TE Connectivity 832 User manual

Operating Manual
Operating Manual 832 & 832M1, Rev B www.te.com October 20, 2015
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Model 832 & 832M1 Accelerometer
TE Connectivity
Vibration Sensors Design Center
32 Journey, Suite 150
Aliso Viejo, CA 92656 USA
Tel: [phone]
www.meas-spec.com
[e-mail]

Operating Manual
Operating Manual 832 & 832M1, Rev B www.te.com October 20, 2015
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TMTM
Warranty
TE Connectivity accelerometers are warranted
during a period of one year from date of
shipment to original purchaser to be free from
defects in material and workmanship. The
liability of Seller under this warranty is limited to
replacing or repairing any instrument or
component thereof which is returned by Buyer,
at his expense, during such period and which
has not been subjected to misuse, neglect,
improper installation, repair, alteration, or
accident. Seller shall have the right to final
determination as to the existence and cause of a
defect. In no event shall Seller be liable for
collateral or consequential damages. This
warrant is in lieu of any other warranty,
expressed, implied, or statutory; and no
agreement extending or modifying it will be
binding upon Seller unless in writing and signed
by a duly authorized officer.
Receiving Inspection
Every TE Connectivity accelerometer is carefully
inspected and is in perfect working condition at
the time of shipment. Each accelerometer
should be checked as soon as it is received. If
the unit is damaged in any way, or fails to
operate, a claim should immediately be filed with
the transportation company.
Service Concerns
If a TE Connectivity instrument requires service,
first contact the nearest TE Connectivity
representative. They may be able to solve the
problem without returning the unit to the factory.
If it is determined that factory service is required,
call Customer Service at the regional
headquarters for an RMA number before return.
Returns
All units being returned to the factory require an
RMA (Return Material Authorization) number
before they will be accepted. This number may
be obtained by calling Customer Service at the
regional headquarters with the following
information; model number(s), quantity, serial
number(s), and symptoms of the problem, if
being returned for service. You must include the
original purchase order number if under
warranty.
Recalibration Services
The Vibration Sensors Design Center and its
two manufacturing facilities in China and France
offer factory re-calibration services for
Piezoresistive, Piezoelectric and Integrated
Electronics Piezoelectric (IEPE, ISOTRON, ICP,
etc.) accelerometers. NIST (US), DKD
(Germany), COFRAC (France) traceable
calibration services on sensitivity at 100 Hz (102
or 120 Hz in Europe) and full frequency sweeps
are offered. Contact the regional headquarters
for pricing information.
Inquiries
Address all inquiries on operation or applications
to your nearest Sales Representative, or to the
Vibration Applications Support as follows:
Global Headquarters
1000 Lucas Way
Hampton, VA 23666, USA
Tel: [phone]
Vibration Sensors Design Center
32 Journey, Suite 150
Aliso Viejo, CA 92656, USA
Tel: [phone]
European Headquarters
105 av. du Général Eisenhower
BP 1036, 31023 Toulouse Cedex, France
Tel: [phone]
Asian Headquarters
Measurement Specialties (China), Ltd.
F1.6-4D, Tian An Development Compound
Shenzhen, China 518057
Tel: [phone]

