Sony KX-TGF380AGM User manual

© Panasonic System Networks Co., Ltd. 2015
Unauthorized copying and distribution is a violation
of law.
ORDER NO. KM41511964CE
Telephone Equipment
Model No. KX-TGF380AGM
KX-TGFA30AGM
Digital Corded/Cordless Phone with
Link-to-Cell
M:MetallicBlackVersion
(for Argentina)
KX-TGFA30
(Handset)
Model No Base Unit Handset Charger Unit
KX-TGF380 1 (TGF380) 1 (TGFA30)
Configuration for each model
(Charger Unit)
KX-TGF380
(Base Unit)
1

2
KX-TGF380AGM/KX-TGFA30AGM
WARNING
This service information is designed for experienced repair technicians only and is not designed for use by the general
public. It does not contain warnings or cautions to advise non-technical individuals of potential dangers in attempting
to service a product. Products powered by electricity should be serviced or repaired only by experienced professional
technicians. Any attempt to service or repair the product or products dealt with in this service information by anyone
else could result in serious injury or death.
IMPORTANT SAFETY NOTICE
There are special components used in this equipment which are important for safety. These parts are marked by
in the Schematic Diagrams, Circuit Board Diagrams, Exploded Views and Replacement Parts List. It is essential that
these critical parts should be replaced with manufacturer’s specified parts to prevent shock, fire or other hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING
If lead free solder was used in the manufacture of this product, the printed circuit boards will be marked PbF.
Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.
When this mark does appear, please read and follow the special instructions described in this manual on the
use of PbF and how it might be permissible to use Pb solder during service and repair work.
LWhen you note the serial number, write down all 11 digits. The serial number may be found on the bottom of the unit.
LThe illustrations in this Service Manual may vary slightly from the actual product.

