Texas Instruments TDP158RSBEVM User manual

1
SLLU257A–February 2017–Revised February 2018
Submit Documentation Feedback Copyright © 2017–2018, Texas Instruments Incorporated
TDP158 RSB Evaluation Module
User's Guide
SLLU257A–February 2017–Revised February 2018
TDP158 RSB Evaluation Module
This document describes how to use and configure the TDP158RSBEVM and provides recommendations
for system hardware implementation. These recommendations are only guidelines and it is the designer’s
responsibility to consider all system characteristics and requirements. Refer to the TDP158 data sheet
(SLLSEX2) for technical details such as device operation, terminal description, and so forth.
Contents
1 Overview...................................................................................................................... 2
1.1 What is the TDP158? .............................................................................................. 2
1.2 What is the TDP158 EVM?........................................................................................ 2
2 Hardware Description ....................................................................................................... 3
2.1 Video Connectors for TDP158 Ports............................................................................. 3
2.2 Local I2C Access.................................................................................................... 3
2.3 Enable and Reset................................................................................................... 4
2.4 Power................................................................................................................. 4
2.5 Jumper Configuration .............................................................................................. 5
2.6 Component Population Configuration............................................................................ 5
2.7 USB Interface via TUSB3410 .................................................................................... 6
3 Quick Start Guide............................................................................................................ 6
4 Schematic and Bill of Materials ............................................................................................ 7
4.1 Schematic............................................................................................................ 7
4.2 Bill of Materials .................................................................................................... 11
5 Board Layout................................................................................................................ 13
6 Total Phase Aardvark I2C Host Adapter Scripts........................................................................ 16
7 References.................................................................................................................. 16
List of Figures
1 TDP158RSBEVM............................................................................................................ 2
2 TDP158RSBEVM Block Diagram ......................................................................................... 3
3 TDP158RSBEVM Schematics (1 of 4) - Input Connectors ............................................................ 7
4 TDP158RSBEVM Schematics (2 of 4) - TDP158RSB Implementation .............................................. 8
5 TDP158RSBEVM Schematics (3 of 4) - Regulators ................................................................... 9
6 TDP158RSBEVM Schematics (4 of 4) - TUSB3410 Implementation .............................................. 10
7 Layer 1 (Top) ............................................................................................................... 13
8 Layer 2 (GND).............................................................................................................. 13
9 Layer 3 (PWR).............................................................................................................. 14
10 Layer 4 (PWR).............................................................................................................. 14
11 Layer 5 (GND).............................................................................................................. 15
12 Layer 6 (Bottom)............................................................................................................ 15
List of Tables
1 Aardvark I2C (J18) Pin-Out ................................................................................................. 4
2 TDP158 Target I2C Address................................................................................................ 4
3 SW1 DIP Switch Setting.................................................................................................... 5
4 Component Configuration .................................................................................................. 5

Copyright © 2017, Texas Instruments Incorporated
Overview www.ti.com
2SLLU257A–February 2017–Revised February 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
TDP158 RSB Evaluation Module
5 Bill of Materials ............................................................................................................. 11
Trademarks
Aardvark is a trademark of Total Phase, Inc..
All other trademarks are the property of their respective owners.
1 Overview
1.1 What is the TDP158?
The TDP158 is a DisplayPort to Transition Minimized Differential Signal (TMDS) redriver supporting Digital
Video Interface (DVI) 1.0 and High Definition Multimedia Interface (HDMI) 1.4b and 2.0 output signals.
The TDP158 supports the Dual Mode Standard version 1.1 type 1 and type 2 through the DDC link. The
TDP158 supports a data rate of up to 6Gbps per data lane to support UltraHD (4K×2K/60Hz) 8-bits per
color high-resolution video and HDTV with 16-bit color depth at 1080p (1920×1080/60Hz).
1.2 What is the TDP158 EVM?
The TDP158 EVM is a PCB created to help customers evaluate the TDP158 device for video applications.
This EVM can also be used as a hardware reference design for implementation of the TDP158 in the RSB
package. PCB design and layout files can be provided upon request to provide PCB design illustrations of
the routing and placement rules. Figure 1 is a picture of the EVM.
Figure 1. TDP158RSBEVM

