Telit Wireless Solutions WE310F5-I Installation manual

WE310F5-I/P Module Hardware
User Guide
1VV0301662 Rev 2 –2020-09-01

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SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE
NOTICE
While reasonable efforts have been made to assure the accuracy of this document, Telit
assumes no liability resulting from any inaccuracies or omissions in this document, or from
use of the information obtained herein. The information in this document has been
carefully checked and is believed to be reliable. However, no responsibility is assumed for
inaccuracies or omissions. Telit reserves the right to make changes to any products
described herein andreserves the right to revisethis document and to make changes from
time to time in content hereof with no obligation to notify any person of revisions or
changes. Telit does not assume any liability arising out of the application or use of any
product, software, or circuit described herein; neither does it convey license under its
patent rights or the rights of others.
It is possible that this publication may contain references to, or information about Telit
products (machines and programs), programming, or services that are not announced in
your country. Such references or information must not be construed to mean that Telit
intends to announce such Telit products, programming, or services in your country.
COPYRIGHTS
This instruction manual and the Telit products described in this instruction manual may
be, include or describe copyrighted Telit material, such as computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve
for Telit and its licensors certain exclusive rights for copyrighted material, including the
exclusive right to copy, reproduce in any form, distribute and make derivative works of the
copyrighted material. Accordingly, any copyrighted material of Telit and its licensors
contained herein or in the Telit products described in this instruction manual may not be
copied, reproduced, distributed, merged or modified in any manner without the express
written permission of Telit. Furthermore, the purchase of Telit products shall not be
deemed to grant either directly or by implication, estoppel, or otherwise, any license under
the copyrights, patents or patent applications of Telit, as arises by operation of law in the
sale of a product.
COMPUTER SOFTWARE COPYRIGHTS
The Telit and 3rd Party supplied Software (SW) products described in this instruction
manual may include copyrighted Telit and other 3rd Party supplied computer programs
stored in semiconductor memories or other media. Laws in the Italy and other countries
preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted
computer programs, including the exclusive right to copy or reproduce in any form the
copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party
supplied SW computer programs contained in the Telit products described in this
instruction manual may not be copied (reverse engineered) or reproduced in any manner
without the express written permission of Telit or the 3rd Party SW supplier. Furthermore,
the purchase of Telit products shall not be deemedto grant either directly or by implication,
estoppel, or otherwise, any license under the copyrights, patents or patent applications of
Telit or other 3rd Party supplied SW, except for the normal non-exclusive, royalty free
license to use that arises by operation of law in the sale of a product.

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USAGE AND DISCLOSURE RESTRICTIONS
I. License Agreements
The software described in this document is the property of Telit and its licensors. It is
furnished by express license agreement only and may be used only in accordance with
the terms of such an agreement.
II. Copyrighted Materials
Software and documentation are copyrighted materials. Making unauthorized copies is
prohibited by law. No part of the software or documentation may be reproduced,
transmitted, transcribed, stored in a retrieval system, or translated into any language or
computer language, in any form or by any means, without prior written permission of Telit
III. High Risk Materials
Components, units, or third-party products used in the product described herein are NOT
fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control
equipment in the following hazardous environments requiring fail-safe controls: the
operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air
Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its
supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High
Risk Activities.
IV. Trademarks
TELIT and the Stylized T Logo are registered in Trademark Office. All other product or
service names are the property of their respective owners.
V. Third Party Rights
The software may include Third Party Right software. In this case you agree to comply
with all terms and conditions imposed on you in respect of such separate software. In
addition to Third Party Terms, the disclaimer of warranty and limitation of liability provisions
in this License shall apply to the Third Party Right software.
TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED
FROM ANY THIRD PARTIES REGARDING ANY SEPARATE FILES, ANY THIRD
PARTY MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS
FROM WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODE”), AND
THE USE OF ANY OR ALL THE OTHER CODE IN CONNECTION WITH THE
SOFTWARE, INCLUDING (WITHOUT LIMITATION) ANY WARRANTIES OF
SATISFACTORY QUALITY OR FITNESS FOR A PARTICULAR PURPOSE.
NO THIRD PARTY LICENSORS OF OTHER CODE SHALL HAVE ANY LIABILITY FOR
ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR
CONSEQUENTIAL DAMAGES (INCLUDING WITHOUT LIMITATION LOST PROFITS),
HOWEVER CAUSED AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER
LEGAL THEORY, ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF
THE OTHER CODE OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER
OR BOTH THIS LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE
FILES, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

