Telit Wireless Solutions WE310F5-I Installation manual

1VV0301698
2021-01 Rev.0
Telit Technical Documentation
WE310F5-I/P Module
Hardware User Guide
1VV0301662 Rev. 16 – 2021-10-01

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APPLICABILITY TABLE
PRODUCTS
WE310F5-I
WE310F5-P

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CONTENTS
1. INTRODUCTION 5
Scope 5
Audience 5
Contact Information, Support 5
Symbol Convention 5
Related Documents 6
2. GENERAL PRODUCT DESCRIPTION 7
Overview 7
Product Variants and Frequency Bands 7
Block Diagram 8
3. FEATURES 9
Main Features 9
4. PIN ALLOCATION 11
PIN-Out 11
General Purpose I/O 14
SAR ADC Characteristics 15
Pad Layout 15
5. POWER SUPPLY 17
Power Supply Requirements 17
Logic Levels 17
Power Up and Shutdown Sequences 17
Average power consumption 18
WLAN Continuous Tx power consumption 18
6. RF SPECIFICATION 20
Wi-Fi Tx Power 20
Wi-Fi Rx Sensitivity 20
BLE Tx Power 21
BLE Rx Sensitivity 21
7. DESIGN GUIDELINES 22
General Digital Interface Recommendations 22
Power supply design guidelines 23
Bypass Capacitors 24
General Design Rules 24
Audio 26
Audio considerations 27

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ESD Characteristics 28
8. MECHANICAL DESIGN 29
WE310F5-I 29
WE310F5-P 30
PCB Pad Design 30
PCB Pad Dimensions 31
Stencil 31
Solder Paste 31
PCB Pad Dimensions 32
9. PACKAGING 33
Tray 33
Moisture sensitivity 34
10. CONFORMITY ASSESSMENT ISSUES 35
FCC/IC Regulatory Notices 35
FCC/IC Compliance 35
11. SAFETY RECOMMENDATIONS 38
12. GLOSSARY 39
13. DOCUMENT HISTORY 40

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1. INTRODUCTION
Scope
This document describes electrical specifications, mechanical information, interfaces
application, and manufacturing information about the Telit WE310F5-I/P Wi-Fi/BLE
module. With the help of this document and other application notes or user guides, users
can understand the Telit WE310F5-I/P Wi-Fi/BLE module well and develop various
products quickly.
Audience
This document is intended for Telit customers, especially system integrators, about to
implement their applications using the Telit module.
Contact Information, Support
For general contact, technical support services, technical questions and report
documentation errors contact Telit Technical Support at:
• TS[email protected]
• [e-mail]
• TS[email protected]
• TS[email protected]
Alternatively, use: https://www.telit.com/support
For detailed information about where you can buy the Telit modules or for
recommendations on accessories and components visit https://www.telit.com
We aim to make this guide as helpful as possible. Keep us informed of your comments
and suggestions for improvements.
Telit appreciates feedback from the users of our information.
Symbol Convention
Danger:
This information MUST be followed,
or catastrophic
equipment failure or personal injury may occur.
Warning: Alerts the user on important steps about the module
integration.
Note/Tip:
Provides advice and suggestions that may be useful when
integrating the module.
Electrostatic Discharge:
Notifies the user to take proper grounding
precautions before handling the product.
All dates are in ISO 8601 format, that is. YYYY-MM-DD.

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Related Documents
Module Name
Description
80664ST11034A
WE310F5-I/P AT Command Reference Guide
1VV0301663
WE310F5-I/P EVB Hardware User Guide
Table 1: Related documents

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2. GENERAL PRODUCT DESCRIPTION
Overview
The WE310F5-I/P is a module with a single-band Wi-Fi/BLE (5.0) 2.4GHz combo module
that provides an easy and cost-effective way for users to add wireless connectivity to
their products. This module is available in two different factors the antenna version
named WE310F5-I with 15mmx18mm dimensions and an on-board multilayer antenna
and the WE310F5-P with 13.1mmX14.3mm with antenna pad. The two versions share the
same Pinout and are P2P compatible.
Product Variants and Frequency Bands
The Telit WE310F5 module is available in two variants. For details on the differences
between the two variants.
•WE310F5-I
•WE310F5-P
WE310F5-I
WE310F5-P
Figure 1: Product Variants and Frequency Band