USB2
Connector
5-V
Dongle
5-V to 3.3-V
LDO
3.3-V to 1.1-V
LDO
Aardvark
Connector TUSB3410
SCL_CTL
SDA_CTL
DP Connector Top
HDMI Connector
IN0P/N
IN1P/N
IN2P/N
I3P/N
DDC_SCL/SDA
TMDS_D2P/N
TMDS_D1P/N
TMDS_D0P/N
TMDS_CLKP/N
DDC_SCL/SDA
TDP158
(40-Pin RSB)
Copyright © 2017, Texas Instruments Incorporated
www.ti.com Hardware Description
3
SLLU257A–February 2017–Revised February 2018
Submit Documentation Feedback Copyright © 2017–2018, Texas Instruments Incorporated
TDP158 RSB Evaluation Module
1.2.1 What is Included in the TDP158RSBEVM?
The major components of the EVM are as follows:
• TDP158RSB
• Standard DP source connector (receptacle)
• Standard HDMI sink connector (receptacle)
• DC power regulators
• I2C programming interface for external I2C host connection
• USB interface (utility available)
2 Hardware Description
Figure 2 illustrates the EVM block diagram.
Figure 2. TDP158RSBEVM Block Diagram
2.1 Video Connectors for TDP158 Ports
The EVM has a DP connection for the source and an HDMI connection for the sink. J2 is a standard DP
connector (Molex 47272-0001). J4 is a standard HDMI connector (Molex 4715-10001). There is a third
video connection on the board for an HDMI source (J1), this function is not supported on the TDP158RSB
EVM.
2.2 Local I2C Access
Access to the local I2C signals on the TDP158 is provided via input connector J18. Note that the I2C signal
levels should be at 3.3 V when the I2C interface is accessed through the connector.
A standalone external I2C host can be connected via J18 for debug and control purposes. An example of
an external I2C Host controller is the Total Phase Aardvark™ I2C/SPI Host Adapter (Total Phase Part#:
TP240141). Sample scripts for this I2C Host controller are provided by request.

Hardware Description www.ti.com
4SLLU257A–February 2017–Revised February 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
TDP158 RSB Evaluation Module
Table 1. Aardvark I2C (J18) Pin-Out
J18 Pin # Description J18 Pin # Description
1 SCL_CTL 2 GND
3 SDA_CTL 4 NC
5 NC 6 NC
7 NC 8 NC
9 NC 10 GND
Table 2. TDP158 Target I2C Address
TDP158 I2C Target Address
Bit 7 (MSB)
A6 Bit 6 A5 Bit 5 A4 Bit 4 A3 Bit 3 A2 Bit 2 A1 Bit 1 A0 Bit 0 (W/R)
1 0 1 1 1 1 0 0/1
7 Bit Address = 5Eh
NOTE: The target I2C address for the TDP158 can be modified with the EVM jumper settings.
2.3 Enable and Reset
There are three device enable and reset options to use with the EVM.
A. Supervisor circuitry option
This is the default configuration on the TDP158 EVM. The enable (EN) signal is held low until the
power good (PG) from the 3.3-V voltage regulator reaches a stable high-voltage level then is released
high.
B. RC timing option
The C35 external capacitor and internal resistor are used to control the EN ramp time after the device
is powered on. The C35 is a DNI (Do Not Install option) by default. The C35 needs to be installed and
R70 needs to be uninstalled to enable this option.
C. External control option
A push button (SW1) is provided for manual control of the EN and OE input of the TDP158.
2.4 Power
A DC power jack (J13) to accept a 5-V wall power adapter is provided on the EVM. The DC power jack
(CUI Inc. PJ-202AH) has an inner diameter of 2.1 mm and an outer diameter of 5.5 mm. The tip of the 5-V
power supply must be positive. A 5-V power supply of at least 1.5 A that meets the stated requirements
can be used to power the TDP158RSBEVM. Power is provided to the EVM when SW1 is set to
position 1.
CAUTION
Do not plug in any power source higher than the configured voltage (5 V).
Alternately, it is possible to power the EVM by connecting a USB micro cable to a host and setting SW1 to
position 3. Note that this usage may exceed USB compliance requirements for power consumption.

www.ti.com Hardware Description
5
SLLU257A–February 2017–Revised February 2018
Submit Documentation Feedback Copyright © 2017–2018, Texas Instruments Incorporated
TDP158 RSB Evaluation Module
2.5 Jumper Configuration
Jumpers are provided to operate the device and EVM in different configurations, see Table 3.
Table 3. SW1 DIP Switch Setting
DIP SW No Signal Name Description Default Config
J3 HPD_SNK JP 2–3 for external HPD
JP 2–1 for board_5V JP 2–3
J5 PRE JP 1–2 for 3 db
JP 2–3 for 0 db
When I2C_EN is low
JP 2–3
J6 SWAP JP 1–2 for SWAP
JP 2–3 for Normal
When I2C_EN is low
JP 2–3
J7 I2C_EN JP 1–2 for I2C_EN = High; Puts Device into I2C Control Mode
JP 2–3 for I2C_EN = Low; Puts Device into Pin Strap Mode JP 2–3 Puts Device into Pin Strap Mode
J8 TERM JP 1–2 for 75–150 Ω
JP 2–3 for 150–300 Ω
NC; no termination
NC
Note: When TMDS_CLOCK_RATIO_STATUS
bit = 1, the TDP158 automatically sets source
termination at 75 Ωto 150 Ω.
J9 VSADJ JP 1–2 for 5.5 kΩ
JP 2–3 for adjustable resistance (6 kΩ)
NC – N/A
JP 2–3
The default value is 6 kΩon early EVMs (prior to
revision B)
J10 EQ1_SEL_A0 JP 1–2 for:
•tabI2C Addr bit A0 = 1, when I2C_EN = H
•tabFixed EQ at 14 dB @ 3G, when I2C_EN = L
JP 2–3 for:
•tabI2C Addr bit A0 = 0, when I2C_EN = H
•tabFixed EQ at 7.5 dB @ 3G, when I2C_EN = L
NC for Adaptive EQ
NC
J11 EQ2_SEL_A1 JP 1–2 for:
•tabI2C Addr bit A0 = 1, when I2C_EN = H
•tabFixed EQ at 14 dB @ 3G, when I2C_EN = L
JP 2–3 for:
•tabI2C Addr bit A0 = 0, when I2C_EN = H
•tabFixed EQ at 7.5 dB @ 3G, when I2C_EN = L
NC for Adaptive EQ
NC
J12 SLEW JP 1–2 for fast
JP 2–3 for slowest
NC for mid range
NC
2.6 Component Population Configuration
To allow the TDP158 EVM to support both HDMI or DP input, there are many components that need to be
removed, placed, or modified depending on the board configuration. Table 4 provides a summary of the
component configuration for the TDP158 RSB. In addition, the unused source receptacle can be
depopulated.
Table 4. Component Configuration
Function Reference Designator TDP158
Differential Pair - IN C16, C17, C18, C19, C20, C21, C22, C23 populated with 0.1 µF
Differential Pair - HDMI IN R9, R10, R11, R14, R15, R16, R17, R18 not populated (0 Ω)
SDA or SCL - HDMI R12, R13 not populated (2 kΩ)
Differential Pair - DP IN R26, R27, R31, R32, R33, R34, R35, R37 populated with 0 Ω
SDA, SCL, or HPD - DP R29, R30 populated with 2 kΩ
Pullup Differential Pair HDMI IN R1, R2, R3, R4, R5, R6, R7, R8 populated with 49.9 Ω

