................................... 32
3.13. Debug Interface ................................................................................................................. 32
3.14. JTAG Interface................................................................................................................... 32
3.15. Wake Up Signal (WAKE-UP) ............................................................................................. 33
3.16. Fast Shutdown Signal (FAST_SHUTDOWN) .................................................................... 34
3.17. PWM .................................................................................................................................. 34

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3.18. RF Interface ....................................................................................................................... 35
3.18.1. RF Connection ......................................................................................................... 35
3.18.2. RF Performances ..................................................................................................... 35
4. MECHANICAL DRAWINGS ............................................................................... 37
5. DESIGN GUIDELINES ....................................................................................... 39
5.1. Power-Up Sequence ......................................................................................................... 39
5.2. Module Switch-Off ............................................................................................................. 39
5.3. Sleep Mode Management ................................................................................................. 39
5.4. Power Supply Design ........................................................................................................ 40
5.5. Power On Connection Examples....................................................................................... 40
5.6. USIM1 Application ............................................................................................................. 41
5.7. EMC and ESD Guidelines for USIM1 Card ....................................................................... 41
5.8. ESD Guidelines for USB .................................................................................................... 42
5.9. PWM .................................................................................................................................. 42
6. RELIABILITY SPECIFICATION (TBC) .............................................................. 44
6.1. Reliability Compliance ....................................................................................................... 44
6.2. Reliability Prediction Model ............................................................................................... 44
6.2.1. Life Stress Test ........................................................................................................ 44
6.2.2. Environmental Resistance Stress Tests .................................................................. 45
6.2.3. Corrosive Resistance Stress Tests ......................................................................... 45
6.2.4. Thermal Resistance Cycle Stress Tests .................................................................. 46
6.2.5. Mechanical Resistance Stress Tests ....................................................................... 47
6.2.6. Handling Resistance Stress Tests ........................................................................... 48
7. FCC LEGAL INFORMATION ............................................................................. 49
8. ORDERING INFORMATION .............................................................................. 51
9. TERMS AND ABBREVIATIONS ........................................................................ 52

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List of Figures
Figure 1. Architecture Overview ..................................................................................................... 13
Figure 2. Mechanical Overview (Top View and Bottom View) ....................................................... 14
Figure 3. Actual Module (Top View) ............................................................................................... 14
Figure 4. Actual Module (Bottom View) .......................................................................................... 14
Figure 5. Pad Configuration ............................................................................................................ 22
Figure 6. PWR_ON_N and PWR_OFF Sequence ......................................................................... 30
Figure 7. JTAG Timing Waveform .................................................................................................. 33
Figure 8. Relative Timing for the PWM Output ............................................................................... 34
Figure 9. Mechanical Drawing ........................................................................................................ 37
Figure 10. Dimensions and Footprint Drawing ................................................................................. 38
Figure 11. Voltage Limiter Example ................................................................................................. 40
Figure 12. PWR_ON_N Connection Example with Switch ............................................................... 40
Figure 13. PWR_ON_N Connection Example with an Open Collector Transistor ........................... 40
Figure 14. Design Application with USIM1 Slot ................................................................................ 41
Figure 15. EMC and ESD Components Close to the USIM1. .......................................................... 41
Figure 16. ESD Protection for USB .................................................................................................. 42
Figure 17. Example of an LED Driven by the PWM0 Output ........................................................... 42
Figure 18. Example of a BUZZER Driven by the PWM0 Output ...................................................... 43