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WE310F5
-I/P
Note/Tip:
(
EN
) The integration of the WE310F5-I/P module within the user application
shall be done according to the design rules described in this manual.
(
IT
) L’integrazione del modulo cellulare WE310F5-I/P all’interno
dell’applicazione dell’utente dovrà rispettare le indicazioni progettuali
descritte in questo manuale.
(
DE
) Die Integration des WE310F5-I/P Mobilfunk-Moduls in ein Gerät muß
gemäß der in diesem Dokument beschriebenen Kunstruktionsregeln
erfolgen.
(
SL
) Integracija WE310F5-I/P modula v uporabniški aplikaciji bo morala
upoštevati projektna navodila, opisana v tem priročniku.
(
SP
) La utilización del modulo WE310F5-I/P debe ser conforme a los usos
para los cuales ha sido deseñado descritos en este manual del usuario.
(
FR
) L’intégration du module cellulaire WE310F5-I/P dans l’application de
l’utilisateur sera faite selon les règles de conception décrites dans ce
manuel.
[
HE
]
Block Diagram
The following figure shows a high-level block diagram of the WE310F5-I/P module and
its major functional blocks.
Figure 2: Telit WE310F5-I/P module block diagram

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3. FEATURES
Main Features
1. Highly integrated single chip with low power single-band (2.4GHz) Wireless
LAN (WLAN) and Bluetooth Low Energy (BLE5.0) communication controller.
2. Dedicated ArmV8-M Cortex-M33 (KM4) processor + low power Armv8-M
Cortex-M23 (KM0) WLAN (802.11 b/g/n) MAC, a 1T1R capable WLAN, and BLE.
3. FLASH Memory 4Mbytes (32Mbits)
4. 456KB RAM
5. Retention SRAM 156 byte
Item
Description
Wi-Fi
802.11 b/g/n 1X1 2.4GHz
20MHz/40MHz Channel width
Data rates up to MCS7
Low power architecture
Low Power Tx/Rx for short-range application
Low Power beacon listen mode
Low power Rx mode
Very low power suspends mode (DLPS)
Built-in PA
Internal PTA interface for arbitrating data transmission between
Wi-Fi and Internal Bluetooth or external 2.4G devices
BLE
BLE 5.0
Both central and peripheral modes
Internal Co-existence mechanism between Wi-Fi and BLE to share
the same antenna
Temperature
Range
Operating: -40°C ~ 85°C
Junction: -40°C ~ 105°C
Storage: -55°C ~ 125°C
Table 2: Main Features
The WE310F5-I/P module supports the following peripherals Interfaces.
Item
Peripherals
Comment
UART
UART0
Low Power Mode Wakeup
AUX_UART LOG UART/Low power mode wakeup (no Flow
control)). Used for flashing, RF Tests, and logs.
SPI
SPI0
Master/Slave Clock up to 50 MHz
I2C
HS_I2C
Standard/fast/high speed mode (up to 3.33Mbps)
SDIO
1-Bit SDIO mode
Maximum Clock 50 MHz
PWM
HS_PWM8/
LP_PWM2
DVI
I2S Sampling rates: 8kHz ~ 176.4kHz
Mono, stereo, and 5.1 channel.
The sample size for Mono: 16-bit, 32-bit

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The sample size for Stereo & 5.1 channel: 16-bit,
24-bit 32 bit.
PCM not supported
WAKEUP
Wake up from deep sleep
USB
USB 2.0 CDC class device
ADC
12-bit SAR ADC Single ended input
Range: 0~3.3V
RTC
12- or 24-hour format (seconds, minutes, hours,
days)
Daylight saving compensation
Register write protection
Table 3: Supported Peripherals

