Sony Hcd-gpx9 User manual

SERVICE MANUAL

COMPACT DISC DECK RECEIVER

AEP Model

UK Model

HCD-GPX9

Ver. 1.1 2005.05

SPECIFICATIONS

9-879-468-02

2005E05-1

Sony Corporation

Personal Audio Group

Published by Sony Engineering Corporation

– Continued on next page –

HCD-GPX9 is the amplifier, CD player, tape deck

and tuner section in CMT-GPX9DAB.

Model Name Using Similar Mechanism HCD-GPX5

CD CD Mechanism Type CDM80B-K6BD80A

Section Base Unit Name BU-K6BD80A

Optical Pick-up Block Name KSM-213DCP

Tape deck Model Name Using Similar Mechanism HCD-GPX5

Section Tape Transport Mechanism Type CMAL1Z234A

AUDIO POWER SPECIFICATIONS

Main unit

Amplifier section

DIN power output (rated): 30 + 30 W

(6 ohms at 1 kHz, DIN)

Continuous RMS power output (reference):

35 + 35 W

(6 ohms at 1 kHz, 10%

THD)

Music power output (reference):

60 + 60 W

Inputs

AUDIO IN: Sensitivity 250 mV,

impedance 47 kilohms

Outputs

PHONES: Accepts headphones with

an impedance of 8 ohms or

more

SPEAKER: Accepts impedance of 6 to

16 ohms.

CD player section

Laser Diode Properties Emission Duration:

Continuous

Laser Output*:

Less than 44.6 µW

µ

*This output is the value measurement at a distance of

200 mm from the objective lens surface on the

Optical Pick-up Block with 7 mm operture.

Frequency response 20 Hz – 20 kHz

Wavelength 780 – 790 nm

Aerial terminal 75 Ω, F female

FM stereo, FM/AM superheterodyne tuner

FM tuner section

Tuning range 87.5 – 108.0 MHz

Aerial FM lead aerial

Aerial terminals 75 ohms unbalanced

Intermediate frequency 10.7 MHz

AM tuner section

Tuning range 531 – 1,602 kHz

(with the tuning interval

set at 9 kHz)

Aerial AM loop aerial, external

aerial terminal

Intermediate frequency 450 kHz

Tape deck section

Recording system 4-track 2-channel, stereo

Frequency response 50 – 13,000 Hz (±3 dB),

using Sony TYPE I

cassettes

Tuner section

DAB tuner section

Frequency range

Band-III: 174.928 (5A) –

239.200 (13F) MHz

L-Band: 1452.960 MHz (L1) –

1490.624 MHz (L23)

(L-Band is not available

for the UK model.)

*For details, see “DAB frequency table” below.

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HCD-GPX9

Notes on chip component replacement

•Never reuse a disconnected chip component.

•Notice that the minus side of a tantalum capacitor may be

damaged by heat.r may be damaged by heat.

Flexible Circuit Board Repairing

•Keep the temperature of the soldering iron around 270 ∞C

during repairing.

•Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

•Be careful not to apply force on the conductor when soldering

or unsoldering.

This appliance is classified as

a CLASS 1 LASER product.

The CLASS 1 LASER

PRODUCT MARKING is

located on the rear exterior.

CAUTION

Use of controls or adjustments or performance of procedures

otherthanthosespecified herein may result inhazardousradiation

exposure.

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINE

WITH MARK 0ON THE SCHEMATIC DIAGRAMS AND IN

THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.

REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE

PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR

IN SUPPLEMENTS PUBLISHED BY SONY.

L-Band

Notes

•L-Band is not available for the UK model.

•Frequencies are displayed to two places of decimals

on this system.

