Sony Walkman NW-E002F User manual

SERVICE MANUAL
Sony Corporation
Connect Business Division
Published by SonyTechno Create Corporation
US Model
Canadian Model
NW-E002F/E003F/E005F
AEP Model
NW-E002F/E003F
E Model
Chinese Model
Tourist Model
NW-E002F/E003F/E005F
DIGITAL MUSIC PLAYER
9-887-213-06
2006K16-1
© 2006.11
Ver. 1.5 2006.11
SPECIFICATIONS
NW-E002F/E003F/E005F
US and foreign patents licensed from
Dolby Laboratories.
HOME
Supported bit rates
MP3: 32 to 320 kbps variable bit rate-compliant
WMA: 32 to 192 kbps variable bit rate-compliant
ATRAC: 48/64/66 (ATRAC3)*/96/105 (ATRAC3)*/
128/132 (ATRAC3)/160/192/256/320/352 kbps
* CD recording cannot be done using SonicStage software
in ATRAC3 at 66/105 kbps.
Sampling frequency*
MP3: 32, 44.1, 48 kHz
WMA: 44.1 kHz
ATRAC: 44.1 kHz
* Sampling frequency may not correspond to all encoders.
Frequency response
20 to 20,000 Hz (single signal measurement)
FM Frequency range
87.5 to 108.0 MHz
IF (FM)
375 kHz
Antenna
Headphone cord antenna
Interface
Headphone: Stereo mini
Hi-speed USB (USB 2.0 compliant)
Operating temperature
5°C to 35°C (67°F to 95°F)
Power source
• Built-in rechargeable lithium-ion battery
• USB power (from a computer through the USB
connector of the player)
Battery life (continuous playback)*
ATRAC format:Approximately 28 hours (Playback at 132 kbps)
ATRAC format:Approximately 25 hours (Playback at 128 kbps)
ATRAC format:Approximately 27 hours (Playback at 48 kbps)
MP3 format: Approximately 27 hours (Playback at 128 kbps)
WMA format: Approximately 19 hours (Playback at 128 kbps)
FM radio reception: Approximately 8 hours
Dimension (w/h/d)
24.8 × 79.0 ×13.6 mm (1 × 3 1/8 × 9/16 inches)
(w/h/d, projecting parts not included)
Mass
Approx. 25 g (0.9 oz)
Audio compression technology
– MPEG-1 Audio Layer-3 (MP3)
– Windows Media Audio (WMA)
– Adaptive Transform Acoustic Coding (ATRAC)
Maximum recordable number of songs and time (Approx.)*
* When transferring four-minute songs.
NW-E002F NW-E003F
Bit rate Songs Time Songs Time
48 kbps 340 22 hr. 40 min. 685 45 hr. 00 min.
64 kbps 255 17 hr. 00 min. 515 34 hr. 20 min.
96 kbps 170 11 hr. 20 min. 345 23 hr. 00 min.
128 kbps 125 8 hr. 20 min. 260 17 hr. 20 min.
132 kbps 120 8 hr. 00 min. 250 16 hr. 40 min.
160 kbps 100 6 hr. 40 min. 205 13 hr. 40 min.
192 kbps 85 5 hr. 40 min. 170 11 hr. 20 min.
256 kbps 64 4 hr. 10 min. 130 8 hr. 40 min.
320 kbps 51 3 hr. 20 min. 100 6 hr. 40 min.
352 kbps 46 3 hr. 00 min. 94 6 hr. 10 min.
NW-E005F
Bit rate Songs Time
48 kbps 1,350 90 hr. 00 min.
64 kbps 1,000 66 hr. 40 min.
96 kbps 690 46 hr. 00 min.
128 kbps 520 34 hr. 40 min.
132 kbps 500 33 hr. 20 min.
160 kbps 415 27 hr. 40 min.
192 kbps 345 23 hr. 00 min.
256 kbps 260 17 hr. 20 min.
320 kbps 205 13 hr. 40 min.
352 kbps 185 12 hr. 20 min.
Capacity
Supplied accessories
(User available capacity)*
512 MB (Approx. 482 MB = 505,724,928 bytes)
1 GB (Approx. 968 MB = 1,015,726,080 bytes)
2 GB (Approx. 1.89 GB = 2,035,974,144 bytes)
* Available storage capacity of the player may vary.
A portion of the memory is used for data management
functions.
Headphones (1)
CD-ROM* (1)
- SonicStage software
- Operation Guide (PDF file)
Quick Start Guide (1)
* Do not attempt to play this CD-ROM in an audio CD
player.
Design and specifications are subject to change without
notice.

