Sony HCD-SHAKE10 User manual

SERVICE MANUAL
Sony Corporation
Published by Sony EMCS (Malaysia) PG Tec
CD/DVD RECEIVER
9-890-688-04
2019J80-1
© 2019.10
US Model
Canadian Model
HCD-SHAKE10/SHAKE30
AEP Model
Thai Model
HCDSHAKEX30/HCDSHAKEX70
UK Model
HCDSHAKEX30
Russian Model
Australian Model
HCDSHAKEX10/HCDSHAKEX30
E Model
HCDSHAKEX10/
HCDSHAKEX30/
HCDSHAKEX70
Ver. 1.3 2019.10
• HCD-SHAKE10 is the tuner, USB, CD Player, Bluetooth, NFC and amplifi er section in SHAKE-X10.
• HCD-SHAKE30 is the tuner, USB, CD Player, Bluetooth, NFC and amplifi er section in SHAKE-X30.
• HCDSHAKEX10 is the tuner, USB, DVD Player, Bluetooth, NFC and amplifi er section in SHAKE-X10D.
• HCDSHAKEX30 is the tuner, USB, DVD Player, Bluetooth, NFC and amplifi er section in SHAKE-X30D.
• HCDSHAKEX70 is the tuner, USB, DVD Player, Bluetooth, NFC and amplifi er section in SHAKE-X70D.
SPECIFICATIONS
CD/DVD Section
Model Name Using Similar Mechanism HCD-SHAKEX1/SHAKEX3/SHAKEX7
CD/DVD Mechanism Type CDM90-DVBU204//M
Optical Pick-up Name CMS-S76RFS7GP
Photo: HCDSHAKEX70
AUDIO POWER SPECIFICATIONS
POWER OUTPUT AND TOTAL
HARMONIC DISTORTION:
(US models only)
Shake-X30 only
With 4 ohm loads, both channels driven, from
150 Hz – 20,000 Hz; rated 90 watts per channel
minimum RMS power, with no more than 0.7%
total harmonic distortion from 250 milliwatts to
rated output.
Shake-X10 only
With 4 ohm loads, both channels driven, from
150 Hz – 20,000 Hz; rated 80 watts per channel
minimum RMS power, with no more than 0.7%
total harmonic distortion from 250 milliwatts to
rated output.
Inputs
AUDIO/PARTY CHAIN IN L/R
(SHAKE-X10/X30):
Voltage 2 V, impedance
47 kilohms
AUDIO/PARTY CHAIN IN (TV) L/R
(SHAKE-X10D/X30D/X70D):
Voltage 2 V, impedance
47 kilohms
TV (ARC) (SHAKE-X10D/X30D/X70D):
Supported audio signal:
2-channel Linear PCM
MIC1:
Sensitivity 1 mV, impedance
10 kilohms
MIC2/GUITAR:
Sensitivity 1 mV, impedance
10 kilohms (When guitar mode is
turned off.)
Sensitivity 200 mV, impedance
1 Megaohm (When guitar mode is
turned on.)
Outputs
AUDIO/PARTY CHAIN OUT L/R:
Voltage 2 V, impedance 1 kilohm
VIDEO OUT (SHAKE-X10D/X30D/X70D):
Max. output level 1 Vp-p,
unbalanced, Sync. negative load
impedance 75 ohms
HDMI OUT (TV) (SHAKE-X10D/X30D/
X70D):
Supported audio signal:
2-channel Linear PCM (up to
48 kHz), Dolby Digital
HDMI section (SHAKE-X10D/X30D/X70D)
Connector:
Type A (19 pin)
Disc player section
System:
Compact disc and digital audio system
(SHAKE-X10/X30)
Compact disc and digital audio and
video system (SHAKE-X10D/X30D/
X70D)
Laser Diode Properties
Emission Duration: Continuous
Laser Output*: Less than 44.6 μW
* This output is the value measurement
at a distance of 200 mm from the
objective lens surface on the Optical
Pick-up Block with 7 mm aperture.