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List of Tables
Table 1. Supported Bands/Connectivity ........................................................................................ 10
Table 2. General Features ............................................................................................................ 11
Table 3. ESD Specifications .......................................................................................................... 15
Table 4. Environmental Specifications .......................................................................................... 15
Table 5. Pin Definition ................................................................................................................... 17
Table 6. Pad Type Codes .............................................................................................................. 21
Table 7. Power Supply Pad Description ........................................................................................ 23
Table 8. Power Supply Electrical Characteristics .......................................................................... 23
Table 9. Low Current Consumption Mode ..................................................................................... 24
Table 10. Current Consumption ..................................................................................................... 24
Table 11. VGPIO Pad Description ................................................................................................... 25
Table 12. VGPIO Electrical Characteristics ..................................................................................... 25
Table 13. USIM1 Pad Description ................................................................................................... 26
Table 14. USIM1 Electrical Characteristics ..................................................................................... 26
Table 15. USB Pad Description ....................................................................................................... 26
Table 16. USB Electrical Characteristics ......................................................................................... 27
Table 17. Digital I/O Electrical Characteristics ................................................................................ 27
Table 18. GPIO Pad Description ..................................................................................................... 28
Table 19. UART1 Pad Description .................................................................................................. 28
Table 20. PWR_ON_N Pad Description .......................................................................................... 29
Table 21. PWR_ON_N Electrical Characteristics ........................................................................... 29
Table 22. RESET_IN_N Pad Description ........................................................................................ 30
Table 23. RESET_IN_N Electrical Characteristics .......................................................................... 31
Table 24. ADC Pad Description ...................................................................................................... 31
Table 25. ADC Electrical Characteristics ........................................................................................ 31
Table 26. Clock Interface Pad Description ...................................................................................... 32
Table 27. Software Trace Pad Description...................................................................................... 32
Table 28. JTAG Pad Description ..................................................................................................... 32
Table 29. JTAG Electrical Characteristics ....................................................................................... 33
Table 30. WAKE-UP Pad Description ............................................................................................. 33
Table 31. WAKE-UP Electrical Characteristics ............................................................................... 34
Table 32. FAST_SHUTDOWN Pad Description ............................................................................. 34
Table 33. FAST_SHUTDOWN Electrical Characteristics ............................................................... 34
Table 34. PWM Pad Description ..................................................................................................... 35
Table 35. PWM Electrical Characteristics (TBC)............................................................................. 35
Table 36. RF Pad Connection ......................................................................................................... 35
Table 37. Typical RX Sensitivity ...................................................................................................... 36

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Product Technical Specification
Table 38. Standards Conformity ...................................................................................................... 44
Table 39. Life Stress Test................................................................................................................ 44
Table 40. Environmental Resistance Stress Tests ......................................................................... 45
Table 41. Corrosive Resistance Stress Tests ................................................................................. 45
Table 42. Thermal Resistance Cycle Stress Tests ......................................................................... 46
Table 43. Mechanical Resistance Stress Tests .............................................................................. 47
Table 44. Handling Resistance Stress Tests .................................................................................. 48
Table 45. Ordering Information ....................................................................................................... 51

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1. Introduction
This document is the Product Technical Specification for the AirPrime HL77xx series of embedded
modules. It defines the high-level product features and illustrates the interfaces for these features; and
is intended to cover the hardware aspects of the product, including electrical and mechanical.
Variants covered in this document are:
• HL7718
• HL7748
• HL7749
The AirPrime HL77xx modules belong to the AirPrime HL Series from Essential Connectivity Module
family. These are industrial grade Embedded Wireless Modules that provides data connectivity on
LTE networks (as listed in Table 1 Supported Bands/Connectivity).
The AirPrime HL77xx modules support a large variety of interfaces such as USB 2.0, UART, ADC,
USIM interface, PWM and GPIOs to provide customers with the highest level of flexibility in
implementing high-end solutions.
Table 1. Supported Bands/Connectivity
RF Band
Transmit Band (Tx)
Receive Band (Rx)
Maximum
Output Power
HL7718
HL7748
HL7749
LTE B2
1850 to 1910 MHz
1930 to 1990 MHz
23dBm ± 2dBm
✓
LTE B3
1710 to 1785 MHz
1805 to 1880 MHz
23dBm ± 2dBm
✓
LTE B4
1710 to 1755 MHz
2110 to 2155 MHz
23dBm ± 2dBm
✓
LTE B12
699 to 716 MHz
729 to 746 MHz
23dBm ± 2dBm
✓
LTE B13
777 to 787 MHz
746 to 756 MHz
23dBm ± 2dBm
✓
LTE B28
703 to 748 MHz
758 to 803 MHz
23dBm ± 2dBm
✓
1.1. Common Flexible Form Factor (CF3)
The AirPrime HL77xx modules belong to the Common Flexible Form Factor (CF3) family of modules.
This family consists of a series of WWAN modules that share the same mechanical dimensions (same
width and length with varying thicknesses) and footprint. The CF3 form factor provides a unique
solution to a series of problems faced commonly in the WWAN module space as it:
• Accommodates multiple radio technologies (LTE advanced) and band groupings.
• Supports bit-pipe (Essential Module Series) and value add (Smart Module Series) solutions.
• Offers electrical and functional compatibility.
• Provides Direct Mount as well as Socketability depending on customer needs.