Frequency Label

1452.960 MHz L1

1454.672 MHz L2

1456.384 MHz L3

1458.096 MHz L4

1459.808 MHz L5

1461.520 MHz L6

1463.232 MHz L7

1464.944 MHz L8

1466.656 MHz L9

1468.368 MHz L10

1470.080 MHz L11

1471.792 MHz L12

1473.504 MHz L13

1475.216 MHz L14

1476.928 MHz L15

1478.640 MHz L16

1480.352 MHz L17

1482.064 MHz L18

1483.776 MHz L19

1485.488 MHz L20

1487.200 MHz L21

1488.912 MHz L22

1490.624 MHz L23

Power consumption 85 W

0.25 W (in Power Saving

Mode)

Dimensions (w/h/d) Approx. 181.5 × 261.5 ×

357.5 mm incl. projecting

parts and controls

Mass Approx. 5.8 kg

General

Power requirements 230 V AC, 50/60 Hz

Design and specifications are subject to change

without notice.

DAB frequency table

Band-III

Note

Frequencies are displayed to two places of decimals on

this system.

Frequency Label Frequency Label

174.928 MHz 5A 209.936 MHz 10A

176.640 MHz 5B 211.648 MHz 10B

178.352 MHz 5C 213.360 MHz 10C

180.064 MHz 5D 215.072 MHz 10D

181.936 MHz 6A 216.928 MHz 11A

183.648 MHz 6B 218.640 MHz 11B

185.360 MHz 6C 220.352 MHz 11C

187.072 MHz 6D 222.064 MHz 11D

188.928 MHz 7A 223.936 MHz 12A

190.640 MHz 7B 225.648 MHz 12B

192.352 MHz 7C 227.360 MHz 12C

194.064 MHz 7D 229.072 MHz 12D

195.936 MHz 8A 230.784 MHz 13A

197.648 MHz 8B 232.496 MHz 13B

199.360 MHz 8C 234.208 MHz 13C

201.072 MHz 8D 235.776 MHz 13D

202.928 MHz 9A 237.488 MHz 13E

204.640 MHz 9B 239.200 MHz 13F

206.352 MHz 9C

208.064 MHz 9D

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HCD-GPX9

TABLE OF CONTENTS

1. SERVICING NOTES ............................................... 4

2. GENERAL

Location of Controls........................................................ 6

3. DISASSEMBLY

3-1. Disassembly Flow ........................................................... 8

3-2. Side Plate (L)/(R) ............................................................ 9

3-3. Top Block Assy ............................................................... 9

3-4. Tape Mechanism Deck (CMAL1Z234A)........................ 10

3-5. Front Panel Section ......................................................... 10

3-6. MAIN Board.................................................................... 11

3-7. DAB Board ...................................................................... 11

3-8. CD Mechanism Deck Block............................................ 12

3-9. Base Unit (BU-K6BD80A) ............................................. 12

3-10. BD Board......................................................................... 13

3-11. Driver Board .................................................................... 13

3-12. Chassis (Top) ................................................................... 14

3-13. Lever (Loading-L/R) ....................................................... 15

3-14. Lever (Disc Sensor)/(Disc Stop) ..................................... 16

3-15. Holder (BU215) Assy ...................................................... 16

3-16. Lever (BU Lock) ............................................................. 17

3-17. Close Lever...................................................................... 17

3-18. Lever (Dir), Gear (IDL-B)............................................... 18

3-19. Gear (IDL-C) ................................................................... 18

4. TEST MODE.............................................................. 19

5. ELECTRICAL ADJUSTMENTS

Deck Section.................................................................... 21

CD Section ...................................................................... 22