Frequency response:
20 Hz – 20 kHz
Video color system format (SHAKE-X10D/
X30D/X70D):
LA9 model:
NTSC
Other models:
NTSC and PAL
USB section
Supported USB device:
Mass Storage Class
Maximum current:
1 A
(USB) port:
Type A
FM tuner section
FM stereo, FM superheterodyne tuner
Antenna:
FM lead antenna
Tuning range:
87.5 MHz – 108.0 MHz (100 kHz step)
(SHAKE-X10/X30)
87.5 MHz – 108.0 MHz (50 kHz step)
(SHAKE-X10D/X30D/X70D)
BLUETOOTH section
Communication system:
BLUETOOTH Standard version 3.0
Output:
BLUETOOTH Standard Power Class 2
Maximum communication range:
Line of sight approx. 10 m (33 ft)*1
Frequency band:
2.4 GHz band (2.4000 GHz –
2.4835 GHz)
Modulation method:
FHSS (Freq Hopping Spread Spectrum)
Compatible BLUETOOTH profiles*2:
A2DP (Advanced Audio Distribution
Profile)
AVRCP (Audio Video Remote Control
Profile)
SPP (Serial Port Profile)
Supported codecs:
SBC (Subband Codec)
AAC (Advanced Audio Coding)
LDAC
*1 The actual range will vary depending on
factors such as obstacles between devices,
magnetic fields around a microwave oven,
static electricity, reception sensitivity,
antenna’s performance, operating system,
software application, etc.
*2 BLUETOOTH standard profiles indicate the
purpose of BLUETOOTH communication
between devices.
– Continued on next page –
HCD-SHAKE10/SHAKE30/
HCDSHAKEX10/HCDSHAKEX30/HCDSHAKEX70
Note:
Be sure to keep your PC used for service and
checking of this unit always updated with the
latest version of your anti-virus software.
In case a virus aff ected unit was found during
service, contact your Service Headquarters.
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HCD-SHAKE10/SHAKE30/HCDSHAKEX10/HCDSHAKEX30/HCDSHAKEX70
2
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
Supported audio formats
Supported bit rate and sampling frequencies:
MP3:
32/44.1/48 kHz,
32 kbps – 320 kbps (VBR)
AAC:
44.1 kHz, 48 kbps – 320 kbps
(CBR/VBR)
WMA:
44.1 kHz, 48 kbps – 192 kbps
(CBR/VBR)
WAV:
44.1/48 kHz (16 bit)
Supported video formats (SHAKE-X10D/X30D/X70D)
Xvid:
Video codec: Xvid video
Bit rate: 4.854 Mbps (MAX)
Resolution/Frame rate:
720 × 480, 30 fps
720 × 576, 25 fps (except for LA9 model)
Audio codec: MP3
MPEG4:
File format: MP4 File Format
Video codec: MPEG4 Simple
Profile (AVC is not compatible.)
Bit rate: 4 Mbps
Resolution/Frame rate:
720 × 480, 30 fps
720 × 576, 25 fps (except for LA9 model)
Audio codec: AAC-LC (HE-AAC is not compatible.)
DRM: Not compatible
General
Power requirements:
SHAKE-X10/X30: AC 120 V, 60 Hz
SHAKE-X10D/X30D/X70D: AC 120 V – 240 V, 50/60 Hz
Power consumption:
SHAKE-X70D: 375 W
SHAKE-X30D/SHAKE-X10D/SHAKE-X30/SHAKE-X10:
220 W
Power consumption (at the Power Saving mode) (SHAKE-X10D/
X30D/X70D):
0.5 W (When “BT STBY” is set to “OFF” and [CONTROL
FOR HDMI] is set to [OFF].)
2 W* (When “BT STBY” is set to “ON” and [CONTROL
FOR HDMI] is set to [ON].)