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4. PIN ALLOCATION
PIN-Out
All IO’s are in LVTTL 3.3V logic.
Pin
Signal
I/O
Function
Comment
Pull-down
Restriction
Primary serial port
Y16
RXD0
I
Serial data Input (RXD)
>1K
AA15
TXD0
O
Serial data Output (TXD)
>1K
Y18
CTS0 I Input for Clear to send
signal (CTS)
>1K
AA17
RTS0 O Output for Request to
send signal (RTS)
>1K
USB
U19
USB_D+
I/O
USB differential Data (+)
>1K
V18
USB_D-
I/O
USB differential Data (-)
>1K
Auxiliary Serial Port
Y10
TX_AUX O Auxiliary (DEBUG) UART
output
Program
mode pin
>1K
AA9
RX_AUX I Auxiliary (DEBUG) UART
input
>1K
DIGITAL IO
V11
IO1/I2C_SCL
I/O
Configurable GPIO
V13
IO2/I2C_SDA
I/O
Configurable GPIO
D7
IO3/SD_D0
I/O
Configurable GPIO
D9
IO4
I/O
Configurable GPIO
D11
IO5
I/O
Configurable GPIO
D13
SPI_INT/IO6 I/O SPI Interrupt /
Configurable GPIO
SPI
AA5
SPI_MOSI
I/O
MOSI
Y6
SPI_CS
I/O
Chip Select
>1K
AA7
SPI_CLK
I/O
Clock
>1K
Y8
SPI_MISO
I/O
MISO
>1K
ADC and DAC
B18
ADC I Analog to Digital
Converter Input
0V ~ 3.3V >1K
R16
DAC
O
PWM output
RF
A5
WIFI/BT
ANTENNA
I/O RF pad (50 ohm) on P
variant

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Miscellaneous
N16
ON*
I
RESET pin
Active low
L16
WAKEUP I WAKEUP Module from
sleep
>1K
Audio
C1
DVI_WA0
O
I2S Frame Sync
D2
DVI_RX
O
I2S RX
E1
DVI_TX
I
I2S TX
F2
DVI_CLK
I
I2S CLK
Power Supply
W1
VBATT_3V3
-
Main power supply 3.3V
Power
AA3
VBATT_3V3
-
Main power supply 3.3V
Power
A3
GND
-
RF Ground
Power
A7
GND
-
RF Ground
Power
A9
GND
-
RF Ground
Power
A13
GND
-
RF Ground
Power
A17
GND
-
RF Ground
Power
B4
GND
-
RF Ground
Power
B6
GND
-
RF Ground
Power
B10
GND
-
RF Ground
Power
B12
GND
-
RF Ground
Power
B14
GND
-
RF Ground
Power
B16
GND
-
RF Ground
Power
C19
GND
-
RF Ground
Power
D18
GND
-
RF Ground
Power
F8
GND
-
Thermal Ground
Power
F12
GND
-
Thermal Ground
Power
F18
GND
-
Thermal Ground
Power
G19
GND
-
Thermal Ground
Power
H6
GND
-
Thermal Ground
Power
H14
GND
-
Thermal Ground
Power
J19
GND
-
Thermal Ground
Power
K18
GND
-
Thermal Ground
Power
M18
GND
-
Thermal Ground
Power
N19
GND
-
Thermal Ground
Power
P6
GND
-
Thermal Ground
Power
P14
GND
-
Thermal Ground
Power
T8
GND
-
Thermal Ground
Power
T12
GND
-
Thermal Ground
Power
U1
GND
-
Power Ground
Power
V2
GND
-
Power Ground
Power
W19
GND
-
Power Ground
Power
Y2
GND
-
Power Ground
Power

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Table 4: SAR ADC Characteristic
Note/Tip:
Reserved Pins must not be connected. Unused pins can be left open.
Y4
GND
-
Power Ground
Power
Debug Port (SWD)
J4
SWD_CLK
SWD_CLK
L4
SWD_DATA
SWD_DATA
Bootstrap pin. LOW for SWD
RESERVED
A1
RESERVED
-
RESERVED
A11
RESERVED
-
RESERVED
A15
RESERVED
-
RESERVED
B2
RESERVED
-
RESERVED
B8
RESERVED
-
RESERVED
E19
RESERVED
-
RESERVED
G1
RESERVED
-
RESERVED
G4
RESERVED
-
RESERVED
G16
RESERVED
-
RESERVED
H2
RESERVED
-
RESERVED
H18
RESERVED
-
RESERVED
J1
RESERVED
-
RESERVED
J16
RESERVED
-
RESERVED
K2
RESERVED
-
RESERVED
L1
RESERVED
-
RESERVED
L19
RESERVED
-
RESERVED
M2
RESERVED
-
RESERVED
N1
RESERVED
-
RESERVED
N4
RESERVED
-
RESERVED
P2
RESERVED
-
RESERVED
P18
RESERVED
-
RESERVED
R1
RESERVED
-
RESERVED
R4
RESERVED
-
RESERVED
R19
RESERVED
-
RESERVED
T2
RESERVED
-
RESERVED
T18
RESERVED
-
RESERVED
V7
RESERVED
-
RESERVED
V9
RESERVED
-
RESERVED
Y12
RESERVED
-
RESERVED
Y14
RESERVED
-
RESERVED
AA11
RESERVED
-
RESERVED
AA13
RESERVED
-
RESERVED