Hardware Description www.ti.com
6SLLU257A–February 2017–Revised February 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
TDP158 RSB Evaluation Module
2.6.1 DDC Snoop Option
To accommodate systems that do not properly resend DDC commands after HPD goes low, TI has
implemented an DDC snoop mode on the TDP158RSB EVM. This mode allows the HPD line to be routed
around the TDP158, but remain connected to the TDP158 on the sink side to allow the TDP158 to snoop
its state. This snoop mode is disabled, by default, on the TDP158RSB EVMs.
• Pop R22, R23, no pop R19, R20, R12, R13 for HDMI, DDC snoop
• Pop R24, R25, no pop R38, R39, R29, R30 for DP, DDC snoop
• Pop R19, R20, R12, R13, no pop R22, R23 for HDMI, DDC on
• Pop R38, R39, R29, R30, no pop R24, R25 for DP, DDC on
2.6.2 HPD Snoop Option
Not available for the TDP158RSB EVM.
2.7 USB Interface via TUSB3410
Use the following settings for USB interface via TUSB3410:
• J19 must be set to SDA – SDA_USB
• J17 must be set to SCL – SCL_USB
• Attached USB micro cable to J16 and to the host computer
• Start the Eye Scan Tool software. Refer to the EyesScan Tool User's Guide (SLUUBK2) for details.
3 Quick Start Guide
Use the following steps for quick-start procedures:
1. Apply 5-V power to the EVM, turn on SW1. LED D1 should light up.
2. If using external I2C adapter instead of pin straps, configure the TDP158 at this step.
3. Plug in a DP source using a standard DP cable into J2 (Standard DP connector).
4. Plug in an HDMI video sink device into J4 (Standard HDMI connector) using a standard HDMI cable.
5. Video output on HDMI sink should be observed.

