Telit Wireless Solutions LE910C1-NA Installation manual

LE910Cx
Hardware User Guide
1VV0301298 Rev. 1.04 - 2017-05-25

LE910Cx Hardware User Guide
1VV0301298 Rev. 1.04 - 2017-05-25
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Applicability Table
This documentation applies to the ollowing products:
Table 1: Applicability Table
Module Na e Description
LE910C1-NA North America – AT&T with global
roaming
LE910C1-NS North America - Sprint variant
LE910C1-AP APAC variant

LE910Cx Hardware User Guide
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SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE
Notice
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in ormation obtained herein. The in ormation in this document has been care ully checked and is
believed to be entirely reliable. However, no responsibility is assumed or inaccuracies or
omissions. Telit reserves the right to make changes to any products described herein and reserves
the right to revise this document and to make changes rom time to time in the content hereo with
no obligation to noti y any person o revisions or changes. Telit does not assume any liability arising
out o the application or use o any product, so tware, or circuit described herein; neither does it
convey any license under its patent rights or the rights o others.
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or describe copyrighted Telit material, such as computer programs stored in semiconductor
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Usage and Disclosure Restrictions
License Agree ents
The so tware described in this document is the property o Telit and its licensors. It is urnished by
an express license agreement only and may be used only in accordance with the terms o such an
agreement.
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High Risk Materials
Components, units, or third-party products used in the product described herein are NOT ault-
tolerant and are NOT designed, manu actured, or intended or use as on-line control equipment in
the ollowing hazardous environments requiring ail-sa e controls: the operation o nuclear
acilities, aircra t navigation or aircra t communication systems, air tra ic control, li e support, or
weapons systems (“high risk activities"). Telit and its supplier(s) speci ically disclaim any expressed
or implied warranty o itness or such high risk activities.
Trade arks
TELIT and the stylized T logo are trademarks and/or registered trademarks o Telit Communications
S.p.A. in the Unites States and/or other countries. All other product or service names are the
property o their respective owners.
Copyright © 2016 Telit Communications S.p.A.

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Contents
1. Introduction ..................................................................................................... 13
1.1. Scope ................................................................................................................ 13
1.2. Audience .......................................................................................................... 13
1.3. Contact In ormation, Support .......................................................................... 13
1.4. Text Conventions ............................................................................................. 14
1.5. Related Documents .......................................................................................... 15
1.6. Abbreviations ................................................................................................... 16
2. General Product Description ............................................................................ 17
2.1. Overview .......................................................................................................... 17
2.2. Applications ..................................................................................................... 17
2.3. General Functionality and Main Features ....................................................... 18
2.4. Block Diagram .................................................................................................. 21
2.5. Environmental Requirements .......................................................................... 22
2.5.1. Temperature Range .............................................................................. 22
2.5.2. RoHS Compliance.................................................................................. 22
2.6. Frequency Bands .............................................................................................. 23
2.6.1. RF Bands per Regional Variant ............................................................. 23
2.6.2. Re erence Table o RF Bands Characteristics ....................................... 24
2.7. Sensitivity ......................................................................................................... 26
2.8. LE910Cx Mechanical Speci ications ................................................................. 27
2.8.1. Dimensions ........................................................................................... 27
2.8.2. Weight .................................................................................................. 27
3. LE910Cx Module Connections ........................................................................... 28
3.1. Pin-out .............................................................................................................. 28
3.2. LE910Cx - Signals That Must Be Connected ..................................................... 39
3.3. LGA Pads Layout ............................................................................................... 41
3.4. Backward Compatibility to xE910 Family ........................................................ 42
4. Electrical Specifications .................................................................................... 43
4.1. Absolute Maximum Ratings – Not Operational ............................................... 43