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General Purpose I/O
Module by default has 5 dedicated GPIO’s (IO1 ~ IO5). The remaining GPIO’s are
multiplexed with other interfaces.
Pin
Signal Name
GPIO Number
V11
IO1/I2C_SCL
IO1
V13
IO2/I2C_SDA
IO2
D7
IO3/SD_CMD
IO3
D9
IO4/SD_CLK
IO4
D11
IO5/SD_D0
IO5
D13
SPI_INT/IO6
IO6
Y16
RXD0
IO7
AA15
TXD0
IO8
Y18
CTS0
IO9
AA17
RTS0
IO10
U19
USB_D+
IO11
V18
USB_D-
IO12
Y10
TX_AUX
IO13
AA9
RX_AUX
IO14
AA5
SPI_MOSI
IO15
Y6
SPI_CS
IO16
AA7
SPI_CLK
IO17
Y8
SPI_MISO
IO18
B18
ADC
IO19
R16
DAC
IO20
L16
WAKEUP
IO21
C1
DVI_WA0
IO22
D2
DVI_RX
IO23
E1
DVI_TX
IO24
F2
DVI_CLK
IO25
J4
SWD_CLK
IO26
L4
SWD_DATA
IO27
Table 5: General Purpose I/O
GPIO Number
Alternate Function1- I2C
Alternate Function2 - 1bit mode SDIO
IO1
I2C_SCL (I2C Clock)
SD_CMD (SD Command)
IO2
I2C_SDA (I2C Data)
SD_CLK (SD Clock)
IO3
SD_D0 (SD Data 0)
IO4
I2S_MCLK (I2S MCLK)
IO5
IO6
SPI_INT
Table 6: General Purpose I/O Alternate Function

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SAR ADC Characteristics
Parameter
Condition
Minimum
Typical
Maximum
Unit
Temperature
-40
25
125
C°
Resolution
Bypass mode
12
Bits
Resistor driver
mode
12 Bits
Clock Source
From digital
1000
kHz
DC Offset Error
Cover
VBAT=1.62~3.63V
2 LSB
Table 7: SAR ADC Characteristics
Pad Layout
The Pad layout for both (WE310F5-I and WE310F5-P) versions of the module is the
same, the only difference is the dimension of the module as WE310F5-I has the
onboard antenna.
The following figures show the pad layout:
Figure 5: Telit WE310F5-I Pads Layout Top View

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Figure 6: Telit WE310F5-I PIN Out Legend
Figure 7: Telit WE310F5-P Pads Layout Top View
Figure 8: Telit WE310F5-P PIN Out Legend

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5. POWER SUPPLY
Power Supply Requirements
The WE310F5-I/P can be directly supplied by a 3.3V power supply source capable of at
least 500mA or higher. The voltage supply to all the required parts of the chipset is
provided by an embedded switching regulator.
Power Supply
Minimum
Typical
Maximum
Main Power ratings
3.0 V
3.3V
3.6 V
Table 8: Power Supply Requirements
Logic Levels
Levels with VIO = 3.3V
Min
VIH Input high level
2.0V
VIL Input low level
-
VOH Output high level
2.4V
VOL Output low level
-
IT+ Schmitt-trigger High Level
1.78V
IT- Schmitt-trigger Low Level
1.36V
ILL input-Leakage Current
-10A
Levels with VIO = 3.3V
Min
VIH Input high level
2.0V
VIL Input low level
-
VOH Output high level
2.4V
Table 9: Logic Levels
Power Up and Shutdown Sequences
Module power up and shutdown sequences are shown below:
Figure 3: Power On Sequence
Figure 4: Shutdown Sequence
Symbol
Parameter
Min
Typical
Max
Unit
TPRDY
VDD_IO ready time
0.6
0.6
1
ms
VRST
Shutdown occurs after ON* lower than
this voltage
0 0 0.5*VBAT
T_3V3
V
TRST
The required time when ON* is lower
than VRST
10 10 - µs
Table 10: Timing Specification of -Power up/shutdown sequence

