Telit Wireless Solutions LE910C1-NA Installation manual

LE910Cx
Hardware User Guide
1VV0301298 Rev. 1.04 - 2017-05-25

LE910Cx Hardware User Guide
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Applicability Table
This documentation applies to the ollowing products:
Table 1: Applicability Table
Module Na e Description
LE910C1-NA North America – AT&T with global
roaming
LE910C1-NS North America - Sprint variant
LE910C1-AP APAC variant

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SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE
Notice
While reasonable e orts have been made to assure the accuracy o this document, Telit assumes
no liability resulting rom any inaccuracies or omissions in this document, or rom use o the
in ormation obtained herein. The in ormation in this document has been care ully checked and is
believed to be entirely reliable. However, no responsibility is assumed or inaccuracies or
omissions. Telit reserves the right to make changes to any products described herein and reserves
the right to revise this document and to make changes rom time to time in the content hereo with
no obligation to noti y any person o revisions or changes. Telit does not assume any liability arising
out o the application or use o any product, so tware, or circuit described herein; neither does it
convey any license under its patent rights or the rights o others.
It is possible that this publication may contain re erences to, or in ormation about Telit products
(machines and programs), programming, or services that are not announced in your country. Such
re erences or in ormation must not be construed to mean that Telit intends to announce such Telit
products, programming, or services in your country.
Copyrights
This instruction manual and the Telit products described in this instruction manual may be, include,
or describe copyrighted Telit material, such as computer programs stored in semiconductor
memories or other media. Laws in Italy and other countries preserve or Telit and its licensors
certain exclusive rights or copyrighted material, including the exclusive right to copy, reproduce in
any orm, distribute, and make derivative works o the copyrighted material. Accordingly, any
copyrighted material o Telit and its licensors contained herein or in the Telit products described in
this instruction manual may not be copied, reproduced, distributed, merged, or modi ied in any
manner without the express written permission o Telit. Furthermore, the purchase o Telit
products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any
license under the copyrights, patents or patent applications o Telit, as arises by operation o law
in the sale o a product.
Co puter Software Copyrights
Telit and third-party so tware (SW) products described in this instruction manual may include
copyrighted Telit and other third-party computer programs stored in semiconductor memories or
other media. Laws in Italy and other countries preserve or Telit and other third-party SW certain
exclusive rights or copyrighted computer programs, including the exclusive right to copy or
reproduce in any orm the copyrighted computer program. Accordingly, any copyrighted Telit or
other third-party SW computer programs contained in the Telit products described in this
instruction manual may not be copied (reverse engineered) or reproduced in any manner without
the express written permission o Telit or the third-party SW supplier. Furthermore, the purchase
o Telit products shall not be deemed to grant either directly or by implication, estoppel, or
otherwise, any license under the copyrights, patents or patent applications o Telit or other third-
party SW, except or the normal non-exclusive, royalty ree license to use that arises by operation
o law in the sale o a product.

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Usage and Disclosure Restrictions
License Agree ents
The so tware described in this document is the property o Telit and its licensors. It is urnished by
an express license agreement only and may be used only in accordance with the terms o such an
agreement.
Copyrighted Materials
So tware and documentation are copyrighted materials. Making unauthorized copies is prohibited
by law. No part o the so tware or documentation may be reproduced, transmitted, transcribed,
stored in a retrieval system, or translated into any language or computer language, in any orm or
by any means, without prior written permission o Telit.
High Risk Materials
Components, units, or third-party products used in the product described herein are NOT ault-
tolerant and are NOT designed, manu actured, or intended or use as on-line control equipment in
the ollowing hazardous environments requiring ail-sa e controls: the operation o nuclear
acilities, aircra t navigation or aircra t communication systems, air tra ic control, li e support, or
weapons systems (“high risk activities"). Telit and its supplier(s) speci ically disclaim any expressed
or implied warranty o itness or such high risk activities.
Trade arks
TELIT and the stylized T logo are trademarks and/or registered trademarks o Telit Communications
S.p.A. in the Unites States and/or other countries. All other product or service names are the
property o their respective owners.
Copyright © 2016 Telit Communications S.p.A.

