Telit Wireless Solutions ZE51-2.4 User manual

ZE51/61-2.4 RF Module User Guide
1VV0300868 Rev.4 – 23/06/2011

ZE51/61-2.4 RF module User Guide
1VV0300868 Rev.4 – 23/06/2011
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 2 of 54
This document is related to the following product :

ZE51/61-2.4 RF Module User Guide
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DISCLAIMER
The information contained in this document is the proprietary information of Telit Communications S.p.A.
and its affiliates (“TELIT”). The contents are confidential and any disclosure to persons other than the
officers, employees, agents or subcontractors of the owner or licensee of this document, without the prior
written consent of Telit, is strictly prohibited.
Telit makes every effort to ensure the quality of the information it makes available. Notwithstanding the
foregoing, Telit does not make any warranty as to the information contained herein, and does not accept
any liability for any injury, loss or damage of any kind incurred by use of or reliance upon the information.
Telit disclaims any and all responsibility for the application of the devices characterized in this document,
and notes that the application of the device must comply with the safety standards of the applicable
country, and where applicable, with the relevant wiring rules.
Telit reserves the right to make modifications, additions and deletions to this document due to
typographical errors, inaccurate information, or improvements to programs and/or equipment at any time
and without notice. Such changes will, nevertheless be incorporated into new editions of this document.
Copyright: Transmittal, reproduction, dissemination and/or editing of this document as well as utilization
of its contents and communication thereof to others without express authorization are prohibited.
Offenders will be held liable for payment of damages. All rights are reserved.
© Copyright Telit RF Technologies 2011.

ZE51/61-2.4 RF module User Guide
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CONTENTS
CHAPTER I. INTRODUCTION...................................................................................................................6
I.1. AIM OF THE DOCUMENT.................................................................................................................................................................................... 6
I.2. CONTACT INFORMATION,SUPPORT .................................................................................................................................................................. 6
I.3. REFERENCE DOCUMENTS................................................................................................................................................................................. 7
I.4. DOCUMENT CHANGE LOG ................................................................................................................................................................................. 7
I.5. GLOSSARY ...................................................................................................................................................................................................... 8
CHAPTER II. REQUIREMENTS ................................................................................................................9
II.1. REGULATIONS REQUIREMENTS........................................................................................................................................................................ 9
II.2. FUNCTIONAL REQUIREMENTS........................................................................................................................................................................ 12
II.3. SOFTWARE .................................................................................................................................................................................................. 12
II.4. TEMPERATURE REQUIREMENTS .................................................................................................................................................................... 13
CHAPTER III. GENERAL CHARACTERISTICS ......................................................................................14
III.1. MECHANICAL CHARACTERISTICS ................................................................................................................................................................. 14
III.2. MECHANICAL DIMENSIONS........................................................................................................................................................................... 15
III.3. DC CHARACTERISTICS................................................................................................................................................................................ 16
III.4. FUNCTIONAL CHARACTERISTICS .................................................................................................................................................................. 17
III.5. DIGITAL CHARACTERISTICS ......................................................................................................................................................................... 20
III.6. ABSOLUTE MAXIMUM RATINGS .................................................................................................................................................................... 21
III.7. ORDERING INFORMATION ............................................................................................................................................................................ 22
CHAPTER IV. TECHNICAL DESCRIPTION ............................................................................................23
IV.1. PIN-OUT OF THE SMD MODULE.................................................................................................................................................................... 23
IV.2. DIP MODULE MECHANICAL DIMENSIONS AND PIN-OUT ................................................................................................................................... 25
IV.3. PIN-OUT CORRESPONDENCE TABLE.............................................................................................................................................................. 26
IV.4. DESCRIPTION OF THE SIGNALS..................................................................................................................................................................... 27
CHAPTER V. PROCESS INFORMATION ...............................................................................................28
V.1. DELIVERY ..................................................................................................................................................................................................... 28
V.2. STORAGE ..................................................................................................................................................................................................... 29
V.3. SOLDERING PAD PATTERN ............................................................................................................................................................................. 29
V.4. SOLDER PASTE COMPOSITION (ROHS PROCESS) ........................................................................................................................................... 31
V.5. PLACEMENT.................................................................................................................................................................................................. 31
V.6. SOLDERING PROFILE (ROHS PROCESS)......................................................................................................................................................... 32
CHAPTER VI. BOARD MOUNTING RECOMMENDATION..................................................................... 34
VI.1. ELECTRICAL ENVIRONMENT.......................................................................................................................................................................... 34