6. DIAGRAMS

6-1. Block Diagram – CD SERVO Section – ........................ 23

6-2. Block Diagram – AUDIO Section – ............................... 24

6-3. Block Diagram

– PANEL/POWER SUPPLY Section – ........................... 25

6-4. Printed Wiring Board – DRIVER Board – ..................... 27

6-5. Schematic Diagram – DRIVER Board –........................ 27

6-6. Printed Wiring Board – BD Board – .............................. 28

6-7. Schematic Diagram – BD Board – ................................. 29

6-8. Printed Wiring Board – DAB Board –............................ 30

6-9. Schematic Diagram – DAB Board – .............................. 31

6-10. Printed Wiring Board – MAIN Board – ......................... 32

6-11. Schematic Diagram – MAIN Board (1/3) – ................... 33

6-12. Schematic Diagram – MAIN Board (2/3) – ................... 34

6-13. Schematic Diagram – MAIN Board (3/3) – ................... 35

6-14. Printed Wiring Board – AMP Board – ........................... 36

6-15. Schematic Diagram – AMP Board – .............................. 37

6-16. Printed Wiring Board – PANEL (1) Board –.................. 38

6-17. Schematic Diagram – PANEL (1) Board – .................... 39

6-18. Printed Wiring Board – PANEL (2) Board –.................. 40

6-19. Schematic Diagram – PANEL (2) Board – .................... 41

6-20. Printed Wiring Board – POWER Board – ...................... 42

6-21. Schematic Diagram – POWER Board –......................... 43

7. EXPLODED VIEWS

7-1. Side Plates Section .......................................................... 52

7-2. Front Panel Section ......................................................... 53

7-3. Top Block Section ........................................................... 54

7-4. MAIN Section ................................................................. 55

7-5. Chassis Section-2 ............................................................ 56

7-6. CD Mechanism Deck Section-1

(CDM80B-K6BD80A) .................................................... 57

7-7. CD Mechanism Deck Section-2

(CDM80B-K6BD80A) .................................................... 58

7-8. CD Mechanism Deck Section-3

(CDM80B-K6BD80A) .................................................... 59

7-9. CD Mechanism Deck Section-4

(CDM80B-K6BD80A) .................................................... 60

7-10. Base Unit Section (BU-K6BD80A) ................................ 61

8. ELECTRICAL PARTS LIST................................ 62

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HCD-GPX9

The laser diode in the optical pick-up block may suffer electrostatic

break-down because of the potential difference generated by the

charged electrostatic load, etc. on clothing and the human body.

During repair, pay attention to electrostatic break-down and also

use the procedure in the printed matter which is included in the

repair parts.

The flexible board is easily damaged and should be handled with

care.

NOTES ON LASER DIODE EMISSION CHECK

The laser beam on this model is concentrated so as to be focused on

the disc reflective surface by the objective lens in the optical pick-

up block. Therefore, when checking the laser diode emission,

observe from more than 30 cm away from the objective lens.

LASER DIODE AND FOCUS SEARCH OPERATION

CHECK

Carry out the“S curve check” in“CD section adjustment” and check

that the S curve waveforms is output three times.

NOTES ON HANDLING THE OPTICAL PICK-UP

BLOCK OR BASE UNIT

SERVICE POSITION

–Tape Mechanism Deck –

SECTION 1

SERVICING NOTES

tape mechanism deck

UNLEADED SOLDER

Boards requiring use of unleaded solder are printed with the lead-

free mark (LF) indicating the solder contains no lead.

(Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

: LEAD FREE MARK

Unleaded solder has the following characteristics.

•Unleaded solder melts at a temperature about 40 °C higher

than ordinary solder.

Ordinary soldering irons can be used but the iron tip has to be

applied to the solder joint for a slightly longer time.

Soldering irons using a temperature regulator should be set to

about 350 °C.

Caution: The printed pattern (copper foil) may peel away if

the heated tip is applied for too long, so be careful!

•Strong viscosity

Unleaded solder is more viscou-s (sticky, less prone to flow)

than ordinary solder so use caution not to let solder bridges

occur such as on IC pins, etc.

•Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may

also be added to ordinary solder.

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HCD-GPX9

– CD Mechanism deck –

– AMP Board –

2

Remove the AMP board

from heat sink.

AMP board

1

two screws

(BVTP3

×

16)

heat sink

CD mechanism deck

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HCD-GPX9 SECTION 2

GENERAL This section is extracted from

instruction manual.

