Sony HCD-RG444 User manual

SERVICE MANUAL
Sony Corporation
Home Audio Company
Published by Sony Engineering Corporation
HCD-RG444
AEP Model
MINI HI-FI COMPONENT SYSTEM
9-877-899-01
2004E1678-1
© 2004.05
•HCD-RG444 is the tuner, deck, CD and
amplifier section in MHC-RG444S.
SPECIFICATIONS
Ver 1.0 2004.05
Amplifier section
Front speaker
DIN power output (rated): 100 + 100 watts (6 ohms at
1kHz, DIN)
Continuous RMS power output (reference):
120 + 120 watts (6 ohms at
1kHz, 10% THD)
Music power output (reference):
240 + 240 watts (6 ohms at
1kHz, 10% THD)
Sub woofer
DIN power output (rated): 100 watts (6 ohms at
60 Hz, DIN)
Continuous RMS power output (reference):
120 watts (6 ohms at
50 Hz, 10% THD)
Music power output (reference):
240 watts (6 ohms at
50 Hz, 10% THD)
Inputs
GAME INPUT AUDIO L/R (phono jacks):
voltage 250 mV,
impedance 47 kilohms
GAME INPUT VIDEO (phono jack):
1Vp-p, 75 ohms
Outputs
PHONES (stereo mini jack):
accepts headphones of
8ohms or more
VIDEO OUT (phono jack):max. output level 1Vp-p,
unbalanced, Sync
negative, load impedance
75 ohms
SPEAKER: accepts impedance of 6 to
16 ohms
SUB WOOFER OUT: accepts impedance of 6 to
16 ohms
CD player section
System Compact disc and digital
audio system
Laser Semiconductor laser
(λ=780 nm)
Emission duration:
continuous
Frequency response 2 Hz – 20 kHz (±0.5 dB)
Wavelength 780 – 790 nm
Signal-to-noise ratio More than 90 dB
Dynamic range More than 90 dB
Tape deck section
Recording system 4-track 2-channel, stereo
Frequency response 50 – 13,000 Hz (±3 dB),
using Sony TYPE I
cassettes
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range 87.5 – 108.0 MHz
(50-kHz step)
Antenna FM lead antenna
Antenna terminals 75 ohms unbalanced
Intermediate frequency 10.7 MHz
AM tuner section
Tuning range 531 – 1,602 kHz (with the
tuning interval set at
9kHz)
Antenna AM loop antenna
Antenna terminals External antenna terminal
Intermediate frequency 450 kHz
Model Name Using Similar Mechanism HCD-RG222
CD CD Mechanism Type CDM74-F1BD81
Section Optical Pick-up Name
KSM-215DCP/C2NP
Tape deck Model Name Using Similar Mechanism HCD-RG222
Section Tape Transport Mechanism Type CWM43FF-05
– Continued on next page –
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TEL [phone] QQ 376315150 892498299 TEL [phone] QQ 376315150 892498299
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2
HCD-RG444
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINEWITH
MARK 0ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
otherthanthosespecifiedherein mayresultinhazardousradiation
exposure.
Notes on chip component replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
•Keep the temperature of soldering iron around 270˚C
during repairing.
•Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The release method of a CD disc tray LOCK function
There is a disc lock function for the disc theft prevention for a
demonstration at a shop front in this machine.
Procedue:
1. Press the ?/1 button to turn the set on.
2. Press two buttons of xand Z(EJECT) simultaneously for
five seconds.
3. The message “LOCKED” is displayed and the tray is locked.
(Even if exiting from this mode, the tray is still locked.)
4. Press two buttons of xand Z(EJECT) simultaneously for
five seconds again.
5. The message “UNLOCKED” is displayed and the tray is
unlocked.
6. To exit from this mode, press the ?/1 button to turn the set
off.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
•Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
•Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
General
Power requirements:
:230 V AC, 50/60 Hz
Power consumption 275 watts
0.25 watts (at the Power
Saving Mode)
Dimensions (w/h/d) incl. projecting parts and controls
Amplifier/Tuner/Tape/CD section:
Approx. 280 × 327 ×
425 mm
Mass Approx. 10.0 kg
Design and specifications are subject to change
without notice.