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Product Technical Specification
Introduction
1.2. Physical Dimensions
AirPrime HL77xx modules are compact, robust, fully shielded modules with the following dimensions:
• Length: 23 mm
• Width: 22 mm
• Thickness: 2.5 mm
• Weight: 2.6 g
Note: Dimensions specified above are typical values.
1.3. General Features
The table below summarizes the AirPrime HL77xx modules’ features.
Table 2. General Features
Feature
Description
Physical
• Small form factor (146-pad solderable LGA pad) – 23mm x 22mm x 2.5mm
(nominal)
• Metal shield can.
• RF connection pads (RF main interface)
• Baseband signals connection
Electrical
Single or double supply voltage (VBATT and VBATT_PA) – 3.2V – 4.5V
RF
HL7718 (Mono-band LTE):
• LTE B13
HL7748 (Tri-band LTE):
• LTE B2
• LTE B4
• LTE B12
HL7749 (Dual-band LTE):
• LTE B3
• LTE B28
SIM interface
• Only 1.8V support for USIM1
• SIM extraction / hot plug detection
• SIM/USIM support
• Conforms with ETSI UICC Specifications.
• Supports SIM application tool kit with proactive SIM commands
Application interface
• NDIS NIC interface support (Windows 7, Windows 8, Linux)
• MBIM support
• Multiple non-multiplexed USB channel support
• Dial-up networking
• USB selective suspend to maximize power savings
• CMUX multiplexing over UART
• AT command interface – 3GPP 27.007 standard, plus proprietary extended
AT commands

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Product Technical Specification
Introduction
Feature
Description
Protocol stack
Single mode LTE operation:
• LTE FDD, bandwidth 1.4-20 MHz
• System Release: 3GPP Rel. 13
• Category M1 (up to 375 kbit/s in uplink, 300 kbit/s in downlink)
• Max modulation 16 QAM UL/DL
• Intra-frequency and inter-frequency mobility
SMS
• SMS over SGs
• SMS MO and MT
• SMS saving to SIM card or ME storage
• SMS reading from SIM card or ME storage
• SMS sorting
• SMS concatenation
• SMS Status Report
• SMS replacement support
• SMS storing rules (support of AT+CNMI, AT+CNMA)
Connectivity
• Multiple cellular packet data profiles
• Sleep mode for minimum idle power draw
• Mobile-originated PDP context activation / deactivation
• Static and Dynamic IP address. The network may assign a fixed IP address
or dynamically assign one using DHCP (Dynamic Host Configuration
Protocol).
• PDP context type (IPv4, IPv6, IPv4v6). IP Packet Data Protocol context
• RFC1144 TCP/IP header compression
Environmental
Operating temperature ranges (industrial grade):
• Class A: -30°C to +70°C
• Class B: -40°C to +85°C
RTC
Real Time Clock (RTC)

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Product Technical Specification
Introduction
1.4. Architecture
The figure below presents an overview of the AirPrime HL77xx modules’ internal architecture and
external interfaces.
Note: Dotted parts are optional depending on variant.
AirPrime HL7718, HL7748 and HL7749
32.768KHz
VGPIO
RESET_IN_N
LGA-
146
Baseband
MCU DSP
PMU
Analog Baseband
Embedded
SIM
LGA-
146
PWR_ON
SAW
Filters
USB
Front-End
Module
(SAW/PA/
Switch)
RX
RAM Memory
Peripherals
Flash
Memory
SIM
Switch
Transceiver
26MHz
VBATT_PA
Figure 1. Architecture Overview
1.5. Interfaces
The AirPrime HL77xx modules provide the following interfaces and peripheral connectivity:
• 1x - VGPIO (1.8V)
• 1x - 1.8V USIM
• 1x - eUICC/USIM (optional embedded SIM)
• 1x - USB 2.0
• 10x - GPIOs (1 of which has a multiplex)
• 1x - 8-wire UART
• 1x - Active Low POWER ON
• 1x - Active Low RESET
• 2x - ADC
• 2x - System Clock Out (32,768KHz and 26MHz)
• 1x – Debug Interface