Displ ayPort++
HDMI RX
Pop R22, R23, no pop R19, R20, R12, R13 for HDMI, DDC SNOOP
Pop R19, R20, R12, R13, no pop R22, R23 for HDMI, DDC ON
Pop R38, R39, R29, R30 no pop R24, R25 for DP, DDC ON
Pop R24, R25 no pop R38, R39, R29, R30 for DP, DDC snoop -
NOTE: DDC snoop enables 5V DDC operation
HPD_SRC is a 3.3V signal
HDMI specification requires
a 5.0V signal
DP_SCL_SRC
DP_SDA_SRC
DPRX_GND
C_DPRX_LN1N
C_DPRX_LN1P
C_DPRX_LN3N
C_DPRX_LN3P
C_DPRX_LN2N
C_DPRX_LN2P
C_DPRX_LN0N
C_DPRX_LN0P
DP_CAD
HDMI_SCL_SR_IN
HDMI_SDA_SRC_IN
HDMI_IN_5V
BOARD_5V
BOARD_3P3V
BOARD_3P3VBOARD_3P3V
BOARD_5V
IN_D2P PAGE2,3
IN_D2N PAGE2,3
IN_D1P PAGE2,3
IN_D1N PAGE2,3
IN_D0P PAGE2,3
IN_D0N PAGE2,3
IN_CLKP PAGE2,3
IN_CLKN PAGE2,3
SCL_SRC PAGE2,3
SDA_SRC PAGE2,3
IN_CLKN PAGE2,3
IN_CLKP PAGE2,3
IN_D0N PAGE2,3
IN_D0P PAGE2,3
IN_D1N PAGE2,3
IN_D1P PAGE2,3
IN_D2N PAGE2,3
IN_D2P PAGE2,3
CEC PAGE2,3
CEC PAGE2,3
SPDIF PAGE3
SCL_SRC PAGE2,3
SDA_SRC PAGE2,3
HDMI_SDA_SRC PAGE3
HDMI_SCL_SRC PAGE3
HPD_SRC PAGE2,3
HPD_SRC PAGE2,3
R35 0
R11 0 - DNI
R30
2K
R36
1M
R17 0 - DNI
R37 0
J2
Display_Port_Connector_Sink
GND7
21
GND8
22
GND9
23
GND10
24
ML_3n 1
GND1 2
ML_3p 3
ML_2n 4
GND2 5
ML_2p 6
ML_1n 7
GND3 8
ML_1p 9
ML_0n 10
GND4 11
ML_0p 12
CAD (GND) 13
DP_CEC (GND) 14
AUX_p (SCL) 15
GND6 16
AUX_n (SDA) 17
HPD 18
DP_PWR_RTN 19
DP_PWR 20
R12
2K - DNI
J1
11
22
33
44
55
66
77
88
99
10 10
11 11
12 12
13 13
14 14
15 15
16 16
17 17
18 18
19 19
Case1
20
Case2
21 Case3 22
Case4 23
R8
49.9
C1
1 uF
R38 0
R26 0
R10 0 - DNI
R20 0 - DNI
R16 0 - DNI
R6
49.9
R23
0 - DNI
R29
2K
R39 0
R31 0
R9 0 - DNI
R15 0 - DNI
R24
0 - DNI
LP1
R28
100K
R13
2K - DNI
R21 0 Ohm - DNI
R33 0
R19 0 - DNI
R34 0
R14 0 - DNI
R7
49.9
R25
0 - DNI
R18 0 - DNI
R27 0
LP2
R1
49.9
R22
0 - DNI
R2
49.9
R5
49.9
R3
49.9
R32 0
R4
49.9
Copyright © 2017, Texas Instruments Incorporated
www.ti.com Schematic and Bill of Materials
7
SLLU257A–February 2017–Revised February 2018
Submit Documentation Feedback Copyright © 2017–2018, Texas Instruments Incorporated
TDP158 RSB Evaluation Module
4 Schematic and Bill of Materials
This section contains the schematics and bill of materials for the EVM.
4.1 Schematic
Figure 3 through Figure 6 illustrates the EVM schematics.
Figure 3. TDP158RSBEVM Schematics (1 of 4) - Input Connectors

SDA_CTL and SCL_CTL are configuration
inputs when I2C_EN is low. J5 and J6 will set
the values of these pins and J17 and J19
should not be populated.
HDMI TX
TDP158
SDA_CTL/PRE
SCL_CTL/SWAP
VDD_1P1VVCC_3P3V
VDD_1P1V VCC_3P3V
BOARD_5V
BOARD_5V
VCC_3P3V
VCC_3P3V
VCC_3P3V VCC_3P3V VCC_3P3V
VCC_3P3V
VCC_3P3V
IN_D2PPAGE2
IN_D2NPAGE2
IN_D1PPAGE2
IN_D1NPAGE2
IN_D0PPAGE2
IN_D0NPAGE2
IN_CLKPPAGE2
IN_CLKNPAGE2
HPD_SRCPAGE2
HDMI_SCL_SRC PAGE2
HDMI_SDA_SRC PAGE2
SDA_SRCPAGE2
SCL_SRCPAGE2
OE PAGE4
SCL_CTL/SWAPPAGE5
SDA_CTL/PREPAGE5
CECPAGE2
SPDIFPAGE2
R43
0 Ohm
R55
PTV09 10K POT
R58
0 Ohm
J10
EQ1_A0
LO
HI
1
2
3
R59
0 Ohm
C17
0.1uF
J3
1 2 3
C14
10 pF
C2
10uF
J7
I2C_EN
LO
HI
1
2
3
R41
2K
C9
0.01uF
R52
0 Ohm
J5
PRE
LO
HI
1
2
3
C18
0.1uF
R46
0 Ohm
J8
TERM
LO
HI
1
2
3
C11
10uF
C7
4.7 pF
R57
0 Ohm
C3
0.01uF
R40
2K
C10
10 pF
C19
0.1uF
R48
0 Ohm
R44
0 Ohm
R49
0 Ohm
R56
47K
C15
4.7 pF
C16
0.1uF
C5
0.01uF
C4
0.01uF
C20
0.1uF
R50
0 Ohm
J9
HDR3X1 M .1
DEFAULT
VSADJ
POT
1
2
3
C21
0.1uF
LP5
R45
0 Ohm
U1
TDP158RSB
IN_D2P
1
IN_D2N
2
HPD_SRC
3
IN_D1P
4
IN_D1N
5
IN_D0P
6
IN_D0N
7
I2C_EN
8
IN_CLKP
9
IN_CLKN
10
VCC1 11 VDD1 12
SCL_CTL/SWAP
13
SDA_CTL/PRE
14
GND1 15
TERM
16
EQ1/A0
17
VSADJ
18
NC 19
VDD2 20
OUT_CLKN 21
OUT_CLKP 22
EQ2/A1
23
OUT_D0N 24
OUT_D0P 25
OUT_D1N 26
OUT_D1P 27
HPD_SNK 28
OUT_D2N 29
OUT_D2P 30
VDD3 31
SCL_SNK 32
SDA_SNK 33
SLEW
34
GND2 35
OE
36
VCC2 37
SCL_SRC
38
SDA_SRC
39
VDD4 40
PAD 41
LP3
LP4
C22
0.1uF
C6
10 pF
R51
5.49K
R54
0 Ohm
J11
EQ2_A1
LO
HI
1
2
3
C12
0.01uF
J6
SWAP
LO
HI
1
2
3
C23
0.1uF
J12
SLEW
LO
HI
1
2
3
R53
0 Ohm
C13
0.01uF
R47
0 Ohm
R42
1K
C8
0.01uF
J4
D2P
1
GND1
2
D2N
3
D1P
4
GND2
5
D1N
6
D0P
7
GND3
8
D0N
9
CLKP
10
GND4
11
CLKN
12
CEC
13
UTILITY
14
SCL
15
SDA
16
DDC/CEC GND
17
5V
18
HPD
19
GND5 20
GND6 21
GND7 22
GND8 23
Copyright © 2017, Texas Instruments Incorporated
Schematic and Bill of Materials www.ti.com
8SLLU257A–February 2017–Revised February 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
TDP158 RSB Evaluation Module
Figure 4. TDP158RSBEVM Schematics (2 of 4) - TDP158RSB Implementation