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VI.2. POWER SUPPLY DECOUPLING ON ZE51/61-2.4 MODULE ............................................................................................................................... 35
VI.3. RF LAYOUT CONSIDERATIONS ...................................................................................................................................................................... 36
VI.4. ANTENNA CONNECTION ON PRINTED CIRCUIT BOARDS ................................................................................................................................. 37
VI.5. ZE51/61-2.4 INTERFACING : ........................................................................................................................................................................ 38
CHAPTER VII. ANTENNA CONSIDERATIONS....................................................................................... 41
VII.1. ANTENNA RECOMMENDATIONS ................................................................................................................................................................... 41
VII.2. ANTENNA MATCHING .................................................................................................................................................................................. 42
VII.3. ANTENNA TYPES ........................................................................................................................................................................................ 43
VII.4. EXTERNAL ANTENNA .................................................................................................................................................................................. 43
VII.5. EMBEDDABLE ANTENNAS............................................................................................................................................................................ 45
CHAPTER VIII. ANNEXES.......................................................................................................................48
VIII.1. DECLARATION OF CONFORMITY ................................................................................................................................................................ 48
VIII.2. CONFORMITY ASSESSMENT ISSUES FCC/IC.............................................................................................................................................. 52
VIII.3. EXAMPLES OF PROPAGATION ATTENUATION............................................................................................................................................... 53
VIII.4. OUTPUT POWER PROGRAMMING................................................................................................................................................................ 54

ZE51/61-2.4 RF module User Guide
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CHAPTER I. INTRODUCTION
I.1. Aim of the Document
The aim of this document is to present the features and the application of the ZE51/61-2.4 radio module. After the
introduction, the characteristics of the ZE51/61-2.4 radio module will be described within the following distinct
chapters:
-Requirements
-General Characteristics
-Technical description
-Process information
-Board Mounting Recommendations
-Antenna Considerations
I.2. Contact Information, Support
For general contact, technical support, to report documentation errors and to order manuals, contact Telit Technical
Support Center (TTSC) at:
[email protected]
[email protected]
[email protected]
[email protected]
Alternatively, use:
http://www.telit.com/en/products/technical-support-center/contact.php
For detailed information about where you can buy the Telit modules or for recommendations on accessories and
components visit:
http://www.telit.com
To register for product news and announcements or for product questions contact Telit Technical Support Center
(TTSC).
Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for
improvements. Telit appreciates feedback from the users of our information.