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Product Technical Specification
Introduction
• 1x - JTAG Interface
• 1x - Wake up signal
• 1x - Fast shutdown signal
• 1x - PWM
• 1x - Main RF Antenna
1.6. Connection Interface
The AirPrime HL77xx modules are an LGA form factor device. All electrical and mechanical
connections are made through the 146 Land Grid Array (LGA) pads on the bottom side of the PCB.
Figure 2. Mechanical Overview (Top View and Bottom View)
The 146 pads have the following distribution:
• 66 inner signal pads, 1x0.5mm, pitch 0.8mm
• 1 reserved test point (do not connect), 1.0mm diameter
• 7 test point (JTAG), 0.8mm diameter, 1.20mm pitch
• 64 inner ground pads, 1.0x1.0mm, pitch 1.825mm/1.475mm
• 4 inner corner ground pads, 1x1mm
• 4 outer corner ground pads, 1x0.9mm
Figure 3. Actual Module (Top View)
Figure 4. Actual Module (Bottom View)

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Product Technical Specification
Introduction
1.7. ESD
Refer to the following table for ESD Specifications.
Table 3. ESD Specifications
Category
Connection
Specification
Operational
RF ports
IEC-61000-4-2 — Level (Electrostatic Discharge Immunity Test)
Non-operational
Host connector
interface
Unless otherwise specified:
• JESD22-A114 ± 1kV Human Body Model (TBC)
• JESD22-A115 ± 200V Machine Model (TBC)
• JESD22-C101C ± 250V Charged Device Model (TBC)
Signals
SIM connector
Adding ESD protection is highly recommended at the point where
the USIM contacts are exposed, and for any other signals that
would be subjected to ESD by the user.
Other host signals
1.8. Environmental and Certifications
1.8.1. Environmental Specifications
The environmental specification for both operating and storage conditions are defined in the table
below.
Table 4. Environmental Specifications
Conditions
Range
Operating Class A
-30°C to +70°C
Operating Class B
-40°C to +85°C
Storage
-40°C to +85°C
Class A is defined as the operating temperature ranges that the device:
• Shall exhibit normal function during and after environmental exposure.
• Shall meet the minimum requirements of 3GPP or appropriate wireless standards.
Class B is defined as the operating temperature ranges that the device:
• Shall remain fully functional during and after environmental exposure
• Shall exhibit the ability to establish an SMS or DATA call (emergency call) at all times even
when one or more environmental constraint exceeds the specified tolerance.
• Unless otherwise stated, full performance should return to normal after the excessive
constraint(s) have been removed.

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Product Technical Specification
Introduction
1.8.2. Regulatory
The AirPrime HL7718 and HL7748 modules will be compliant with FCC regulations, while the
AirPrime HL7749 module will be compliant with RCM regulations.
1.8.3. RoHS Directive Compliant
The AirPrime HL77xx modules are compliant with RoHS Directive 2011/65/EU which sets limits for
the use of certain restricted hazardous substances. This directive states that “from 1st July 2006, new
electrical and electronic equipment put on the market does not contain lead, mercury, cadmium,
hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE)”.
1.8.4. Disposing of the Product
This electronic product is subject to the EU Directive 2012/19/EU for Waste Electrical
and Electronic Equipment (WEEE). As such, this product must not be disposed of at a
municipal waste collection point. Please refer to local regulations for directions on how
to dispose of this product in an environmental friendly manner.
1.9. References
[1] AirPrime HL Series Customer Process Guidelines
Reference Number: 4114330
[2] AirPrime HL77xx AT Commands Interface Guide
Reference Number: 41110842
[3] AirPrime HL Series Development Kit User Guide
Reference Number: 4114877