Main unit

BASS +/– wk

Cassette compartment 4

CD SYNCHRO 7

DAB qf

DIRECTION 6

Disc slot wf

DISPLAY ea

Display window 3

DSGX qs

FM MODE wh

FUNCTION e;

PHONES jack wd

PLAY MODE ws

Remote sensor 2

REPEAT wa

TREBLE +/– qd

TUNER/BAND qg

TUNING MODE wj

TUNING +/– wg

VOLUME qa

?/1 (power) 1

./> (CD skip back/skip

forward) w;

m/M (CD rewind/fast

forward) ql

m/M (tape rewind/fast

forward) wl

x(CD stop) qj

x(tape stop) 9

zREC PAUSE/START 8

CD/NX (play/pause) qk

TAPE/nN (play) 0

A(CD eject) qh

APUSH EJECT (tape open/close)

5

List of button locations and reference pages

ALPHABETICAL ORDER

A – O P – Z

BUTTON DESCRIPTIONS

?

/

1

mM

Y

x

mM

.>

N

Xx

Z

12 3 56

7

8

9

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0

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qd

qf

qg

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ea

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HCD-GPX9

Remote control

CD qh

CLEAR qd

CLOCK/TIMER SELECT 2

PLAY MODE qk

REPEAT 4

SLEEP w;

TAPE qg

TUNER BAND 5

TUNER MEMORY qj

TUNING MODE qk

VOLUME +/– qa

?/1 (power) 1

m/M (rewind/fast forward)

7

./> (skip back/skip

forward) qf

x(stop) 8

X(pause) 8

N(play) 8

+/– (tuning) qf

ALPHABETICAL ORDER

A – O P – Z

BUTTON DESCRIPTIONS

4

5

6

7

8

9

w; 1

qd

qs

ql

qk

qj

qh

qg

qf

qa

0

3

2

CLOCK/TIMER SET 3

DAB 6

DISPLAY ql

ENTER 9

EQ qs

FM MODE 4

FUNCTION q;

Use buttons on the remote for the operation.

1Press ?/1 to turn on the unit.

2Press CLOCK/TIMER SET.

3Press . or >repeatedly to set the

hour.

4Press ENTER.

5Press . or >repeatedly to set the

minute.

6Press ENTER.

The clock starts working.

To adjust the clock

1

Press CLOCK/TIMER SET.

2

Press . or >repeatedly to select

“CLOCK SET”, then press ENTER.

3

Do the same procedures as step 3 to 6

above.

Note

The clock is not displayed in Power Saving Mode.

Setting the clock

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HCD-GPX9

8

•This set can be disassembled in the order shown below.

3-1. DISASSEMBLY FLOW

SECTION 3

DISASSEMBLY

SET

3-2. SIDE PLATE

(L)/(R)

(Page 9)

3-8. CD

MECHANISM

DECK BLOCK

(Page 11)

3-15. HOLDER

(BU215) ASSY

(Page 15)

3-16. LEVER

(BU LOCK)

(Page 16)

3-17. CLOSE

LEVER

(Page 16)

3-18. LEVER (DIR),

GEAR (IDL-B)

(Page 17)

3-10. BD BOARD

(Page 12)

3-9. BASE UNIT

(BU-K6BD80A)

(Page 12)

3-12. CHASSIS (TOP)

(Page 13)

3-11. DRIVER

BOARD

(Page 13)

3-13. LEVER

(LOADING-L/R)

(Page 14)

3-14. LEVER (DISC

SENSOR)/

(DISC STOP )

(Page 15)

3-19. GEAR

(IDL-C)

(Page 17)

3-4. TAPE MECHANISM DECK

(CMAL1Z234A)

(Page 10)

3-7. DAB BOARD

(Page 10)

3-5. FRONT PANEL

SECTION

(Page 10)

3-6. MAIN BOARD

(Page 11)

3-3. TOP BLOCK

ASSY

(Page 9)

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HCD-GPX9

9

3-3. TOP BLOCK ASSY

Note: Follow the disassembly procedure in the numerical order given.