2
NW-E002F/E003F/E005F
TABLE OF CONTENTS
1. GENERAL ................................................................... 5
2. DISASSEMBLY
2-1. Disassembly Flow ........................................................... 6
2-2. Cabinet (Top) ................................................................... 7
2-3. Cabinet (Low) Assy ......................................................... 7
2-4. MAIN Board-1 ................................................................ 8
2-5. MAIN Board-2 ................................................................ 9
2-6. Battery (A) Assy .............................................................. 9
2-7. Organic EL Indicator Module ......................................... 10
3. TEST MODE ............................................................... 11
4. DIAGRAMS
4-1. Block Diagram ................................................................ 13
4-2. Printed Wiring Boards
– MAIN, SWITCH Board (Side A) –.............................. 14
4-3. Printed Wiring Boards
– MAIN, SWITCH Board (Side B) –.............................. 15
4-4. Schematic Diagram – MAIN Board (1/3) – ................... 16
4-5. Schematic Diagram – MAIN Board (2/3) – ................... 17
4-6. Schematic Diagram
– MAIN Board (3/3), SWITCH Board –......................... 18
5. EXPLODEDVIEWS
5-1. Overall-1.......................................................................... 26
5-2. Overall-2.......................................................................... 27
5-3. Overall-3.......................................................................... 28
5-4. Overall-4.......................................................................... 29
6. ELECTRICAL PARTS LIST .................................. 30
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Flexible Circuit Board Repairing
•Keep the temperature of the soldering iron around 270 °C
during repairing.
•Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering
or unsoldering.
• Microsoft, Windows, Windows NT and Windows Media are trademarks or
registered trademarks of Microsoft Corporation in the United States and/or
other countries.
• Adobe and Adobe Reader are trademarks or registered trademarks of Adobe
Systems Incorporated in the United States and/or other countries.
• MPEG Layer-3 audio coding technology and patents licensed from
Fraunhofer IIS and Thomson.
• IBM and PC/AT are registered trademarks of International Business
Machines Corporation.
• Macintosh is a trademark of Apple Computer, Inc..
• Pentium is a trademark or a registered trademark of Intel Corporation.
• CD and music-related data from Gracenote, Inc., copyright © 2000-2004
Gracenote.
Gracenote CDDB
®
Client Software, copyright 2000-2004 Gracenote. This
product and service may practice one or more of the following U.S. Patents:
#5,987,525; #6,061,680; #6,154,773, #6,161,132, #6,230,192, #6,230,207,
#6,240,459, #6,330,593, and other patents issued or pending. Services
supplied and/or device manufactured under license for following Open
Globe,Inc. United States Patent 6,304,523. Gracenote and CDDB are
registered trademarks of Gracenote.
The Gracenote logo and logotype, and the “Powered by Gracenote” logo are
trademarks of Gracenote.
Notes on chip component replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Ver. 1.1

3
NW-E002F/E003F/E005F
Fig-1
Fig-2
NOTES ON ARRANGETHE OEL MODULE FLEXIBLE CABLE
pre-fold
SHEET (OEL-FPC), ADHESIVE
Remove protection sheet.
folding line
segment portion
SPACER (OEL)
1. Pre-fold the flexible cable as in Fig-1.
3. Make sure it does not cover the segment portion as in Fig-2.
2. Affix at the center of folding line and remove release SHEET (OEL-FPC), ADHESIVE.
Fold and press fit at the area of SHEET (OEL-FPC), ADHESIVE.
Remove protection sheet from OLED.
3mm
4.5mm
TABLE OF DESTINATION AND COLORVARIATION
USNW-E002F
NW-E003F
BLACK SILVER PINK VIOLET GREEN BLUE
CND
AEP
E
KR
MX
US
CND
AEP
CEV
E
KR
MX
CEV
CN
JE
JE
CN
NW-E005F US
CND
E
KR
MX
JE
CN
• Abbreviation
CEV : Poland, Czech, Greece and Turkey models
CN : Chinese model
CND : Canadian model
KR : Korean model
MX : Mexican model
JE : Tourist model
Ver. 1.4

4
NW-E002F/E003F/E005F
Fig-1
Fig-3
Fig-4
Fig-2
NOTES ON ARRANGETHE BATTERYWIRES AND SW PWB WIRES
HP GUIDE HP GUIDE
BATTERY WIRES
BATTERY WIRES
BATTERY WIRES
SW PWB WIRES
SW PWB WIRES
RIB
BATTERY WIRES
1. Arrange BATTERY WIRES as in Fig-1 and Fig-2.
2. Arrange SW PWB WIRES to arrow direction (Fig-3) and attach the HP GUIDE.
3. Arrange BATTERY WIRES and SW PWB WIRES under the RIB as Fig-4 then attach the battery.
NOTES ON REPLACEMENT OF Ref. No. 15 (CABINET (MID) ASSY)
Ref. No.15 has both the suffix-1 and the suffix-2 on part number.
Please confirm by the following two methods at replacement.
1.Whether it has Ref.No.30 (HP GUIDE SHEET) or not.
• The one with Ref. No. 30 t Using the suffix-2 of Ref. No. 15.
• The one not with Ref. No. 30 t Using the suffix-1 of Ref. No.15.
2. Distinguish by the following serial number.
Suffix-2 is adopted since the following serial number.
NW-E002F : from 5076285
NW-E003F : from 5070762 t Using the suffix-2 of Ref. No. 15.
NW-E005F : from 5022246
Ver. 1.3
CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.