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Contents
1. Introduction ..................................................................................................... 13
1.1. Scope ................................................................................................................ 13
1.2. Audience .......................................................................................................... 13
1.3. Contact In ormation, Support .......................................................................... 13
1.4. Text Conventions ............................................................................................. 14
1.5. Related Documents .......................................................................................... 15
1.6. Abbreviations ................................................................................................... 16
2. General Product Description ............................................................................ 17
2.1. Overview .......................................................................................................... 17
2.2. Applications ..................................................................................................... 17
2.3. General Functionality and Main Features ....................................................... 18
2.4. Block Diagram .................................................................................................. 21
2.5. Environmental Requirements .......................................................................... 22
2.5.1. Temperature Range .............................................................................. 22
2.5.2. RoHS Compliance.................................................................................. 22
2.6. Frequency Bands .............................................................................................. 23
2.6.1. RF Bands per Regional Variant ............................................................. 23
2.6.2. Re erence Table o RF Bands Characteristics ....................................... 24
2.7. Sensitivity ......................................................................................................... 26
2.8. LE910Cx Mechanical Speci ications ................................................................. 27
2.8.1. Dimensions ........................................................................................... 27
2.8.2. Weight .................................................................................................. 27
3. LE910Cx Module Connections ........................................................................... 28
3.1. Pin-out .............................................................................................................. 28
3.2. LE910Cx - Signals That Must Be Connected ..................................................... 39
3.3. LGA Pads Layout ............................................................................................... 41
3.4. Backward Compatibility to xE910 Family ........................................................ 42
4. Electrical Specifications .................................................................................... 43
4.1. Absolute Maximum Ratings – Not Operational ............................................... 43

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4.2. Recommended Operating Conditions ............................................................. 43
4.3. Logic Level Speci ications ................................................................................. 44
4.3.1. 1.8V Pads - Absolute Maximum Ratings ............................................... 44
4.3.2. 1.8V Standard GPIOs ............................................................................ 44
4.3.3. 1.8V SD Card Pads ................................................................................. 45
4.3.4. 1.8V SIM Card Pads ............................................................................... 45
4.3.5. Dual Voltage Pads - Absolute Maximum Ratings ................................. 46
4.3.6. SD Card Pads @ 2.95V .......................................................................... 46
4.3.7. SIM Card Pads @2.95V ......................................................................... 47
5. Hardware Co ands ....................................................................................... 48
5.1. Turning on the LE910Cx Module ...................................................................... 48
5.2. Initialization and Activation State .................................................................... 48
5.3. Turning OFF the LE910Cx Module ................................................................... 50
5.3.1. Shutdown by So tware Command ....................................................... 50
5.3.2. Hardware Shutdown ............................................................................. 51
5.3.4. Unconditional Hardware Shutdown ..................................................... 52
6. Power Supply ................................................................................................... 53
6.1. Power Supply Requirements............................................................................ 53
6.2. General Design Rules ....................................................................................... 55
6.2.1. Electrical Design Guidelines .................................................................. 55
6.2.1.1. + 5V Input Source Power Supply – Design Guidelines ......... 55
6.2.1.2. + 12V Input Source Power Supply – Design Guidelines ....... 56
6.2.1.3. Battery Source Power Supply – Design Guidelines .............. 58
6.2.2. Thermal Design Guidelines ................................................................... 59
6.2.3. Power Supply PCB Layout Guidelines ................................................... 60
7. Antenna(s) ....................................................................................................... 61
7.1. GSM/WCDMA/LTE Antenna Requirements ..................................................... 61
7.2. GSM/WCDMA/LTE Antenna – PCB Line Guidelines ......................................... 62
7.3. GSM/WCDMA/LTE Antenna – Installation Guidelines .................................... 63
7.4. Antenna Diversity Requirements ..................................................................... 63