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Average power consumption
The table below shows the current consumption in different states. These
measurements are obtained from a DC power analyzer.
Power Consumption
Typical Average (mA)
Standby
0.003
Idle (Radio OFF, UART ON)
14.3
Deep Sleep (Radio OFF) (no Wi-Fi Association)
0.04
Deep Sleep (Radio ON) (with Wi-Fi Association)
1.43
DTIM=1
1.01
DTIM=3
0.597
DTIM=10
0.203
BLE RX (peak current, connected to BT NW)
53
BLE TX (at 8dBm Tx @1Mbps)
109
Wi-Fi RX (continuous)
58
Table 11: Module power consumption in different states
WLAN Continuous Tx power consumption
The table below shows the current consumed by the module at different WLAN data
rates. These measurements are obtained from a DC power analyzer.
Wi-Fi 2G4 / CH 6
Standard 802.11x
Modulation
Data Rates
WE310F5-P
RF Output (dBm)
Current
[email protected]
b
BPSK
1 Mbps
15.7
265
QPSK
2 Mbps
15.7
261
CCK
5.5 Mbps
15.7
256
CCK
11 Mbps
15.7
248
g
BPSK
6 Mbps
15.7
245
BPSK
9 Mbps
14.7
239
QPSK
12 Mbps
14.7
225
QPSK
18 Mbps
14.2
212
16 QAM
24 Mbps
14.2
205
16 QAM
36 Mbps
13.7
185
64 QAM
48 Mbps
13.7
177
64 QAM
54 Mbps
13.7
173
n
BPSK
MCS0_20
14.7
231
QPSK
MCS1_20
13.7
209
QPSK
MCS2_20
13.7
201
16 QAM
MCS3_20
13.2
191
16 QAM
MCS4_20
13.2
181
64 QAM
MCS5_20
12.7
169
64 QAM
MCS6_20
12.7
165
64 QAM
MCS7_20
12.7
163
BPSK
MCS0_40
13.7
209

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QPSK
MCS1_40
12.7
188
QPSK
MCS2_40
12.7
178
16QAM
MCS3_40
12.2
167
16QAM
MCS4_40
12.2
155
64QAM
MCS5_40
11.7
146
64QUAM MCS6_40 11.7 142
64QAM
MCS7_40
11.7
139
Table 12: WLAN Continuous Tx Power consumption
Danger:
The equipment must be
supplied by an external limited power
source in compliance with clause 2.5 of the standard EN 60950-1.

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6. RF SPECIFICATION
Wi-Fi Tx Power
The Wi-Fi Transmit power at RF pad at 25 °C @3.3V. To measure WE310F5-P power,
remove the antenna and connect a pigtail to the RF pad.
Wi-Fi 2G4 / CH 6
Standard 802.11x
Modulation
Data Rates
WE310F5-I
RF Output (dBm)
WE310F5-P
RF Output (dBm)
b
BPSK
1 Mbps
18.0
15.7
QPSK
2 Mbps
18.0
15.7
CCK
5.5 Mbps
18.0
15.7
CCK
11 Mbps
18.0
15.7
g
BPSK
6 Mbps
18.0
15.7
BPSK
9 Mbps
17.0
14.7
QPSK
12 Mbps
17.0
14.7
QPSK
18 Mbps
16.5
14.2
16 QAM
24 Mbps
16.5
14.2
16 QAM
36 Mbps
16.0
13.7
64 QAM
48 Mbps
16.0
13.7
64 QAM
54 Mbps
16.0
13.7
n
BPSK
MCS0_20
17.0
14.7
QPSK
MCS1_20
16.0
13.7
QPSK
MCS2_20
16.0
13.7
16 QAM
MCS3_20
15.5
13.2
16 QAM
MCS4_20
15.5
13.2
64 QAM
MCS5_20
15.0
12.7
64 QAM
MCS6_20
15.0
12.7
64 QAM
MCS7_20
15.0
12.7
BPSK
MCS0_40
16.0
13.7
n
QPSK
MCS1_40
15.0
12.7
QPSK
MCS2_40
15.0
12.7
16 QAM
MCS3_40
14.5
12.2
16 QAM
MCS4_40
14.5
12.2
64 QAM
MCS5_40
14.0
11.7
64 QAM
MCS6_40
14.0
11.7
64 QAM
MCS7_40
14.0
11.7
Table 13: Wi-Fi Tx Power
Wi-Fi Rx Sensitivity
Wi-Fi Rx sensitivity at RF pad @ 25 °C.
Wi-Fi 2G4 / CH 6
Standard 802.11x
Modulation
Data Rates
Sensitivity (dBm)
b
BPSK
1 Mbps
-97
QPSK
2 Mbps
-93
CCK
5.5 Mbps
-92