5
NW-E002F/E003F/E005F
SECTION 1
GENERAL This section is extracted
from instruction manual.

6
NW-E002F/E003F/E005F SECTION 2
DISASSEMBLY
Note: This set can be disassembled in the order shown below.
2-1. DISASSEMBLY FLOW
2-3. CABINET (LOW) ASSY
(Page 7)
2-4. MAIN BOARD-1
(Page 8)
2-5. MAIN BOARD-2
(Page 9)
2-6. BATTERY (A) ASSY
(Page 9)
2-7. ORGANIC EL INDICATOR
MODULE (Page 10)
2-2. CABINET (TOP)
(Page 7)
SET
Ver. 1.1

7
NW-E002F/E003F/E005F
Note: Follow the disassembly procedure in the numerical order given.
2-2. CABINET (TOP)
2-3. CABINET (LOW) ASSY
3 screw
2 sheet (VOL)
1 USB cover assy
5 cabinet (top)
4 eight claws
1 two screw
s
(M1.4)
4 four claws
2 rib
3 USB holder
9 cabinet (low) assy
5 sheet (HP)
6 button (VOL)
When installing knob (hold)
insert it in the groove.
knob (hold)
8 three adhesive sheets (cabinet)
7 spacer (lower)

8
NW-E002F/E003F/E005F
2-4. MAIN BOARD-1
3 two screws (B1.4)
1 two sheets immunity
2 sheet immunity
7 sheet (conductive)
4 two claws
6 sheet (static-C)
5 USB stay
9 connector (2P) (CN401)
8 Peel off the sheet (static-B).
0 button (F/R) ass
y
MAIN board
flat side
qa organic EL indicator module
(39core) (CN601)
qs Remove the MAIN board section
in the direction of the arrow.

9
NW-E002F/E003F/E005F
2-5. MAIN BOARD-2
2-6. BATTERY (A) ASSY
6 Remove soldering from
the three points.
7 MAIN board
2 sheet (static)
3 HP guide
4 adhesive sheet (H.P)
5 cushion (wire)
red
white
blue
Note: Be careful not to damage
the harnesses.
Attach the cushon
(wire) after folding
back the harness.
SWITCH board
CN401
1 Remove the harness.
1 tow sheets
(BATT)
2 battery (A) assy

10
NW-E002F/E003F/E005F
2-7. ORGANIC EL INDICATOR MODULE
1 sheet (OEL)
3 two spacers
2 OEL module sub assy
6 organic EL indicator module
5 adhesive sheet (OEL-FPC)
4 sheet (static-B)
Ver. 1.2

11
NW-E002F/E003F/E005F
SECTION 3
TEST MODE
1. HOWTO ENTERTHETEST MODE
1. Set the HOLD .switch in the HOLD ON position.
2. Whilekeeping pressingthe Nx and
HOME
buttons
in the HOLD ON position, press the RESET switch.
3. Then the characters “TEST MODE INITIALIZE..” is
displayed momentarily, and then the following indication is
displayed on screen.
“TEST MODE”
“0.8.04.00 [JP]”
2. HOWTO CHANGETHETEST MODE
1. While the machine is in the TEST mode, set the HOLD .
switch from the ON to OFF position, or OFF to ON position.
2. Then test mode toggles and the following indication toggles
as shown below.
“TEST MODE (HOLD:OFF)” and
“TEST MODE (HOLD:ON)”
3. SYSTEM PARAMETER INITIALIZE
1. While the machine is in the TEST mode, press the
HOME
button.
2. Then the system parameter is initialized and the following
indication is displayed on screen.
“System Parameter Initialized.”
4. ALL KEY CHECK MODE
1. While the machine is in the TEST mode, press the Nx
button, andthen thefollowingindicationis displayed onscreen.
“ALL KEY CHECK”
“0x0001(ALL=0x00f3)”
2. Pressthe
HOME
button,then thehexadecimalnumber
2h is added and the following indication is displayed.
“0x0003(ALL=0x00f3)”
3. Press the – button, then the hexadecimal number 10h is added
and the following indication is displayed.
“0x0013(ALL=0x00f3)”
4. Press the + button, then the hexadecimal number 20h is added
and the following indication is displayed.
“0x0033(ALL=0x00f3)”
5. Press the >button, then the hexadecimal number 40h is
added and the following indication is displayed.
“0x0073(ALL=0x00f3)”
6. Press the .button, then the hexadecimal number 80h is
added then “0x00f3(ALL=0x00f3)” “KEYCHECK OK!”
displayed momentarily, and the machine exits the All Key
Check Mode and the Test Mode.
7. While the machine is in any step of step 2 to step 5 of theAll
Key Check mode, press the Nx button.
8. Then “key check Canceled..” displayed momentarily, and the
All Key Check mode is stopped.
9. Re-press the Nx button, back to the original step the All
Key Check mode.
5. CHARGE CURRENT SELECT
1. While the machine is in the TEST MODE (HOLD:ON), press
the > button, the charge current and the indication toggles
as shown below.
“CHG: 100mA” and “CHG: 500mA”
6. CHARGE ON/OFF SELECT
1. While the machine is in the TEST MODE (HOLD:ON), insert
to the USB port on PC.
2. Press the .button, then the charge ON/OFF and the
indication toggles as shown below.
“CHG: start..” and “CHG: stop..”
7. BEEP ON/OFF CHECK
1. While the machine is in the TEST MODE (HOLD:ON), press
the + button.
2. Then the beep ON/OFF and the indication toggles as shown
below.
“BEEP: OFF” and “BEEP: ON”
3. When switch is set to “BEEP: OFF” from “BEEP: ON”, check
that the beep sound comes from headphone jack.
8. DISPLAY CHECK
1. While the machine is in the TEST MODE (HOLD:ON), press
the – button.
2. Thenbrightness ofentire screenchanges inthe following order,
each time the – button is pressed.
Entire screen shows full brightness. (ALL ON)
Entire screen shows black screen. (ALL OFF)
Entire screen shows half brightness. (HALF ON)
9.TUNER ON/OFF CHECK
1. Whilethe machine isin theTEST MODE(HOLD:OFF), press
the > button.
2. Thentuner ON/OFFand theindication togglesas shownbelow.
“Tuner: ON” and “Tuner: OFF”
3. When “Tuner: ON” mode, check that the FM broadcast is
output from headphone jack.
10. FM RECEPTION FREQUENCY CHECK
1. Whilethe machine isin theTEST MODE(HOLD:OFF), press
the . button.
2. Press the . button. Each time the . button is pressed,
the frequencies are checked and the following indication is
displayed as shown below.
“TUNER Freq. tCENTER (91.00MHz)”
“TUNER Freq. tMAX (107.75MHz)”
“TUNER Freq. tMIN (76.00MHz)”
11. SLEEP CHECK
1. Whilethe machine isin theTEST MODE(HOLD:OFF), press
the + button.
2. Then “SLEEP IN” displayed momentarily, and the machine
enters the sleep mode.
3. While the machine is in the sleep mode, press any button.
4. Then“SLEEP OUT”displayed momentarily, themachine exits
the sleep mode and enters the test mode of the pressed key.
12. INFORMATION CHECK
1. Whilethe machine isin theTEST MODE(HOLD:OFF), press
the – button to enter the information mode.
2. Each time the – button is pressed, various information are
checked in the following order.
“VERSION: 0.8.04.00”
“BOOTs VERSION: 0.4”
“SHIMUKE: JP”
“HWCONF: m:02h v:0h”
“Storage: 512MB”
“TUNER:YES”
“SVN VERSION: 1600:1601S”
13. HOWTO EXITTHETEST MODE
Press the RESET switch in any state to exit the test mode.