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2. Pad Definition
AirPrime HL77xx pads are divided into 2 functional categories.
• Core functions and associated pads cover all the mandatory features for M2M connectivity and will be available by default across all CF3 family of
modules. These Core functions are always available and always at the same physical pad locations. A customer platform using only these functions
and associated pads are guaranteed to be forward and/or backward compatible with the next generation of CF3 modules.
• Extension functions and associated pads bring additional capabilities to the customer. Whenever an Extension function is available on a module, it
is always at the same pad location.
Other pads marked as “not connected” or “reserved” should not be used.
Table 5. Pin Definition
Pad #
Signal Name
Function
I/O
Active
Low/High
Power
Supply
Domain
Recommendation
for Unused Pads
Type
1
GPIO1
General purpose input/output
I/O
-
1.8V
Left Open
Extension
2
UART1_RI
UART1 Ring indicator
O
-
1.8V
Connect to test point
Core
3
UART1_RTS
UART1 Request to send
I
L
1.8V
Connect to test point
Core
4
UART1_CTS
UART1 Clear to send
O
L
1.8V
Connect to test point
Core
5
UART1_TX
UART1 Transmit data
I
-
1.8V
Connect to test point
Core
6
UART1_RX
UART1 Receive data
O
-
1.8V
Connect to test point
Core
7
UART1_DTR
UART1 Data terminal ready
I
L
1.8V
Connect to test point
Core
8
UART1_DCD
UART1 Data carrier detect
O
L
1.8V
Connect to test point
Core
9
UART1_DSR
UART1 Data set ready
O
L
1.8V
Connect to test point
Core
10
GPIO2
General purpose input/output
I/O
-
1.8V
Connect to test point
Core
11
RESET_IN_N
Input reset signal
I
L
1.8V
Left Open
Core

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Product Technical Specification
Pad Definition
Pad #
Signal Name
Function
I/O
Active
Low/High
Power
Supply
Domain
Recommendation
for Unused Pads
Type
12
USB_D-
USB Data Negative (Low / Full Speed)
I/O
-
3.3V
Connect to test point
Extension
USB Data Negative (High Speed)
0.38V
13
USB_D+
USB Data Positive (Low / Full Speed)
I/O
-
3.3V
Connect to test point
Extension
USB Data Positive (High Speed)
0.38V
14
NC
Not Connected
Not connected
15
NC
Not Connected
Not connected
16
NC
Not Connected
Not connected
17
NC
Not Connected (Reserved for future use)
Not connected
18
NC
Not Connected (Reserved for future use)
Not connected
19
WAKE-UP
Wake Up
I
H
1.8V
Left Open
Extension
20
NC
Not Connected (Reserved for future use)
Not connected
21
NC
Not Connected
Not connected
22
GNSS_FREQ_OUT
26MHz System Clock Output
O
-
1.8V
Left Open
Extension
23
32K_CLKOUT
32.768kHz System Clock Output
O
-
1.8V
Left Open
Extension
24
ADC1
Analog to digital converter
I
-
1.2V
Left Open
Extension
25
ADC0
Analog to digital converter
I
-
1.2V
Left Open
Extension
26
UIM1_VCC
1.8V USIM1 Power supply
O
-
1.8V
Mandatory connection
Core
27
UIM1_CLK
1.8V USIM1 Clock
O
-
1.8V
Mandatory connection
Core
28
UIM1_DATA
1.8V USIM1 Data
I/O
-
1.8V
Mandatory connection
Core
29
UIM1_RESET
1.8V USIM1 Reset
O
L
1.8V
Mandatory connection
Core
30
GND
Ground
0V
0V
Mandatory connection
Extension
31
NC
Not Connected
Not connected
32
GND
Ground
0V
0V
Mandatory connection
Extension
33
PCM_OUT*
PCM data out
O
-
1.8V
Left Open
Extension
34
PCM_IN*
PCM data in
I
-
1.8V
Left Open
Extension
35
PCM_SYNC*
PCM sync out
I/O
-
1.8V
Left Open
Extension