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APPLICABILITY TABLE
PRODUCTS
WE310F5-I
WE310F5-P

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Contents
NOTICE…………….. ...................................................................................... 2
COPYRIGHTS................................................................................................ 2
COMPUTER SOFTWARE COPYRIGHTS...................................................... 2
USAGE AND DISCLOSURE RESTRICTIONS............................................... 3
CONTENTS.................................................................................................... 5
FIGURE LIST ................................................................................................. 7
TABLE LIST................................................................................................... 8
1. INTRODUCTION.......................................................................... 9
Scope........................................................................................... 9
Audience....................................................................................... 9
Contact Information, Support........................................................ 9
Text Conventions........................................................................ 10
Related Documents.................................................................... 10
2. PRODUCT DESCRIPTION......................................................... 11
Overview..................................................................................... 11
Block Diagram............................................................................ 13
3. FEATURE DESCRIPTION ......................................................... 14
Main Features............................................................................. 14
Bootloader.................................................................................. 17
General Purpose I/O................................................................... 18
ADC-DAC Converter................................................................... 18
4. POWER SUPPLY....................................................................... 20
Power Supply Requirements....................................................... 20
Logic Levels................................................................................ 20
Power Up/ Shutdown Sequences ............................................... 20
Power Consumption ................................................................... 22
Current Consumption Wi-Fi modes............................................ 22
Tx Output Power Wi-Fi and Bluetooth......................................... 23
Rx Sensitivity.............................................................................. 25

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5. PINS ALLOCATION................................................................... 27
Pin-out........................................................................................ 27
Pads Layout................................................................................ 33
6. DESIGN GUIDELINES............................................................... 35
General Digital Interface Recommendations............................... 35
Power circuitry............................................................................ 36
Bypass Capacitors...................................................................... 36
Antenna Guidelines .................................................................... 37
Audio considerations .................................................................. 40
Other General Design Considerations ........................................ 40
7. MECHANICAL DESIGN............................................................. 43
WE310F5-I ................................................................................. 43
WE310F5-P................................................................................ 45
PCB Pad Design......................................................................... 46
PCB Pad Dimensions ................................................................. 46
Stencil......................................................................................... 47
Solder Paste............................................................................... 47
Solder Reflow............................................................................. 48
8. PACKAGING.............................................................................. 50
Tray............................................................................................ 50
Moisture Sensitivity..................................................................... 51
9. CONFORMITY ASSESSMENT ISSUES .................................... 52
FCC/IC Regulatory Notices......................................................... 52
10.FCC/IC COMPLIANCE............................................................... 53
11. SAFETY RECOMMENDATIONS................................................ 56
Read Carefully............................................................................ 56
12. ACRONYMS............................................................................... 57
13. DOCUMENT HISTORY.............................................................. 59

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FIGURE LIST
Figure 1: WE310F5-I 15mm*18mm...............................................................................11
Figure 2: WE310F5-P 13.1mm*14.3mm .......................................................................11
Figure 3: WE310F5-I/P Block Diagram .........................................................................13
Figure 4: Power UP Sequence......................................................................................21
Figure 5: Shutdown Sequence......................................................................................22
Figure 6: Pads Layout Top View –WE310F5-I .............................................................33
Figure 7: Pads Layout Top View –WE310F5-P............................................................34
Figure 8: Pinout Legend Color-WE310F5-I/P................................................................34
Figure 9: EMI Filter Example.........................................................................................36
Figure 10: EMI Suppression on Modem’s Power Supply...............................................36
Figure 11: Placement Example-Please place the module aligning the PCB outline of the
module with that one of the EVK...................................................................................37
Figure 12: Placement Example and Cutout copper area for WE310F5-I-Please place and
remove the copper in any layer of the board.................................................................38
Figure 13: Possible Placement for WE310F5-P............................................................38
Figure 14: RF Track Example .......................................................................................39
Figure 15: Coplanar Waveguide Dimensioning Example...............................................39
Figure 16: Minimal RF Matching Network Circuitry........................................................40
Figure 17: Layout Example for FAST Digital Lines........................................................41
Figure 18: WE310F5-I Mechanical Design....................................................................43
Figure 19: WE310F5-I Side View..................................................................................43
Figure 20: WE310F5-I Recommended Land Pattern.....................................................44
Figure 21: WE310F5-P Mechanical Design...................................................................45
Figure 22: WE310F5-P Side View.................................................................................45
Figure 23: WE310F5-P Recommended Land Pattern ...................................................46
Figure 24: SMD and NSMD Pad...................................................................................46
Figure 25: Inhibit Area for Not Solder Covered Vias......................................................47
Figure 26: Solder Reflow Profile....................................................................................48
Figure 27: WE310F5-I/P Packaging example (to replace with the final one and add the
WE310F5-P figure )......................................................................................................50