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I.3. Reference documents
[1] IEEE Std. 802.15.4-2006 Wireless MAC and PHY Specifications for Low Rate - WPANs
[2] ERC Rec 70-03 ERC Recommendation for SRD, October 2010
[3] EN 300 328-1 V1.7.1 (Europe) ETSI Standards for SRD , October 2006
[4] EN 300 440-1 V1.6.1 (Europe) ETSI Standards for SRD , August 2010
[5] 2002/95/EC Directive of the European Parliament and of the Council, 27 January
2003
[6] CFR47 Part 15 (US) FCC Standards for SRD
[7] ARIB STD-T66 (Japan) ARIB Standards for SRD
[8] Z-One Pro Protocol Stack User
Guide
1vv0300902
[9] 2006/771/EC Harmonization of the radio spectrum for use by short-range devices
[10] 2009/381/EC Amending Decision 2006/771/EC on harmonization of the radio
spectrum for use by short-range devices
[11] SR Manager Tool User Guide 1vv0300899
[12] ZigBee PRO Democase Getting
Started 1vv0300901
[13] ZigBee PRO Democase Use
r
Guide 1vv0300900
I.4. Document change log
R
Re ev vi is si io on n D Da at te e C Ch ha an n
g
ge es s
ISSUE # 0 11/05/10 First Release
ISSUE # 1 28/07/10 Added ZE61-2.4
ISSUE # 2 04/02/11 Updated regulation requirements and schematics in VI.5
ISSUE # 3 14/03/11 Added link for ZE51 USB dongle drivers, info regarding CC debugger.
Added in Annex paragraph regarding Conformity Assessment Issues
FCC/IC and Declaration of conformity
ISSUE # 4 23/05/11 Added text regarding Conformity Assessment Issues FCC/IC and
FCC/IC Certification
Update of Reference documents, DC characteristics, Functional
characteristics, Absolute maximum ratings, DIP module mechanical
dimensions and pin-out labels, Correspondence table and Antenna
matching
A
dded ZE61-2.4/DIP board radiation pattern

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I.5. Glossary
ARIB Association of Radio Industries and Businesses
BER Bit Error Rate
Bits/s Bits per second
(
1000 bits/s = 1Kbps = 1Kbaud
)
CEPT European Conference of Postal and Telecommunications Administrations
CFR Code of Federal Regulations
Chips Chip or chip sequence refers to a spreading-code used to transform the original
data to DSSS
CW Continuous Wave
dBm Power level in decibel milliwatt
(
10 lo
g
(
P/1mW
))
DSSS Direct Sequence Spread Spectrum
EIRP Effective Isotropic Radiated Power
EMC Electro Ma
g
netic Compatibilit
y
EPROM Electrical Programmable Read Only Memory
ERC European Radiocommunications Committee
ETR ETSI Technical Report
ETSI European Telecommunication Standard Institute
FCC Federal Communications Commission
IEEE Institute of Electrical and Electronics Engineers
ISM Industrial, Scientific and Medical
KB 1024 bytes (1 byte = 8 bits)
K
bps kilobits/s
LBT Listen Before Talk
LNA Low Noise Amplifier
MAC Medium Access Control
MHz Mega Hertz (1 MHz = 1000 kHz)
Mchip/s Mega chips per second (A measure of the speed with which chips are generated
in DSSS)
PCB Printed Circuit Board
PROM Programmable Read Only Memory
PER Packet Error Rate
PHY Physical Layer
NRZ Non return to Zero
RF Radio Frequency
RoHS Restriction of Hazardous Substances
RSSI Receive Strength Signal Indicator
Rx Reception
SRAM Static Random Access Memory
SRD Short Range Device
SMD Surface Mounted Device
Tx Transmission
V
ia Metal Hole on a printed circuit board
WPANs Wireless Personal Area Networks

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CHAPTER II. REQUIREMENTS
II.1. Regulations requirements
The ZE51/61-2.4 module is a [1],[2],[6],[7] compliant multi channel radio modem in the 2.4GHz band (unlicensed
frequency band).
Europe Regulation:
The “ERC recommendation 70-03” [2] describes the limits band in the 2.4GHz license free band, in terms of bandwidth,
maximum power, duty cycle, channel spacing and type of application. It gives the following limitations:
Class Frequency
band Maximum radiated power Channel spacing Duty cycle Notes
Annex 1h
(Non-Specific
Short range
Devices)
2400 – 2483.5
MHz 10 mW e.i.r.p.
No channel
spacing
specified
No
restriction
Annex 3a
(Wideband Data
Transmission
systems)
2400 – 2483.5
MHz
100 mW e.i.r.p. and 100
mW/100 kHz e.i.r.p. density
applies when frequency
hopping modulation is used,
10 mW/MHz e.i.r.p. density
applies when other types of
modulation are used.(*)(**)
No channel
spacing
specified.
No
restriction
For wide band
modulations other than
FHSS, the maximum
e.i.r.p. density is limited
to 10 mW/MHz
(*) Compliant to the EU Commission Decision [9], [10]. Techniques to access spectrum and mitigate interference
that provide at least equivalent performance to the techniques described in harmonized standards adopted under
Directive 1999/5/EC must be used.
 