12
NW-E002F/E003F/E005F SECTION 4
DIAGRAMS
Note on Schematic Diagram:
•All capacitors are in µF unless otherwise noted. (p: pF) 50 WV
or less are not indicated except for electrolytics and tantalums.
•All resistors are in Ωand 1/4W or less unless otherwise speci-
fied.
•%: indicates tolerance.
•C: panel designation.
•: B+ Line.
•Voltages and waveforms are dc with respect to ground under
no-signal (detuned) conditions.
no mark : PLAY
•Voltages are taken with aVOM (Input impedance 10 MΩ).
Voltagevariations may benoted duetonormal productiontoler-
ances.
•Waveforms are taken with a oscilloscope.
Voltagevariations may benoted duetonormal productiontoler-
ances.
•Circled numbers refer to waveforms.
•Signal path.
J: PLAY BACK
F: FM
Note on PrintedWiring Board
• X: parts extracted from the component side.
• Y: parts extracted from the conductor side.
• : Pattern from the side which enables seeing.
Caution:
Parts face side: Parts on the parts face side seen from
(Side A) the parts face are indicated.
Pattern face side: Parts on the pattern face side seen from
(Side B) the pattern face are indicated.
• These boards are multi-layer printed board.
However, the patterns of intermediate-layer have not been in-
cluded in the diagram.
*Replacement of IC101, IC201 on MAIN board requires
a special tool.
• Lead Layouts
•Indication of transistor.
surface
CSP (Chip Size Package)Lead layout of conventional IC
C
BThese are omitted. E
Q
•Waveforms
– MAIN Board –
1IC101 <zz, (TEX)
200 mV/DIV, 40 ns/DIV
0.8 Vp-p
83.3 ns
2 IC101 <zzb (EXTAL)
22.2 ns 0.8 Vp-p
200 mV/DIV, 10 ns/DIV