Operating Manual
Operating Manual 832 & 832M1, Rev B www.te.com October 20, 2015
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Description
The Model 832 & 832M1are low power triaxial accelerometer designed to be mounted on circuit boards.
The accelerometers are ideal for embedded applications and is packaged is a hermetic ceramic LCC
package. The Model 832 & 832M1 feature stable piezo-ceramic crystals with full power and signal
conditioning that draw a maximum current of 4 micro-Amps (22 micro-Amps for 832M1). The
accelerometers are offered in ranges from ±100g to ±500g with a flat response up to greater than
2000Hz (greater than 6000Hz for 832M1).
Installation
The model 832 & 832M1 accelerometers are designed to be soldered to printed circuit boards or hybrid
substrates. It is critical that the substrate has a low coefficient of expansion and that you have good
mechanical coupling between the sensor and the mounting surface to ensure good transmissibility.
Ceramic circuit boards are recommended but FR4 boards can also be used with a recommended
thickness of 0.062” (1.57mm). The model 832 accelerometer is not to be reflow soldered in an oven
since the reflow temperatures may shift the output sensitivity. It is recommended to reflow solder on a hot
plate or manually solder the accelerometer to the circuit boards. The following guidelines should be
followed.
The recommended dimensions for the mounting pads on the circuit board are detailed below.
Pre-tinning of the accelerometer pads is recommended to prevent gold embrittlement.
Use a suitable RMA flux coated solder paste.
A recommended stencil thickness is .008” (0.2mm).
If using a hot plate, do not heat above +250°C and leave only on plate long enough for solder to
reflow.

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If the accelerometers are to be subjected to high amplitude shocks during operation then it is also
recommended to apply a thin layer of epoxy underneath the accelerometers after solder attachment. A
low viscosity cyanoacrylate with a room temperature cure such as Loctite 4501 is recommended.
Excitation
Although the model 832 & 832M1 are designed to be operated by 3.3Vdc battery power for optimum
performance, the accelerometer can also be powered by excitation voltages (ExcV) ranging from 2.7 to
5.5Vdc. However, excitation voltages other than 3.3Vdc will affect the full scale range of the
accelerometer since the bias voltage is a function of excitation voltage.
The following formula can be used to calculate the full scale range of the accelerometer when using
different excitation voltages other than 3.3Vdc.
Full scale range (g) = [ExcV –0.3V - (ExcV / 2)] / Sensitivity (V/g)
Example; a model 832-0200 with z-axis sensitivity of 6.41mV/g and 2.8Vdc excitation
Full scale range = [2.8V –0.3V - (2.8V / 2)] / .00641V/g = 172g
Temperature Compensation
The model 832 & 832M1 accelerometers incorporate piezo-ceramic crystals in shear mode that have a
stable temperature performance over the operating range of the accelerometers. Additional temperature
compensation can be accomplished by using an external ASIC with onboard temperature sensing to
further correct temperature induced errors.

Operating Manual
Operating Manual 832 & 832M1, Rev B www.te.com October 20, 2015
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Noise Floor Specifications
The model 832 & 832M1 broadband and spectral noise floor specifications are detailed in table below.
-0025
-0050
-0100
-0200
-0500
Broadband Noise (uV, 0.1Hz ~ 10kHz)
832
300
210
160
150
160
832M1
110
90
50
40
50
832 Spectral Noise (*/√Hz)
@10Hz
120ug
120ug
120ug
120ug
400ug
@100Hz
80ug
80ug
80ug
80ug
320ug
@1000Hz
40ug
40ug
40ug
40ug
160ug
832M1 Spectral Noise (*/√Hz)
@10Hz
120ug
160ug
160ug
160ug
600ug
@100Hz
40ug
40ug
40ug
40ug
160ug
@1000Hz
20ug
16ug
16ug
16ug
80ug

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Frequently Asked Questions
Question: The datasheet shows the operating temperature from -40C to +125C. -40C is not low
enough; we need beyond -55C. What is your plan of meeting this requirement?
Response: We tested the bias at -55C. Test result of 832-0500 DC bias change with temperature is
shown below, DC Bias changes about 0.5% at -55ºC compared to 25ºC:
25ºC -55ºC
X 1.7423 V 1.7535 V
Y 1.7412 V 1.7477 V
Z 1.7928 V 1.8035 V
Total current supply is 4.1uA at -55ºC which is still within specification. Model 832M1 has no problem
working down at -55ºC
Question: Do you happen to have any more detail for the assembling of this part to a board? Our board
assembly department is a little concerned about manually soldering this part. It says on your data sheet
that the accelerometer can’t go through solder reflow at high temperature and that manual soldering is
recommended. I was hoping for some more clarification on this statement.
Response: The reason for the caution is the potential risk of sensitivity shift in the output after reflow
soldering. The units will survive the reflow soldering process. We caution against this process since we
have seen a 1-2% sensitivity drop after reflow soldering. For our reflow profile we have a peak
temperature of +250C since we use non-leaded solder for RoHS compliance. A lower reflow profile may
result in negligible sensitivity shift. If you can use leaded solder such Sn63 or Sn62 (183°C and 179°C
eutectic respectively) then the peak reflow temp should not have to exceed +210C (60sec max). This
should then allow reflow soldering.
Question: We generally conformal coat our circuit boards to protect the circuitry, would there be any
concern with conformal coating?
Response: No concerns with conformal coating. The seismic mass system and electronics are all
hermetically sealed under the cover.
Question: Can we bake the board after coating?
Response: Yes. There will be no problem with an over-night bake at +200F on the model 832M1. We
bake the units for 24hours at +250F during manufacture.

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Frequently Asked Questions (continued)
Question: Just a clarification, at 0g output, is the accelerometer output Supply Voltage/2? So that when
we have a negative acceleration we approach 0 but not negative?
Response: Yes, you are correct. The output will swing nominally +/-1.25V about the bias voltage. For a
+/-100g range accelerometer with 3.3V excitation (bias at 1.65V), the output would be nominally be 0.4V
to 2.9V.
Question: You mentioned about getting us an equation to calculate the measurement range based on
our bias voltage. We talked about how the lower bias voltage would lower the maximum measurement of
this accelerometer and I was hoping to get a better understanding of this.
Response: Page 5 in this manual, under the ‘Excitation’ paragraph, discusses how to calculate the full-
scale range of the accelerometer based on excitation voltages other than the nominal 3.3V. Let us know
if you need further information. Our engineers have confirmed that the minimum excitation voltage is in
fact 2.7V. We specified 3.3V in our datasheet to give us some margin. We also confirmed that we had
previously performed a signal warm-up test on our model 832M1. The signal converged to 98% of its
final value at 30msec. There was no overshoot. It was typical of a single-pole response characteristic
that was determined by its filtering …95% (lapse of three time constants).
Question: Can Measurement Specialties provide a higher temp version of Model 834M1?
Response: Yes, we can make high temp version which operates from -40C to +150C, but the current
consumption will be 60uA.
Question: If I use structural epoxy around the perimeter to reinforce the vibration sensor onto the circuit
card (after soldering) will this affect the vibration response of the sensor? Is there a reinforcement
technique you would recommend?
Response: No, this will not affect the response of the sensor and in fact it is recommended to reinforce
the sensor attachment after soldering. Typically we recommend the customer use a low viscosity
cyanoacrylate adhesive and allow the epoxy to wick underneath the circuit board.

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Frequently Asked Questions (continued)
Question: What mounting techniques and materials are recommended to achieve the best high
frequency response?
Response: To achieve the best frequency response, we recommend mounting the accelerometer
directly to the structure to be measured. An adhesive can be used to secure the accelerometer. Take
precautions not to short the output pads underneath the circuit board. Good frequency response can also
be achieved by mounting the accelerometer onto a ceramic or hybrid circuit board. FR4 boards should
be avoided for applications requiring wide bandwidth measurements since the FR4 material can impart a
resonance to your measuring system. If attaching wires to the output pads then these need to be
properly secured/anchored at regular intervals to minimize cable motion that can add noise and
resonances to the output signal.
Question: What is the material composition of the plating on the solder pads?
Response: The circuit board traces are Titanium-Tungsten plated with Nickel and Gold. 50micro-inches
min of Au (99.9% pure gold per MIL-G-45204, Type III, grade A) over 50-350micro-inches of Ni (per
AMS-QQ-N-290, Class I

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