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4.2. Recommended Operating Conditions ............................................................. 43
4.3. Logic Level Speci ications ................................................................................. 44
4.3.1. 1.8V Pads - Absolute Maximum Ratings ............................................... 44
4.3.2. 1.8V Standard GPIOs ............................................................................ 44
4.3.3. 1.8V SD Card Pads ................................................................................. 45
4.3.4. 1.8V SIM Card Pads ............................................................................... 45
4.3.5. Dual Voltage Pads - Absolute Maximum Ratings ................................. 46
4.3.6. SD Card Pads @ 2.95V .......................................................................... 46
4.3.7. SIM Card Pads @2.95V ......................................................................... 47
5. Hardware Co ands ....................................................................................... 48
5.1. Turning on the LE910Cx Module ...................................................................... 48
5.2. Initialization and Activation State .................................................................... 48
5.3. Turning OFF the LE910Cx Module ................................................................... 50
5.3.1. Shutdown by So tware Command ....................................................... 50
5.3.2. Hardware Shutdown ............................................................................. 51
5.3.4. Unconditional Hardware Shutdown ..................................................... 52
6. Power Supply ................................................................................................... 53
6.1. Power Supply Requirements............................................................................ 53
6.2. General Design Rules ....................................................................................... 55
6.2.1. Electrical Design Guidelines .................................................................. 55
6.2.1.1. + 5V Input Source Power Supply – Design Guidelines ......... 55
6.2.1.2. + 12V Input Source Power Supply – Design Guidelines ....... 56
6.2.1.3. Battery Source Power Supply – Design Guidelines .............. 58
6.2.2. Thermal Design Guidelines ................................................................... 59
6.2.3. Power Supply PCB Layout Guidelines ................................................... 60
7. Antenna(s) ....................................................................................................... 61
7.1. GSM/WCDMA/LTE Antenna Requirements ..................................................... 61
7.2. GSM/WCDMA/LTE Antenna – PCB Line Guidelines ......................................... 62
7.3. GSM/WCDMA/LTE Antenna – Installation Guidelines .................................... 63
7.4. Antenna Diversity Requirements ..................................................................... 63

LE910Cx Hardware User Guide
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7.5. GNSS Antenna Requirements .......................................................................... 64
7.5.1. Combined GNSS Antenna ..................................................................... 64
7.5.2. Linear and Patch GNSS Antenna ........................................................... 64
7.5.3. Front End Design Considerations ......................................................... 64
7.5.4. GNSS Antenna – PCB Line Guidelines ................................................... 65
7.5.5. GNSS Antenna – Installation Guidelines ............................................... 66
8. Hardware Interfaces......................................................................................... 67
8.1. USB Port ........................................................................................................... 68
8.2. HSIC Inter ace .................................................................................................. 69
8.3. SGMII Inter ace (optional) ............................................................................... 69
8.3.1. Ethernet Control inter ace ................................................................... 69
8.4. Serial Ports ....................................................................................................... 70
8.4.1. Modem Serial Port 1 Signals ................................................................. 71
8.4.2. Modem Serial Port 2 ............................................................................. 72
8.4.3. RS232 Level Translation ........................................................................ 73
8.5. Peripheral Ports ............................................................................................... 75
8.5.1. SPI – Serial Peripheral Inter ace ........................................................... 75
8.5.2. I2C - Inter-integrated Circuit ................................................................ 76
8.5.3. SD/MMC Card Inter ace ....................................................................... 76
8.5.4. WiFi SDIO Inter ace .............................................................................. 78
8.6. Audio Inter ace ................................................................................................ 80
8.6.1. Digital Audio ......................................................................................... 80
8.6.1.1. Short Frame Timing Diagrams .............................................. 81
8.6.1.2. Long Frame Timing Diagrams ............................................... 83
8.7. General Purpose I/O ........................................................................................ 85
8.7.1. Using a GPIO Pad as Input .................................................................... 87
8.7.2. Using a GPIO Pad as an interrupt / Wakeup source ............................. 87
8.7.3. Using a GPIO Pad as Output ................................................................. 87
9. Miscellaneous Functions .................................................................................. 89
9.1. Indication o Network Service Availability ....................................................... 89

