Texas Instruments MSP430F6733 User manual

Errata
MSP430F6733 Microcontroller
ABSTRACT
This document describes the known exceptions to the functional specifications (advisories).
Table of Contents
1 Functional Advisories............................................................................................................................................................ 2
2 Preprogrammed Software Advisories.................................................................................................................................. 2
3 Debug Only Advisories.......................................................................................................................................................... 3
4 Fixed by Compiler Advisories............................................................................................................................................... 3
5 Nomenclature, Package Symbolization, and Revision Identification................................................................................ 4
5.1 Device Nomenclature.........................................................................................................................................................4
5.2 Package Markings..............................................................................................................................................................4
5.3 Memory-Mapped Hardware Revision (TLV Structure)....................................................................................................... 5
6 Advisory Descriptions............................................................................................................................................................6
7 Revision History................................................................................................................................................................... 25
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1 Functional Advisories
Advisories that affect the device's operation, function, or parametrics.
✓ The check mark indicates that the issue is present in the specified revision.
Errata Number
Rev A
ADC39 ✓
ADC42 ✓
ADC69 ✓
AUXPMM1 ✓
AUXPMM2 ✓
CPU36 ✓
CPU46 ✓
CPU47 ✓
DMA4 ✓
DMA7 ✓
DMA9 ✓
DMA10 ✓
LCDB5 ✓
LCDB6 ✓
PMM7 ✓
PMM11 ✓
PMM12 ✓
PMM14 ✓
PMM15 ✓
PMM18 ✓
PMM20 ✓
PMM26 ✓
PORT15 ✓
PORT19 ✓
SD3 ✓
UCS11 ✓
USCI36 ✓
USCI37 ✓
USCI41 ✓
USCI42 ✓
USCI47 ✓
USCI50 ✓
2 Preprogrammed Software Advisories
Advisories that affect factory-programmed software.
✓ The check mark indicates that the issue is present in the specified revision.
Errata Number
Rev A
BSL7 ✓
BSL14 ✓
Functional Advisories www.ti.com
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3 Debug Only Advisories
Advisories that affect only debug operation.
✓ The check mark indicates that the issue is present in the specified revision.
Errata Number
Rev A
EEM8 ✓
EEM17 ✓
EEM19 ✓
EEM23 ✓
JTAG26 ✓
JTAG27 ✓
4 Fixed by Compiler Advisories
Advisories that are resolved by compiler workaround. Refer to each advisory for the IDE and compiler versions
with a workaround.
✓ The check mark indicates that the issue is present in the specified revision.
Errata Number
Rev A
CPU21 ✓
CPU22 ✓
CPU40 ✓
Refer to the following MSP430 compiler documentation for more details about the CPU bugs workarounds.
TI MSP430 Compiler Tools (Code Composer Studio IDE)
•MSP430 Optimizing C/C++ Compiler: Check the --silicon_errata option
•MSP430 Assembly Language Tools
MSP430 GNU Compiler (MSP430-GCC)
•MSP430 GCC Options: Check -msilicon-errata= and -msilicon-errata-warn= options
•MSP430 GCC User's Guide
IAR Embedded Workbench
•IAR workarounds for msp430 hardware issues
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5 Nomenclature, Package Symbolization, and Revision Identification
The revision of the device can be identified by the revision letter on the Package Markings or by the HW_ID
located inside the TLV structure of the device.
5.1 Device Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all MSP
MCU devices. Each MSP MCU commercial family member has one of two prefixes: MSP or XMS. These
prefixes represent evolutionary stages of product development from engineering prototypes (XMS) through fully
qualified production devices (MSP).
XMS – Experimental device that is not necessarily representative of the final device's electrical specifications
MSP – Fully qualified production device
Support tool naming prefixes:
X: Development-support product that has not yet completed Texas Instruments internal qualification testing.
null: Fully-qualified development-support product.
XMS devices and X development-support tools are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."
MSP devices have been characterized fully, and the quality and reliability of the device have been demonstrated
fully. TI's standard warranty applies.
Predictions show that prototype devices (XMS) have a greater failure rate than the standard production devices.
TI recommends that these devices not be used in any production system because their expected end-use failure
rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the temperature
range, package type, and distribution format.
5.2 Package Markings
PZ100 LQFP (PZ) 100 Pin
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PN80 LQFP (PN), 80 Pin
5.3 Memory-Mapped Hardware Revision (TLV Structure)
Die Revision TLV Hardware Revision
Rev A 10h
Further guidance on how to locate the TLV structure and read out the HW_ID can be found in the device User's
Guide.
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6 Advisory Descriptions
ADC39 ADC Module
Category Functional
Function Erroneous ADC10 results in extended sample mode
Description If the extended sample mode is selected (ADC10SHP = 0) and the ADC10CLK is
asynchronous to the SHI signal, the ADC10 may generate erroneous results.
Workaround 1) Use the pulse sample mode (ADC10SHP=1)
OR
2) Use a synchronous clock for ADC10 and the SHI signal.