1313
NW-E002F/E003F/E005F
NW-E002F/E003F/E005F
4-1. BLOCK DIAGRAM
• Signal Path
: PLAY BACK
: FM
CN101
USB
CONNECTOR
VBUS
DATA-
GND
DATA+
TUNER
IC2702
DM
126
125
118
119
DP
X101
12MHz
RESET
HOLD
ON OFF
TX
TEX
AOUT R
6
AOUT L
5
DA
7
LA
8
CL
9
STO
ANT
13
2
HPOUTL
HPOUTR
115
116
X102
45.1584MHz XTAL
259 CRST1A
39 GPION1/INT9
EXTAL
1VCC
10X1
VDD IO2.8
J101
RECHARGEABLE
BATTERY
Li-ion
1PCS, 3.7V 700mA
IC601
POWER CONTROL
D601
IC2701
13
DRIVE
Q401
36
33
SIO/GPIOG1
SCKO 134
132
CS4/GPIOA25 235
SCS0/GPIOG2
SO0/GPIOG0 133
135
MICINL
MICINR 186
183
136
9
1 - 8
88
138
87
248
I/O1
I/O8
NAND FLASH ROM
IC1301
CLE
16
10 ALE
17
16 XWE
18
17 XWP
19
18 R/B1
7
15 XRE
8
11 XCE1
9
29
32
41
.
44
236
204 - 211,
222 - 229
31,32
37-41
44,45
48,49
51-53
55,56
DQ0
DQ15
32MB FLASH ROM & 4MB SRAM
IC201
161 - 176,
195 - 199
1
5-8
12-17
19-21
23-27
29,34
A0
A20
A1
A21
ORGANIC EL
INDICATOR
MODULE
XOE
36
231 XCE1F
35
265 XRSTF
10
237 XWE
4
232 XCE1S
43
239 XUB
9
238 XLB
2
233
91
90
GATE
Q2701
RTC
X801
38 GPION0/INT8
77 AN0
FUNCTION
KEY
S501 - 504
40 GPION2/INT10
FUNCTION
KEY 41 GPION3/INT11
89 GPIOF2
102 MSDIO2/GPIOE3
103 MSDIO3/GPIOE4
101 MSDIO1/GPIOE2
29 RST2OUT
127 VBUS/GPIOD0
230 WAIT/GPIOA20
84 AN7
USB IN2
4
USB IN1
VDD AD 2.0
VDD CORE 1.2
VDD IO 2.8
3
BAT1
7
BAT2
8
OUT AD 17
28LX CORE
VDD USB 3.3
OUT USB3.3 35
VDD UNREG
24LX IO
26OUT CORE
2USB H/L
9XCHG STAT
10XCHG EN
20IU3
30EN
40USB POK
Q601,602
Q604
Q605
IC101
SYSTEM CONTROLLER
NAND FLASH INTERFACE
USB INTERFACE
A/D, D/A CONVERTER
SERIAL INTERFACE
S101
S505
+2.7V
REG
( (
HEADPHONES
JACK
( (
Q501, 502
SWITCH
D0/GPIOA4
D15/GPIOA19
SDDAT3/INT5/GPIOF4
SDDAT2/INT4/GPIOF3
RE/GPIOA26
CS0/GPIOA21
RST
WE/GPIOA27
CS1/GPIOA22
UB/GPIOA29
LB/GPIOA28
CS2/GPIOA23
NCLE/GPIOC8
NALE/GPIOC9
NWE/GPIOC15
NWP/GPIOC16
NRB0/GPIOC17
NRE/GPIOC14
NCE0/GPIOC10
NAND0/GPIOC0
NAND7/GPIOC7
SI1/GPIOH1
SCK1
DREQ/INT2/GPIOF1
OSCIN
INT1/GPIOF0

1414
NW-E002F/E003F/E005F
NW-E002F/E003F/E005F
4-2. PRINTED WIRING BOARDS – MAIN, SWITCH BOARD (SIDE A) – :Uses unleaded solder.
• Semiconductor
Location
Ref. No. Location
D601 D-11
IC101 C-4
IC1301 C-8
IC2701 E-9
Q501 E-4
Q502 E-3
Q602 E-9
Q2701 E-8
* IC101
IC1301
IC2701
*CSP(Chip Size Package)
MAIN BOARD (SIDE A)
BLUE
WHITE
RED
4
USB
CONNECTOR
1
( (
E
E
1
16
34
6
12 7
E
GS
DG
2
1
S
D
SWITCH BOARD (SIDE A)
HOLD
1-870-341- (11)
RECHARGEABLE
BATTERY Li-ion
1PCS, 3.7V
700mA
OFF ON
.
>
11
1-870-355- (11)
21
E005F
E003F/E005F
E005F
E003F/E005F
CN101
C115
C155
R126
C118
R111
R2115
C120
C119
R110
C162
LF101
C102
C104
JL102
R510
VDR106
JL103
Q502
Q501
C114
JL101
R514
R101
R515
C107 R102
C123
C110
R103
R114
R513
C124
VDR108
C620
R112
JL108
JL110
JL109
C619
R802 FB104
VDR105
VDR107
C159
C125
R113
C126
C136
C153
R1303
C801 JL801 JL802
X101
C156
R129
R1301
X102
R122
C154
R124
C111C134 R120
R1302 R1305
C152
C144
R1306
C150
C137
C1301 R1304 R803
C140 C139 R507
R511
R506
R504
R801
Q2701
X801
R2709
Q602
R2707
C2701
C2702
R602
R2704
JL504
JL503
JL505
D601 R501
C501
VDR501
R505
S505
R512
R503
R509
R502
R508
S504
S503
CN601
JL903 JL901 JL902
1
A
B
C
D
E
F
G
H
I
J
2 3 4 5 6 7 8 9 10 11 12 13 14 15
*Replacement of IC101 on MAIN board requires a
special tool.