3
KX-TGF380AGM/KX-TGFA30AGM
TABLE OF CONTENTS PAGE PAGE
1 Safety Precautions----------------------------------------------- 5
1.1. For Service Technicians --------------------------------- 5
2 Warning-------------------------------------------------------------- 5
2.1. Battery Caution--------------------------------------------- 5
2.2. About Lead Free Solder (PbF: Pb free)-------------- 5
2.2.1. Suggested PbF Solder ------------------------------ 6
2.3. Discarding of P. C. Board-------------------------------- 6
3 Specifications ----------------------------------------------------- 7
4 Technical Descriptions ----------------------------------------- 8
4.1. Circuit Configuration of TGF38x Series
Phones------------------------------------------------------- 8
4.2. US-DECT Description------------------------------------ 9
4.2.1. TDD Frame Format ---------------------------------- 9
4.2.2. TDMA system------------------------------------------ 9
4.2.3. Signal Flowchart in the Radio Parts-------------10
4.3. Block Diagram (Base Unit_Main)---------------------11
4.4. Tel Interface Circuit---------------------------------------12
4.5. Block Diagram (Base Unit_RF Part)-----------------13
4.6. Circuit Operation (Base Unit)--------------------------14
4.6.1. BBIC (Base Band IC: IC501) ---------------------14
4.6.2. Flash Memory (IC502)------------------------------14
4.6.3. Flash Memory (IC601)------------------------------14
4.6.4. Bluetooth Unit (IC721)------------------------------14
4.6.5. Power Supply Circuit/Reset Circuit--------------15
4.6.6. Telephone Line Interface---------------------------16
4.6.7. Parallel Connection Detect Circuit/Auto
Disconnect Circuit -----------------------------------17
4.6.8. Calling Line Identification (Caller ID)/Call
Waiting Caller ID-------------------------------------18
4.7. Block Diagram (Handset)-------------------------------20
4.8. Block Diagram (Handset_RF Part)-------------------21
4.9. Circuit Operation (Handset)----------------------------22
4.9.1. Outline--------------------------------------------------22
4.9.2. Power Supply Circuit/Reset Circuit--------------22
4.9.3. Charge Circuit ----------------------------------------23
4.9.4. Battery Low/Power Down Detector--------------23
4.9.5. Speakerphone----------------------------------------23
4.10. Circuit Operation (Charger Unit)----------------------24
5 Location of Controls and Components ------------------25
6 Installation Instructions---------------------------------------25
7 Operating Instructions-----------------------------------------25
8 Test Mode ----------------------------------------------------------26
8.1. Engineering Mode----------------------------------------26
8.1.1. Base Unit ----------------------------------------------26
8.1.2. Handset ------------------------------------------------28
9 Service Mode -----------------------------------------------------30
9.1. How to Clear User Setting (Handset Only)---------30
10 Troubleshooting Guide----------------------------------------31
10.1. Troubleshooting Flowchart-----------------------------31
10.1.1. Check Power------------------------------------------32
10.1.2. Check Record ----------------------------------------33
10.1.3. Check Playback -------------------------------------36
10.1.4. Check Battery Charge------------------------------36
10.1.5. Check Link---------------------------------------------37
10.1.6. Check the RF part -----------------------------------39
10.1.7. Registering a Handset to the Base Unit--------43
10.1.8. Deregistering a Handset---------------------------43
10.1.9. Check Handset Transmission --------------------44
10.1.10. Check Handset Reception------------------------44
10.1.11. Check Caller ID -------------------------------------44
10.1.12. Check BT Communication------------------------45
11 Disassembly and Assembly Instructions---------------47
11.1. Disassembly Instructions-------------------------------47
11.1.1. Base Unit----------------------------------------------47
11.1.2. Handset------------------------------------------------ 52
11.1.3. Charger Unit------------------------------------------53
11.1.4. How to Replace the Base unit LCD-------------54
11.2. How to Replace the Handset LCD-------------------56
12 Measurements and Adjustments -------------------------- 57
12.1. Equipment Required ------------------------------------57
12.2. The Setting Method of JIG-----------------------------57
12.2.1. Connections (Base Unit) --------------------------57
12.2.2. Connections (Handset) ----------------------------58
12.2.3. How to install Batch file into P.C.----------------59
12.2.4. Commands--------------------------------------------60
12.3. Adjustment Standard (Base Unit)--------------------61
12.3.1. Bottom View ------------------------------------------ 61
12.4. Adjustment Standard (Handset)----------------------62
12.4.1. Component View ------------------------------------ 62
12.5. Things to Do after Replacing X'tal ------------------- 63
12.5.1. How to download the data ------------------------63
13 Miscellaneous----------------------------------------------------68
13.1. How to Replace the LLP (Leadless Leadframe
Package) IC ----------------------------------------------- 68
13.1.1. Preparation--------------------------------------------68
13.1.2. Caution-------------------------------------------------68
13.1.3. How to Remove the IC-----------------------------68
13.1.4. How to Install the IC -------------------------------- 69
13.2. How to Replace the Flat Package IC ---------------70
13.2.1. Preparation--------------------------------------------70
13.2.2. How to Remove the IC-----------------------------70
13.2.3. How to Install the IC -------------------------------- 71
13.2.4. How to Remove a Solder Bridge----------------71
13.3. Terminal Guide of the ICs, Transistors and
Diodes ------------------------------------------------------72
13.3.1. Base Unit----------------------------------------------72
13.3.2. Handset------------------------------------------------ 72
14 Schematic Diagram --------------------------------------------73
14.1. For Schematic Diagram --------------------------------73
14.1.1. Base Unit (Schematic Diagram (Base
Unit_Main)) ------------------------------------------- 73
14.1.2. Handset (Schematic Diagram
(Handset_Main))-------------------------------------73
14.2. Schematic Diagram (Base Unit_Main)--------------74
14.2.1. KX-TGF380-------------------------------------------74
14.3. Schematic Diagram (BT module) --------------------76
14.4. Schematic Diagram (Base Unit_Operation)-------78
14.5. Schematic Diagram (Base Unit_Hook Switch) --- 78
14.6. Schematic Diagram (Base Unit_LCD)-------------- 80
14.7. Schematic Diagram (Base Unit_LED) --------------80
14.8. Schematic Diagram (Handset_Main) ---------------82
14.8.1. BBIC MODUL Schematic Diagram
(Handset_Main)--------------------------------------84
15 Printed Circuit Board ------------------------------------------87
15.1. Circuit Board (Base Unit_Main) ----------------------87
15.1.1. Component View ------------------------------------ 87