1.1V LDO REGULATOR
5.0V BOOST
3.3V BUCK REGULATOR - 4V to 17V input
RESET
REG_PG
EN1P2
SS1P2
FB_1PT2V
PWRIN_SW
FB_3PT3V
TPS3808_CTPB_MANUAL_RESET
BOARD_3P3V
BOARD_1P1V
BOARD_3P3V
VDD_1P1V
VCC_3P3V
BOARD_3P3V
USB_5V
BOARD_5V
BOARD_3P3V
BOARD_IN
VCC_3P3V
BOARD_3P3V
VCC_3P3V
REG_PG PAGE4
REG_PGPAGE4
OE PAGE3
C37
220pF
LP10
GND
R69
10K
R63
240K
J15
1 2
LP8
L1
2.2 uH
J14
1 2
SW1
3POS - SPDT
WALL - OFF - USB 5V
1 2 3
U5
TPS3808
RESET#
1
GND
2
MR#
3CT 4
SENSE 5
VDD 6
C33
10 pF
+
C24
220uF
C32
10uF
D1
LED Green 0805
5V PWR
C38
0.1uF
R68
4.99K
R70 0 Ohm
R67
499
C25
10uF
C26
22uF
R62
0 Ohm
T
S
J13
2.1mm x 5.5mm
1
2
3
C35
220nF - DNI
L2
1 uH
C28
10uF
U2
TPS62150A
SW1 1
SW2 2
SW3 3
PG 4
FB 5
AGND
6
FSW 7
DEF 8
SS/TR
9
AVIN
10 PVIN1
11 PVIN2
12 EN
13
VOS
14
PGND1
15 PGND2 16
PAD
17
U3
TPS74201RGWT
OUT1 1
NC1
2
NC2
3
NC3
4
IN1
5
IN2
6
IN3
7
IN4
8
PG 9
BIAS
10
EN
11
GND
12
NC4
13
NC5
14
SS
15
FB 16
NC6
17
OUT4 18
OUT3 19
OUT2 20
PAD
21
R64
10K - DNI
C36
18pF
R65
4.7K
C29
10uF
C31
2.2uF
R72 0 Ohm
N.O.
SW2
PB_SWITCH
RESET
1
2
4
3
R60
100K
C30
0.01uF
LP6
3.3V
R71
4.7K
R61
750K
C34
1nF - DNI
LP9
GND
R66
1.87K
U4
TPS61240
GND 1
VOUT 2
FB 3 EN
4
L
5
VIN
6
PAD
7
C27
3.3 nF
LP7
1.1V
Copyright © 2017, Texas Instruments Incorporated
www.ti.com Schematic and Bill of Materials
9
SLLU257A–February 2017–Revised February 2018
Submit Documentation Feedback Copyright © 2017–2018, Texas Instruments Incorporated
TDP158 RSB Evaluation Module
Figure 5. TDP158RSBEVM Schematics (3 of 4) - Regulators