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Product Technical Specification
Pad Definition
Pad #
Signal Name
Function
I/O
Active
Low/High
Power
Supply
Domain
Recommendation
for Unused Pads
Type
36
PCM_CLK*
PCM clock
I/O
-
1.8V
Left Open
Extension
37
GND
Ground
0V
0V
Mandatory connection
Core
38
NC
Not Connected (Reserved for future use)
Not connected
39
GND
Ground
0V
0V
Mandatory connection
Core
40
GPIO7
General purpose input/output
I/O
-
1.8V
Left Open
Core
41
GPIO8
General purpose input/output
I/O
-
1.8V
Connect to test point
Core
42
NC
Not Connected (Reserved for future use)
Not connected
43
NC
Not Connected (Reserved for future use)
Not connected
44
DEBUG_TX
Debug Transmit data
O
1.8V
Left Open
Extension
45
VGPIO
GPIO voltage output
O
1.8V
Left Open
Core
46
GPIO6
General purpose input/output
I/O
-
1.8V
Left Open
Core
47
NC
Not Connected (Reserved for future use)
Left Open
Not connected
48
GND
Ground
0V
0V
Mandatory connection
Core
49
RF_MAIN
RF Input/output
-
Mandatory connection
Core
50
GND
Ground
0V
0V
Mandatory connection
Core
51
DEBUG_RX
Debug Receive data
I
1.8V
Left Open
Extension
52
GPIO10
General purpose input/output
I/O
-
1.8V
Left Open
Extension
53
GPIO11
General purpose input/output
I/O
-
1.8V
Left Open
Extension
54
GPIO15
General purpose input/output
I/O
-
1.8V
Left Open
Extension
55
NC
Not Connected
Not connected
56
NC
Not Connected
Not connected
57
NC
Not Connected
Not connected
58
PWM0
Pulse Width Modulation
O
-
1.8V/3V
Left Open
Extension
59
PWR_ON_N
Active Low Power On control signal
I
L
1.8V
Mandatory connection
Core
60
NC
Not Connected
Not connected

41110555 Rev 1.0 November 01, 2017 20
Product Technical Specification
Pad Definition
Pad #
Signal Name
Function
I/O
Active
Low/High
Power
Supply
Domain
Recommendation
for Unused Pads
Type
61
VBATT_PA
Power supply (refer to section 3.1 Power Supply
for more information)
I
-
3.2V (min)
3.7V (typ)
4.5V (max)
Mandatory connection
Core
62
VBATT_PA
Power supply (refer to section 3.1 Power Supply
for more information)
I
-
3.2V (min)
3.7V (typ)
4.5V (max)
Mandatory connection
Core
63
VBATT
Power supply
I
-
3.2V (min)
3.7V (typ)
4.5V (max)
Mandatory connection
Core
64
UIM1_DET / GPIO3
USIM1 Detection / General purpose input/output
I/O
H
1.8V
Left Open
Core
65
FAST_SHUTDOWN
Fast Shutdown
I
L
1.8V
Left Open
Extension
66
GPIO5
General purpose input/output
I/O
-
1.8V
Left Open
Extension
67-70
GND
Ground
GND
0V
Core
71 -
166
Note: These pads are not available on the AirPrime HL77xx modules.
167 -
234
GND
Ground
GND
0V
Core
236
JTAG_RESET
JTAG RESET
I
L
1.8V
Left Open
Extension
237
JTAG_TCK
JTAG Test Clock
I
-
1.8V
Left Open
Extension
238
JTAG_TDO
JTAG Test Data Output
O
-
1.8V
Left Open
Extension
239
JTAG_TMS
JTAG Test Mode Select
I
-
1.8V
Left Open
Extension
240
JTAG_TRST
JTAG Test Reset
I
L
1.8V
Left Open
Extension
241
JTAG_TDI
JTAG Test Data Input
I
-
1.8V
Left Open
Extension
242
NC
Not Connected
Not connected
* This pad is not supported on the AirPrime HL77xx.