4
KX-TGF380AGM/KX-TGFA30AGM
15.1.2. Bottom View ------------------------------------------88
15.2. Circuit Board (Base Unit_Operation)----------------89
15.3. Circuit Board (Base Unit_Operation_Hook
Switch)------------------------------------------------------91
15.3.1. Component View ------------------------------------91
15.3.2. Bottom View ------------------------------------------91
15.4. Circuit Board (Base Unit_LCD)-----------------------93
15.5. Circuit Board (Base Unit_LED)-----------------------93
15.6. Circuit Board (Handset_Main) ------------------------95
15.6.1. Component View ------------------------------------95
15.6.2. Bottom View ------------------------------------------96
15.7. Circuit Board (Handset_BBIC Module)-------------97
15.7.1. Component View ------------------------------------97
16 Exploded View and Replacement Parts List-----------98
16.1. Cabinet and Electrical Parts (Base Unit)-----------98
16.1.1. KX-TGF380-------------------------------------------98
16.2. Cabinet and Electrical Parts (Handset)-------------99
16.3. Cabinet and Electrical Parts (Charger Unit)----- 100
16.4. Accessories and Packing Materials --------------- 101
16.4.1. KX-TGF380AGM ---------------------------------- 101
16.5. Replacement Parts List------------------------------- 102
16.5.1. Base Unit-------------------------------------------- 102
16.5.2. Handset---------------------------------------------- 104
16.5.3. Charger Unit ---------------------------------------- 106
16.5.4. Accessories and Packing Materials----------- 106
16.5.5. Screws ----------------------------------------------- 106
16.5.6. Fixtures and Tools--------------------------------- 106

5
KX-TGF380AGM/KX-TGFA30AGM
1 Safety Precautions
1.1. For Service Technicians
•Repair service shall be provided in accordance with repair technology information such as service manual so as to
prevent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
•ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2Warning
2.1. Battery Caution
Risk of explosion if battery is replaced by an incorrect type.
Dispose of used batteries according to the instructions.
2.2. About Lead Free Solder (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50 F ~ 70 F (30 C ~ 40 C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700 F ± 20 F (370 C ± 10 C).
• Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 F (600 C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
Component
Component
pin
Solder
Remove all of the
excess solder
(Slice View)
p

6
KX-TGF380AGM/KX-TGFA30AGM
2.2.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer's specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
2.3. Discarding of P. C. Board
When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.
0.3 mm X 100 g 0.6 mm X 100 g 1.0 mm X 100 g

7
KX-TGF380AGM/KX-TGFA30AGM
3 Specifications
Note:
Design and specifications are subject to change without notice.
Note for Service:
•Operation range: Up to 300 m outdoors, Up to 50 m indoors, depending on the condition.
LStandard:
DECT 6.0 (Digital Enhanced
Cordless Telecommunications 6.0),
Bluetooth wireless technology 2.1
LFrequency range:
1.91 GHz to 1.93 GHz (DECT)
2.402 GHz to 2.48 GHz (Bluetooth)
LRF transmission power:
115 mW (max)
LPower source:
220 - 240 V AC, 50/60 Hz
LPower consumption:
Base unit :
Standby: Approx. 0.8 W
Maximum: Approx. 3.0 W
Charger :
Standby: Approx. 0.1 W
Maximum: Approx. 1.8 W
LOperating conditions:
0°C - 40°C, 20 % - 80 % relative air humidity (dry)
LDimensions (W x D x H):
Base unit: Approx. 222 mm x 163 mm x 103 mm
Handset: Approx. 48 mm x 30 mm x 168 mm
Charger unit: Approx. 72 mm x 73 mm x 39 mm
LMass (Weight):
Base unit: Approx. 580 g
Handset: Approx. 140 g
Charger: Approx. 100 g