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7.5. GNSS Antenna Requirements .......................................................................... 64
7.5.1. Combined GNSS Antenna ..................................................................... 64
7.5.2. Linear and Patch GNSS Antenna ........................................................... 64
7.5.3. Front End Design Considerations ......................................................... 64
7.5.4. GNSS Antenna – PCB Line Guidelines ................................................... 65
7.5.5. GNSS Antenna – Installation Guidelines ............................................... 66
8. Hardware Interfaces......................................................................................... 67
8.1. USB Port ........................................................................................................... 68
8.2. HSIC Inter ace .................................................................................................. 69
8.3. SGMII Inter ace (optional) ............................................................................... 69
8.3.1. Ethernet Control inter ace ................................................................... 69
8.4. Serial Ports ....................................................................................................... 70
8.4.1. Modem Serial Port 1 Signals ................................................................. 71
8.4.2. Modem Serial Port 2 ............................................................................. 72
8.4.3. RS232 Level Translation ........................................................................ 73
8.5. Peripheral Ports ............................................................................................... 75
8.5.1. SPI – Serial Peripheral Inter ace ........................................................... 75
8.5.2. I2C - Inter-integrated Circuit ................................................................ 76
8.5.3. SD/MMC Card Inter ace ....................................................................... 76
8.5.4. WiFi SDIO Inter ace .............................................................................. 78
8.6. Audio Inter ace ................................................................................................ 80
8.6.1. Digital Audio ......................................................................................... 80
8.6.1.1. Short Frame Timing Diagrams .............................................. 81
8.6.1.2. Long Frame Timing Diagrams ............................................... 83
8.7. General Purpose I/O ........................................................................................ 85
8.7.1. Using a GPIO Pad as Input .................................................................... 87
8.7.2. Using a GPIO Pad as an interrupt / Wakeup source ............................. 87
8.7.3. Using a GPIO Pad as Output ................................................................. 87
9. Miscellaneous Functions .................................................................................. 89
9.1. Indication o Network Service Availability ....................................................... 89

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9.2. Indication o So tware Ready ........................................................................... 90
9.3. RTC – Real Time Clock ...................................................................................... 90
9.4. VAUX Power Output ........................................................................................ 90
9.5. ADC Converter ................................................................................................. 91
9.5.1. Description............................................................................................ 91
9.5.2. Using the ADC Converter ...................................................................... 91
9.6. Using the Temperature Monitor Function ...................................................... 91
9.7. GNSS Characteristics ........................................................................................ 92
10. Mounting the Module on your Board ............................................................... 93
10.1. General ............................................................................................................. 93
10.2. Finishing & Dimensions .................................................................................... 93
10.3. Recommended Footprint or the Application ................................................. 96
10.4. Stencil ............................................................................................................... 97
10.5. PCB Pad Design ................................................................................................ 97
10.6. Recommendations or PCB Pad Dimensions (mm) .......................................... 98
10.7. Solder Paste ..................................................................................................... 99
10.7.1. Solder Re low ........................................................................................ 99
11. Application Guide ........................................................................................... 101
11.1. Debug o the LE910Cx Module in Production ................................................ 101
11.2. Bypass Capacitor on Power Supplies ............................................................. 102
11.3. SIM Inter ace .................................................................................................. 103
11.3.1. SIM Schematic Example ...................................................................... 103
11.4. EMC Recommendations ................................................................................. 104
11.5. Download and Debug Port ............................................................................. 105
11.5.1. Fast Boot mode................................................................................... 105
11.5.2. Recovery Boot Mode .......................................................................... 105
12. Packing Syste ............................................................................................... 106
12.1. Packing system – Tray .................................................................................... 106
12.2. Tape & Reel .................................................................................................... 108
12.3. Moisture Sensitivity ....................................................................................... 110

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13. Safety Reco endations ................................................................................ 111
14. Confor ity assess ent issues ......................................................................... 112
14.1. FCC/ISED Regulatory notices ........................................................................ 112
15. Docu ent History ........................................................................................... 115