1515
NW-E002F/E003F/E005F
NW-E002F/E003F/E005F
4-3. PRINTED WIRING BOARDS – MAIN, SWITCH BOARD (SIDE B) –
:Uses unleaded solder.
• Semiconductor
Location
Ref. No. Location
D401 C-7
D2701 D-11
IC201 C-4
IC601 C-9
IC2702 C-13
Q401 D-7
Q601 E-9
Q604 C-7
Q605 E-9
IC2702 IC601
* IC201
*CSP(Chip Size Package)
MAIN BOARD (SIDE B)
SWITCH BOARD (SIDE B)
1-870-341- (11)
11
1-870-355- (11)
21
VOL + VOL -
RESET
S
D
G
S
SD
G
S
G
D
D
G
ORGANIC EL
INDICATOR MODULE
1
3
2
HOME
1
3
2
HEADPHONES
JACK
( (
C2707
S502
R2708
C2703
R2706R2702
R601
R2701
VDR601
S501
S101
R2705
JL602 JL2701
JL601 JL502 C2706
J101
JL608
JL605
FB103 C2705
JL702
C2708
SOL701
FB101
VDR103
R141
R131
R132
VDR104
FB102
D2701
R610 R614 R604 C617
C2704
C604
Q601
R603
C621
Q605
S901
S902
VDR902
VDR901
C603 C602 C601
C127
C128
R140
C143
R613
C610
C607
C609
R621
JL618
R635
R616
R629
C605
R611
JL617JL501
JL604
JL619
JL612 JL615
JL614
C606
C625
R407
C405
C615 C613
R631
C608
R605
R617
C624 C623
VDR606
R627
CN401
L601
L602
R633
C622
R619
R626
C402
R404
Q604
C409 C407
C408
R634
C626
R403
C627
R406
R405
C403
C614
C616
D401
Q401
JL616
JL107
JL112
JL111
JL113
JL114
JL105
JL115
JL301
R401
VDR101
VDR102
R116
JL106
JL104
R402
C401
C2112
C2117
R2106
R2107
R121 C149 VDR301 E003F/E005F
FB401
C146
R117
C133
C130
C147
R118 C138
C106
C101 R201
C201
C105
C132
C129
C109
JL603
C103
R125
R105 R104
C108
C406
C145 C142
C148 C116
C141
R409
R203
R202
R408
FB402
R119
JL201
L401
VDR602
VDR604
123456789101112131415
A
B
C
D
E
F
G
H
I
J
*Replacement of IC201 on MAIN board requires a
special tool.

1616
NW-E002F/E003F/E005F
NW-E002F/E003F/E005F
4-4. SCHEMATIC DIAGRAM – MAIN BOARD (1/3) – • See page 12 forWaveforms. • See page 20 for IC Pin Function Description.
18
18
17
18
18
17
18
17
18
17
17
18
17
18
18
18
18
17
17
17
17
17
17
17
D3/GPIOA7
D1/GPIOA5
D2/GPIOA6
D0/GPIOA4
D4/GPIOA8
NC
S101
J101
X102
LF101
R113
R112
R114
VDR102
VDR108
R116
R118
R117
R140
R141
R132 R131 VDR104 VDR103
R124
R121
R129
R126
R119
R120
R125
VDR105 VDR106
R2115
VDR101
R111
R110
VDR107
R2107
R2106
R105
R104
R102
R103
R101
R122 X101
CN101
C123
C124
C125
C126
JL105
C138
C134
C128
C127
FB102
FB103
FB101
C2112 C2117
C139
C140
C136
C137
C154
C152
C153
C150 C159
JL113
JL112
JL111
JL114
JL115
C148
C149
C146
C145
C144
C147
C142
C141
C143
C155
C156
JL108
JL109 JL110
JL107
JL106
FB104
C133
C132
C130
C129
JL104
C120
C162
C119
C116
C118
C115
C114
JL102
JL103
C101
C103
C104
C102
C105
C106
C109
C108
JL101
C107
C110
C111
IC101
45.1584MHz
0UH
0
0
0
100k
33k
100
10
10
10k 10k
AGND
DGND
22
4700
150
220
0
0
470k
4700
100k
10
8.2K
8.2K
0
0
10k
470
100
1M 12MHz
0.01
0.01
1
1
0.1
0.1
220MF
220MF
TU_ANT
0.22 0.22
TU_OUTR
TU_OUTL
VDD_IO2.8
VDD_CORE1.2
VDD_AD2.0
VDD_UNREG
VDD_NAND2.8
VDD_USB3.3
VDD_RTC2.8
RTC_CE
RTC_SCK
RTC_SI
RTC_SO
RTC_CLKOUT
RTC_INTR
USB_VBUS
VCORE_XUP
MAIN_XRST
PWR_ON1
NAND_RB1
NAND_XCE1
NAND_RB0
NAND_XCE0
NAND_XWP
NAND_XRE
NAND_XWE
NAND_ALE
NAND_CLE
NAND_AD7
NAND_AD6
NAND_AD5
NAND_AD4
NAND_AD3
NAND_AD2
NAND_AD1
NAND_AD0
BATT_SENSEON
OEL_XRST
KEY_XPLAY
KEY_XMENU
KEY_XHOLD
KEY_XWAKE
BIU_XCS0
BIU_XCS1
OEL_XCS
BIU_XRE
BIU_XWE
BIU_XUB
BIU_XLB
BIU_A1
BIU_A2
BIU_A3
BIU_A4
BIU_A5
BIU_A6
BIU_A7
BIU_A8
BIU_A9
BIU_A10
BIU_A11
BIU_A12
BIU_A13
BIU_A14
BIU_A15
BIU_A16
BIU_A17
BIU_A18
BIU_A19
BIU_A20
BIU_A21
BIU_D0
BIU_D1
BIU_D2
BIU_D3
BIU_D4
BIU_D5
BIU_D6
BIU_D7
BIU_D8
BIU_D9
BIU_D10
BIU_D11
BIU_D12
BIU_D13
BIU_D14
BIU_D15
BATT_SENSE
KEY_AD1
VBUS_XDET
OEL_DC
TU_CLKON
TU_LA
TU_STO
TU_DA
TU_SCK
CHG_OFF
CHG_XING
CHG_XLOW
0.1
0.1
1
1
10
1
1
0.1 0.47
0.1
1
1
0.22
100p
0.1
10
0.1
1000p
5p
5p
0.1
0.1
0.1
0.1
0.1
1
1
1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.022
100p
100p
CXD5090-003GG