8
KX-TGF380AGM/KX-TGFA30AGM
4 Technical Descriptions
4.1. Circuit Configuration of TGF38x Series Phones
TGF38x Series consists of DECT cordless telephone and Bluetooth Module.
Both voices of transmission and reception are transferred by PCM.
BBIC on DECT side controls the cordless telephone system, which makes control data communication with BT_IC on BT
Module in serial data.
DECT6.0 BT devices
TGFA30
Handset
PSTN DC
5.5V
BBIC
FLASH
IC601
(TAM)
IC421
(Data)
TEL I/F POWER
QSPI FLASH
IC502
(Program)
Main PCB
BT_Module
(IC721)
(IC501)
MIC
SPEAKER
BT Interface
HANDSET

9
KX-TGF380AGM/KX-TGFA30AGM
4.2. US-DECT Description
Transmitting and receiving carrier between base unit and handset is same frequency.
4.2.1. TDD Frame Format
4.2.2. TDMA system
This system is the cycles of 10 ms, and has 6 duplex paths, but maximum duplex communication path is 5 because of dummy
bearer use.
In 1 slot 417 s, the 10 ms of voice data is transmitted.
•2 - Handsets Link
Traffic Bearer
A link is established between base unit and handset.
The state where duplex communication is performed.
Handset doesn't make up duplex in no free RF channels because of interference. (*1)
Dummy Bearer
Base unit sends Dummy-data to the all stand-by state handsets.
Handsets receive that data for synchronization and monitoring request from the base unit.
Base unit doesn't send Dummy bearer in no free RF channels because of interference. (*1)
Note:
(*1) It is a feature under FCC 15 regulation and for interference avoidance.
In the case of checking RF parts, it is better in least interference condition.
417 μs (available) 417 μs (blind)
5 ms 5 ms
Up Link ( Handset ->Base Unit ) Down Link ( Base Unit ->Handset )
DATA rate : 1.152 Mbps
RX1 RX2 RX3 RX4 RX5 RX6 TX1 TX2 TX3 TX4 TX5 TX6
RX1 RX2 RX3 RX4 RX5 RX6 TX1 TX2 TX3 TX4 TX5 TX6
TX RX
RXTX
Traffic Bearer Dummy bearer
Base unit
Handset 1
(Stand by)
Handset 2
(Link)
Handset 3
(Link)

10
KX-TGF380AGM/KX-TGFA30AGM
4.2.3. Signal Flowchart in the Radio Parts
Reception
Base unit:
A voice signal from TEL line is encoded to digital data and converted into a 1.9GHz modulated radio signal by BBIC(IC501).
The RF signal, after which is amplified in BBIC, is fed to selected antenna.
Handset:
As for a handset RF, RF signal is received in one antenna.
BBIC down-converts to 864 kHz IF signal from RX signal and demodulates it to digital data "RXDATA".
BBIC (IC1) converts RXDATA into a voice signal and outputs it to speaker.
Transmission
Handset:
A voice signal from microphone is encoded to digital data and converted into a 1.9GHz modulated radio signal by BBIC(IC1).
The RF signal, after which is amplified in BBIC, is fed to an antenna.
Base unit:
As for a base unit RF, RF signal is received in two antennas.
BBIC (IC501) compares RF signal levels and selects the antenna to be used. Then BBIC down-converts to 864 kHz IF signal
from RX signal in the selected antenna, and demodulates it to digital data "RXDATA".
BBIC (IC501) converts RXDATA into a voice signal and outputs it to TEL line.

11
KX-TGF380AGM/KX-TGFA30AGM
4.3. Block Diagram (Base Unit_Main)
KX-TGF380AG BLOCK DIAGRAM (Base Unit_Main)
IC501
BBIC
Crystal 10.368MHz
KEY
PAD
IC601
Flash
(Voice Prompt)
SIDE TONE
CIRCUIT
LSRp
MICh
Q161
Q141
TR RLY
P3_6
Q141
䠇䡚 䠉䡚
D101 TEL Jack
CIDINn CIDINp
IC502
Flash
(Program)
QSPI
AVD/VDD
+1.8V
(VDD1)
VBAT
Q301
VBAT
(VDD3)
DCDC
Converter
IC302
Charge
Control
Circuit
RF Block
RF_VDD
VDD_PA
IC722
IC721
BT Module
ANT1
ANT2
BT 1.8V
ANT
LCD
module
STM
IC421
TIP RING
DC 5.5V GND
Battery

12
KX-TGF380AGM/KX-TGFA30AGM
4.4. Tel Interface Circuit
TX AMP
SIDE TONE
RX AMP
CONTROL CIRCUIT
CALLER ID
DETECT
BELL DETECT
P101
R142
3
4
2
1
C101
Q141
C102
SA101
TIP
RING
R141
REGULATOR
C104
R102
C106
R104
C103
R101
C105
R103
D101

13
KX-TGF380AGM/KX-TGFA30AGM
4.5. Block Diagram (Base Unit_RF Part)
10.368
MHz
IC501 RF block
TXDATA
ANT1
ANT1
RF_TXp RF_TXn RF_RXp RF_RXn
ANT2
ANT2
Control
Logic
RXDATA
Mixer
Demodulator
PLL
3856-3843MHz
/3859-3845MHz
Modulator
DA802
KX-TGF380AG BLOCK DIAGRAM (Base Unit_RF Part)

14
KX-TGF380AGM/KX-TGFA30AGM
4.6. Circuit Operation (Base Unit)
General Description:
(BBIC, Flash Memory, EERROM) is a digital speech/signal processing system that implements all the functions of speech
compression, record and playback, and memory management required in a digital telephone answering machine.
The BBIC system is fully controlled by a host processor. The host processor provides activation and control of all that functions
as follows.
4.6.1. BBIC (Base Band IC: IC501)
•Voice Message Recording/Play back
The BBIC system uses a proprietary speech compression technique to record and store voice message in Flash Memory.
An error correction algorithm is used to enable playback of these messages from the Flash Memory.
•DTMF Generator
When the DTMF data from the handset is received, the DTMF signal is output.
•Synthesized Voice (Pre-recorded message)
The BBIC implements synthesized Voice, utilizing the built in speech detector and a Flash Memory, which stored the vocabulary.
•Caller ID demodulation
The BBIC implements monitor and demodulate the FSK/DTMF signals that provide CID information from the Central Office.
•Digital Switching
The voice signal from telephone line is transmitted to the handset or the voice signal from the handset is transmitted to the
Telephone line, etc. They are determined by the signal path route operation of voice signal.
•Block Interface Circuit
RF part, LED, Key scan, Speaker, Telephone line.
4.6.2. Flash Memory (IC502)
Main program data is stored.
4.6.3. Flash Memory (IC601)
Following information data is stored.
•Voice signal
ex: Pre-recorded Greeting message, Incoming message
4.6.4. Bluetooth Unit (IC721)
Use for Bluetooth communication.
RF part
ADPCM
Analog
Front
End
&
Multi-
plexer
TEL
Line
Interface
Digital
Speech
Processor
Caller ID
Modem
Digital TAM System
Flash Memory IC601
Host CPU
BBIC (IC501)
TDD & TDMA
with FHSS
Processor ADPCM
PCM OUT
MIC
SP
PCM IN
Keys/ LEDs
/ Charge
Flash Memory
(Program)
IC502
Bluetooth Unit

15
KX-TGF380AGM/KX-TGFA30AGM
4.6.5. Power Supply Circuit/Reset Circuit
There are 2 pattern from power supply voltage.
1) AC adapter voltage is converted to VBAT(3.0V) at DCDC converter.
2) Battery voltage goes through to VBAT(Battery voltage).
VBAT is used for various voltage of the system.
Circuit Operation:
Startmonitor
(IC501 57pin)
VDD1 (1.8 V)
VBAT
Reset (RSTN)
(IC501_77pin)
BBIC chip initialize
(CKM/STM)
AC adapter
+5.5V
Battery
Charge
Control
Circuit
DCDC
converter
IC302
VDD3
VBAT
Q301
VDD1
+1.8V
QSPI FLASH
IC502
TAM FLASH
IC601
RF Part
IC722
Bluetooth
unit
IC721
+1.8V
DCDC
converter
VDD6
4.0V
LCD module
VDD4
3.0V_CP1
LEDs
BBIC
IC501
3.0V_CP2
VDD5
Sub IC
IC421
LCD backlight