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TABLE LIST
Table 1: Feature Description Table...............................................................................16
Table 2: Peripherals Interfaces .....................................................................................17
Table 3: GPIO Alternate Pinmux Table.........................................................................18
Table 4: Power Supply requirements ............................................................................20
Table 5: Input/output Levels..........................................................................................20
Table 6: Timing Specification-Power Sequence............................................................21
Table 7: General Power Consumption ..........................................................................22
Table 8: Tx Power Consumption @2.4GHz...................................................................23
Table 9: IEEE 802.11 EVM @2.4GHz...........................................................................25
Table 10: BLE Transmit Power .....................................................................................25
Table 11: Rx RF Output Pad Sensitivity @2.4GHz .......................................................26
Table 12: BLE Sensitivity at RF Output Pad..................................................................26
Table 13: Pinout Table..................................................................................................33
Table 14: PCB Finishing Recommendation...................................................................47
Table 15: Recommended Solder Paste Type...............................................................47
Table 16: Solder Reflow Table......................................................................................49

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1. INTRODUCTION
Scope
The aim of this document is to describe some of the hardware solutions
useful for developing a product with the Telit WE310F5-I/P Wi-Fi/BLE
module.
Audience
This document is intended for Telit customers, who are integrators, about to
implement their applications using our WE310F5-I/P modules.
Contact Information, Support
For general contact, technical support services, technical questions
and report documentation errors contact Telit Technical Support at:
•TS[email protected]
•[e-mail]
•[e-mail]
•[e-mail]
Alternatively, use:
http://www.telit.com/support
For detailed information about where you can buy the Telit modules or for
recommendations on accessories and components visit:
http://www.telit.com
Our aim is to make this guide as helpful as possible. Keep us informed of your
comments and suggestions for improvements.
Telit appreciates feedback from the users of our information.

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Text Conventions
Danger –This information MUST be followed, or catastrophic
equipment failure or bodily injury may occur.
Caution or Warning –Alerts the user to important points about
integrating the module, if these points are not followed, the module
and end user equipment may fail or malfunction.
Tip or Information –Provides advice and suggestions that may be
useful when integrating the module.
All dates are in ISO 8601 format, i.e. 2019-01-08.
Related Documents
•WE310F5-I/P AT Command Reference Guide
•WE310F5-I/P EVB Hardware User Guide

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2. PRODUCT DESCRIPTION
Overview
The WE310F5-I/P is a module with single band Wi-Fi/BLE(5.0) 2.4GHz combo module
that provides an easy and cost-effective way to the users to add wireless connectivity to
their products. This module is available in two different from factors the antenna version
named WE310F5-I with 15mmx18mm dimensions and an on-board multilayer antenna
and the WE310F5-P with 13.1mmX14.3mm with antenna PAD. The two versions share
the same Pinout and are P2P compatible.
The following figure shows the WE310F5-I and WE310F5-P
Figure 1: WE310F5-I 15mm*18mm
Figure 2: WE310F5-P 13.1mm*14.3mm