3-2. SIDE PLATE (L) / (R)

q;

side plate (R)

7

two screws

(BVTT3

×

6)

4

two screws

(BVTT3

×

8)

5

side plate (L)

1

screw

(BVTP3

×

10)

2

two screws

(BVTT3

×

6)

3

screw

(BVTP3

×

10)

6

screw

(BVTP3

×

10)

8

screw

(BVTP3

×

10)

9

two screws

(BVTT3

×

8)

5

8

top block assy

7

connector

(CN301)

2

screw

(BVTT3

×

6)

6

wire (flat type)

(7 core) (CN302)

4

Open the plate.

3

harness

4

Open the plate.

1

screw

(BVTT3

×

6)

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HCD-GPX9

10

3-4. TAPE MECHANISM DECK (CMAL1Z234A)

3-5. FRONT PANEL SECTION

2

harness

1

four screws

(BVTP3

×

8)

3

tape mechanism deck

(CMAL1Z234A)

5

front panel section

4

Open the plate.

3

two screws

(BVTT3

×

6)

1

wire (flat type)

(21 core) (CN310)

2

connector

(CN604)

4

Open the plate.

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HCD-GPX9

11

3-6. MAIN BOARD

3-7. DAB BOARD

qs

wire (flat type) (17 core)

(CN304)

1

wire (flat type) (9 core)

(CN306)

8

screw

(BVTT3

×

6)

qd

MAIN board

9

4

heat sink cover

7

three screw

s

(BVTP3

×

8)

3

two screws

(BVTT3

×

8)

2

three connectors

(CN603, 605, 901)

5

connector (CN201)

6

connector

(CN701)

0

wire (flat type)

(15 core) (CN305)

qa

wire (flat type)

(11 core) (CN315)

2

wire (flat type) (11 core)

(CN715)

1

connector

5

connector

(CN700)

7

module (DAB tuner)

6

two holders DAB

3

four screws

(BVTT3

×

6)

8

DAB board

4

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HCD-GPX9

12

3-9. BASE UNIT (BU-K6BD80A)

3-8. CD MECHANISM DECK BLOCK

qa

CD mechanism

deck block

5

screw

(BVTT3

×

6)

8

screw

(BVTT3

×

6)

9

two screws

(BVTT3

×

6)

0

cover (CDM)

3

screw

(BVTT3

×

6

)

7

1

connector

4

DAB block

6

three screws

(BVTT3

×

6)

2

two screws

(KTP3

×

8)

qs

base unit (BU-K6BD80A)

3

two screws

(BVTP3

×

10)

1

two screws

(BVTT3

×

10)

4

CD mecha bracket (R)

block

2

CD mecha bracket (L)

7

two coil springs

(insulator)

8

two insulators

6

two stoppers

(BU)

5

two screws

(BVTP M2.6)

9

two floating screws

(PTPWH M2.6)

0

two coil springs

(insulator)

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two insulators

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HCD-GPX9

13

3-10. BD BOARD

3-11. DRIVER BOARD

1

Remove four solders.

4

BD board

2

wire (flat type) (16 core)

(CN101)

3

screw (2.6)

3

Remove two solders.

2

two screws

(BVTP 2.6)

5

DRIVER board

4

motor (pully) assy

(loading)

1

belt (MOT)

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HCD-GPX9

14

3-12. CHASSIS (TOP)

1

screw

(BVTP 2.6)

4

three screws

(BVTP 2.6)

3

two screws

(P 2

×

10)

5

chassis (top)

2

lever (CL UP2)

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HCD-GPX9

15

3-13. LEVER (LOADING-L/R)

lever (loading-R)

Align the horizontal position.

lever (loading-L)

Install the

both levers so that they move symmetrically.