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List of Tables
Table 1: Applicability Table ................................................................................................................. 2
Table 2: Related Documents ............................................................................................................ 15
Table 3: RF Bands per Regional Variant ............................................................................................ 23
Table 4: RF Bands Characteristics ..................................................................................................... 24
Table 5: LE910Cx Pin-out .................................................................................................................. 28
Table 6: Mandatory Signals .............................................................................................................. 39
Table 7: Absolute Maximum Ratings – Not Operational .................................................................. 43
Table 8: Recommended Operating Conditions ................................................................................ 43
Table 9: Absolute Maximum Ratings - Not Functional ..................................................................... 44
Table 10: Operating Range – Inter ace Levels (1.8V CMOS) ............................................................ 44
Table 11: Operating Range – SD Card Pads Working at 1.8V ........................................................... 45
Table 12: Operating Range – SIM Pads Working at 1.8V.................................................................. 45
Table 13: Absolute Maximum Ratings - Not Functional ................................................................... 46
Table 14: Operating Range – For SD Card Pads Operating at 2.95V ................................................ 46
Table 15: Operating Range – For SIM Pads Operating at 2.95V ....................................................... 47
Table 16: Power Supply Requirements ............................................................................................ 53
Table 17: LE910Cx Current Consumption ......................................................................................... 53
Table 18: GSM / WCDMA/ LTE Antenna Requirements ................................................................... 61
Table 19: Antenna Line on PCB Requirements ................................................................................. 61
Table 20: Antenna Diversity Requirements ...................................................................................... 63
Table 21: Antenna Line on PCB Requirements ................................................................................. 65
Table 22: LE910Cx Hardware Inter aces ........................................................................................... 67
Table 23: USB Inter ace Signals ........................................................................................................ 68
Table 25: Ethernet Control Inter ace Signals .................................................................................... 69
Table 24: Modem Serial Port 1 Signals ............................................................................................. 71
Table 25 Modem Serial Port 2 Signals .............................................................................................. 72
Table 26: SPI Signals ......................................................................................................................... 75
Table 27: SD Card Signals .................................................................................................................. 77
Table 28: WiFi SDIO Inter ace Signals ............................................................................................... 78
Table 29: Digital Audio Inter ace (DVI) Signals ................................................................................. 80
Table 30: PCM_CODEC Timing Parameters ...................................................................................... 82
Table 31: AUX_PCM_CODEC Timing Parameters ............................................................................. 84
Table 32: Primary GPIOs ................................................................................................................... 85
Table 33: Network Service Availability Indication ............................................................................ 89
Table 34: Operating Range – VAUX Power Supply ........................................................................... 90
Table 35: ADC Parameters ................................................................................................................ 91
The values are related to typical environment and conditions Table 36 GNSS Characteristics....... 92
Table 37: Recommendations or PCB Pad Sur aces ......................................................................... 98
Table 38: Solder Pro ile Characteristics .......................................................................................... 100
Table 39: SIM Inter ace – C1 Range ................................................................................................ 103

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Table 40: EMC Recommendations ................................................................................................. 104
Table 41: Document Revision History ............................................................................................ 115

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List of Figures
Figure 1: LE910Cx Block Diagram ..................................................................................................... 21
Figure 2: LGA Pads Layout ................................................................................................................ 41
Figure 3: LE910Cx vs. LE910 Pin-out Comparison (top view) ........................................................... 42
Figure 4: Power-on Circuit ................................................................................................................ 48
Figure 5: LE910Cx Initialization and Activation ................................................................................ 49
Figure 6: Shutdown by So tware Command ..................................................................................... 50
Figure 7: Hardware Shutdown .......................................................................................................... 51
Figure 8: Circuit or Unconditional Hardware Shutdown ................................................................. 52
Figure 9 Power down timing using HW_SHUTDOWN_N ................................................................. 52
Figure 10: Example o Linear Regulator with 5V Input ..................................................................... 56
Figure 11: Example o Switching Regulator with 12V Input – Part 1 ................................................ 57
Figure 12: Example o Switching Regulator with 12V Input – Part 2 ................................................ 57
Figure 13: RS232 Level Adaption Circuitry Example ......................................................................... 73
Figure 14: RS232 Serial Port Lines Connection Layout ..................................................................... 74
Figure 15: SPI Signal Connectivity ..................................................................................................... 75
Figure 16: SD/MMC Inter ace Connectivity ...................................................................................... 77
Figure 17: Primary PCM Timing ........................................................................................................ 81
Figure 18: Auxiliary PCM Timing ....................................................................................................... 83
Figure 19: GPIO Output Pad Equivalent Circuit ................................................................................ 88
Figure 20: Status LED Re erence Circuit ........................................................................................... 89
Figure 21: LE910Cx Mechanical Dimensions (bottom view) ............................................................ 93
Figure 22: LE910Cx Mechanical Dimensions (Top view) .................................................................. 94
Figure 23: LE910Cx Mechanical Dimensions (Side view) .................................................................. 95
Figure 24: Recommended Footprint - Top View, 181 pads (dimensions are in mm, top view). ...... 96
Figure 25: PCB Pad Design ................................................................................................................ 97
Figure 26: PCB Pad Dimensions ........................................................................................................ 98
Figure 27: Solder Re low Pro ile ....................................................................................................... 99
Figure 28: SIM Schematics .............................................................................................................. 103
Figure 29: Packing ........................................................................................................................... 106
Figure 30: Tray Drawing .................................................................................................................. 107
Figure 31: Module Positioning into the Carrier .............................................................................. 108
Figure 32: Carrier Tape Detail ......................................................................................................... 108
Figure 33: Reel Detail ...................................................................................................................... 109
Figure 34: Reel Box Detail ............................................................................................................... 110