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9.2. Indication o So tware Ready ........................................................................... 90
9.3. RTC – Real Time Clock ...................................................................................... 90
9.4. VAUX Power Output ........................................................................................ 90
9.5. ADC Converter ................................................................................................. 91
9.5.1. Description............................................................................................ 91
9.5.2. Using the ADC Converter ...................................................................... 91
9.6. Using the Temperature Monitor Function ...................................................... 91
9.7. GNSS Characteristics ........................................................................................ 92
10. Mounting the Module on your Board ............................................................... 93
10.1. General ............................................................................................................. 93
10.2. Finishing & Dimensions .................................................................................... 93
10.3. Recommended Footprint or the Application ................................................. 96
10.4. Stencil ............................................................................................................... 97
10.5. PCB Pad Design ................................................................................................ 97
10.6. Recommendations or PCB Pad Dimensions (mm) .......................................... 98
10.7. Solder Paste ..................................................................................................... 99
10.7.1. Solder Re low ........................................................................................ 99
11. Application Guide ........................................................................................... 101
11.1. Debug o the LE910Cx Module in Production ................................................ 101
11.2. Bypass Capacitor on Power Supplies ............................................................. 102
11.3. SIM Inter ace .................................................................................................. 103
11.3.1. SIM Schematic Example ...................................................................... 103
11.4. EMC Recommendations ................................................................................. 104
11.5. Download and Debug Port ............................................................................. 105
11.5.1. Fast Boot mode................................................................................... 105
11.5.2. Recovery Boot Mode .......................................................................... 105
12. Packing Syste ............................................................................................... 106
12.1. Packing system – Tray .................................................................................... 106
12.2. Tape & Reel .................................................................................................... 108
12.3. Moisture Sensitivity ....................................................................................... 110

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13. Safety Reco endations ................................................................................ 111
14. Confor ity assess ent issues ......................................................................... 112
14.1. FCC/ISED Regulatory notices ........................................................................ 112
15. Docu ent History ........................................................................................... 115

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List of Tables
Table 1: Applicability Table ................................................................................................................. 2
Table 2: Related Documents ............................................................................................................ 15
Table 3: RF Bands per Regional Variant ............................................................................................ 23
Table 4: RF Bands Characteristics ..................................................................................................... 24
Table 5: LE910Cx Pin-out .................................................................................................................. 28
Table 6: Mandatory Signals .............................................................................................................. 39
Table 7: Absolute Maximum Ratings – Not Operational .................................................................. 43
Table 8: Recommended Operating Conditions ................................................................................ 43
Table 9: Absolute Maximum Ratings - Not Functional ..................................................................... 44
Table 10: Operating Range – Inter ace Levels (1.8V CMOS) ............................................................ 44
Table 11: Operating Range – SD Card Pads Working at 1.8V ........................................................... 45
Table 12: Operating Range – SIM Pads Working at 1.8V.................................................................. 45
Table 13: Absolute Maximum Ratings - Not Functional ................................................................... 46
Table 14: Operating Range – For SD Card Pads Operating at 2.95V ................................................ 46
Table 15: Operating Range – For SIM Pads Operating at 2.95V ....................................................... 47
Table 16: Power Supply Requirements ............................................................................................ 53
Table 17: LE910Cx Current Consumption ......................................................................................... 53
Table 18: GSM / WCDMA/ LTE Antenna Requirements ................................................................... 61
Table 19: Antenna Line on PCB Requirements ................................................................................. 61
Table 20: Antenna Diversity Requirements ...................................................................................... 63
Table 21: Antenna Line on PCB Requirements ................................................................................. 65
Table 22: LE910Cx Hardware Inter aces ........................................................................................... 67
Table 23: USB Inter ace Signals ........................................................................................................ 68
Table 25: Ethernet Control Inter ace Signals .................................................................................... 69
Table 24: Modem Serial Port 1 Signals ............................................................................................. 71
Table 25 Modem Serial Port 2 Signals .............................................................................................. 72
Table 26: SPI Signals ......................................................................................................................... 75
Table 27: SD Card Signals .................................................................................................................. 77
Table 28: WiFi SDIO Inter ace Signals ............................................................................................... 78
Table 29: Digital Audio Inter ace (DVI) Signals ................................................................................. 80
Table 30: PCM_CODEC Timing Parameters ...................................................................................... 82
Table 31: AUX_PCM_CODEC Timing Parameters ............................................................................. 84
Table 32: Primary GPIOs ................................................................................................................... 85
Table 33: Network Service Availability Indication ............................................................................ 89
Table 34: Operating Range – VAUX Power Supply ........................................................................... 90
Table 35: ADC Parameters ................................................................................................................ 91
The values are related to typical environment and conditions Table 36 GNSS Characteristics....... 92
Table 37: Recommendations or PCB Pad Sur aces ......................................................................... 98
Table 38: Solder Pro ile Characteristics .......................................................................................... 100
Table 39: SIM Inter ace – C1 Range ................................................................................................ 103