1717
NW-E002F/E003F/E005F
NW-E002F/E003F/E005F
4-5. SCHEMATIC DIAGRAM – MAIN BOARD (2/3) – • See page 19 for IC Block Diagram.
16
18
16
16
16
16
16
16
16
18
16
18
16
16
16
16
IC201
R203
R202
JL201
R201
C1301
R1306
R1305
R1303
E003F/E005F
E003F/E005F E003F/E005F
NO MOUNT : E002F NO MOUNT : E002F
R1304
R1301
R1302
Q401
FB401
FB402
C407
C402
D401
C401
C405
C409
SOL701
R2701
R2702 R2706
R2705
R2704
C2701 1
R2707
R2708
C2704
JL2701
JL702
R2709
R803
R802
R801 JL801
JL802
C201
VDR301
JL301
IC1301
R401
R402 R404
R403
R406
R408 R409
R407
R405
L401
C403
C406 C408
CN401
IC2701
IC2702
C2706
D2701
Q2701
C2707
C2708
C2705
C2703
C801
X801
S71PL032J04BFWOBOB
100k
100k
0
0.1
0
100k
0
470k
VDD_NAND2.8
NAND_AD0
NAND_AD1
NAND_AD2
NAND_AD3
NAND_AD4
NAND_AD5
NAND_AD6
NAND_AD7
NAND_XRE
NAND_CLE
NAND_ALE
NAND_XWE
NAND_XCE0
NAND_XCE1
NAND_XWP
NAND_RB1
NAND_RB0
DGND
MCH3443-TL-E
4.7
100p
MA21D3800LS0
10
1
1
4.7k
6.8k 1k
68
0
10
4700
100
C2702
1
470k
RTC_INTR
RTC_SCK
RTC_SI
RTC_SO
RTC_CE
VDD_RTC2.8
10k
470k
0
AGND
0.1
BIU_D0
BIU_D1
BIU_D2
BIU_D3
BIU_D4
BIU_D5
BIU_D6
BIU_D15
BIU_D14
BIU_D13
BIU_D12
BIU_D11
BIU_D10
BIU_D9
BIU_D8
BIU_D7
BIU_A21
BIU_A20
BIU_A19
BIU_A18
BIU_A17
BIU_A16
BIU_A15
BIU_A14
BIU_A13
BIU_A12
BIU_A11
BIU_A10
BIU_A9
BIU_A8
BIU_A7
BIU_A6
BIU_A5
BIU_A4
BIU_A3
BIU_A2
BIU_A1
BIU_XCS0
BIU_XCS1
MAIN_XRST
BIU_XRE
BIU_XWE
BIU_XLB
BIU_XUB
VDD_IO2.8
0
2.2 68k
820k
100k
220k 1M
470k
0
1MF
1MF 2.2MF
39POEL_XCS
OEL_XRST
OEL_DC
TK63727HCL-G
SDFMM1N23GB2T
0.01
MA3S13700LS0
2SK354700LS0
220p
220p
0.1
TU_CLKON
RTC_CLKOUT
TU_STO
TU_ANT
TU_OUTR
TU_OUTL
TU_DA
TU_SCK
TU_LA
0.1
RX-4574LC
*3
*2
*1

1818
NW-E002F/E003F/E005F
NW-E002F/E003F/E005F
4-6. SCHEMATIC DIAGRAM – MAIN BOARD (3/3), SWITCH BOARD –
16
16
17
16
17
16
16
16
16
17
16
16
16
16
CN601
Q601
Q602
D601
Q605
VDR606
C619 C620
Q604
S505
R504
R505
R506
R507 R511
R512
R501
R502
R508 R509R503 R510
R513
R515
R514
JL501
JL502
Q501
JL602
JL601
R601
R602
R603
R604C617
R605
R629
C601
C602
C603
JL605
JL608
R610
R613
R614
C604
C607
C609
C610
JL618
R616
R619
R621
R635
C616 C614
C621 C622 R626L602
C623
C624 C613 C615
JL614
L601
R631 C625
C627
C626R634
R627
R633
JL619
JL612JL617
R617
C608
C606
C605
R611
JL603
JL604
JL616
JL615
Q502
JL503
JL504
S504S503
S502S501
VDR501
C501
JL505
JL901
JL902
JL903
S901 S902
VDR902
VDR901
IC601
AGND
DGND
2P
2SK354700LS0
2SJ067400LS0
RB520S-30TE61
2SK354700LS0
47MF 47MF
2SK354700LS0
HOLD
10k
10k
10k
470k 470k
470k
10k 22k 22k 47k10k 10k
100k
10k
10k
KEY_XWAKE
KEY_XPLAY
KEY_XHOLD
KEY_XMENU
KEY_AD1
USB_VBUS
BATT_SENSEON
BATT_SENSE
CHG_XLOW
VBUS_XDET
VDD_USB3.3
VCORE_XUP
PWR_ON1
VDD_CORE1.2
VDD_UNREG
VDD_IO2.8
VDD_AD2.0
CHG_OFF
CHG_XING
0
470k
100k
33k0.01
0
470k
4.7
10
10
470k
10k
6200
0.15
1
1
0.01
0
0
4700
470k
10 10
10
10 00
10
10 10 10
470k 0.1
1000p
33p100k
0
0
0
1
1
0.1
470k
2SC584600LS0
PLAY/STOP
MENU
0.01
DGND
MAX8670ETL
CN601
Q601
Q602
D601
Q605
VDR606
C619 C620
Q604
S505
R504
R505
R506
R507 R511
R512
R501
R502
R508 R509R503 R510
R513
R515
R514
JL501
JL502
Q501
JL602
JL601
R601
R602
R603
R604C617
R605
R629
C601
C602
C603
JL605
JL608
R610
C604
C607
C609
C610
JL618
R616
R619
R621
R635
C616 C614
C621 C622 R626L602
C623
C624 C613 C615
JL614
L601
R631 C625
C627
C626R634
R627
R633
JL619
JL612JL617
R617
C608
C606
C605
R611
JL603
JL604
JL616
JL615
Q502
JL503
JL504
S504S503
S502S501
C501
JL505
JL901
JL902
JL903
S901 S902
VDR902
VDR901
IC601
AGND
DGND
2P
2SK354700LS0
2SJ067400LS0
RB520S-30TE61
2SK354700LS0
2SK354700LS0
HOLD
10k
10k
10k
470k 470k
470k
22k 22k 47k10k 10k
100k
10k
10k
KEY_XWAKE
KEY_XPLAY
KEY_XHOLD
KEY_XMENU
KEY_AD1
2SA2029T2L
USB_VBUS
BATT_SENSEON
BATT_SENSE
CHG_XLOW
VBUS_XDET
VDD_USB3.3
VCORE_XUP
PWR_ON1
VDD_CORE1.2
VDD_UNREG
VDD_IO2.8
VDD_AD2.0
CHG_OFF
CHG_XING
0
470k
100k
33k0.01
0
470k
4.7
10
10
470k
0.15
1
1
0.01
0
0
4700
470k
10 10
10
10 00
10
10 10 10
470k 0.1
1000p
33p
0
0
0
1
1
0.1
470k
2SC584600LS0
PLAY/STOP
MENU
0.01
DGND
MAX8670ETL
VDR601
VDR602
VDR604

19
NW-E002F/E003F/E005F
•IC Block Diagrams
IC2701 TK63727HCL-G
– MAIN Board –
VIN 1
GND 2
VOUT 3
V REF
ON/OFF
CONTROL THERMAL &
OVER CURRENT
PROTECTION
VCONT
6
GND
5
NC
4

20
NW-E002F/E003F/E005F
•IC Pin Function Description
MAIN BOARD IC101 CXD5090-003GG
(SYSTEM CONTROLLER, NAND FLASH INTERFACE, USB INTERFACE, A/D, D/A CONVERTER, SERIAL INTERFACE)
Pin No. Pin Name I/O Description
1NAD0/GPIOC0 I Data signal
2NAD1/GPIOC1 I Data signal
3NAD2/GPIOC2 I Data signal
4NAD3/GPIOC3 I Data signal
5NAD4/GPIOC4 I Data signal
6NAD5/GPIOC5 I Data signal
7NAD6/GPIOC6 I Data signal
8NAD7/GPIOC7 I Data signal
9NCLE/GPIOC8 O Command latch enable signal to NAND FLASH ROM
10 NALE/GPIOC9 O Address latch enable signal to NAND FLASH ROM
11 NCE0/GPIOC10 O Chip enable signal to NAND FLASH ROM
12 NCE1/GPIOC11 O Chip enable signal (Not used)
13 NCE2/GPIOC12 O Chip enable signal (Connected to ground terminal)
14 NCE3/GPIOC13 O Chip enable signal (Connected to ground terminal)
15 NRE/GPIOC14 O Read signal to NAND FLASH ROM
16 NWE/GPIOC15 O Write signal to NAND FLASH ROM
17 NWP/GPIOC16 O Write protection signal to NAND FLASH ROM
18 NRB0/GPIOC17 O Read/Busy signal to NAND FLASH ROM
19 NRB1/GPIOC18 O Read/Busy signal (Not used)
20 NRB2/GPIOC19 O Read/Busy signal (Connected to +2.8V)
21 NRB3/GPIOC20 O Read/Busy signal (Connected to +2.8V)
22 DVS — Ground terminal
23 DVDIO2 — Power supply terminal
24 DVDIO2 — Power supply terminal
25 DVS — Ground terminal
26 DVDK2 — Power supply terminal
27 DVS — Ground terminal
28 CRST2 I Reset signal (Pull down)
29 RST2OUT O Reset signal output for Power Control IC
30 RST2VDD — Power supply terminal
31 T_ADINL — For TEST (Connected to ground terminal)
32 HPVDD — Power supply terminal
33 HPOUTL O Headphone Lch signal output
34 PVDD — Power supply terminal
35 PGND — Ground terminal
36 HPOUTR O Headphone Rch signal output
37 HPGND — Ground terminal
38 GPION0/INT8 I Wake up signal input
39 GPION1/INT9 I HOLD key signal input
40 GPION2/INT10 I Function key signal input
41 GPION3/INT11 I Function key signal input
42 TDI I JTAG data input (Not used)
43 TMS I JTAG test mode control signal input (Not used)
44 TCK I JTAG clock signal input (Not used)
45 TDO O JTAG clock signal output (Not used)
46 TRST I JTAG reset input
47 TEST I Boot control