AARDVARK
CONNECTOR
TUSB3410
RSTIn
X1
X2
BOARD_3P3V
BOARD_3P3V
BOARD_3P3V
BOARD_3P3V
BOARD_3P3V
+1V8
USB_5V
+1V8
BOARD_3P3V
VCC_3P3V
SCL_CTL_USBPAGE5
SDA_CTL_USBPAGE5
SDA_CTL_USB PAGE5
SCL_CTL_USB PAGE5
SCL_CTL/SWAPPAGE3
SDA_CTL/PREPAGE3
U6
TUSB3410
RESET
9
DP0
6DM0
7
VCC1 3
PUR
5
SUSP
2
X2
26
X1/CLKI
27
GND3
28
TEST0 23
TEST1 24
VREGEN
1
VDD1V8 4
DTR 21
RTS 20
SOUT/IR_SOUT 19
SIN/IR_SIN 17
RI/CP 16
DCD 15
DSR 14
CTS 13
VCC2 25
P3_0
32
P3_1
31
P3_3
30
SDA
10 SCL
11
GND2
18 GND1
8
P3_4
29
CLKOUT 22
WAKEUP 12
C46
0.1uF
R80
1K
C45
22pF
C50
0.1uF
R83
2K
Y1
CRYSTAL
1
3
2
4
R81 1K
C4733pF
C51
1 uF
J19
SDA
SDA_USB
SDA_AAR
1
2
3
J16
USB Micro B
VBUS 1
DM 2
DP 3
GND 5
S1 6
S2 7
ID 4
S3
8
S4
9
S5
10
S6
11
R73 1.5K
J17
SCL
SCL_USB
SCL_AAR
1
2
3
R84
2K
R76
10K
C4933pF
R79
10K
0402
5%
C44
0.01uF
R82
15K
C42
2.2uF
R75 33
R77
1K
C40
0.01uF
R78
1K
J18
CONN PCB 5x2-S
2
4
6
8
10
1
3
5
7
9
U7
CAT24C256WI-GT3
Vcc 8
SDA 5
A0
1
A1
2
A2
3
Vss
4SCL 6
WP 7
C43
0.1uF
C48
22pF
C39
0.01uF
C41
0.1uF
R74 33
Copyright © 2017, Texas Instruments Incorporated
Schematic and Bill of Materials www.ti.com
10 SLLU257A–February 2017–Revised February 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
TDP158 RSB Evaluation Module
Figure 6. TDP158RSBEVM Schematics (4 of 4) - TUSB3410 Implementation

www.ti.com Schematic and Bill of Materials
11
SLLU257A–February 2017–Revised February 2018
Submit Documentation Feedback Copyright © 2017–2018, Texas Instruments Incorporated
TDP158 RSB Evaluation Module
4.2 Bill of Materials
Table 5 lists the EVM BOM.
Table 5. Bill of Materials
Item Qty Reference Part PCB Footprint Manufacturer Part Number Pkg Description
1 2 C1,C51 1 uF 603 Taiyo Yuden LMK107B7105KA-T 603 CAP CER 1UF 10V 10% X7R 0603
2 5 C38,C41,C43,C46,C50 0.1uF 402 Yageo CC0402KRX5R6BB104 402 CAP CER 0.1UF 10V 10% X5R 0402
3 6 C2,C11,C25,C28,C29,C3
210uF 805 TDK C2012X5R1C106K085AC 805 CAP CER 10UF 16V 10% X5R 0805
4 8 C16,C17,C18,C19,C20,C
21,C22,C23 0.1uF 201 TDK C0603X5R0J104M 201 CAP CER .10UF 6.3V X5R 0201
5 11 C3,C4,C5,C8,C9,C12,C1
3,C30,C39,C40,C44 0.01uF 402 Murata GRM155R71H103KA88D 402 CAP CER 1000PF 50V 10% X7R 0402
6 4 C6,C10,C14,C33 10 Pf 402 Murata GRM1555C1H100JA01D 402 CAP CER 10PF 50V 10% X7R 0402
7 1 C36 18pF 402 AVX 04025A180JAT2A 402 CAP CERM 18PF 5% 50V NP0 0402
8 1 C37 220pF 402 Taiyo Yuden UMK105B7221KV-F 402 CAP CER 220PF 50V 10% X7R 0402
9 1 C24 220uF 7343 Kemet T491D227K016AT 7343 CAP TANT 220UF 16V 10% 2917
10 1 C27 3.3 nF 402 Samsung CL05B332KB5NNNC 402 CAP CER 3300PF 50V 10% X7R 0402
11 1 C26 22uF 805 Murata GRM21BR60J226ME39L 805 CAP CER 22UF 6.3V 20% X5R 0805
12 2 C31,C42 2.2uF 805 Taiyo Yuden EMK212BJ225KG-T 805 CAP CER 2.2UF 16V 10% X5R 0805
13 0 C34,C35,R9,R10,R11,R1
4,R15,R16,R17,R18,
R19,R20,R22,R23,R24,R
25, R12,R13,R21,R64
DNI 402 / 201
14 2 C45,C48 22pF 402 Murata GRM1555C1H220JA01D 402 CAP CER 22PF 50V 5% NP0 0402
15 2 C47,C49 33pF 402 Murata GRM1555C1H330JA01D 402 CAP CER 33PF 50V 5% NP0 0402
16 2 C7,C15 4.7pF 402 Murata GRM1555C1H4R7CA01D 402 CAP CER 4.7PF 50V 5% NP0 0402
17 1 D1 LED Green 0805 805 Lite On LTST-C171GKT 805 LED GREEN CLEAR THIN 0805 SMD
18 2 J14,J15 HDR2X1 M .1 HDR_THVT_1x2_100 3M 961102-6404-AR HDR2X1 CONN HEADER VERT SGL 2POS GOLD
19 11 J3,J5,J6,J7,J8,J9,J10,J1
1,J12,J17,J19 HDR3X1 M .1 HDR_THVT_1x3_100 3M 961103-6404-AR HDR3X1 CONN HEADER VERT SGL 3POS GOLD
20 1 J2 Display_Port_Connect
or_Sink_0 DISPLAYPORT Molex 47272-0001 DISPLAYPORT CONN RCPT 20POS UDI R/A SMD
21 1 J18 Header 5x2 0.1" thru-
hole con_thvt_shrd_2x5_100_m 3M N2510-6002-RB con_thvt_shrd_2x5_100_ mCONN HEADER 10 POS STRGHT GOLD
22 1 J13 2.1mm x 5.5mm PJ-202AH CUI Inc. PJ-202AH (PJ-002AH) 2.1mm x 5.5mm CONN PWR JACK 2.1X5.5MM HIGH CUR
23 1 J16 USB Micro B USB Micro B FCI 10103592-0001LF USB MICRO CONN RCPT REV MICRO USB B R/A
24 10 LP1,LP2,LP3,LP4,LP5,L
P6,LP7,LP8,LP9,LP10 LP TESTLOOP Keystone Electronics 5006 THRU TEST POINT PC COMPACT .063"D BLK
25 1 L1 2.2 uH 1008 TDK VLS252010ET-2R2M 1008 INDUCTOR POWER 2.2UH 1.3A SMD
26 1 L2 1 uH 1008 TDK NLCV25T-1R0M-EFR 1008 INDUCTOR POWER 1.0UH 1008
27 2 J1,J4 HDMI CON_HDMI_RT_19_0p50mm Molex 471510001 CON_HDMI_RT_19_0p5
0mm CONN RCPT 19POS HDMI RT ANG SMD
28 8 R1,R2,R3,R4,R5,R6,R7,
R8 49.9 201 Panasonic ERJ-1GEF49R9C 201 RES SMD 49.9 OHM 1% 1/20W 0201
29 5 R42,R77,R78,R80,R81 1K 402 Yageo RC0402JR-071KL 402 RES SMD 1K OHM 5% 1/16W 0402