(**) For IEEE802.15.4 DSSS modulation used by ZigBee, the modulated signal is spread over 2MHz. So, the
maximum radiated power is 20mW. The output power must therefore be reduced to approximately +13 dBm in
order to get CE approval. The final output power level will depend on the antenna used.

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Restrictions for non specific SR devices Annex 1h 2400-2483.5MHz:
Country Restriction Reason/Remark
Norway Implemented
This subsection does not apply for the
geographical area within a radius of 20 km
from the centre of N
y
-Ålesund
Russian
Federation Bluetooth
Ukraine Limited implementation e.i.r.p. ≤100 mW
Restrictions for Wideband Data Transmission systems Annex 3a 2400-2483.5MHz:
Country Restriction Reason/Remark
France
Outdoor use limited to 10
mW e.i.r.p. within the
band 2454-2483.5 MHz
Military Radiolocation use. Reforming of
the 2.4 GHz band has been ongoing in
recent years to allow current relaxed
regulation. Full implementation planned
2012
Italy
For private use, a general authorisation is
required if WAS/RLAN’s are used outside
own premises. For public use, a general
authorization is required
Ukraine Limited Implemented
e.i.r.p. ≤100 mW with built-in antenna with
amplification factor up to 6 dBi
Norway Implemented
This subsection does not apply for the
geographical area within a radius of 20 km
from the centre of Ny-Ålesund
Russian
Federation
1. SRD with FHSS modulation
1.1. Maximum 2.5 mW e.i.r.p.
1.2. Maximum 100 mW e.i.r.p. Permitted for
use SRD for outdoor applications without
restriction on installation height only for
purposes of gathering telemetry information for
automated monitoring and resources
accounting systems.
Permitted to use SRD for other purposes for
outdoor applications only when the installation
height is not exceeding 10 m above the ground
surface.
1.3.Maximum 100 mW e.i.r.p. Indoor
applications
2. SRD with DSSS and other than FHSS
wideband modulation
2.1. Maximum mean e.i.r.p. density is 2
mW/MHz. Maximum 100 mW e.i.r.p.
2.2. Maximum mean e.i.r.p. density is 20
mW/MHz. Maximum 100 mW e.i.r.p. Permitted
to use SRD for outdoor applications
only for purposes of gathering telemetry
information for automated monitoring and

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resources accounting systems or
security systems.
2.3. Maximum mean e.i.r.p. density is 10
mW/MHz. Maximum
100 mW e.i.r.p. Indoor applications
For the complete document please refer to [2] and EU Commission Decision [9], [10].
The 2.4 Ghz band is a harmonized band in most of Europe. So the product must be declared in compliance with
the harmonized ETSI standards EN 300 440 (Class 1h) or EN 300 228 (Class 3a).
Finally, the module complies with the new European Directive 2002/95/EC concerning the Restrictive Usage of
Hazardous Substances (RoHS).
USA Regulation:
In the United States the FCC is responsible for the regulation of all RF devices. Our module intended for
unlicensed operation is regulated by CFR 47, Part 15 [6].
The 2.4 GHz band used for unlicensed radio equipment is regulated by section 15.247.
Japan regulation
In Japan the unlicensed use of short range devices in the 2.4 GHz ISM band is regulated by the ARIB standard
STD-T66 [7].

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II.2. Functional Requirements
The ZE51/61-2.4 module is a complete solution from serial interface to RF interface. The ZE51/61-2.4 module has
a digital part and a RF part.
The digital part has the following functionalities:
-Communication interface
-I/O management
-Micro controller with embedded software
The RF part has the following functionalities:
-2.4 GHz IEEE 802.15.4 compliant RF transceiver
-Half Duplex bi-directional link
-RF front-end component with low noise Rx amplification and Tx power amplification (ZE61-2.4 module
only)
II.3. Software
The ZE51/61-2.4 module is provided pre-flashed with Telit in-house ZigBee® PRO stack. Please refer to ZigBee
PRO Protocol Stack User Guide [8] for detail information.
In case the customer needs to develop his own software, different tools are available:
8051 compiler from IAR : http://www.iar.se/website1/1.0.1.0/244/1/
CC debugger: http://focus.ti.com/docs/toolsw/folders/print/cc-debugger.html
The technical support for these tools will be done by the providing company.
All necessary drivers for ZE51-2.4 Usb dongle can be found under the following link:
http://www.ftdichip.com/Drivers/VCP.htm
A complete correspondence table of the connections between the CC2530 and the pin out of the module, as well
as the connections to the included STM M24C64 EEPROM can be found in chapter IV.3.
In case, the customer wants to test the RF performances of the module, Telit can provide its own
proprietary test software that is available in the download zone together with description of all the
functionalities.

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II.4. Temperature Requirements
Minimum Typical Maximum Unit
Operating
Temperature - 40 25 + 85 °C
Relative humidity @ 25°C 20 75 %
Storage
Temperature - 40 25 + 85 °C

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CHAPTER III. GENERAL CHARACTERISTICS
III.1. Mechanical Characteristics
Size : Rectangular 26 x 15 mm
Height : 3 mm
Weight : 1,7 g
PCB thickness: 0.8 mm
Cover : Dimensions : 21 x 14 x 2.2mm
Thickness : 200µm
Components : All SMD components, on one side of the PCB.
Connectors : The terminals allowing conveying I/O signals are half-moons located around.
Mounting : SMD
Half moons on the 4 external sides
Number of pins : 30

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III.2. Mechanical dimensions

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III.3. DC Characteristics
Measured on ZE51/61-2.4/DIP interface with T = 25°C, Vdd = 3V, 50 ohm impedance if nothing else
noted.
Max limits apply over the entire operating range, T=-40°C to +85°C, Vdd=2V to 3.6V and all channels.
Characteristics ZE51 Min. Typ. Max.
Power Supply
(VDD): +2.0V +3.6V
Transmission : 35mA 39mA*
Reception : 26mA 29mA
Stand-by (32.768 khz On) : 2µA 2.7µA
Sleep (wake up on
interruption) : 1µA
I/O low level : GND - 0.9 V
I/O high level : VDD - 0.7V - VDD
Characteristics ZE61 Min. Typ. Max.
Power Supply
(VDD): +2.0V +3.6V
Transmission : 160mA 195mA*
Reception : 31mA 33mA
Stand-by (32.768 khz On) : 2,2µA 2.9µA
Sleep (wake up on
interruption) : 1,5µA
I/O low level : GND - 0.9 V
I/O high level : VDD - 0.7V - VDD
* : Maximum Tx consumption is reached for T= -40°C , Vdd=3.6 Volts and default power register setting. In this
condition, the ZE61 RF output power achieves until 21dBm.

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III.4. Functional characteristics
Measured on ZE51/61-2.4/DIP interface with T = 25°C, Vdd = 3V, 50 ohm impedance if nothing else noted.
Global
Frequency band 2400 - 2483.5 MHz
Channel spacing 5 MHz
Channel number 16 : Channel 11 (2405MHz) Channel 26 (2480MHz)
Technology DSSS
Modulation O-QPSK with half sine pulse shaping
Radio bit rate 250 kbps
Transmit chip rate 2 Mchip/s
Transmission ZE51 Min. Typ. Max.
Output Power +4dBm ± 1 dB on the whole band
(selectable by software )
Harmonics
2nd harmonic
3
rd harmonic
-45 dBm
-59 dBm
Spurious emission
30 - 1000 MHz
1 - 12.75 GHz
1.8 - 1.9 GHz
5.15 - 5.3 GHz
-36 dBm
-30 dBm
-47 dBm
-47 dBm
(Complies with [3], [4],
[6],[7])
Error Vector Magnitude
(EVM) 5% 15%
Transmission ZE61 Min. T
y
p. Max.
Output Power* +19dBm ± 1 dB on the whole band
(selectable by software )
Harmonics
2nd harmonic
3
rd harmonic
-42 dBm
-44 dBm
Spurious emission
30 - 1000 MHz
1 - 12.75 GHz
1.8 - 1.9 GHz
5.15 - 5.3 GHz
-36 dBm
-30 dBm
-47 dBm
-47 dBm

