Sony HCD-HP8V User manual

HCD-HP8V
E Model SERVICE MANUAL
MICRO HI-FI COMPONENT SYSTEM
Sony Corporation
Home Audio Company
Published by Sony Engineering Corporation
9-877-476-01
2003G1678-1
© 2003.07
HCD-HP8V is the Amplifier, CD player, Tape
Deck and Tuner section in CMT-HP8V.
SPECIFICATIONS
Ver 1.0 2003.07
Model Name Using Similar Mechanism NEW
CD CD Mechanism Type CDM69BH-30BD62
Section Base Unit Name BU-30BD62
Optical Pick-up Name A-MAX.3
TAPE Model Name Using Similar Mechanism HCD-EP515
Section Tape Transport Mechanism Type CMAL1Z234A
Tape deck section
Recording system 4-track 2-channel, stereo
Frequency response 50 – 13,000 Hz (±3 dB),
using Sony TYPE I
cassettes
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range 87.5 – 108.0 MHz
AntennaFM lead antenna
Antenna terminals 75 ohms unbalanced
Intermediate frequency 10.7 MHz
AM tuner section
Tuning range
Middle Eastern model: 531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
Other models: 530 – 1,710 kHz
(with the tuning interval
set at 10 kHz)
531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
Antenna AM loop antenna
Antenna terminals External antenna terminal
Intermediate frequency 450 kHz
Main unit
Amplifier section
The following measured at AC 120, 127, 220, 240 V
50/60 Hz
DIN power output (rated): 60 + 60 watts (6 ohms at 1
kHz, DIN)
Continuous RMS power output (reference):
60 + 60 watts (6 ohms at 1
kHz, 10% THD)
Inputs
MD IN (phono jacks): Sensitivity 250 mV,
impedance 47 kilohms
MIC (phone jack): Sensitivity 1 mV,
impedance 10 kilohms
Outputs
PHONES (stereo minijack):
Accepts headphones of 8
ohms or more
MD OUT (phono jack): Impedance 1 kilohm
VIDEO OUT (phono jack):
Max. output level 1Vp-p,
unbalanced, Sync
negative, load impedance
75 ohms
SPEAKER: Accepts impedance of 6 to
16 ohms.
CD player section
System Compact disc and digital
audio system
Laser Semiconductor laser
(λ=780 nm)
Emission duration:
continuous
Frequency response 2 Hz – 20 kHz (±0.5 dB)
Wavelength 780 – 790 nm
Signal-to-noise ratio More than 90 dB
Dynamic range More than 90 dB
Video color system format
NTSC, PAL

2
HCD-HP8V
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINE WITH
MARK 0ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
General
Power requirements
Saudi Arabian model: 120 – 127/220 or 230 – 240
V AC, 50/60 Hz
Adjustable with voltage
selector
Other models: 120 V, 220 V or 230 – 240
V AC, 50/60 Hz
Adjustable with voltage
selector
Power consumption: 100 watts
Dimensions (w/h/d) Approx. 199 ×252 ×400
mm
Mass Approx. 7.5 kg
Supplied accessories: Remote commander (1)
Batteries (2)
AM loop antenna (1)
FM lead antenna (1)
Speaker pads (8)
Video cable (1)
Design and specifications are subject to change
without notice.

