Texas Instruments TPA751 MSOP User manual

February 2001 Mixed-Signal Products
TPA751 MSOP
Audio Power Amplifier
Evaluation Module
User’s Guide
SLOU112

IMPORTANT NOTICE
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any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
Customers are responsible for their applications using TI components.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
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intellectual property right of TI covering or relating to any combination, machine, or process in which such
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Mailing Address:
Texas Instruments
Post Office Box 655303
Dallas, Texas 75265
Copyright 2001, Texas Instruments Incorporated

iii
Chapter Title—Attribute Reference
Preface
Related Documentation From Texas Instruments
 TI Plug-N-Play Audio Amplifier Evaluation Platform (literature
number SLOU011) provides detailed information on the evaluation
platform and its use with TI audio evaluation modules.
 TPA751 700-mW Low-Voltage Audio Power Amplifier (literature
number SLOS336) This is the data sheet for the TPA751 audio
amplifier integrated circuit.
FCC Warning
This equipment is intended for use in a laboratory test environment only. It
generates, uses, and can radiate radio frequency energy and has not been
tested for compliance with the limits of computing devices pursuant to subpart
J of part 15 of FCC rules, which are designed to provide reasonable protection
against radio frequency interference. Operation of this equipment in other
environments may cause interference with radio communications, in which
case the user at his own expense will be required to take whatever measures
may be required to correct this interference.

iv

Running Title—Attribute Reference
v
Contents
Contents
1 Introduction 1-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1 Feature Highlights 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Description 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 TPA751 EVM Specifications 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2 Operation 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.1 Precautions 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2 Quick Start List for Platform 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3 Quick Start List for Stand-Alone 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4 Stand-Alone Connection Diagram 2-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.5 Reference 2-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.5.1 TPA751 EVM Schematic Diagram 2-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.5.2 TPA751 MSOP Audio Power Amplifier Evaluation Module Parts List 2-7. . . . . . . .
2.5.4 TPA751 EVM PCB Layers 2-8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figures
1–1 The TI TPA751 Audio Amplifier Evaluation Module 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–1 Quick Start Platform Map 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–2 Quick Start Module Map 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–3 TPA751 EVMs Connected for Stereo BTL Output 2-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–4 TPA751 EVM Schematic Diagram 2-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–5 TPA751 EVM PCB 2-8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–6 TPA751 EVM Bottom Layer 2-8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Tables
2–1. Platform Jumper and Switch Settings for the TPA751 EVM 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–2. TPA751 EVM Parts List 2-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

vi

1-1
Introduction
This chapter provides an overview of the Texas Instruments (TI) TPA751
MSOP Audio Power Amplifier Evaluation Module (SLOP357). It includes a list
of EVM features, a brief description of the module illustrated with a pictorial
diagram, and a list of EVM specifications.
Topic Page
1.1 Feature Highlights 1–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Description 1–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 TPA751 EVM Specifications 1–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chapter 1

Feature Highlights
1-2
Introduction
1.1 Feature Highlights
The TI TPA751 MSOP Audio Power Amplifier Evaluation Module and the TI
Plug-n-Play Audio Amplifier Evaluation Platform include the following
features:
TPA751 low-voltage audio power amplifier evaluation module
Single-channel, bridge-tied load (BTL)
2.5-V and 5.5-V operation
700-mW output power into 8 Ωat 5 V, BTL
Ultra-low current consumption in shutdown mode
Internal thermal and short-circuit protection
Module gain is set at –4 V/V in BTL mode, –2 V/V in SE mode
Quick and Easy Configuration With The TI Plug-N-Play Audio Amplifier
Evaluation Platform
Evaluation module is designed to simply plug into the platform,
automatically making all signal, control, and power connections
Platform provides flexible power options
Jumpers on the platform select power and module control options
Switches on the platform route signals
Platform provides quick and easy audio input and output connections
Platform Power Options
Onboard 9-V battery
External 5-V to 15-V (VCC) supply inputs
External regulated VDD supply input
Socket for on-board 5-V/3.3-V VDD voltage regulator EVM
Onboard overvoltage and reverse polarity power protection
Platform Audio Input and Output Connections
Left and right RCA phono jack inputs
Miniature stereo phone jack input
Left and right RCA phono jack outputs
Left and right compression speaker terminal outputs
Miniature stereo headphone jack output

Description
1-3
Introduction
1.2 Description
The TPA751 MSOP Audio Power Amplifier Evaluation Module is a complete,
low-power single-channel audio power amplifier. It consists of the TI TPA751
700-mW low-voltage audio power amplifier IC in a very small MSOP package,
along with a small number of other parts mounted on a circuit board that is
approximately one and a quarter inches square (see Figure 1–1).
Figure 1–1.The TI TPA751 Audio Amplifier Evaluation Module
OUT+
IN–
IN+
VDD GND
U1 †
Shutdown
R5
OUT–
GND
C4
TEXAS
INSTRUMENTS
SLOP357
TPA751 MSOP EVM
C5
S1
R1 +
R2
C2
C1
R3
R4
C3
†Due to the very small size of the MSOP IC package, the standard part number TPA751 is
replaced with the code TIATC.
Single in-line header pins are mounted to the underside of the module circuit
board. These pins allow the EVM to be plugged into the TI plug-n-play audio
amplifier evaluation platform or to be wired directly into existing circuits and
equipment when used stand-alone.
The platform, with room for a pair of TPA751 evaluation modules, is a
convenient vehicle for demonstrating TI’s audio power amplifier and related
evaluation modules. The EVMs simply plug into the platform, which
automatically provides power to the modules, interconnects them correctly,
and connects them to a versatile array of standard audio input and output jacks
and connectors. Easy-to-use configuration controls allow the platform and
EVMs to quickly model many possible end-equipment configurations.
There is nothing to build, nothing to solder, and nothing but the speakers
included with the platform to hook up.
1.3 TPA751 EVM Specifications
Supply voltage range, VDD 2.5 V to 5.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply current, IDD 450 mA, max. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output power, PO:8-ΩBTL, VDD = 5 V 700 mW. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Audio input voltage, VI2 Vpp, max. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Minimum load impedance, RL8 Ω. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1-4
Introduction