ADC42 ADC Module
Category Functional
Function ADC stops converting when successive ADC is triggered before the previous conversion
ends
Description Subsequent ADC conversions are halted if a new ADC conversion is triggered while ADC
is busy. ADC conversions are triggered manually or by a timer. The affected ADC modes
are:
- sequence-of-channels
- repeat-single-channel
- repeat-sequence-of-channels (ADC12CTL1.ADC12CONSEQx)
In addition, the timer overflow flag cannot be used to detect an overflow
(ADC12IFGR2.ADC12TOVIFG).
Workaround 1. For manual trigger mode (ADC12CTL0.ADC12SC), ensure each ADC conversion
is completed by first checking ADC12CTL1.ADC12BUSY bit before starting a new
conversion.
2. For timer trigger mode (ADC12CTL1.ADC12SHP), ensure the timer period is greater
than the ADC sample and conversion time.
To recover the conversion halt:
1. Disable ADC module (ADC12CTL0.ADC12ENC = 0 and ADC12CTL0.ADC12ON = 0)
2. Re-enable ADC module (ADC12CTL0.ADC12ON = 1 and ADC12CTL0.ADC12ENC =
1)
3. Re-enable conversion
ADC69 ADC Module
Category Functional
Function ADC stops operating if ADC clock source is changed from SMCLK to another source
while SMCLKOFF = 1.
Advisory Descriptions www.ti.com
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Description When SMCLK is used as the clock source for the ADC (ADC12CTL1.ADC12SSELx =
11) and CSCTL4.SMCLKOFF = 1, the ADC will stop operating if the ADC clock source is
changed by user software (e.g. in the ISR) from SMCLK to a different clock source. This
issue appears only for the ADC12CTL1.ADC12DIVx settings /3/5/7. The hang state can
be recovered by PUC/POR/BOR/Power cycle.
Workaround 1. Set CSCTL4.SMCLKOFF = 0 before switch ADC clock source.
OR
2. Only use ADC12CTL1.ADC12DIVx as /1, /2, /4, /6, /8
AUXPMM1 AUXPMM Module
Category Functional
Function AUXVCC1/AUXVCC2 can not be switched back to DVCC
Description When the system is running with the AUXVCC1 supply after DVCC/AVCC is lost, if the
AUXVCC1 voltage goes lower than SVSH setting for POR and above BORH level, the
system can not switch back to DVCC after DVCC ramps back up again.
Similarly, when the system is running with the AUXVCC2 supply after DVCC/AVCC is lost,
if the AUXVCC2 voltage goes lower than SVSH setting for POR and above BORH level,
the system can not switch back to DVCC after DVCC ramps back up again.
Workaround When the system is running with the AUXVCC1 supply, use SVMH to monitor AUXVCC1
voltage. When AUXVCC1 is lower than the SVMH setting, the program drives the chip
into LPMx.5. After DVCC ramps up back again, trigger one of the wake up pins. The
power supply could be switched back to DVCC again.
When the system is running with the AUXVCC2 supply, use SVMH to monitor AUXVCC2
voltage. When AUXVCC2 is lower than the SVMH setting, the program drives the chip
into LPMx.5. After DVCC ramps up back again, trigger one of the wake up pins. The
power supply could be switched back to DVCC again.
AUXPMM2 AUXPMM Module
Category Functional
Function Latch-up in AUXPMM
Description Latch-up current can appear at the AUXPMM module supply pins in the following two
scenarios:
Scenario 1: When the AUXPMM is configured for hardware- or software-controlled
switching and the module switches from DVCC to AUXVCC2, latch-up current can
appear at AUXVCC2 at the switching point defined by SVSMHCTL.SVSMHRRL (or
AUXCTL2.AUX0LVLx). The probability for this event to occur depends on:
a) Operating temperature (higher temperatures increase probability)
b) External AUXVCC2 voltage level (higher voltages increase probability)
c) SVSMHRRL level (lower levels increase probability) defining the switching level in
hardware-controlled mode
d) AUX0LVLx level (lower levels increase probability) defining the switching level in
software-controlled mode (applicable to DVCC only)
Scenario 2: When a battery is connected to DVCC, AUXVCC1 or AUXVCC2 as the first
voltage supply, due to the low internal resistance of the battery a very fast rise time is
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seen by the AUXPMM and latch-up current can appear at the connected supply if:
a) Rise times are in the range of 140 kV/s (faster rise times increase probability)
b) Device operates at temperatures of 75 deg C and above (higher temperatures increase
probability)
The latch-up current disappears after complete power cycles of all supply sources.
Workaround For scenario 1:
- Increase SVSMRRL to a level above maximum external voltage expected on AUXVCC2.
SVSMRRL = 6 or 7 (requires VCORE level of 3) is applicable for AUXVCC2 of up to
maximum voltage, 3.58V, while a lower SVSMRRL setting can be selected if a lower
voltage (e.g. 3.3V) is expected on AUXVCC2.