Schematic and Bill of Materials www.ti.com
12 SLLU257A–February 2017–Revised February 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
TDP158 RSB Evaluation Module
Table 5. Bill of Materials (continued)
Item Qty Reference Part PCB Footprint Manufacturer Part Number Pkg Description
30 2 R28,R60 100K 402 Yageo RC0402JR-07100KL 402 RES SMD 100K OHM 5% 1/16W 0402
31 10 R26,R27,R31,R32,R33,R
34,R35,R37,R38,R39 0 201 Panasonic ERJ-1GN0R00C 201 RES SMD 0.0 OHM JUMPER 1/20W
32 6 R29,R30,R40,R41,R83,R
84 2K 402 Yageo RC0402JR-072KL 402 RES SMD 2K OHM 5% 1/16W 0402
33 17 R43,R44,R45,R46,R47,R
48,R49,R50,R52,R53,R5
4,R57,R58,R59,R62,R70,
R72
0 Ohm 402 Panasonic ERJ-2GE0R00X 402 RES SMD 0.0 OHM JUMPER 1/10W
34 1 R36 1M 402 Yageo RC0402JR-071ML 402 RES SMD 1M OHM 5% 1/16W 0402
35 1 R51 5.49K 402 Panasonic ERJ-2RKF5491X 402 RES SMD 5.49K OHM 1% 1/10W 0402
36 1 R55 PTV09 10K POT THRUHOLE Bourns PTV09A-4015F-B103 THRUHOLE POT 10K OHM 9MM SQ .05W CARB
37 3 R69,R76,R79 10K 402 Yageo RC0402JR-0710KL 402 RES SMD 10K OHM 5% 1/16W 0402
38 2 R65,R71 4.7K 402 Yageo RC0402JR-074K7L 402 RES SMD 4.7K OHM 5% 1/16W 0402
39 1 R67 499 402 Vishay Dale CRCW0402499RDHEDP 402 RES SMD 499 OHM 0.5% 1/16W 0402
40 1 R61 750K 402 Vishay Dale CRCW0402750KJNED 402 RES SMD 750K OHM 5% 1/16W 0402
41 1 R63 240K 402 Vishay Dale CRCW0402240KJNED 402 RES SMD 240K OHM 5% 1/16W 0402
42 1 R66 1.87K 402 Stackpole RMCF0402FT1K87 402 RES SMD 1.87K OHM 1% 1/16W 0402
43 1 R68 4.99K 402 Yageo RC0402FR-074K99L 402 RES SMD 4.99K OHM 1% 1/16W 0402
44 1 R73 1.5K 402 Yageo RC0402JR-071K5L 402 RES SMD 1.5K OHM 5% 1/16W 0402
45 2 R74,R75 33 201 Yageo RC0201JR-0733RL 201 RES SMD 33 OHM 5% 1/20W 0201
46 1 R82 15K 402 Yageo RC0402JR-0715KL 402 RES SMD 15K OHM 5% 1/16W 0402
47 1 R56 47K 402 Rohm MCR01MRTJ473 402 RES SMD 47K OHM 5% 1/16W 0402
48 1 SW2 PB_SWITCH SW_MOM_2NO OMRON B3SN-3012P SW_MOM_2NO SWITCH TACTILE SPST-NO 0.05A 24V
49 1 SW1 3POS_SPDT THRUHOLE_3POS NKK Switches MS13ANW03 THRUHOLE_3POS SW SLIDE SPDT 6A SILVER STR 125V
50 1 U1 TDP158RSB 40_RSB TI TDP158RSB 40_RSB 6 Gbps AC Coupled to TMDS™/HDMI™ Redriver
51 1 U5 TPS3808G30DBVT 6DBV TI TPS3808G30DBVT 6DBV IC VOLT SUPERVISOR 3.0V SOT23-6
52 1 U2 TPS62150A RGT16 TI TPS62150ARGTT RGT16 IC REG BUCK SYNC ADJ 1A 16QFN
53 1 U4 TPS61240 6DRV TI TPS61240DRVT 6DRV IC REG BOOST SYNC 5V 0.45A 6SON
54 1 U3 TPS74201RGWT RGW20 TI TPS74201RGWT RGW20 IC REG LDO ADJ 1.5A 20VQFN
55 1 U6 TUSB3410 LQFP32 TI TUSB3410VF LQFP-32 IC CONV SERIAL-TO-USB 32-LQFP
56 1 U7 CAT24C256WI-GT3 8SOIC ON Semiconductor CAT24C256WI-GT3 8SOIC IC EEPROM 256KBIT 400KHZ 8SOIC
57 1 Y1 12 MHz Crystal ECX-32 ECS Inc. ECS-120-20-33-TR 4-SMD CRYSTAL 12MHZ 20PF SMD
58 4 EVM Assembly 0.75" Standoff 4-40 - F/F Keystone Electronics 2029 OD 0.187" ROUND STANDOFF 4-40 ALUM 3/4"
59 4 EVM Assembly 0.25"- Stainless Steel
Screws 4-40 Phillips Panhead Building Fasteners PMSSS 440 0025 PH OD 0.187" MACHINE SCREW PAN PHILLIPS 4-40
60 9 Shunts Shunt SHUNT 3M 969102-0000-DA SHUNT SHUNT JUMPER .1" BLACK GOLD
61 1 PCB TDP158RSBEVM ANY INT043 Printed Circuit Board