Dimensions (w/h/d) (excl. speakers)
(Approx.):
455 mm × 165 mm × 330 mm
(18 in × 6 1/2 in × 13 in)
Mass (excl. speakers) (Approx.):
SHAKE-X70D: 6.2 kg
SHAKE-X30D/SHAKE-X10D/SHAKE-X30/SHAKE-X10:
5.8 kg (12 lb 13 oz)
* The power consumption of the system will be less than 0.5 W
when there is no HDMI connection and “BT STBY” is set to
“OFF”.
Design and specifications are subject to change without notice.
License and Trademark Notice
• “CD” logo is trademark.
•
is a trademark of DVD Format/Logo Licensing Corporation.
• “DVD+RW”, “DVD-RW”, “DVD+R”, “DVD-R”, “DVD VIDEO”,
and the “CD” logos are trademarks.
• WALKMAN® and WALKMAN® logo are registered
trademarks of Sony Corporation.
• MPEG Layer-3 audio coding technology and patents licensed from
Fraunhofer IIS and Thomson.
• Windows Media is either a registered trademark or trademark of
Microsoft Corporation in the United States and/or other countries.
• This product is protected by certain intellectual property rights
of Microsoft Corporation. Use or distribution of such technology
outside of this product is prohibited without a license from
Microsoft or an authorized Microsoft subsidiary.
• This system incorporates Dolby* Digital.
* Manufactured under license from Dolby Laboratories. Dolby,
Dolby Audio, and the double-D symbol are trademarks of
Dolby Laboratories.
• This system incorporates High-Definition Multimedia In-
terface (HDMI™) technology. The terms HDMI and HDMI
High-Definition Multimedia Interface, and the HDMI Logo
are trademarks or registered trademarks of HDMI Licens-
ing, LLC in the United States and other countries.
• “BRAVIA” is a trademark of Sony Corporation.
• LDAC™ and LDAC logo are trademarks of Sony
Corporation.
• The BLUETOOTH® word mark and logos are registered
trademarks owned by Bluetooth SIG, Inc. and any use of such
marks by Sony Corporation is under license. Other trademarks and
trade names are those of their respective owners.
• The N-Mark is a trademark or registered trademark of NFC
Forum, Inc. in the United States and in other countries.
• Android™ is a trademark of Google Inc.
• Google Play is a trademark of Google Inc.
• Apple, the Apple logo, iPhone, iPod, and iPod touch are
trademarks of Apple Inc., registered in the U.S. and other
countries. App Store is a service mark of Apple Inc.,
registered in the U.S. and other countries.
• Use of the Made for Apple badge means that an accessory has
been designed to connect specifically to the Apple product(s)
identified in the badge, and has been certified by the
developer to meet Apple performance standards. Apple is not
responsible for the operation of this device or its compliance
with safety and regulatory standards.
• THIS PRODUCT IS LICENSED UNDER THE MPEG-4 VISUAL
PATENT PORTFOLIO LICENSE FOR THE PERSONAL AND
NON-COMMERCIAL USE OF A CONSUMER FOR
(i) ENCODING VIDEO IN COMPLIANCE WITH THE MPEG-
4 VISUAL STANDARD (“MPEG-4 VIDEO”)
AND/OR
(ii) DECODING MPEG-4 VIDEO THAT WAS ENCODED BY
A CONSUMER ENGAGED IN A PERSONAL AND NON-
COMMERCIAL ACTIVITY AND/OR WAS OBTAINED
FROM A VIDEO PROVIDER LICENSED TO PROVIDE
MPEG-4 VIDEO.
NO LICENSE IS GRANTED OR SHALL BE IMPLIED
FOR ANY OTHER USE. ADDITIONAL INFORMATION
INCLUDING THAT RELATING TO PROMOTIONAL,
INTERNAL AND COMMERCIAL USES AND LICENSING
MAY BE OBTAINED FROM MPEG LA, L.L.C.
HTTP://WWW.MPEGLA.COM
• All other trademarks are trademarks of their respective
owners.