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WE310F5-I/P
NOTE:
(EN) The integration of the WE310F5-I/P module within user
application shall be done according to the design rules described in
this manual.
(IT) L’integrazione del modulo cellulare WE310F5-I/P all’interno
dell’applicazione dell’utente dovrà rispettare le indicazioni progettuali
descritte in questo manuale.
(DE) Die Integration des WE310F5-I/P Mobilfunk-Moduls in ein Gerät
muß gemäß der in diesem Dokument beschriebenen
Kunstruktionsregeln erfolgen.
(SL) Integracija WE310F5-I/P modula v uporabniški aplikaciji bo
morala upoštevati projektna navodila, opisana v tem priročniku.
(SP) La utilización del modulo WE310F5-I/P debe ser conforme a los
usos para los cuales ha sido deseñado descritos en este manual del
usuario.
(FR) L’intégration du module cellulaire WE310F5-I/P dans
l’application de l’utilisateur sera faite selon les règles de conception
décrites dans ce manuel.
(HE)

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Block Diagram
Following is the block diagram:
Figure 3: WE310F5-I/P Block Diagram

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3. FEATURE DESCRIPTION
Main Features
1. Highly integrated single chip with low power single band (2.4GHz) Wireless LAN
(WLAN) and Bluetooth Low Energy (BLE5.0) communication controller.
2. Dedicated ArmV8-M Cortex-M33 (KM4) processor + low power Armv8-M Cortex-M23
(KM0) WLAN (802.11 b/g/n) MAC, an 1T1R capable WLAN baseband, RF, Bluetooth
and peripherals.
3. High Speed connectivity interfaces, SDIO and USB, audio codec, Key-scan and touch
keys.
4. ROM/SRAM memories for IOT, Wi-Fi protocol functions and applications.
A more detailed description of the features is shown in the following table:
Item
Description
WiFi
802.11 b/g/n 1X1 2.4GHz
Support 20MHz/40MHz up to MCS7
Low power architecture
Low Power Tx/Rx for short range application
Low Power beacon listen mode
Low power Rx mode
Very low power suspends mode (DLPS)
Built-in PA
Internal PTA interface for arbitrating data transmission between WiFi and
Internal Bluetooth or external 2.4G devices
BT BLE
BLE 5.0
Both central and peripheral modes
High power mode (8dBm, shares the same PA with WiFi)
Internal Co-existence mechanism between Wi-Fi and BT to share the
same antenna
SD/SDIO
SDIO 2.0 SDR25 Supported
High efficiency SPI interface in both full duplex and half duplex modes
Clock rate variable up to 50 MHz
Internal DMA supported
SDIO device time consuming from power on to initialization : 64.15ms

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Item
Description
USB
USB 2.0
HS/FS/LS mode
Internal DMA support
1.5Kbyte built-in\bulk out buffers
SPI
Master/slave modes
SPI (High Speed) master/slave up to 50 MHz
Dynamic bit-rate clock
UART
Format 1 start bi/, 7/8 bits, 0/1 parity and 1/2 Stop
Multiples baud rates supporter
Loopback mode for test
Differentiate clock for TX and RX paths
Low power mode for Rx path
I2C
Two Wires I2C Interface (SDA and SCL)
Standard mode (up to 100Kbps)
Fast mode (up to 400Kbps)
High speed mode (up to 3.33Mbps) Master/Slave Operations,
HS_USI_I2C is supported.
7-10 bit addressing
Audio DAC and
earphone
driver
Sampling Frequency 8/16/32/44.1/48/88.2/96 KHz
Integrates earphone driver
•40mW on 16load
•20mW on 32load
Gain Control in DAC path
•Gain Step: 0.375dB/Step
•Gain Range: -64.5 dB ~ 0dB
Audio Output mode Line-Out single-end mode
AUDIO ADC
Sampling Frequency 8/16/32/44.1/48/88.2/96 KHz
ADC input gain range:
•Gain Step: 0.375dB/Step