— Bottom view —

2

two hooks

4

two hooks

3

lever (loading-L)

5

lever (loading-R)

SPT-T (loading-R) SPT-T (loading-L)

1

PRECAUTION DURING LEVER (LOADING R / L) INSTALLATION

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HCD-GPX9

16

3-15. HOLDER (BU215) ASSY

3-14. LEVER (DISC SENSOR)/(DISC STOP)

chassis (top)

hole

Install the lever (disc stop) so that the both holes

are aligned.

hole

1

gear (cap)

3

two claws

5

two hooks

6

lever (disc stop) lever (disc stop)

4

lever (disc sensor)

PRECAUTION DURING DISC STOP LEVER INSTALLATION

2

gear (IDL L)

5

213 down holder SPR-E

1

screw

(BVTP 2.6

×

8)

2

lever (CL UP2)

6

holder (BU215) assy

3

floating screw

(PTPWHM2.6)

4

floating screw

(PTPWHM2.6)

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HCD-GPX9

17

3-16. LEVER (BU LOCK)

3-17. CLOSE LEVER

4

three hooks

1

floating screw

(PTPWH M2.6)

5

lever (BU lock)

2

gear (cap)

3

gear (BU lock)

1

washer (3-1-0.4)

2

SPR-E lever close

4

shaft disc stop

5

close lever

3

claw

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HCD-GPX9

18

3-18. LEVER (DIR), GEAR (IDL-B)

3-19. GEAR (IDL-C)

4

pulley (gear)

3

nylon washer 1.7

2

claw

washer

0

lever (DIR)

6

gear (IDL-A)

qa

gear (IDL-B)

1

DIR SPR-E

9

stoper

7

Loosen the screw.

8

Hold the release lever

and change the direction.

5

gear (cap)

6

claw

1

gear (IDL-F)

5

gear loading lever

2

two claws

4

three hooks

3

gear (IDL-D)

7

gear (IDL-C)

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2

8

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4

2

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8

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19

HCD-GPX9

SECTION 4

TEST MODE

[MC COLD RESET]

The cold reset clears all data including preset data stored in the

memory to initial conditions. Execute this mode when returning

the set to the customer.

Procedure:

1. In the standby status, press the I/1button to turn the power

on.

2. Press three buttons of I/1, x(CD), and [DSGX]

simultaneously.

3. The set is reset, and become standby status.

[COMMON TEST MODE]

EnterThe CommonTest Mode

Procedure:

1. In the standby status, press the I/1button to turn the power

on.

2. Press three buttons of [REPEAT],x(TAPE), and [DSGX]

simultaneously.

3. When the common test mode is activated, “SLEEP” and

“PLAY” icons are blink on the fluorescent indicator tube.

AMPTest

Procedure:

1. In the common test mode, if turn the [VOLUME] knob

clockwise, it displays “VOL MAX”, and if turn the knob

counterclockwise, it displays “VOL MIN”.

2. If the [TREBLE] knobs are turned clockwise or

counterclockwise, it displays “TONE FLAT”.

3. If the [BASS] knobs are turned clockwise, it displays “TONE

MAX”, and if turn the knob counterclockwise, it displays

“TONE MIN”.

4. To release from this mode, disconnect theAC plug to turn the

power off.

Tape Test

Procedure:

1. In the common test mode, insert a tape.

2. Input any audio signal from the [VIDEO/MD] jack (J301) on

the MAIN board.

3. Press the [ REC] button, and press the [ TAPE] button to

select the tape direction.

4. Press the [ REC] button again to start recording.

5. If press the m(TAPE) or M(TAPE) button, the tape is

returned to recording start point by cue or review operation,

and starts playback.

6. To release from this mode, disconnect theAC plug to turn the

power off.

[PANEL TEST MODE]

EnterThe PanelTest Mode

Procedure:

1. In the standby status, press the I/1button to turn the power

on.

2. Press three buttons of [PLAY MODE], x(TAPE), and [DSGX]

simultaneously.

3. When the panel test mode is activated, LEDs and segments of

fluorescent indicator tube are all turned on.

Version Check

Procedure:

1. In the panel test mode (all LEDs and segments of fluorescent

indicator tube are turned on), pressthe [TUNING MODE] button.