Or
- Connect all 3 supplies via 3 external diodes to DVCC and realize the switching externally
without using the internal AUXPMM switches. See application report "Implementation of a
Three-Phase Electronic Watt-Hour Meter Using the MSP430F471xx" for details.
Or
- Use AUXVCC1 instead of AUXVCC2 for backup supply
For scenario 2:
Limit the supply voltage ramp up time through a series resistor (e.g. 10 Ohm) in the critical
supply path. Side effects such as voltage dips due to high current consumption of the
device need to be considered.
BSL7 BSL Module
Category Software in ROM
Function BSL does not start after waking up from LPMx.5
Description When waking up from LPMx.5 mode, the BSL does not start as it does not clear the Lock
I/O bit (LOCKLPM5 bit in PM5CTL0 register) on start-up.
Workaround 1. Upgrade the device BSL to the latest version (see Creating a Custom Flash-Based
Bootstrap Loader (BSL) Application Note - SLAA450 for more details)
OR
2. Do not use LOCKLPM5 bit (LPMx.5) if the BSL is used but cannot be upgraded.
BSL14 BSL Module
Category Software in ROM
Function BSL request to unlock the JTAG
Description The feature in the BSL to keep the JTAG unlocked by setting the bit
BSL_REQ_JTAG_OPEN in the return value has been disabled in this device.
Workaround None
CPU21 CPU Module
Category Compiler-Fixed
Advisory Descriptions www.ti.com
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Function Using POPM instruction on Status register may result in device hang up
Description When an active interrupt service request is pending and the POPM instruction is used to
set the Status Register (SR) and initiate entry into a low power mode , the device may
hang up.
Workaround None. It is recommended not to use POPM instruction on the Status Register.
Refer to the table below for compiler-specific fix implementation information.
IDE/Compiler Version Number Notes
IAR Embedded Workbench Not affected
TI MSP430 Compiler Tools (Code
Composer Studio) v4.0.x or later
User is required to add the compiler
or assembler flag option below. --
silicon_errata=CPU21
MSP430 GNU Compiler (MSP430-
GCC) MSP430-GCC 4.9 build 167 or later
CPU22 CPU Module
Category Compiler-Fixed
Function Indirect addressing mode with the Program Counter as the source register may produce
unexpected results
Description When using the indirect addressing mode in an instruction with the Program Counter (PC)
as the source operand, the instruction that follows immediately does not get executed.
For example in the code below, the ADD instruction does not get executed.
mov @PC, R7
add #1h, R4
Workaround Refer to the table below for compiler-specific fix implementation information.
IDE/Compiler Version Number Notes
IAR Embedded Workbench Not affected
TI MSP430 Compiler Tools (Code
Composer Studio) v4.0.x or later
User is required to add the compiler
or assembler flag option below. --
silicon_errata=CPU22
MSP430 GNU Compiler (MSP430-
GCC) MSP430-GCC 4.9 build 167 or later
CPU36 CPU Module
Category Functional
Function PC corruption when single-stepping through flash erase
Description When single-stepping over code that initiates an INFOD Flash memory erase, the
program counter is corrupted.
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Workaround None.
NOTE: This erratum applies to debug mode only.
CPU40 CPU Module
Category Compiler-Fixed
Function PC is corrupted when executing jump/conditional jump instruction that is followed by
instruction with PC as destination register or a data section
Description If the value at the memory location immediately following a jump/conditional jump
instruction is 0X40h or 0X50h (where X = don't care), which could either be an instruction
opcode (for instructions like RRCM, RRAM, RLAM, RRUM) with PC as destination
register or a data section (const data in flash memory or data variable in
RAM), then the PC value is auto-incremented by 2 after the jump instruction is executed;
therefore, branching to a wrong address location in code and leading to wrong program
execution.
For example, a conditional jump instruction followed by data section (0140h).
@0x8012 Loop DEC.W R6
@0x8014 DEC.W R7
@0x8016 JNZ Loop
@0x8018 Value1 DW 0140h
Workaround In assembly, insert a NOP between the jump/conditional jump instruction and program
code with instruction that contains PC as destination register or the data section.
Refer to the table below for compiler-specific fix implementation information.
IDE/Compiler Version Number Notes
IAR Embedded Workbench IAR EW430 v5.51 or later
For the command line version add
the following information Compiler:
--hw_workaround=CPU40
Assembler:-v1
TI MSP430 Compiler Tools (Code
Composer Studio) v4.0.x or later
User is required to add the compiler
or assembler flag option below. --
silicon_errata=CPU40
MSP430 GNU Compiler (MSP430-
GCC) Not affected
CPU46 CPU Module
Category Functional
Function POPM peforms unexpected memory access and can cause VMAIFG to be set
Description When the POPM assembly instruction is executed, the last Stack Pointer increment is
followed by an unintended read access to the memory. If this read access is performed
on vacant memory, the VMAIFG will be set and can trigger the corresponding interrupt
(SFRIE1.VMAIE) if it is enabled. This issue occurs if the POPM assembly instruction is
performed up to the top of the STACK.
Advisory Descriptions www.ti.com
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