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1. Introduction
1.1. Scope
This document introduces the Telit LE910Cx module and presents possible and recommended
hardware solutions or developing a product based on the LE910Cx module. All the eatures and
solutions detailed in this document are applicable to all LE910Cx variants, where “LE910Cx” re ers
to the variants listed in the applicability table.
I a speci ic eature is applicable to a speci ic product only, it will be clearly marked.
NOTE:
LE910Cx re ers to all modules listed in the Applicability Table.
This document takes into account all the basic unctions o a wireless module; a valid hardware
solution is suggested or each unction, and incorrect solutions and common errors to be avoided
are pointed out.
Obviously, this document cannot embrace every hardware solution or every product that can be
designed. Obviously, avoiding invalid solutions must be considered mandatory. Where the
suggested hardware con igurations need not be considered mandatory, the in ormation given
should be used as a guide and a starting point or properly developing your product with the Telit
LE910Cx module.
NOTE:
The integration o the GSM/GPRS/EGPRS/WCDMA/HSPA+/LTE LE910Cx cellular module within a
user application must be done according to the design rules described in this manual.
1.2. Audience
This document is intended or Telit customers, especially system integrators, about to implement
their applications using the Telit LE910Cx module.
1.3. Contact Infor ation, Support
For general contact, technical support, to report documentation errors and to order manuals,
contact Telit’s Technical Support Center (TTSC) at:
•[email protected]
•[email protected]om
•[email protected]

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Alternatively, use:
http://www.telit.com/en/products/technical-support-center/contact.php
For detailed in ormation about where you can buy the Telit modules or or recommendations on
accessories and components, visit:
http://www.telit.com
To register or product news and announcements or or product questions contact Telit’s
Technical Support Center (TTSC).
Our aim is to make this guide as help ul as possible. Keep us in ormed o your comments and
suggestions or improvements.
Telit appreciates eedback rom the users about the in ormation provided.
1.4. Text Conventions
The ollowing conventions are used to emphasize speci ic types o in ormation:
Danger:
This information MUST be followed or catastrophic equipment failure or bodily injury may
occur.
Caution or arning:
Alerts the user to i portant points about integrating the odule. If these points are not
followed, the odule and end user equip ent ay fail or alfunction.
NOTE:
Tip or In ormation – Provides advice and suggestions that may be use ul when integrating the
module.
All dates are in ISO 8601 ormat, that is, YYYY-MM-DD.

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1.5. Related Docu ents
Table 2: Related Docu ents
Docu ent Title Docu ent Nu ber
Re 1: LE9x0 AT Command User Guide 80407ST10116A
Re 2: Telit EVB HW User Guide 1VV0301249
Re 3: LE910Cx Inter ace Board HW User Guide 1VV0301323
Re 4: LE910/LE920 Digital Voice Inter ace Application Note 80000NT11246A
Re 5: Telit_LE920A4_LE910Cx_Wi-Fi_Inter ace_Application_Note_r1 80490NT11511A
Re 6: Antenna Detection Application Note 80000NT10002A
Re 7: High-Speed Inter-Chip USB Electrical Speci ication, version 1.0
(a supplement to the USB 2.0 speci ication, Section 3.8.2)

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1.6. Abbreviations
Ter Definition
ADC Analog-to-digital converter
AE Application-enabled
DAC Digital-to-analog converter
DTE Data Terminal Equipment
FDD Frequency division duplex
GLONASS Global orbiting navigation satellite system
GNSS Global navigation satellite system
GPIO General-purpose input/output
GPRS General packet radio services
GPS Global positioning system
GSM Global system or mobile communications
HSIC High-speed inter-chip
I2C Inter-integrated circuit
LTE Long term evolution
SD Secure digital
SGMII Serial Gigabit media-independent inter ace
SIM Subscriber identity module
SOC System-on-Chip
SPI Serial peripheral inter ace
UART Universal asynchronous receiver transmitter
UMTS Universal mobile telecommunications system
USB Universal serial bus
WCI Wireless Coexistence Inter ace
WCDMA Wideband code division multiple access

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2. General Product Description
2.1. Overview
LE910Cx is Telit’s new LTE series or IoT applications.
In its most basic use case, LE910Cx can be applied as a wireless communication ront-end or
telematics products, o ering GNSS and mobile communication eatures to an external host CPU
through its rich inter aces.
LE910Cx is available in hardware variants as listed in Table 1: Applicability Table. For di erences in
the designated RF band sets – re er to Section 2.6.1, RF Bands per Regional Variant.
2.2. Applications
LE910Cx can be used or telematics applications where tamper-resistance, con identiality, integrity,
and authenticity o end-user in ormation are required, or example:
•Emergency call
•Telematics services
•Road pricing
•Pay-as-you-drive insurance
•Stolen vehicles tracking
•Internet connectivity

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2.3. General Functionality and Main Features
The LE910Cx series o cellular modules eatures LTE and multi-RAT modem together with an on-
chip power ul application processor and a rich set o inter aces.
The major unctions and eatures are listed below:
Function Features
Modem •Multi-RAT cellular modem or voice and data communication
oLTE FDD Cat1 (Other variants) (10/5Mbps DL/UL).
oCarrier aggregation is not supported
oGSM/GPRS/EDGE
oWCDMA up to DC HSPA+, Rel.9
•Support or European eCall , US E911, and ERA Glonass
•Support or SIM pro ile switching
•Regional variants with optimal choice o RF bands or worldwide
coverage o countries and MNOs
•State-o -the-art GNSS solution with
GPS/GLONASS/BeiDou/Galileo/QZSS receiver
Digital audio
subsystem
•PCM/I2S digital audio inter ace
•Up to 48 kHz sample rate, 16 bit words
Two USIM ports –
dual voltage
•Class B and Class C support
•Hot swap support
•Clock rates up to 4 MHz
Application
processor
Application processor to run customer application code
•32 bit ARM Cortex-A7 up to 1.3 GHz running the Linux operating
system
•Flash + DDR are large enough to allow or customer’s own
so tware applications

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Function Features
Inter aces Rich set o inter aces, including:
•SD/MMC Card Inter ace supporting SD3.0 standard
•SDIO or external WiFi transceiver supporting SDIO3.0 standard
•SGMII or external Ethernet transceiver (optional)
oCompliant with IEEE802.3
oFull duplex operation at 1 Gbps
oHal / ull duplex operation at 10/100 Mbps
oSupport or VLAN tagging
oSupport or IEEE1588, PTP (Precision Time Protocol)
•USB2.0 – USB port is typically used or:
oFlashing o irmware and module con iguration
oProduction testing
oAccessing the Application Processor’s ile system
oAT command access
oHigh-speed WWAN access to external host
oDiagnostic monitoring and debugging
oCommunication between Java application environment and an
external host CPU
oNMEA data to an external host CPU
•HSIC
oHigh-speed 480 Mbps (240 MHz DDR) USB trans ers are 100% host
driver compatible with traditional USB cable connected topologies
oBidirectional data strobe signal (STROBE)
oBidirectional data signal (DATA)
oNo power consumption unless a trans er is in progress
oMaximum trace length 10 cm
oSignals driven at 1.2V standard LVCMOS levels
•Peripheral Ports – SPI, I2C, UART
•GPIOs
•Antenna ports

LE910Cx Hardware User Guide
1VV0301298 Rev. 1.04 - 2017-05-25
Reproduction orbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved
Telit Con idential In ormation, provided under NDA Page
20 of 116
Function Features
Form actor Form actor (28x28mm), accommodating the multiple RF bands in each
region variant
Environment and
quality
requirements
The entire module is designed and quali ied by Telit or satis ying the
environment and quality requirements.
Single supply
module
The module generates all its internal supply voltages.
RTC No dedicated RTC supply, RTC is supplied by VBATT
Operating
temperature
Range -40 °C to +85 °C (conditions as de ined in Section 2.5.1, Temperature
Range).
NOTE:
The ollowing inter aces are unique or the LE910Cx and may not be supported on other ( ormer
or uture) xE910 amily. Special care must be taken when designing the application board i
uture compatibility is required:
- SGMII or Ethernet connectivity
- SDIO or WIFI connectivity
- SD/MMC or SD Card connectivity