2. Destinationindication and model type indication are displayed

on the fluorescent indicator tube alternately.

3. From this status, each time the [TUNING MODE] button is

pressed, it changes the version display of each module

cyclically as follows.

Display Module

MC Main controller

GC Display

CD CD system

CDD CD device master

CDMA CDM upper module

CDMB CDM lower module

BDA BD upper module

BDB BD lower module

ST Tuner

TA Amplifier

TM Timer

TC Tape

4. To date of any module, press the [DSGX] button.

5. To releasefromthis mode, press threebuttonsof [PLAY MODE],

x(TAPE), and [DSGX] simultaneously.

Key Check

Procedure:

1. In the panel test mode (all LEDs and segments of fluorescent

indicator tube are turned on), press the [PLAY MODE] button.

2. It displays “K 0 J0 V0” on the fluorescent indicator tube.

3. Each time a button is pressed, “K” value increases. However,

once a button is pressed, it is no longer taken into account.

All keys are pressed, display becomes “K26”.

4. “V” value increases like 0, 2, 4... or 1, 3, 5... if turn the

[VOLUME] knob clockwise, or it decreases like 0, 8, 6... or 1,

9, 7... if turn the knob counterclockwise.

“J” valueincreases like 1, 2, 3...if turn the [BASS] or[TREBLE]

knob clockwise, or it decreases like 0, 9, 8 ... if turn the knob

counterclockwise.

5. To release from this mode, press three buttons of [PLAY

MODE], x(TAPE), and [DSGX] simultaneously.

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20

HCD-GPX9

[CD REPEAT 5 LIMIT CANCEL MODE]

Number of repeat for CD playback is 5 times when the repeat mode

is“REPEAT”.Thismode enablesCD to repeatplaybackforlimitless

times.

Procedure:

1. Press the I/1button to turn the power on.

2. Press the [FUNCTION] button to select CD function.

3. Press three buttons of m(CD), x(TAPE), and [DSGX]

simultaneously.

4. ItenterstheCDrepeat 5 limit cancel mode and display “LIMIT

OFF”

5. To release this mode, press the I/1button to turn the power

off.

[CD SHIP MODE]

This mode can run the CD sled motor optionally. Use this mode,

for instance, when cleaning the optical pick-up.

Procedure:

1. Press the I/1button to turn the power on.

2. Press the [FUNCTION] button to select CD function.

3. Press three buttons of [TUNING MODE], x(CD),

and I/1simultaneously. *1

4. Set to the CD ship mode. (chucking on)

5. After blink “STANDBY”, “LOCK” is displayed, disconnect

the AC plug.

*1) If press three buttons of [DIRECTION], u(CD), and

[DSGX] simultaneously, Activate the CD ship mode and

MC cold reset.

[CD SLOT LOCK]

This mode is for the antitheft of CD disc in shop. (not for transport)

Procedure:

1. Press the I/1button to turn the power on.

2. Press the [FUNCTION] button to select CD function.

3. Insert a disc.

4. While pressing the x(CD) button, press the A(CD) button

for more 5 seconds.

5. The message “LOCKED” is displayed and the disc slot is

locked. (Even if exiting from this mode, the disc slot is still

locked)

6. If press the A(CD) button to eject the disc, the message

“LOCKED” is displayed and can not eject the disc.

7. To release this lock, while pressing the x(CD) button, press

the A(CD) button for 5 seconds again.

8. The message “UNLOCKED” is displayed and the disc slot is

unlocked.

[CD POWER MANAGE]

This mode is for switch the CD power supply on/off. Even if this

state pulls out AC plug, it is held.

Procedure:

1. Press the I/1button to turn the power on.

2. Press the [FUNCTION] button to select CD function.

3. Press the I/1button again to turn the power off (standby).

4. While pressing the x(CD) button, press the I/1button.

5. It turns power on and display “CD POWER”, then display

“ON” or “OFF”.

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TEL 13942296513 QQ 376315150 892498299

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Sony HCD-GPX9 User manual

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