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3
HCD-RG444
TABLE OF CONTENTS
1. SERVICING NOTE ·························································· 4
2. GENERAL ·········································································· 5
3. DISASSEMBLY
3-1. Cover (Top) ··································································· 8
3-2. CD Door ········································································ 8
3-3. Front Panel Section ······················································· 9
3-4. CD Mechanism Deck (CDM74-F1BD81) ···················· 9
3-5. Tape Mechanism Deck, Game Jack Board·················· 10
3-6. PANEL Board······························································ 10
3-7. Back Panel Section, SUB-TRANS Board ··················· 11
3-8. Power Transformer ····················································· 11
3-9. MAIN Board ······························································· 12
3-10.SUB-WOOFER Board ················································ 12
3-11.AMP Board ································································· 13
3-12.BD81A Board ······························································ 13
3-13.CONNECT Board ······················································· 14
3-14.DRIVER Board, SW Board········································· 14
3-15.Optical Pick-up (KSM-215DCP/C2NP) ····················· 15
3-16.SENSOR Board ··························································· 15
3-17.MOTOR (TB) Board ··················································· 16
3-18.MOTOR (LD) Board ···················································16
4. TEST MODE···································································· 17
5. MECHANICAL ADJUSTMENTS ····························· 20
6. ELECTRICAL ADJUSTMENTS······························ 20
7. DIAGRAMS
7-1. Block Diagrams – PANEL Section – ························· 26
– MAIN Section – ······················································· 27
– BD/DRIVER Section – ············································ 28
– SUB-WOOFER Section – ········································29
7-2. Printed Wiring Board – BD81A Section – ················· 30
7-3. Schematic Diagram – BD81A Section – ····················31
7-4. Printed Wiring Board
– CD MECHANISM Section – ···································32
7-5. Schematic Diagram – CD MECHANISM Section –····· 33
7-6. Printed Wiring Board – MAIN Section – ··················· 34
7-7. Schematic Diagram – MAIN Section (1/2) – ············· 35
7-8. Schematic Diagram – MAIN Section (2/2) – ············· 36
7-9. Printed Wiring Board – PANEL COMB Section – ···· 37
7-10.Schematic Diagram – PANEL COMB Section – ······· 38
7-11.Printed Wiring Board – SUB-WOOFER Section –···· 39
7-12.Schematic Diagram – SUB-WOOFER Section – ······ 40
7-13.Printed Wiring Board – PANEL Section – ················· 41
7-14.Schematic Diagram – PANEL Section (1/2) – ··········· 42
7-15.Schematic Diagram – PANEL Section (2/2) – ··········· 43
7-16.Printed Wiring Board – TRANS Section –················· 44
7-17.Printed Wiring Board – AMP Section – ····················· 45
7-18.Schematic Diagram – AMP POWER Section – ········· 46
8. EXPLODED VIEWS
8-1. MAIN Section ····························································· 55
8-2. Front Panel Section ····················································· 56
8-3. MAIN Board Section ·················································· 57
8-4. CD Mechanism Deck Section -1 (CDM74-F1BD81) ···· 58
8-5. CD Mechanism Deck Section -2 (CDM74-F1BD81) ···· 59
9. ELECTRICAL PARTS LIST ······································· 60
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TEL [phone] QQ 376315150 892498299 TEL [phone] QQ 376315150 892498299
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4
HCD-RG444 SECTION 1
SERVICING NOTE
•SERVICE POSITION -1 (AMP BOARD)
BD81A board
CD mechanism dec
k
Remove the CD mechanism deck and place it on top of the pedestal as shown.
Inspect the BD81A board in this set up.
front panel
CD mechanism deck
AMP board
To inspect the AMP board, turn both of the front panel
and the CD mechanism deck so that the left side of the product faces down.
•SERVICE POSITION -2 (BD81A BOARD)
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TEL [phone] QQ 376315150 892498299 TEL [phone] QQ 376315150 892498299
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5
HCD-RG444
SECTION 2
GENERAL
Main unit
ALBUM +
ALBUM –
qh (12, 14, 19)
wg (12, 14, 19)
CD eg (9, 11, 14, 19, 20)
CD SYNC wj (19)
Deck A wk (18)
Deck B qj (18, 19, 20, 24)
DISC 1 – 3 q; (12, 14, 35)
DISC SKIP/EX-CHANGE qs
(11, 12, 14, 19)
Disc tray 9(11)
DISPLAY 2(17, 27, 28)
Display window 5
EFFECT ON/OFF 8(22)
ENTER qa (14, 15, 22)
EQ BAND 7(22)
GAME es (20, 23, 30)
GAME INPUT AUDIO L/R jacks
wd (20, 29)
GAME INPUT VIDEO jack wf
(29)
GAME MIXING wh (23)
GROOVE 8(21)
ILLUMINATION 3(28)
Operation Dial
(– EQ +/l L) 6(12,
14, 19, 22)
P FILE qd (22)
PHONES jack ql
PLAY MODE wl (12, 14, 18, 19,
20, 35)
Power illuminator qk (28)
PRESET EQ qd (22)
REC PAUSE/START wj (19, 20,
23, 24)
Remote sensor 4
SURROUND 8(23)
TAPE A/B ed (18, 19, 20, 24)
TUNER/BAND ef (15, 16, 20)
TUNING MODE wl (15, 16, 35)
TUNING + qh (15, 16)
TUNING – wg (15, 16)
VOLUME control w; (21)
?/1 (power)1(8,16,27, 30, 33,
35)
X(pause) wg (12, 19)
Z(eject) qf (11)
PUSH Z(deck B) (eject) qg (18)
x(stop) wg (12, 19, 24, 35)
M(fast forward) qh (12, 19)
H(play) qh (12, 18, 19)
m(rewind) wg (12, 19)
ZPUSH (deck A) (eject) e; (18)
List of button locations and reference pages
How to use this page
Use this page to find the location of buttons and other
parts of the system that are mentioned in the text.
Ill
us
t
ra
ti
on num
b
er
r
TAPE A/B ed (18, 19, 20, 24)
RR
Name of button/part Reference page
ALPHABETICAL ORDER
A – O P – Z
BUTTON DESCRIPTIONS
ALBUM
ALBUM
TUNING TUNING
J
H
h
S
j
s
wd
12345 6 78 9
q;
qf
qa
qs
qd
w;
ql
qg
qh
qk
wfwg
wh
wk
wj
wl
es
ef
ed
eg
e;
qj
This section is extracted
from instruction manual.
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TEL [phone] QQ 376315150 892498299 TEL [phone] QQ 376315150 892498299
http://www.xiaoyu163.com
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