16
KX-TGF380AGM/KX-TGFA30AGM
4.6.6. Telephone Line Interface
Telephone Line Interface Circuit:
Function
• Bell signal detection
• ON/OFF hook and pulse dial circuit
• Side tone circuit
Bell (RINGING) signal detection and OFF HOOK circuit:
In the idle mode, Q141 is open to cut the DC loop current and decrease the ring load. When ring voltage appears at the Tip (T)
and Ring (R) leads (When the telephone rings), the AC ring voltage is transferred as follows:
L1T C105 R103 R110 R111R112 BBIC pin18 (RINGING)
When the CPU (BBIC) detects a ring signal, Q141 turns on, thus providing an off-hook condition (active DC current flow through
the circuit). Following signal flow is the DC current flow.
T D101 Q141 Q161 R163 D101 P101 R
ON HOOK Circuit:
Q141 is open, Q141 is connected as to cut the DC loop current and to cut the voice signal. The unit is consequently in an on-
hook condition.
Pulse Dial Circuit:
Pin 19 of BBIC turns Q141 ON/OFF to make the pulse dialing.
Side Tone Circuit:
Basically this circuit prevents the TX signal from feeding back to RX signal. As for this unit, TX signal feed back from Q161 is
canceled by the canceller circuit of BBIC.
OFF Hook
BELL signal detection
C174
C171
R166
R178
RX
Pin25 of IC501
TX
Pin27 of IC501
R160
+
C161
C167
R165
R162
C173 R151R164
C184
C103
C111
Q161
E
B
C
R163
R117
C115
R109
C109
Q141
Q142 C101
P101
L1T
L1R
D101
C102
1
2
3+
~~
_
4
R145
C142
C152
R152
AK
D142
R141
B
E C
E
BC
R142
SA101
R111
R101
HOOK
Pin19 of IC501
CIDOUT
Pin24 of IC501
LSRn
Pin28 of IC501
RINGING
Pin18 of IC501
CIDINn
Pin23 of IC501
CIDINp
Pin21 of IC501
R168
PARADET
Pin17 of IC501
ADC1
Pin33 of IC501
ADC0
Pin32 of IC501
R118
C116
R115
R116
R110
C110
R112
C113
C105
R103
C104
R102
C106
R104

17
KX-TGF380AGM/KX-TGFA30AGM
4.6.7. Parallel Connection Detect Circuit/Auto Disconnect Circuit
Function:
In order to disable call waiting and stutter tone functions when using telephones connected in parallel, it is necessary to have a
circuit that judges whether a telephone connected in parallel is in use or not. This circuit determines whether the telephone
connected in parallel is on hook or off hook by detecting changes in the T/R voltage.
Circuit Operation:
Parallel connection detection when on hook:
When on hook, the voltage is monitored at pin 32 of IC501. There is no parallel connection if the voltage is
0.54 V or higher, while a parallel connection is deemed to exist if the voltage is lower.
Parallel connection detection when off hook:
When off hook, the voltage is monitored at pin 17 of IC501; the presence/absence of a parallel connection is determined by
detecting the voltage changes.
If the Auto disconnect function is ON and statuses are Hold, receiving ICM, OGM transmitting, BBIC disconnects the line after
detecting parallel connection is off hook.
C174
C171
R166
R178
RX
Pin25 of IC501
TX
Pin27 of IC501
R160
+
C161
C167
R165
R162
C173 R151R164
C184
Q161
E
B
C
R163
R117
C115
Q141
Q142 C101
P101
L1T
L1R
D101
C102
1
2
3+
~~
_
4
R145
C142
C152
R152
AK
D142
R141
B
E
C
E
B
C
R142
SA101
HOOK
Pin19 of IC501
R168
PARADET
Pin17 of IC501
ADC1
Pin33 of IC501
ADC0
Pin32 of IC501
R118
C116
R115
R116

18
KX-TGF380AGM/KX-TGFA30AGM
4.6.8. Calling Line Identification (Caller ID)/Call Waiting Caller ID
Function:
Caller ID
The caller ID is a chargeable ID which the user of a telephone circuit obtains by entering a contract with the telephone company
to utilize a caller ID service. For this reason, the operation of this circuit assumes that a caller ID service contract has been
entered for the circuit being used. The data for the caller ID from the telephone exchange is sent during the interval between the
first and second rings of the bell signal. The data from the telephone exchange is a modem signal which is modulated in an FSK
(Frequency Shift Keying) * format. Data "1"is a 1200 Hz sine wave, and data "0"is a 2200 Hz sine wave. There are two types of
the message format which can be received: i.e. the single message format and plural message format. The plural message
format allows to transmit the name and data code information in addition to the time and telephone number data.
*: Also the telephone exchange service provides other formats.
1st Ring
2 sec Silent interval 4 sec
2nd Ring
2 sec
0.5 s575 msmin 0.5 s
DATA
0.1 Vrms
STD Ring / 20 Hz
Tip-Ring
DATA in
A
BDATA out
1200 Hz
=DATA "1"
1 bit=833 µs
2200 Hz
=DATA "0 "
70 Vrms
month dayhour minute number
201348700035161504
Single message format
Plural message format
1st Ring
2 sec
718 ms
2nd Ring
0.5 s
DATA
month dayhourminute number
20134870003516 16
DATA CODE NAME
201 John Smith 04

19
KX-TGF380AGM/KX-TGFA30AGM
Call Waiting Caller ID
Calling Identity Delivery on Call Waiting (CIDCW) is a CLASS service that allows a customer, while off-hook on an existing call,
to receive information about a calling party on a waited call. The transmission of the calling information takes place almost
immediately after the customer is alerted to the new call so he/she can use this information to decide whether to take the new
call.
Function:
The telephone exchange transmits or receives CAS and ACK signals through each voice RX/TX route. Then FSK data and
MARK data pass the following route.
Telephone Line P101 C105, C104 R103, R102 IC501(23, 21).
If the unit deems that a telephone connected in parallel is in use, ACK is not returned even if CAS is received, and the
information for the second and subsequent callers is not displayed on the portable handset display.
CAS
CAS: CPE Alerting Signal
Dual Tone of 2130 Hz, 2750 Hz
-15 dBm (900 ohm load)
80 5 ms
MARK DATA
0~500 ms 58~75 ms about 300 ms
(be changed by
Information Volume)
Continuance Signal
of 1200 Hz (Data "1") "FSK"
ACK: Acknowledged Signal
DTMF
"D"
ACK
0~100 ms 60 5 ms
Telephone Exchange Cordless phone
Cordless phone
Signal Flow
Signal Flow
Telephone Exchange
Call Waiting Format
CIDOUT
Pin 24
C110
R110
R109
CIDINn
Pin 23
CIDINp
Pin 21
LSRn
Pin 28
C109
P101
L1T
L1R
SA101
IC501
C103
R101
C105
R103
C104
R102
C106
R104

20
KX-TGF380AGM/KX-TGFA30AGM
4.7. Block Diagram (Handset)
IC1
IC3
MIP
MIN
HSSPOUTP
LOUT
HSMIP
HEADSET_DET
SPOUTP
SPOUTN
CKM//STM
CKM/STM
BBIC
RESET
CHG_CTL
BATTERY_ON
CHG_DET
WP, CLK, DATA
KEYSTOROBE_A~E
KEYIN_1~5
CHARGE
MIC
Receiver
Headset Jack
CN4
Monitor SP
LCD
CHARGE
PUMP
IC4
KEYS
RF part
ANT1
X1
13.824 MHz
EEPROM
3V
BATTERY
LED
(LCD)
RSTN
VBAT
VBAT
3V
4.0V VBAT
RXn
RXp
TXp
TXn
KX-TGFA30 BLOCK DIAGRAM (Handset)
KEY_LED
CP_OFF
Q6
LED
(KEY)
4V
CHARGE
CONTROL
POWER SUPPLY
CONTROL