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Item
Description
•Gain Range: -17.625 dB ~ 30dB (digital)
Mic input boost gain stage 0/20/30/40dB (analog)
Audio input mode:
•Analog MICx2 or Digital MICx2
I2S
Sample rate:
•8/12/16/24/32/48/64/96/192/384/7.35/11.025/14.7/22.05/29.4/44.1/
58.8/88.2/176.4 KHz
•I2S channel number: mono, stereo, 5.1 channel 16-bit, 24-bit, 32-bit
•Support mono and stereo for Tx & Rx mode
•Support 5.1 Tx mode (DAC), not support Rx mode (ADC)
•Not Support PCM mode
RTC
Independent CD timer/counter
Timer with seconds, minutes, hours, days (12- or 24-hour format)
Dayling saving compensation programmable by software
One programmable alarm with interrupt function. The alarm can be
triggered by any combination of the time fields
Digital calibration circuit
Register write protection
Key-Matrix
Table 1: Feature Description Table
The WE310F5-I/P module supports the following peripherals Interfaces.
Item
Peripherals
Comment
UART
LP_UART1
LP_UART0
Low Power Mode Wakeup
LOGUART/Low power mode wakeup (no
Flow control))
SPI
HS_SPI
Maximum 50 MHz/Master/Slave

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EXT_32K
LP_TIM4_TRIG
LP_TIM5_TRIG
EXT_32K
LP_TIM4_TRIG
LP_TIM5_TRIG
Timer Capture
Time Capture
RIR
I2C
LP_I2C
Standard/fast/high speed mode (up to
3.33Mbps)
SDIO
1-Bit SDIO mode
SD HOST
Maximum 25 MHz Clock
Maximum 25 MHz Clock
PWM
HS_PWM0~17
LP_PWM0~5
X14
Support Low Power Mode X5
I2S
I2S
Wake Pin
Wake Pin
Wake up from deep sleep
HS_TIM4_TRIG
HS_TIM5_TRIG
HS_TIM4_TRIG
HS_TIM5_TRIG
Timer Capture
Timer Capture
Analog Pin
USB
ADC
USB host or device (selectable)
0~3.3V x14
Internal Flash
Memory
4M bytes (32M bits)
NOR FLASH
Table 2: Peripherals Interfaces
Bootloader
The firmware boot-up can be performed only through
internal NOR flash. The firmware update can be performed only through AUX_UART.
To download image to the module, TX_AUX (pin Y10) must be asserted to LOW before
turning on the module.
Instructions:- TBD

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Please refer to documents for more detail.
General Purpose I/O
The module has 6 GPIO which can be configured as Input \ Output or as Alternate
Function.
Following table provides the GPIO numbers and their alternate functions with direction
and Internal PU/PD at startup.
GPIO
Number
Alternate Function1
- I2C
Alternate
Function2
- 1bit mode
SDIO
Internal
PU/PD
GPIO_01
I2C_SCL (I2C Clock)
SD_CMD
(SD
Command)
I/O
No Pull
GPIO_02
I2C_SDA (I2C Data)
SD_CLK (SD
Clock)
I/O
No Pull
GPIO_03
-
SD_D0 (SD
Serial Data 0)
I/O
No Pull
GPIO_04
I/O
No Pull
GPIO_05
I/O
No Pull
GPIO_06
I/O
No Pull
Table 3: GPIO Alternate Pinmux Table
ADC-DAC Converter
1. Resolution 12-bit SAR
2. Available channel number
a. 14x external 3.3V channel and 1C V channel
b. 1X internal channel
3. Configurable input
a. Single end
4. Contain 64 FiFi entries with 16-bt width

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5. Multi-channel DMA support
6. Multi sampling trigger sources
a. Software
b. Timer
7. 1 low power voltage comparator for battery voltage measurement
8. Conversion item control or another FIFO level trigger wakeup

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4. POWER SUPPLY
Power Supply Requirements
The WE310F5-I/P is directly supplied by using a 3.3V power supply source.
The voltage supply to all the required parts of the chipset is provided by an embedded
switching regulator.
Power Supply
Minimum
Typical
Maximum
Main Power ratings
3.0 V
3.3V
3.6 V
Table 4: Power Supply requirements
Logic Levels
Levels with VIO = 3.3V
Min
Typical
Max
VIH Input high level
2.0V
-
-
VIL Input low level
-
-
0.8V
VOH Output high level
2.4V
-
-
VOL Output low level
-
-
0.4V
IT+ Schmitt-trigger High Level
1.78V
1.87V
1.97V
IT- Schmitt-trigger Low Level
1.36V
1.45V
1.56V
ILL input-Leakage Current
-10A
+/-1A
10A
Table 5: Input/output Levels
Power Up/ Shutdown Sequences
The power ON from Deepsleep sequence is shown below: