Texas Instruments TPA751 MSOP User manual

February 2001 Mixed-Signal Products
TPA751 MSOP
Audio Power Amplifier
Evaluation Module
User’s Guide
SLOU112

IMPORTANT NOTICE
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
Customers are responsible for their applications using TI components.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Mailing Address:
Texas Instruments
Post Office Box 655303
Dallas, Texas 75265
Copyright 2001, Texas Instruments Incorporated

iii
Chapter Title—Attribute Reference
Preface
Related Documentation From Texas Instruments
 TI Plug-N-Play Audio Amplifier Evaluation Platform (literature
number SLOU011) provides detailed information on the evaluation
platform and its use with TI audio evaluation modules.
 TPA751 700-mW Low-Voltage Audio Power Amplifier (literature
number SLOS336) This is the data sheet for the TPA751 audio
amplifier integrated circuit.
FCC Warning
This equipment is intended for use in a laboratory test environment only. It
generates, uses, and can radiate radio frequency energy and has not been
tested for compliance with the limits of computing devices pursuant to subpart
J of part 15 of FCC rules, which are designed to provide reasonable protection
against radio frequency interference. Operation of this equipment in other
environments may cause interference with radio communications, in which
case the user at his own expense will be required to take whatever measures
may be required to correct this interference.

iv

Running Title—Attribute Reference
v
Contents
Contents
1 Introduction 1-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1 Feature Highlights 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Description 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 TPA751 EVM Specifications 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2 Operation 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.1 Precautions 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2 Quick Start List for Platform 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3 Quick Start List for Stand-Alone 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4 Stand-Alone Connection Diagram 2-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.5 Reference 2-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.5.1 TPA751 EVM Schematic Diagram 2-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.5.2 TPA751 MSOP Audio Power Amplifier Evaluation Module Parts List 2-7. . . . . . . .
2.5.4 TPA751 EVM PCB Layers 2-8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figures
1–1 The TI TPA751 Audio Amplifier Evaluation Module 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–1 Quick Start Platform Map 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–2 Quick Start Module Map 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–3 TPA751 EVMs Connected for Stereo BTL Output 2-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–4 TPA751 EVM Schematic Diagram 2-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–5 TPA751 EVM PCB 2-8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–6 TPA751 EVM Bottom Layer 2-8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Tables
2–1. Platform Jumper and Switch Settings for the TPA751 EVM 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–2. TPA751 EVM Parts List 2-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

vi

1-1
Introduction
This chapter provides an overview of the Texas Instruments (TI) TPA751
MSOP Audio Power Amplifier Evaluation Module (SLOP357). It includes a list
of EVM features, a brief description of the module illustrated with a pictorial
diagram, and a list of EVM specifications.
Topic Page
1.1 Feature Highlights 1–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Description 1–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 TPA751 EVM Specifications 1–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chapter 1

Feature Highlights
1-2
Introduction
1.1 Feature Highlights
The TI TPA751 MSOP Audio Power Amplifier Evaluation Module and the TI
Plug-n-Play Audio Amplifier Evaluation Platform include the following
features:
TPA751 low-voltage audio power amplifier evaluation module
Single-channel, bridge-tied load (BTL)
2.5-V and 5.5-V operation
700-mW output power into 8 Ωat 5 V, BTL
Ultra-low current consumption in shutdown mode
Internal thermal and short-circuit protection
Module gain is set at –4 V/V in BTL mode, –2 V/V in SE mode
Quick and Easy Configuration With The TI Plug-N-Play Audio Amplifier
Evaluation Platform
Evaluation module is designed to simply plug into the platform,
automatically making all signal, control, and power connections
Platform provides flexible power options
Jumpers on the platform select power and module control options
Switches on the platform route signals
Platform provides quick and easy audio input and output connections
Platform Power Options
Onboard 9-V battery
External 5-V to 15-V (VCC) supply inputs
External regulated VDD supply input
Socket for on-board 5-V/3.3-V VDD voltage regulator EVM
Onboard overvoltage and reverse polarity power protection
Platform Audio Input and Output Connections
Left and right RCA phono jack inputs
Miniature stereo phone jack input
Left and right RCA phono jack outputs
Left and right compression speaker terminal outputs
Miniature stereo headphone jack output

Description
1-3
Introduction
1.2 Description
The TPA751 MSOP Audio Power Amplifier Evaluation Module is a complete,
low-power single-channel audio power amplifier. It consists of the TI TPA751
700-mW low-voltage audio power amplifier IC in a very small MSOP package,
along with a small number of other parts mounted on a circuit board that is
approximately one and a quarter inches square (see Figure 1–1).
Figure 1–1.The TI TPA751 Audio Amplifier Evaluation Module
OUT+
IN–
IN+
VDD GND
U1 †
Shutdown
R5
OUT–
GND
C4
TEXAS
INSTRUMENTS
SLOP357
TPA751 MSOP EVM
C5
S1
R1 +
R2
C2
C1
R3
R4
C3
†Due to the very small size of the MSOP IC package, the standard part number TPA751 is
replaced with the code TIATC.
Single in-line header pins are mounted to the underside of the module circuit
board. These pins allow the EVM to be plugged into the TI plug-n-play audio
amplifier evaluation platform or to be wired directly into existing circuits and
equipment when used stand-alone.
The platform, with room for a pair of TPA751 evaluation modules, is a
convenient vehicle for demonstrating TI’s audio power amplifier and related
evaluation modules. The EVMs simply plug into the platform, which
automatically provides power to the modules, interconnects them correctly,
and connects them to a versatile array of standard audio input and output jacks
and connectors. Easy-to-use configuration controls allow the platform and
EVMs to quickly model many possible end-equipment configurations.
There is nothing to build, nothing to solder, and nothing but the speakers
included with the platform to hook up.
1.3 TPA751 EVM Specifications
Supply voltage range, VDD 2.5 V to 5.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply current, IDD 450 mA, max. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output power, PO:8-ΩBTL, VDD = 5 V 700 mW. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Audio input voltage, VI2 Vpp, max. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Minimum load impedance, RL8 Ω. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1-4
Introduction

2-1
Operation
Operation
Quick start lists in this chapter contain steps that can be followed to quickly
prepare the TI plug-n-play audio amplifier evaluation platform for use with the
TPA751 MSOP Audio Power Amplifier Evaluation Module, or to connect
the TPA751 EVM for stand-alone operation.
Using the TPA751 EVM with the TI evaluation platform is a quick and easy way
to connect power, signal and control inputs, and signal outputs to the EVM,
using standard connectors.
The TPA751 EVM can also be used stand-alone by making connections
directly to the module pins, and it can be wired directly into existing circuits or
equipment. A stand-alone connection diagram appears below.
A schematic, parts list, and PCB and layer illustrations for the EVM are
included in the Reference section of this chapter.
Topic Page
2.1 Precautions 2–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2 Quick Start List for Platform 2–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3 Quick Start List for Stand-Alone 2–4. . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4 Stand-Alone Connection Diagram 2–5. . . . . . . . . . . . . . . . . . . . . . . . . . .
2.5 Reference 2–6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chapter 2

Precautions
2-2
Operation
2.1 Precautions
Power Supply Input Polarity and Maximum Voltage
Always ensure that the polarity and voltage of the external power
connected to VCC power input connector J1, J2, and/or VDD power
input connector J6 are correct. Overvoltage or reverse-polarity
power applied to these terminals can open onboard soldered-in
fuses and cause other damage to the platform, installed evaluation
modules, and/or the power source.
Inserting or Removing EVM Boards
Do not insert or remove EVM boards with power applied – damage
to the EVM board, the platform, or both may result.
Figure 2–1. Quick Start Platform Map
Signal Conditioning
****CAUTION****
Do not insert or remove
EVM boards with power
applied
ICC
JP4
F1
VR1
R1
JP3
JP2 JP1 AC/DC
(J2)
VCC(J1)
D1 D2 D3
D4 J2
J3 J4 J5
AC/DC
In
VCC
In
+
J1
DC
SOURCE
LED1 VCC
LED2 VDD
R2
JP5 IDD
B1
U6
POWER
SUPPLY
U3 U4
U5
U1
U2
Audio
Power
Amps
OnOff Conditioning
S2
J7 J8 Right
Out Left
Out
+– +–
JP6
Mode
Mute
Spk(U2-U4)
JP8
J9 Left
Out
JP7
S3 HP Source
U2-U4
U5
Polarity
Lo
Hi
HP(U5)
C3 C2
++
R3
R5
J10
Stereo
HP Out
TP1
GND
Plug-N-Play Audio Amplifier
Evaluation Platform
SLOP097 Rev. C.1
Stereo
In
Right
In Left
In
J6 In/Out VDD
F2
VR2 +
DC
Power
In/Out
Speaker
Output
Headphone
Output
Audio
Input
Power
Input
Batt
C1+
Right
Out
On Off Pwr
S1
TEXAS INSTRUMENTS 1997
R4
6a
1
23
6b
6b
6b 6b
89
10
4
5

Quick Start List for Platform
2-3
Operation
2.2 Quick Start List for Platform
Follow these steps when using the TPA751 EVM with the TI Plug-N-Play Audio
Amplifier Evaluation Platform (see the platform user’s guide, SLOU011, for
additional details). Typical EVM settings are shown in Table 2–1. Numbered
callouts for selected steps are shown in Figure 2–1.
Platform preparations
1) Ensure that all external power sources are set to off and that the platform
power switch S1 is set to off.
2) Install a TPA751 MSOP module in platform sockets U3 and U4 for stereo
operation (or a module in either U3 or U4 for single channel operation),
taking care to align the module pins correctly.
3) Use switch S2 to select or bypass the signal conditioning EVM (U1).
4) Set control signal Polarity jumper JP8 to Hi.
5) Set jumper JP6 to select the Mute control input (causes the TPA751 to
shutdown if a plug is inserted into platform headphone jack J10).
Table 2–1. Platform Jumper and Switch Settings for the TPA751 EVM
EVM JP6 JP7 JP8 S2 S3
TPA751 Mute X Hi See Note 2 X
Notes: 1) X = Don’t care
2) Set S2 to ON when signal conditioning board is installed in U1; set S2 to OFF when
no signal conditioning board is installed.
Power supply
6) Select and connect the power supply:
a) Connect an external regulated power supply set to a voltage between
2.5 V and 5.5 V to platform VDD power input connector J6, taking care
to observe marked polarity, or
b) Install a voltage regulator EVM (SLVP097 or equiv.) in platform socket
U6. Install a 9-V battery in B1 or connect a 7 V – 12 V power source
to a platform VCC power input J1 or J2 and jumper the appropriate
power input (see platform user’s guide).
Inputs and outputs
7) Ensure that signal source level is set to minimum.
8) Connect the audio source to left and right RCA phono jacks J3 and J5 or
stereo miniature phone jack J4.
9) Connect 8-Ω–32-Ωspeakers to left and right RCA jacks J7 and J9 or to
stripped wire connectors J8.
Power-up
10) Verify correct voltage and input polarity and set the external power supply
to ON. If VCC and an on-board regulator EVM are used to provide VDD, set
platform power switch S1 to on.
Platform LED2 lights indicating the presence of VDD, and the evaluation
modules installed on the platform begin operation.
11) Adjust the signal source level as needed.

Quick Start List for Stand-Alone
2-4
Operation
2.3 Quick Start List for Stand-Alone
Follow these steps to use the TPA751 EVM stand-alone or when connecting
it into existing circuits or equipment. Connections to the TPA751 module
header pins can be made via individual sockets, wire-wrapping, or soldering
to the pins, either on the top or the bottom of the module circuit board.
Numbered callouts for selected steps are shown in Figure 2–2.
Figure 2–2. Quick Start Module Map
5
2
6
4
OUT+
IN–
IN+
VDD GND
U1 †
Shutdown
R5
OUT–
GND
C4
TEXAS
INSTRUMENTS
SLOP357
TPA751 MSOP EVM
C5
S1
R1 +
R2
C2
C1
R3
R4
C3
†Due to the very small size of the MSOP IC package, the standard part number TPA751 is
replaced with the code TIATC.
Power supply
1) Ensure that all external power sources are set to off .
2) Connect an external regulated power supply set to 5 V to the module VDD
and GND pins, taking care to observe marked polarity.
Inputs and outputs
3) Ensure that the signal source level is set to minimum.
4) Connect the audio source to the module IN– and IN+ pins, taking care to
observe marked polarity.
5) Connect the shutdown (S1) pin to GND through a normally open switch.
6) Connect an 8-Ω–32-Ωspeaker to the module OUT+ and OUT– pins.
Power-up
7) Verify correct voltage and input polarity and set the external power supply
to on
.
The EVM should begin operation.
8) Adjust the signal source level as needed.

Stand-Alone Connection Diagram
2-5
Operation
2.4 Stand-Alone Connection Diagram
The power supply range is 2.5 V to 5.5 V and isolated OUT+ and OUT– lines
for BTL operation are required.
Note that the source of any shutdown signal applied to the EVM SHUTDOWN
pin must be able to sink the current flowing through the pullup resistor on the
module (20 kΩ) when the pin is held low.
Figure 2–3 shows a TPA751 EVM connected for stereo BTL operation.
Figure 2–3.TPA751 EVMs Connected for Stereo BTL Output
Audio Input
(Left)
External Mute
Control
(active low)
5 VDC
Audio Input
(Right)
5 VDC GND
OUT+
IN–
IN+
VDD GND
U1 †
Shutdown
R5
OUT–
GND
C4
TEXAS
INSTRUMENTS
SLOP357
TPA751 MSOP EVM
C5
S1
R1 +
R2
C2
C1
R3
R4
C3
OUT+
IN–
IN+
VDD GND
U1 †
Shutdown
R5
OUT–
GND
C4
TEXAS
INSTRUMENTS
SLOP357
TPA751 MSOP EVM
C5
S1
R1 +
R2
C2
C1
R3
R4
C3
Right
Left
†Due to the very small size of the MSOP IC package, the standard part number TPA751 is replaced with the code TIATC.

Reference
2-6
Operation
2.5 Reference
This section includes the TPA751 EVM schematic, the EVM parts list, and the
module PCB layers.
2.5.1 TPA751 EVM Schematic Diagram
Figure 2–4 shows the TPA751 EVM schematic.
Figure 2–4.TPA751 EVM Schematic Diagram
C1
1 µF
C3
1 µF
R1 20 kΩ
IN–
Shutdown
S1 OUT–
GND
OUT+
R5
39 kΩ
R4
20 kΩ
NO
C4
10 µF
C5
1 µF
Shutdown
Bypass
In+
In–
VO–
GND
VDD
VO+
8
7
6
5
1
2
3
4
GND
VDD
2.5 V to 5.5 V
+
C2
1 µF
IN+ R3
20 kΩ
R2
39 kΩ
TIATC
TPA751

Reference
2-7
Operation
2.5.2 TPA751 MSOP Audio Power Amplifier Evaluation Module Parts List
Table 2–2 shows the TPA751 EVM parts list.
Table 2–2.TPA751 EVM Parts List
Reference Description Size EVM
Qty. Manufacturer/ Part Number Vendor Number
C4 Capacitor, 10 µF, 6.3 V A 1 Panasonic
ECS-TOJY106R Digi-Key PCS1106CT-ND
C1, C2,
C3, C5 Capacitor, 1 µF, 80%/–20%, nonpolarized 0603 4 Murata GRM39-Y5V105Z10PT Newark
R1, R3, R4 Resistor, 20 kΩ, 1/16 W, 5% 0603 3 Panasonic
ERJ-3GSYJ203 Digi-Key P20KGCT-ND
R2, R5 Resistor, 39 kΩ, 1/16 W, 5% 0603 2 Panasonic
ERJ-3GSYJ393 Digi-Key P39KGCT-ND
S1 Switch, momentary 1 Panasonic
P8048SCT-ND Digi-Key P8048SCT-ND
Terminal Post Headers 9 Sullins
PTC36SABN Digi-Key S1022-36-ND
U1 IC, TPA751DGN†, audio
amplifier, 700 mW, mono MSOP-8 1 TI TPA751DGN
PCB1 PCB, TPA751 MSOP EVM 1
†Due to the very small size of the MSOP IC package, the standard part number TPA751 is replaced with the code TIATC.
Note: All items are SMD except as noted.

TPA751 EVM PCB Layers
2-8
Operation
2.5.3 TPA751 EVM PCB Layers
The following illustrations depict the TPA751 EVM PCB layers and silkscreen.
These drawings are not to scale. Gerber plots can be obtained from any TI
sales office.
Figure 2–5.TPA751 EVM PCB
Figure 2–6.TPA751 EVM Bottom Layer

IMPORTANT NOTICE
TexasInstrumentsanditssubsidiaries(TI)reservetherighttomakechangestotheirproductsortodiscontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its products to the specifications applicable at the time of sale in accordance with
TI’sstandardwarranty.TestingandotherqualitycontroltechniquesareutilizedtotheextentTIdeemsnecessary
to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except
those mandated by government requirements.
Customers are responsible for their applications using TI components.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TIassumesnoliabilityforapplicationsassistanceorcustomer product design. TI does not warrant or represent
thatanylicense, eitherexpressorimplied,isgrantedunderanypatentright,copyright,maskworkright,orother
intellectual property right of TI covering or relating to any combination, machine, or process in which such
products or services might be or are used. TI’s publication of information regarding any third party’s products
or services does not constitute TI’s approval, license, warranty or endorsement thereof.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alterationandisaccompaniedbyallassociatedwarranties,conditions,limitationsand notices. Representation
or reproduction of this information with alteration voids all warranties provided for an associated TI product or
service, is an unfair and deceptive business practice, and TI is not responsible nor liable for any such use.
Resale of TI’s products or services with statements different from or beyond the parameters stated by TI for
that product or service voids all express and any implied warranties for the associated TI product or service,
is an unfair and deceptive business practice, and TI is not responsible nor liable for any such use.
Also see: Standard Terms and Conditions of Sale for Semiconductor Products. www.ti.com/sc/docs/stdterms.htm
Mailing Address:
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Korea 080-551-2804 -
Malaysia 1-800-800-011 -800-800-1450
New Zealand 000-911 -800-800-1450
Philippines 105-11 -800-800-1450
Singapore 800-0111-111 -800-800-1450
Taiwan 080-006800 -
Thailand 0019-991-1111 -800-800-1450
Fax [phone]
Email [email protected]
Internet www.ti.com/sc/apic
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Printed in the USA
A121400