• In this manual, ™ and ® marks are not specified.
• Abbreviation
AR : Argentina model
AUS : Australian model
CND : Canadian model
E4 : African model
E12 : 220 – 240 V AC area in E model
EA : Saudi Arabia model
LA9 : Latin-American model
MY : Malaysia model
RU : Russian model
TH : Thai model
Ver. 1.3
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HCD-SHAKE10/SHAKE30/HCDSHAKEX10/HCDSHAKEX30/HCDSHAKEX70
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NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
• Keep the temperature of the soldering iron around 270 °C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage. Check
leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2V AC range are suitable. (See
Fig. A)
1.5 kΩ0.15 μF
AC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
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HCD-SHAKE10/SHAKE30/HCDSHAKEX10/HCDSHAKEX30/HCDSHAKEX70
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1. SERVICING NOTES ............................................. 5
2. DISASSEMBLY
2-1. Disassembly Flow........................................................... 10
2-2. Panel, Side (L), Panel, Side (R), Panel, Top Assy .......... 11
2-3. 2CH DAMP Board (SHAKE10/SHAKE30/
HCDSHAKEX10/HCDSHAKEX30)............................. 12
2-4. 4CH DAMP BOARD (HCDSHAKEX70) ..................... 13
2-5. Back Panel Section (SHAKE10/SHAKE30/
HCDSHAKEX10/HCDSHAKEX30)............................. 14
2-6. Back Panel Section (HCDSHAKEX70) ......................... 14
2-7. Panel, Loading Assy ....................................................... 15
2-8. CDM90-DVBU204//M................................................... 16
2-9. Front Panel Section......................................................... 17
2-10. MOTHERBOARD Board............................................... 17
2-11. REGULATOR, SWITCHING (SSN-172AD)
(SHAKE10/SHAKE30/HCDSHAKEX10/
HCDSHAKEX30) .......................................................... 18
2-12. REGULATOR, SWITCHING (SSN-171AD)
(HCDSHAKEX70) ......................................................... 19
2-13. Service, Optical Device (7G), Flexible Flat Cable ......... 20
3. TEST MODE ............................................................ 21
4. ELECTRICAL CHECK ......................................... 23
5. TROUBLESHOOTING .......................................... 24
6. DIAGRAMS
6-1. Block Diagram
-RS SERVO, USB, HDMI Section -............................. 33
6-2. Block Diagram - MAIN Section -................................... 34
6-3. Block Diagram - AMP Section -..................................... 35
6-4. Block Diagram
- PANEL, POWER SUPPLY Section -........................... 36
6-5. Printed Wiring Board
- MOTHERBOARD Board (Component Side) -............ 38
6-6. Printed Wiring Board
- MOTHERBOARD Board (Conductor Side) - ............. 39
6-7. Printed Wiring Board
- 2CH DAMP Board (SHAKE10/SHAKE30/
HCDSHAKEX10/HCDSHAKEX30) - .......................... 40
6-8. Printed Wiring Board
- 4CH DAMP Board (Component Side)
(HCDSHAKEX70) -....................................................... 41
6-9. Printed Wiring Board
- 4CH DAMP Board (Conductor Side)
(HCDSHAKEX70) -....................................................... 42
6-10. Printed Wiring Board - TOP PANEL Board -................. 43
6-11. Schematic Diagram - TOP PANEL Board -.................... 44
6-12. Printed Wiring Board - FL Board - ................................. 45
6-13. Printed Wiring Board - MIC Board - .............................. 46
6-14. Schematic Diagram - MIC Board -................................. 47
TABLE OF CONTENTS
6-15. Printed Wiring Board - LED DRIVER Board - .............. 48
6-16. Printed Wiring Board
- SKY BLUE Board (SHAKE10/SHAKE30/
HCDSHAKEX10/HCDSHAKEX30) - .......................... 49
6-17. Printed Wiring Board
- BAR CENTER Board (HCDSHAKEX70) -................ 49
6-18. Printed Wiring Board
-
HI-RGB RIGHT LED PC BO Board (SHAKE10/
SHAKE30/HCDSHAKEX10/HCDSHAKEX30) -........ 50
6-19. Printed Wiring Board
- HI-RGB RIGHT Board (HCDSHAKEX70) -.............. 50
6-20. Printed Wiring Board - HI-RGB LEFT Board - ............. 51
6-21. Printed Wiring Board - IR Board -.................................. 51
6-22. Schematic Diagram - IR Board - .................................... 51
7. EXPLODED VIEWS
7-1. Panel, Side Section ......................................................... 53
7-2. 2CH DAMP, 4CH DAMP Board Section ....................... 54
7-3. Back Panel Section ......................................................... 55
7-4. MOTHERBOARD Board Section.................................. 56
7-5. Front Panel Section......................................................... 57
7-6. Chassis Section ............................................................... 58
7-7. Top Panel Section ........................................................... 59
7-8. CD/DVD Mechanism Section
(CDM90-DVBU204//M) ................................................ 60
8. ELECTRICAL PARTS LIST .............................. 61
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HCD-SHAKE10/SHAKE30/HCDSHAKEX10/HCDSHAKEX30/HCDSHAKEX70
5
SECTION 1
SERVICING NOTES
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the
leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radiation
exposure.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suff er electrostatic
break-down because of the potential diff erence generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
For customers in US, CND
This appliance is classified as a CLASS 1 LASER product under
IEC 60825-1:2007. This marking is located on the rear exterior of
the unit.
For customers except in US, CND
This appliance is classified as a CLASS 1 LASER product under
IEC 60825-1:2007 and IEC 60825-1:2014. This marking is located
on the rear exterior of the unit.
MODEL IDENTIFICATION
- BACK PANEL -
Model Part No.
HCDSHAKEX10: LA9 4-690-949-0[]
HCDSHAKEX30: LA9 4-690-949-1[]
HCDSHAKEX70: LA9 4-690-949-2[]
HCDSHAKEX30: TH 4-690-953-1[]
HCDSHAKEX70: TH 4-690-953-2[]
HCDSHAKEX10: AR 4-690-969-0[]
HCDSHAKEX30: AR 4-690-969-1[]
HCDSHAKEX70: AR 4-690-969-2[]
HCD-SHAKE10 4-693-563-0[]
HCD-SHAKE30 4-693-563-1[]
HCDSHAKEX10: E4 4-693-564-0[]
HCDSHAKEX30: E4 4-693-564-1[]
HCDSHAKEX70: E4 4-693-564-2[]
AEP, UK 4-693-565-0[]
HCDSHAKEX10: EA 4-693-566-0[]
HCDSHAKEX30: EA 4-693-566-1[]
HCDSHAKEX70: EA 4-693-566-2[]
HCDSHAKEX10: MY 4-693-567-0[]
HCDSHAKEX30: MY 4-693-567-1[]
HCDSHAKEX70: MY 4-693-567-2[]
E12 4-693-568-1[]
HCDSHAKEX10: RU 4-693-569-0[]
HCDSHAKEX30: RU 4-693-569-1[]
HCDSHAKEX10: AUS 4-694-735-0[]
HCDSHAKEX30: AUS 4-694-735-1[]
• Abbreviation
AR : Argentina model
AUS : Australian model
CND : Canadian model
E4 : African model
E12 : 220 – 240 V AC area in E model
EA : Saudi Arabia model
LA9 : Latin-American model
MY : Malaysia model
RU : Russian model
TH : Thai model
L
– MODEL LABEL –
MADE IN MALAYSIA
SERIAL NO.