3
HCD-HP8V
1. SERVICING NOTES ······················································· 4
2. GENERAL ·········································································· 6
3. DISASSEMBLY
3-1. Case (Side-L)(Side-R),
Tape Mechanism Deck (CMAL1Z234A) ······················ 9
3-2. Front Panel Section ······················································· 9
3-3. Panel Board ································································· 10
3-4. Back Panel Section ······················································ 10
3-5. MAIN Board ······························································· 11
3-6. PWR AMP Board, Power Transformer ······················· 11
3-7. CD Mechanism Deck (CDM69BH-30BD62) ············· 12
3-8. JACK Board, VMP Board ··········································· 12
3-9. Base Unit Section ························································ 13
3-10.Base Unit (BU-30BD62) ············································· 13
3-11. BD Board ····································································· 14
3-12.SW Board, Bracket (Top) Assy ··································· 15
3-13.CONNECTOR Board ·················································· 15
3-14.Motor (Stocker) Assy (Stocker)(M761) ······················ 16
3-15.Motor (Roller) Assy (Roller)(M781) ··························· 16
3-16.Motor (Mode) Assy (Mode)(M771) ···························· 17
3-17.Rubber Roller (Slider) Assy ········································ 17
3-18.Timing Belt (Front/Rear)············································· 18
3-19.Cam (Gear) ·································································· 18
3-20.SENSOR Board ··························································· 19
4. ASSEMBLY
4-1. How to Install the Cam (Eject Lock) ···························· 20
4-2. How to Install the Cam (GEAR)··································· 20
4-3. How to Install the Gear (MODE C) ······························ 21
4-4. How to Install the Gear (MODE CAM) ······················· 21
4-5. How to Install the Rotary Encoder (S702),
Gear (STOCKER COMMUNICATION) ····················· 22
4-6. How to Install the Stocker Assy ···································· 22
5. TEST MODE ···································································· 23
6. MECHANICAL ADJUSTMENTS ····························· 24
7. ELECTRICAL ADJUSTMENTS ······························· 25
8. DIAGRAMS ······································································ 28
8-1. Block Diagram — CD SERVO Section — ················· 30
— AUDIO/VIDEO Section — ···································· 31
— MAIN Section — ··················································· 32
8-2. Printed Wiring Boards — BD Section — ··················· 33
8-3. Schematic Diagram — BD Section — ························ 34
8-4. Printed Wiring Boards — VMP Section (1/2) — ········ 35
8-5. Printed Wiring Boards — VMP Section (2/2) — ········ 36
8-6. Schematic Diagram — VMP Section (1/2) — ············ 37
8-7. Schematic Diagram — VMP Section (2/2) — ············ 38
8-8. Printed Wiring Boards — Changer Section — ··········· 39
8-9. Schematic Diagram — Changer Section — ················ 40
8-10.Printed Wiring Boards — Main Section —················· 41
8-11.Schematic Diagram — Main Section — ····················· 42
8-12.Printed Wiring Boards — Front Section — ················ 43
8-13.Schematic Diagram — Front Section —····················· 44
8-14.Printed Wiring Boards
— PWR AMP/Power Section —································· 45
8-15.Schematic Diagram
— PWR AMP/Power Section —································· 46
8-16.IC Block Diagrams ······················································ 47
8-17.IC Pin Function Description ········································ 50
9. EXPLODED VIEWS
9-1. Case, Top Panel Section ·············································· 57
9-2. Front Panel Section ····················································· 58
9-3. Chassis Section-1 ························································ 59
9-4. Chassis Section-2 ························································ 60
9-5. CD Mechanism Section-1 (CDM69BH-30BD62) ······ 61
9-6. CD Mechanism Section-2 (CDM69BH-30BD62) ······ 62
9-7. CD Mechanism Section-3 (CDM69BH-30BD62) ······ 63
9-8. CD Mechanism Section-4 (CDM69BH-30BD62) ······ 64
9-9. CD Mechanism Section-5 (CDM69BH-30BD62) ······ 65
9-10.CD Mechanism Section-6 (CDM69BH-30BD62) ······ 66
9-11.Base Unit Section (BU-30BD62) ································ 67
10.ELECTRICAL PARTS LIST ······································· 68
TABLE OF CONTENTS

4
HCD-HP8V SECTION 1
SERVICING NOTES
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
Notes on chip component replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
•Keep the temperature of the soldering iron around 270 ˚C during
repairing.
•Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering or
unsoldering.
This appliance is classified as a CLASS 1 LASER product.
This label is located on the rear exterior.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
Carry out the “S curve check” in “CD section adjustment” and check
that the S curve waveforms is output three times.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•Unleaded solder melts at a temperature about 40 ˚C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C .
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
•Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
•Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

5
HCD-HP8V
Service Position of theTape Cassette Mechanism Deck
Service Position of the CD Mechanism Deck

6
HCD-HP8V SECTION 2
GENERAL This section is extracted
from instruction manual.
Main unit
CD SYNC 9(18)
DIMMER ws (25)
DISC 1 – 5 qs (10, 13, 32)
Disc slot qf
DISPLAY 6(24, 25, 32)
Display window 3
ECHO LEVEL qg (21)
FUNCTION wd (9, 11, 13, 16, 18,
19, 28)
GROOVE w; (20)
MIC jack qj
MIC LEVEL qh (21)
PHONES jack qd
PLAY MODE 7(9, 13, 18, 19,
23)
PRESET EQ wa (20)
PRESET/ALBUM +/– wf (10,
13, 15, 16)
REC PAUSE/START 0(18, 19,
21)
Remote sensor 2
REPEAT 8(12)
Tape deck 4
TUNER/BAND 5(15, 16)
TUNING +/– qa (15, 16)
VOLUME ql (22)
?/1 (power) 1(7, 8, 16, 22, 23,
32)
m/M (rewind/fast forward)
qa (10, 18)
./> (go back/go forward)
qa (7, 10, 12, 13, 18)
x(stop) 5(10, 11, 16, 18, 19,
21, 23, 32)
X(pause) 5(7, 10, 18)
CD N(play) 5(10, 11, 13, 14,
37)
TAPE nN (play) 5(18, 19,
23)
DISC 1 Z– DISC 5 Z(eject) qk
(9, 10)
List of button locations and reference pages
How to use this page
Use this page to find the location of buttons and other
parts of the system that are mentioned in the text.
Ill
us
t
ra
ti
on num
b
er
r
TAPE A/B 5( 18, 19 )
RR
Name of button/part Reference page
ALPHABETICAL ORDER
A – M P – Z
BUTTON DESCRIPTIONS

7
HCD-HP8V
Remote control
ALBUM +/– wh (10, 13)
CD es (9, 11, 13, 16, 18, 19)
CLEAR 9(13, 14)
CLOCK/TIMER SELECT 2
(23, 24)
CLOCK/TIMER SET 3(8, 22,
23)
DISPLAY 8(24, 25, 32)
D. SKIP qa (10, 13)
EFFECT ON/OFF wd (20)
ENTER wf (8, 13, 15, 22, 23)
GAME (MD)1) 6(19, 28)
GROOVE wa (20)
KARAOKE/MPX qj (21)
KEY CONTROL #/2qk (21)
NEXT wk (11, 14)
Numeric buttons wl (10, 11, 13,
14)
ON SCREEN qs (26)
PLAY MODE e; (9, 13, 18, 19,
23)
PRESET EQ wg (20)
PRESET +/– wk (15, 16)
PREV wk (11, 14)
REPEAT/FM MODE ea (12, 17)
SLEEP 1(22)
SPECIAL MENU q; (14)
SURROUND ql (20)
TAPE A/B2) 5(18, 19)
TUNER BAND ed (15, 16, 19)
TUNER MEMORY 7(15)
TUNING +/– wj (15, 16)
VOL +/– w; (22)
?/1 (power) 4(7, 8, 16, 22, 23,
32)
m/M (rewind/fast forward)
wj (10, 18)
./> (go back/go forward)
wk (7, 10, 12, 13, 18)
x(stop) qg (10, 11, 16, 18, 19,
21, 23, 32)
X(pause) qh (7, 10, 18)
N(play) qd (10, 11, 13, 14, 18,
19, 23, 37)
M/m/</, (cursor) ws (8, 22,
23)
RETURN Oqf (11)
1) This button is used to switch
to MD function.
2) This button is used to switch
to TAPE function.
ALPHABETICAL ORDER
A – N O – Z
BUTTON DESCRIPTIONS
8
9
q; qa
1234
56
7
qs qd
qf qg
qj
ql
w;
wa
ws
wd
wf
wg
wh
wj
wk
wl
e;
ea es
ed
qk
qh
b
V
v
B
Use buttons on the remote for the operation.
1 Press ?/1 to turn on the system.
2Press CLOCK/TIMER SET.
3Press M/m repeatedly to set the hour.
4Press ,.
5Press M/m repeatedly to set the
minute.
6Press ENTER.
The clock starts working.
To adjust the clock
1 Press CLOCK/TIMER SET.
2Press M/m to select “CLOCK SET”, then
press ENTER.
3Do the same procedures as step 3 to 6
above.
Notes
•The clock settings are canceled when you disconnect
the power cord or if a power failure occurs.
•You cannot set the clock in Power Saving Mode.
Setting the clock

8
HCD-HP8V SECTION 3
DISASSEMBLY
• This set can be disassembled in the order shown below.
CD MECHANISM DECK
(CDM69BH-30BD62)
PWR AMP BOARD,
POWER TRANSFORMER
JACK BOARD,
VMP BOARD
FRONT PANEL SECTIONBACK PANEL SECTION
PANEL BOARD
MAIN BOARD
BASE UNIT SECTION
CASE (SIDE-L) (SIDE-R),
TAPE MECHANISM DECK
(CMAL1Z234A))
RUBBER ROLLER
(SLIDER) ASSY
TIMING BELT
(FRONT/REAR) CAM (GEAR)
SENSOR BOARD
SW BOARD,
BRACKET (TOP) ASSY
BASE UNIT
(BU-30BD62)
MOTOR (MODE)
ASSY (MODE) (M771)
MOTOR (ROLLER)
ASSY (ROLLER) (M781)
MOTOR (STOCKER) ASSY
(STOCKER) (M761)
CONNECTOR BOARD
SET
BD BOARD

9
HCD-HP8V
Note: Follow the disassembly procedure in the numerical order given.
3-1. Case (Side-L)(Side-R),Tape Mechanism Deck (CMAL1Z234A)
3-2. Front Panel Section
9 connector
(6p)
2 two screws
(BVTP3 × 16 )
qa four screws
(BVTP2.6 × 8)
qs shield plate (case)
qd tape mechanism deck
(CMAL1Z234A)
8 top panel section
3 case (side-R)
1 four screws
(case3 TP2)
4 four screws
(case3 TP2)
6 case (side-L)
5 two screws
(BVTP3 × 16 )
7 two screws
(BVTP3 × 16 )
q; w ire (flat type) 8p
6 connector
(CN305)
4 connector
(CN405)
1 screw
(BVTP3 × 8
)
7 two screws
(BVTP3 × 8)
3 w ire (flat type)
9p (CN303)
5 w ire (flat type)
37p (CN402)
8 front panel section
2 screw
(BVTP3 × 8)

10
HCD-HP8V
3-3. Panel Board
3-4. Back Panel Section
2 ten screws
(BVTP2.6 × 8)
1 knob (VOL)
3 six claws
4 PANEL board
8 back panel section
3 two screws
(BVTP3 × 8)
6 connector
(CN908)
5 connector
(CN905)
7 connector
(CN904)
4 connector
(CN503)
1 w ire (flat type)
11p (CN101)
2 three screws
(BVTP3 × 10
)

11
HCD-HP8V
3-5. MAIN Board
3-6. PWR AMP Board, Power Transformer
3 connector
(CN404)
2 two screws
(BVTP3 × 8
)
9 MAIN board
6 w ire (flat type)
19p (CN301)
7 w ire (flat type)
27p (CN302)
1 connector
(CN907)
5 w ire (flat type)
9p (CN303)
4 w ire (flat type)
37p (CN402)
8 connector
(CN305)
2 screw
(BVTP3 × 8)
1 connector
(CN902)
3 four screws
(BVTP3 × 8)
4 PWR AMP boar
d
5 four screws
(BVTT4 × 8)
6 power transformer

12
HCD-HP8V
3-7. CD Mechanism Deck (CDM69BH-30BD62)
3-8. JACK Board, VMP Board
5 four screws
(BVTP3 × 8 )
7 CD mechanism deck
(CDM69BH-30BD62)
2 two screws
(BVTP3 × 8 )
1 two screws
(BVTP3 × 8 )
6 w ire (flat type)
28p (CN101)
4 w ire (flat type)
19p (CN201)
3 blacket (TR
)
2 screw
(BVTP3 × 8
)
6 support spacer (VMP)
4 two screws
(BVTP3 × 8 )
1 connector
(CN301)
3 JACK board
7 VMP board
5

13
HCD-HP8V
3-9. Base Unit Section
3-10. Base Unit (BU-30BD62)
1 floating screw (+PTPWHM2.6)
2 screw (DIA. 12)
4 boss
6 boss
3 boss
5 boss
7 base unit section
q; base unit (BU-30BD62)
7 insulator (BU30)
3 floating screw
(+PTPWHM2.6 × 6
)
1 floating screw
(+PTPWHM2.6 × 6)
4 floating screw
(+PTPWHM2.6 × 6)
2 floating screw
(+PTPWHM2.6 × 6)
8 insulator (BU30)
9 insulator (BU30)
6 insulator (BU30)
5

14
HCD-HP8V
3-11. BD Board
1 Remove the solde
r
(four portions).
3 BD board
2 wire (flat type) (16 core)

15
HCD-HP8V
3-12. SW Board, Bracket (Top) Assy
3-13. CONNECTOR Board
6 six screws
(BVTP2.6 × 8
)
5 SW (4) board
4 SW (3) board
3 SW (2) board
2 SW (1) board
7 bracket (top) assy
1 four screws
(BTP2.6 × 6)
3
1 Remove five solders.
– bottom view –
CONNECTOR board
2 four screws
(BVTP2.6
× 8)
4 connector
(CN710)
6 connector
(CN703)
5 connector
(CN702)
7 CONNECTOR board

16
HCD-HP8V
3-14. Motor (Stocker) Assy (Stocker)(M761)
3-15. Motor (Roller) Assy (Roller)(M781)
4
5 STOCKER MOTOR board
3 two screws
(BVTP2.6
× 8)
2 Remove two solder
s
6 motor (stocker) assy
(stocker) (M761)
1 belt (mode)
1 belt (roller V)
4 ROLLER MOTOR boar
d
2 Remove two solders.
3 two screws
5 motor (roller) assy
(roller)(M781)

17
HCD-HP8V
3-16. Motor (Mode) Assy (Mode)(M771)
3-17. Rubber Roller (Slider) Assy
1 Remove five solders
of rotary encoder.
2 Remove two solders
of motor (M771)
MODE MOTOR
board
3 two screws
(BVTP2.6
× 8)
4 MODE MOTOR board
5 belt (mode V)
6 motor (mode) assy
(mode) (M771)
qg sub chassis
qf screw
(BVTP2.6
× 8)
8 step screw
qs step screw
5 step screw
9 tension
spring
(slider 2)
6 tension spring
(base slider 4)
0 rubber roller
(slider 1) assy
7 rubber roller
(slider 1) assy
qa rubber roller
(slider 2) assy
qd rubber roller
(slider 4) assy
3 tension spring
(base slider 5
)
1 step screw
4 rubber roller
(slider 5) assy
2 rubber roller
(slider S) assy

18
HCD-HP8V
3-18. Timing Belt (Front/Rear)
3-19. Cam (Gear)
Note: Refer to assembly (Section 4)
2 gear (mode cam)
: Note
1 screw
(PTPWH2.6
× 8)
3 slider (mode cam) assy
5 two gears
(center)
7 two gears (center)
8 timing belt (rear)
9 timing belt (rear)
4 gear
(timing)
6 timing belt
(front)
timing belt
(rear)
When install three timing belts,
its pass under each claws.
timing belt
(rear)
timing belt (front)
claw
claw
claw
claw
qf cam (gear)
: Note
qs gear(mode cam)
0 gear
(mode C)
:Note
4 gear (mode 5)
8 gear (mode D)
6 gear (mode 5)
1 screw(PTPWH2.6 × 8)
7 screw (PTPWH2.6 × 8)
9 screw
(PTPWH2.6
× 8)
qa screw
(PTPWH2.6
× 8)
3 screw (PTPWH2.6 × 8)
5 screw (PTPWH2.6 × 8
)
2 pulley
(mode deceleration)
qd screw
Note: Refer to assembly
(Section 4).

19
HCD-HP8V
3-20. SENSOR Board
ql harness
qd gear (eject lock)
q; cam (eject lock)
: Note
qh two claws
qj rotary encoder
(S771)
qf gear
(mode B)
w; screw
(BVTP2.6
× 8)
qg screw
(PTPWH2.6
× 8)
wa SENSOR board
8 shaft
(shutter)
7 compression spring
(shutter)
qs cam (BU U/D)
qa screw
(PTPWH2.6
× 8)
3 screw
(BVTP2.6
× 8)
1 screw
(PTPWH2.6
× 8)
4 two screws
(BVTP2.6
× 8)
2 lever shutter (A)
5 base (shutter) block
6 gear (mode A)
9 screw
(PTPWH2.6
× 8)
qk claw
Note: Refer to assembly (Section 4).

20
HCD-HP8V
• This set can be assembled in the order shown below.
4-1. How to Install the Cam (Eject Lock)
SECTION 4
ASSEMBLY
4-2. How to Install the Cam (Gear)
mark
cam (BU U/D)
cam (eject lock)
– bottom view • front –
gear (eject lock)
1 Rotate the cam (BU U/D) fully in the direction of arrow.
2 Engage the gear (eject lock) and the gear of the cam (eject lock)
aligning the mark with the center of the gear (eject lock).
boss
cam (gear)
mark
cam (BU U/D)
– bottom view • front –
1 Check that the cam (BU U/D) can not be rotated in the direction of arrow.
2 Align the mark on the cam (gear) with the boss as shown in the figure
and install the cam (gear).