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(Complies with [3], [4],
[6], [7])
Error Vector Magnitude
(EVM) 5% 15%
* : It’s the responsibility of Telit customers to check that RF output power of the final product is compliant with the
local regulation. See the table in chapter VIII.5 which shows the typical output power for different power settings.
Reception ZE51 Min. Typ. Max.
Sensitivity for PER=1% - -96 dBm -97 dBm
Saturation for PER=1% - 10 dBm -
Adjacent channel
rejection +/- 5 MHz
channel spacing
- 49 dB -
Wanted signal @ -82 dBm, adjacent modulated channel @ +/- 5 MHz,
for PER = 1 %.
Alternate channel
rejection +/- 10 MHz
channel spacing
- 54 dB -
Wanted signal @ -82 dBm, adjacent modulated channel @ +/- 10 MHz,
for PER = 1 %.
Blocking/Desensitisation
@ ±5MHz
@ ±10MHz
@±20MHz
@±50MHz
-
-
-
-
- 40 dBm
- 35 dBm
- 38 dBm
- 37 dBm
-
-
-
-
Wanted signal 3 dB above the sensitivity level, CW jammer,
for PER = 1%.
(Measured according to EN 300 440 class 2)
Spurious emission
in 30 MHz - 12.75 GHz - - -47 dBm (Complies with [3], [4],
[6],[7])

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Reception ZE61 Min. Typ. Max.
Sensitivity for PER=1% - -99 dBm -100dBm
Saturation for PER=1% - 0 dBm -
Adjacent channel
rejection +/- 5 MHz
channel spacing
- 49 dB -
Wanted signal @ -82 dBm, adjacent modulated channel @ +/- 5 MHz,
for PER = 1 %.
Alternate channel
rejection +/- 10 MHz
channel spacing
- 54 dB -
Wanted signal @ -82 dBm, adjacent modulated channel @ +/- 10 MHz,
for PER = 1 %.
Blocking/Desensitisation
@ ±5MHz
@ ±10MHz
@±20MHz
@±50MHz
-
-
-
-
- 35 dBm
- 35 dBm
- 33 dBm
- 35 dBm
-
-
-
-
Wanted signal 3 dB above the sensitivity level, CW jammer,
for PER = 1%.
(Measured according to EN 300 440 class 2)
Spurious emission
in 30 MHz - 12.75 GHz - - -47 dBm (Complies with [3], [4],
[6],[7])

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III.5. Digital Characteristics
Microcontroller 8051 core
Microcontroller
Memory 256KB Flash, 8KB SRAM,
Peripheral memory 8 KB EEPROM
Serial link* Managed by application.
Full Duplex, from 1200 to 115200 bps
7 or 8 bits, with or without parity, 1 or 2 stop bits
Protocol Type : RS-232, TTL level
Flow control* Managed by application.
None, Software (Xon/Xoff) or Hardware (RTS/CTS)
Other Ultra low power voltage detector and µC supervisory circuit
Specific signals Serial : Tx, Rx, RTS, CTS
Inputs : Reset, Stand-By, Prog
I/O : 7 I/O (among those 5 analog inputs with 7 to 12 bits resolution)
Flashing Through serial
Through the air : DOTA (Download Over The Air) functionality
Embedded
functionality Point-to-point stack for test purpose available in download zone
ZigBee Pro stack from Telit
*: In ZigBee Democase : 115.200 bps,8 bits, without parity, 1 stop bit, No flow control