DVD RECEIVER
PART No. Destination Code
Ver. 1.3
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HCD-SHAKE10/SHAKE30/HCDSHAKEX10/HCDSHAKEX30/HCDSHAKEX70
6
PLAYABLE DISCS
HCD-SHAKE10/SHAKE30:
• AUDIO CD
• CD-R/CD-RW in AUDIO CD format
HCDSHAKEX10/HCDSHAKEX30/HCDSHAKEX70:
• DVD VIDEO
• DVD-R/DVD-RW in DVD VIDEO format or video mode
• DVD+R/DVD+RW in DVD VIDEO format
• VIDEO CD (Ver. 1.0, 1.1, and 2.0 discs)
• Super VCD
• CD-R/CD-RW/CD-ROM in VIDEO CD format or super VCD
format
• AUDIO CD
• CD-R/CD-RW in AUDIO CD format
PLAYABLE FILES ON DISCS
• Music:
MP3 files (.mp3)*1*2
• Video (HCDSHAKEX10/HCDSHAKEX30/
HCDSHAKEX70):
MPEG4 files (.mp4/.m4v)*2*3, Xvid files (.avi)
PLAYABLE FILES ON USB DEVICE
• Music:
MP3 files (.mp3)*1*2, WMA files (.wma)*2, AAC files
(.m4a/.mp4/.3gp)*2, WAV files (.wav)*2
• Video (HCDSHAKEX10/HCDSHAKEX30/
HCDSHAKEX70):
MPEG4 files (.mp4/.m4v)*2*3, Xvid files (.avi)
*1 MP3 (MPEG 1 Audio Layer 3) is a standard format defined by
ISO/MPEG for compressed audio data. MP3 files must be in
MPEG 1 Audio Layer 3 format.
*2 Files with copyright protection (Digital Rights Management)
cannot be played back by the system.
*3 MPEG4 files must be recorded in MP4 file format. Supported
video codec and audio codec are as follows:
‒Video codec: MPEG4 Simple Profile (AVC is not
supported.)
‒Audio codec: AAC-LC (HE-AAC is not supported.)
*4 A logical format of files and folders on CD-ROMs, defined by
ISO (International Organization for Standardization).
NOTE OF REPLACEMENT OF THE MS-476 BOARD
When the MS-476 board is defective, exchange the entire
LOADING COMPLETE ASSY (T).
RELEASING THE DISC TRAY LOCK
The disc tray lock function for the antitheft of sample disc in the
shop is equipped.
It can release the lock function in the following procedure.
Releasing Procedure:
1. Press the [1] button to turn the power on.
2. Press the [FUNCTION] button to select the DVD/CD function.
3. Press the [ENTER] button and [VOCAL FADER] button
simultaneously for three seconds.
4. The message “UNLOCKED” is displayed on the screen
display panel and the disc tray is unlocked.
Note: When “LOCKED” is displayed on the screen display panel, the disc
tray lock is not released by turning the power on/off with the [1]
button.
TEST DISCS
Use following TEST DISC when this unit confirms the operation
and checks it.
• For CD
Part No. Description
3-702-101-01 DISC (YEDS-18), TEST
4-225-203-01 DISC (PATD-012), TEST
J-2501-307-A DISC (HLX-A1), TEST
• For DVD SL (Single Layer)
Part No. Description
J-6090-069-A DISC (HLX-503), TEST (NTSC)
J-6090-088-A DISC (HLX-504), TEST (NTSC)
J-2501-305-A DISC (HLX-513), TEST (NTSC)
J-6090-077-A DISC (HLX-506), TEST (PAL)
• For DVD DL (Double Layer)
Part No. Description
J-6090-071-A DISC (HLX-501), TEST (NTSC)
J-6090-089-A DISC (HLX-505), TEST (NTSC)
J-2501-306-A DISC (HLX-514), TEST (NTSC)
J-6090-078-A DISC (HLX-507), TEST (PAL)
If “PROTECT XX” (X is a number)
appears on the display
Immediately unplug the AC
power cord (mains lead), and
check the following items.
ŞAre you using only the supplied
speakers?
ŞIs anything blocking the
ventilation holes of the unit?
After you have checked and
found no problems, reconnect
the AC power cord (mains lead),
and turn on the system. If the
issue persists, contact your
nearest Sony dealer.
Note
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HCD-SHAKE10/SHAKE30/HCDSHAKEX10/HCDSHAKEX30/HCDSHAKEX70
7
NOTE OF REPLACING MOTHERBOARD BOARD OR
BLUETOOTH MODULE OR RC-S730 (WW)
When the MOTHERBOARD board or BLUETOOTH module or
RC-S730 (WW) are replaced, please execute the below service
mode.
Pairing this system with a Bluetooth device
1. Press the [1] button to turn the power on.
2. Place the Bluetooth device within 1 meter from the unit.
3. Press BLUETOOTH on the unit to select Bluetooth function.
“BLUETOOTH” appears on the display.
Hint
• When there is no pairing information on the system (for
example, when you use the BLUETOOTH function for
the first time after purchase), “PAIRING” flashes on the
display and the system enters the pairing mode.
Proceed to step 5.
• If the system is connected to a BLUETOOTH device, press
BLUETOOTH on the unit to disconnect the BLUETOOTH
device.
4. Hold down on the unit for 2 seconds or more.
“PAIRING” flashes on the display.
5. Perform the pairing procedure on the Bluetooth device.
6. Select the system’s name on the display of the Bluetooth
device.
For example, select “SHAKE-X10 or SHAKE-X30 or
SHAKE-X10D or SHAKE-X30D or SHAKE-X70D”.
If passkey is required on the Bluetooth device, enter “0000”.
7. Perform the Bluetooth connection on the Bluetooth device.
8. When pairing is completed and the Bluetooth connection is
established, Bluetooth device name appears on the display.
9. To cancel pairing operation, hold down on the unit
for 2 seconds or more until “BLUETOOTH” appears on the
display.
Connecting with a smartphone by one touch (NFC)
Note: The operation in this mode must use a NFC-compatible smartphone
(Smartphones with a built-in NFC function [OS: Android 2.3.3 or
later, excluding Android 3.x])
1. Press the [1] button to turn the power on.
2. Download and install the app “NFC Easy Connect”.
Download the free Android app from Google Play by searching
for “NFC Easy Connect”.
3. Start the app “NFC Easy Connect” on the smartphone.
Make sure that the application screen is displayed.
4. Touch the smartphone to the N-Mark on the system until the
smartphone vibrates.
Complete the connection by following the instructions
displayed on the smartphone.
5. When pairing is completed and the Bluetooth connection is
established, the Bluetooth device name appears in the display
panel.
Playing music from a Bluetooth device
For a Bluetooth device
1. Press the [1] button to turn the power on.
2. Press BLUETOOTH on the unit to select Bluetooth function.
“BLUETOOTH” appears in the display panel.
3. Establish connection with the Bluetooth device.
Press BLUETOOTH on the unit to connect to the last
connected Bluetooth device.
Perform the Bluetooth connection from the Bluetooth device if
the device is not connected.
Once the connection is established, the Bluetooth device name
appears in the display panel.
4. Press N.
Depending on the Bluetooth device,
– you may have to press Ntwice.
– you may need to start playback of an audio source on the
Bluetooth device.
For an NFC-compatible smartphone
1. Press the [1] button to turn the power on.
Touch the smartphone to the N-Mark on the system to establish
the Bluetooth connection.
Start playback of an audio source on the smartphone. For
details on playback, refer to the operating instructions of your
smartphone.
To disconnect the Bluetooth device
For a Bluetooth device
Press BLUETOOTH on the unit.
“BLUETOOTH” appears in the display panel.
For an NFC-compatible smartphone
Touch the smartphone to the N-Mark on the system again.
To erase all the pairing registration information perform
BLUETOOTH PAIRING HISTORY CLEAR test mode (Re-
fer page 21).
SYSSET
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HCD-SHAKE10/SHAKE30/HCDSHAKEX10/HCDSHAKEX30/HCDSHAKEX70
8
HOW TO OPEN THE TRAY WHEN POWER SWITCH TURN OFF
Note 1: After the side (L, R) panel, top panel section, fan bracket and DC fan are removed, this work is done.
Note 2: Please prepare the thin wire (clip etc. processed to the length of 8 cm or more).
CAPACITOR DISCHARGE FOR ELECTRIC SHOCK PREVENTION
Switching Regulator (SSN-172AD) Board (Conductor side view) (HCD-SHAKE10/SHAKE30/HCDSHAKEX10/HCDSHAKEX30)
In checking the Switching Regulator (SSN-172AD) board, make 3 capacitors discharge of C18, C20 and C27 for eletrical shock prevention.
C18
C20
C27
R
800 :/5 W
800 :/5 W
R
R
800 :/5 W
2Insert the clip etc.
3
tray
1Remove the side (L,R) panel, top panel section,
fan bracket and DC fan.
(Illustration of disassembly is omitted.)
CD/DVD drive
tray
Insert the clip etc.
processed to the
length of 8 cm or
more in the hole
on the side of the
CDM and push.
8 cm or more
hole
– Side view –
– Top view –
Note: Push after it inserts it in this hole well.
Ver. 1.1
SYSSET
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HCD-SHAKE10/SHAKE30/HCDSHAKEX10/HCDSHAKEX30/HCDSHAKEX70
9
CAPACITOR DISCHARGE FOR ELECTRIC SHOCK PREVENTION
Switching Regulator (SSN-171AD) Board (Conductor side view) (HCDSHAKEX70)
In checking the Switching Regulator (SSN-171AD) board, make 4 capacitors discharge of C18, C20, C27 and C28 for eletrical shock
prevention.
SERVICE POSITION
800 :/5
W
R
R
800 :/5 W
C28
R
800 :/5 W
R
800 :/5 W
C27
C18
C20
TOP PANEL board
CDM90-DVBU204//M
2CH DAMP board
(SHAKE10/SHAKE30/
HCDSHAKEX10/HCDSHAKEX30)
4CH DAMP board (HCDSHAKEX70)
MOTHERBOARD board
stand
MIC board
FL board
panel, top assy
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HCD-SHAKE10/SHAKE30/HCDSHAKEX10/HCDSHAKEX30/HCDSHAKEX70
10
Note: Disassemble the unit in the order as shown below.
2-1. DISASSEMBLY FLOW
SECTION 2
DISASSEMBLY
2-2. PANEL, SIDE (L), PANEL, SIDE (R),
PANEL, TOP ASSY
(Page 11)
2-3. 2CH DAMP BOARD
(SHAKE10/SHAKE30/HCDSHAKEX10/HCDSHAKEX30)
(Page 12)
2-5. BACK PANEL SECTION
(SHAKE10/SHAKE30/HCDSHAKEX10/HCDSHAKEX30)
(Page 14)
2-7. PANEL, LOADING ASSY
(Page 15)
2-8. CDM90-DVBU204//M
(Page 16)
2-9. FRONT PANEL SECTION
(Page 17)
2-10. MOTHERBOARD BOARD
(Page 17)
2-4. 4CH DAMP BOARD
(HCDSHAKEX70)
(Page 13)
2-6. BACK PANEL SECTION
(HCDSHAKEX70)
(Page 14)
2-13. SERVICE, OPTICAL DEVICE (7G),
FLEXIBLE FLAT CABLE
(Page 20)
SET
2-11. REGULATOR, SWITCHING (SSN-172AD)
(SHAKE10/SHAKE30/HCDSHAKEX10/HCDSHAKEX30)
(Page 18)
2-12. REGULATOR, SWITCHING (SSN-171AD)
(HCDSHAKEX70)
(Page 19)
SYSSET
2019/10/2523:34:43(GMT+09:00)