www.ti.com Board Layout
13
SLLU257A–February 2017–Revised February 2018
Submit Documentation Feedback Copyright © 2017–2018, Texas Instruments Incorporated
TDP158 RSB Evaluation Module
5 Board Layout
Figure 7 through Figure 12 display the EVM board layouts.
Figure 7. Layer 1 (Top)
Figure 8. Layer 2 (GND)

Board Layout www.ti.com
14 SLLU257A–February 2017–Revised February 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
TDP158 RSB Evaluation Module
Figure 9. Layer 3 (PWR)
Figure 10. Layer 4 (PWR)

www.ti.com Board Layout
15
SLLU257A–February 2017–Revised February 2018
Submit Documentation Feedback Copyright © 2017–2018, Texas Instruments Incorporated
TDP158 RSB Evaluation Module
Figure 11. Layer 5 (GND)
Figure 12. Layer 6 (Bottom)

Total Phase Aardvark I2C Host Adapter Scripts www.ti.com
16 SLLU257A–February 2017–Revised February 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
Revision History
6 Total Phase Aardvark I2C Host Adapter Scripts
Request the latest scripts from your TI representative.
7 References
1. TDP158 6-Gbps AC-Coupled to TMDS™/HDMI™ Redriver
2. Aardvark™ Adapter User Manual
3. High-Definition Multimedia Interface Specification Version 1.4b.
4. High-Definition Multimedia Interface Specification Version 2.0.
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (February 2017) to A Revision .................................................................................................. Page
• Changed the EVM Figure 1.............................................................................................................. 2
• Corrected Reference Designators column in Table 4 ................................................................................ 5
• Corrected TPD158 coulmn resistor values in Table 4................................................................................ 5
• Changed the Section 2.6.1............................................................................................................... 6
• Changed the Section 2.6.2............................................................................................................... 6
• Changed From: TDP158 product preview To: the production datasheet in Section 7 ......................................... 16

STANDARD TERMS FOR EVALUATION MODULES
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.

FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•Reorient or relocate the receiving antenna.
•Increase the separation between the equipment and receiver.
•Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
•Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.

【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
2. 実験局の免許を取得後ご使用いただく。
3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
4EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.

6. Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8. Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated