Texas Instruments LaunchPad C2000 F280015 Series User manual

User's Guide
C2000™ F280015x Series LaunchPad™ Development Kit
ABSTRACT
The LAUNCHXL-F2800157 is a low-cost development board for the Texas Instruments C2000™ Real-
Time Microcontroller series of F280015x devices. The LAUNCHXL-F2800157 is designed around the
TMS320F2800157 real-time MCU and highlights the control, analog, and communications peripherals, as
well as the integrated nonvolatile memory. The LaunchPad™ development kit also features two independent
BoosterPack XL expansion connectors (80-pins), on-board Controller Area Network (CAN) transceiver
supporting both standard CAN (DCAN) and CAN-FD (MCAN), two 5 V encoder interface (eQEP) connectors,
power-domain isolation, and an on-board XDS110 debug probe.
Figure 1-1 highlights the key features of the F280015x LaunchPad.
Isolated USB Interface
(USB1, U12)
USB 5V Power
Isolation Header
(JP1)
JTAG/UART
Isolation Header
(J101)
40-pin Boosterpack
Connector Site 1
(J1 - J4)
VREFHI Header
(J15)
40-pin Boosterpack
Connector Site 2
(J5 - J8)
Encoder Interface
(J12, J13)
CAN Interface
(J14)
Boot Mode Select
Switch
(S3)
VDD (1.2V)
Monitoring Pin
(JP4)
F2800157
Microcontoller
(U1)
Reset Button
(S1)
XDS110 External
Debug Port
(J102)
XDS110 Debug Probe
(U2)
QEP Select Switch
(S5)
UART Select Switch
(S2)
5V & 3.3V Isolation
Headers
(JP2)
CAN Routing Switch
(S4)
CAN Termination
Resistor Jumper
(JP9)
Figure 1-1. LAUNCHXL-F2800157 LaunchPad™ Board Overview
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Table of Contents
1 Board Overview...................................................................................................................................................................... 3
1.1 Kit Contents........................................................................................................................................................................3
1.2 Features............................................................................................................................................................................. 3
1.3 Specifications..................................................................................................................................................................... 3
1.4 Using the F280015x LaunchPad........................................................................................................................................4
1.5 BoosterPacks..................................................................................................................................................................... 5
1.6 Hardware Revisions........................................................................................................................................................... 5
2 Software Development........................................................................................................................................................... 6
2.1 Software Tools and Packages............................................................................................................................................6
2.2 F280015x LaunchPad Demo Program...............................................................................................................................6
2.3 Programming and Running Other Software on the F280015x LaunchPad........................................................................8
3 Hardware Description.............................................................................................................................................................9
3.1 Functional Description and Connections..........................................................................................................................10
3.2 Debug Interface................................................................................................................................................................14
3.3 Alternate Routing............................................................................................................................................................. 14
4 Board Design.........................................................................................................................................................................16
4.1 Schematic........................................................................................................................................................................ 16
4.2 PCB Layout...................................................................................................................................................................... 16
4.3 BOM................................................................................................................................................................................. 21
4.4 LAUNCHXL-F2800157 Board Dimensions...................................................................................................................... 21
5 Frequently Asked Questions............................................................................................................................................... 22
6 References............................................................................................................................................................................ 23
6.1 Reference Documents..................................................................................................................................................... 23
6.2 Other TI Components Used in This Design..................................................................................................................... 24
7 Revision History................................................................................................................................................................... 24
List of Figures
Figure 1-1. LAUNCHXL-F2800157 LaunchPad™ Board Overview............................................................................................ 1
Figure 2-1. LaunchPad XDS110 COM Port................................................................................................................................. 6
Figure 2-2. LaunchPad Demo Serial Terminal - TI Logo............................................................................................................. 7
Figure 2-3. LaunchPad Demo Serial Terminal - ADC Sampling.................................................................................................. 7
Figure 3-1. F280015x LaunchPad™ Development Kit Block Diagram........................................................................................9
Figure 3-2. LaunchPad Power Distribution Diagram................................................................................................................. 10
Figure 3-3. LaunchPad Power Plane Diagram...........................................................................................................................11
Figure 4-1. Top Signal - Layer 1................................................................................................................................................ 17
Figure 4-2. GND - Layer 2......................................................................................................................................................... 18
Figure 4-3. PWR - Layer 3.........................................................................................................................................................19
Figure 4-4. Bottom Signal - Layer 4...........................................................................................................................................20
Figure 4-5. F280015x LaunchPad Dimensions and Component Locations.............................................................................. 21
Figure 5-1. Target Configuration Advanced Options..................................................................................................................22
Figure 5-2. Target Configuration Included in the Demo Project.................................................................................................23
List of Tables
Table 1-1. LAUNCHXL-F2800157 Specifications........................................................................................................................ 3
Table 1-2. Featured BoosterPacks for the F280015x LaunchPad............................................................................................... 5
Table 3-1. Power Domain Shunts...............................................................................................................................................11
Table 3-2. Power LED Indication Descriptions...........................................................................................................................12
Table 3-3. Boot Select Switch Table - S3...................................................................................................................................12
Table 3-4. SCI UART Select Table - S2..................................................................................................................................... 14
Table 3-5. QEP Select Table - S5.............................................................................................................................................. 15
Trademarks
C2000™, LaunchPad™, BoosterPack ™, NexFET™, and Code Composer Studio™ are trademarks of Texas
Instruments.
All trademarks are the property of their respective owners.
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1 Board Overview
1.1 Kit Contents
The F280015x Series LaunchPad™ Development Kit contains these items:
• C2000 F280015x Series LaunchPad development board (LAUNCHXL-F2800157)
• USB Type-A male to USB Type-C™ male cable
• Pinout Map
1.2 Features
The F280015x LaunchPad has these features:
• C2000 Series F2800157SPN (80-pin) microcontroller:
• On-board XDS110 debug probe
• Two user-controlled LEDs
• One microcontroller reset switch
• Selectable power domains:
– USB (isolated)
– BoosterPack ™ plug-in module
– External power supply
• CAN connector with on-board CAN transceiver
– Supports both standard CAN (DCAN) and CAN-FD (MCAN)
– Jumper to easily connect and disconnect CAN termination resistor
• Two independent Enhanced Quadrature Encoder Pulse (QEP)-based encoder connectors
• Two independent BoosterPack XL standard connectors (80-pins) featuring stackable headers to maximize
expansion through the BoosterPack ecosystem
1.3 Specifications
Table 1-1 summarizes the F280015x LaunchPad specifications.
Table 1-1. LAUNCHXL-F2800157 Specifications
Parameter Value
Board Supply Voltage
5 VDC from one of the following sources:
• USB Connector (USB101) - USB Type-C™ cable connected to PC or other compatible
power source.
• BoosterPack 1
• BoosterPack 2
• Auxiliary power connectors
Dimensions 5.5 in x 2.3 in x .425 in (13.97 cm x 5.84 cm x 10.8 mm) (L x W x H)
Break-out Power Output
• 3.3 VDC to BoosterPacks, limited by output of TPS7A3701 LDO. This 3.3-V plane is
shared with on-board components. Total output power limit of TPS7A3701 is 1 Amp.
Assumed Operating Conditions This kit is assumed to run at standard room conditions. The EVM can run at approximately
standard ambient temperature and pressure (SATP) with moderate-to-low humidity.
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1.3.1 External Power Supply or Accessory Requirements
Nominal Output Voltage: 5 VDC
Maximum Output Current: 3 A
Efficiency Level V
Note
TI recommends using an external power supply or power accessory that complies with applicable
regional safety standards such as (by example) UL, CSA, VDE, CCC, PSE, and so on.
1.4 Using the F280015x LaunchPad
The recommended steps for using the F280015x LaunchPad are:
1. Follow the instructions in Section 2.2 to begin running the LaunchPad demo program. Within just a
few minutes, you can control and monitor the F280015x LaunchPad with the pre-programmed quick start
application. Additionally, the FAQ section included in this document can be helpful if there are any issues
that can quickly be addressed.
2. Experiment with BoosterPacks. This development kit conforms to the latest revision of the BoosterPack
pinout standard. This development kit has two independent BoosterPack sites to enable a variety of
expansion opportunities, such as two boosterpacks being used simultaneously. For more information
about the TI LaunchPad and BoosterPack standard, see the TI LaunchPad web page at http://www.ti.com/
launchpad.
3. Take the first step towards developing your own control applications. The F280015x LaunchPad
is supported by the C2000Ware development package. After C2000Ware is installed, look for
\f280015x\examples\launchxl_f2800157 in the installation directory to find the pre-configured example
applications for this board. Any of the other examples found within the \f280015x\examples directory can
be used with minor modifications to run on the LaunchPad as well. For more details about software
development, see Section 2.
a. For applications, features and benefits information, see the C2000 F280015x Real-Time
Microcontrollers.
b. Check out this technical article featuring C2000 Real-Time Microcontrollers about how developers can
take advantage of the scalability and sustainability benefits these devices bring.
4. Customize and integrate the hardware to align to your end application. This development kit can be
used as a reference for building your own custom boards and circuits based on C2000 F280015x series
microcontrollers. The LaunchPad also functions as a foundation for expansion with custom BoosterPacks
and other circuits. This document can serve as a starting point for such projects.
5. Get Trained. Review and download hours of written and video training materials on C2000 Real-time
Microcontrollers and related LaunchPads.
a. See Getting Started With C2000™ Real-Time Control Microcontrollers (MCUs)
b. See the TI Training and Videos page
c. See the C2000 Academy page
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1.5 BoosterPacks
The LAUNCHXL-F2800157 provides a simple and inexpensive way to develop applications with the F280015x
series microcontroller. BoosterPacks are pluggable add-on boards for the LaunchPad ecosystem that follow
a pin-out standard created by Texas Instruments. The TI and third-party ecosystem of BoosterPacks greatly
expands the peripherals and potential applications that you can explore with the F280015x LaunchPad.
Some examples of BoosterPacks that are compatible with the F280015x LaunchPad are listed in Table 1-2. Note
that this is not an exhaustive list of hardware supported BoosterPacks.
Table 1-2. Featured BoosterPacks for the F280015x LaunchPad
BoosterPack/Board Application and Usage
BOOSTXL-3PHGANINV Features a 48-V/10-A three-phase GaN inverter with precision in-line shunt-based
phase current sensing for accurate control of precision drives such as servo drives.
BOOSTXL-DRV8323RS
BOOSTXL-DRV8323RH
DRV8323RS/H Three-Phase, 15A smart gate driver with buck, shunt amps (SPI or
Hardware Interface) Evaluation Module.
DRV8353RS-EVM 15A, 3-phase brushless DC drive stage based on the DRV8353RS gate driver and
CSD19532Q5B NexFET™ power MOSFETs.
DRV8316REVM DRV8316REVM provides three half-H-bridge integrated MOSFET drivers for driving a
three-phase brushless DC (BLDC) motor with 8-A Peak current drive, for 12-V/24-V DC
rails or battery powered applications.
BOOSTXL-BUCKCONV Digital Power Buck Converter BoosterPack for learning the basics of digital power
control with C2000 microcontrollers. The buck converter power stage supports dynamic
loads and converts an external 9-VDC power supply to a configurable DC output
voltage.
BOOSTXL-POSMGR PositionManager BoosterPack is a flexible low voltage platform intended for evaluating
interfaces to absolute encoders and analog sensors like resolvers and SinCos
transducers.
BOOSTXL-SHARP128 Sharp® 128x128 Memory LCD and microSD Card BoosterPack, controlled using SPI.
Display sensor readings, time, graphics, or other information using the LCD screen.
Note
Software support for the BoosterPacks and boards listed varies.
Users can also design their own BoosterPacks for the F280015x LaunchPad. Make sure that compatibility
requirements are met by referencing the signal pin mapping in the LAUNCHXL-F2800157 LaunchPad Kit Pinout
Map or LAUNCHXL-F2800157 Schematic.
1.6 Hardware Revisions
This section contains an abbreviated revision history of the LAUNCHXL-F2800157 as well as known issues with
each revision.
1.6.1 Revision A
The first production revision of the LAUNCHXL-F2800157 was released in July 2023. This revision can be
identified by the "MCU110A" silkscreen labeling on the back side of the EVM between the BoosterPack
Connector site 1 towards the top of the board.
Issues and concerns that have been identified on the EVM are listed below:
Known issues:
• No issues to report at this time of initial release.
Special notes and considerations to be aware of:
• Nothing to report at this time of initial release.
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2 Software Development
This section provides general information about software development, as well as instructions for programming
the LaunchPad. Software tools and packages for C2000 real-time controllers, like the F280015x, are listed in the
C2000 Evaluation & Development page.
2.1 Software Tools and Packages
Code Composer Studio (CCS) is a free integrated development environment (IDE) that supports TI
Microcontroller and Embedded Processors portfolio. Code Composer Studio™ (CCS) IDE provides a feature
rich environment for developing, programming, and debugging code on the C2000 family of MCUs.
C2000WARE is a repository of device-specific drivers, bit-field support files, libraries, peripheral examples,
utilities, hardware files, and documentation for C2000 MCUs. C2000WARE provides a solid foundation to begin
development and evaluation of the F280015x device on the LAUNCHXL-F2800157 and minimize software
development time.
Software Development Kits (SDKs) are provided to make it easy to evaluate C2000 MCUs within specific system
use cases and reduce overall development time. The Motor Control SDK (C2000WARE-MOTORCONTROL-
SDK) is targeted for various motor control applications, such as industrial drives. The Digital Power SDK
(C2000WARE-DIGITALPOWER-SDK) is targeted for digital power system development for various AC-DC,
DC-DC and DC-AC power supply applications.
SysConfig is a powerful graphical user interface tool which configures the C2000 Real-Time Control MCUs and
auto-generates embedded software, visualization diagrams, and debug artifacts. C2000 real-time MCUs can
be easily initialized through SysConfig, and device configuration errors are caught by the tool. The LAUNCHXL-
F2800157 is directly supported in the SysConfig tool and the standardized BoosterPack peripherals can easily
be configured with a few clicks. As the C2000 device's pinmux is configured, the corresponding LaunchPad
header pins are visualized, allowing for streamlined prototyping and debugging.
2.2 F280015x LaunchPad Demo Program
The LAUNCHXL-F2800157 includes a TMSF2800157SPN device pre-programmed with a demo program. When
the LaunchPad is powered on the demo program begins with an LED blink sequence on LED4 and LED5. After
a few seconds the device switches into an ADC sampling mode.
Every 1 second, the ADC samples pin ADCINA6 and the sampled value is represented as follows: If the
sample is above mid-scale (2048), the red LED4 illuminates. If the sample is below mid-scale, the green LED5
illuminates.
In addition to the LED indicators, ADC sample results are also displayed on your PC through the USB/UART
connection. To view the UART information on your PC, first determine the COM port associated with the
LaunchPad. To do this in Windows open the Device Manager. Look for an entry under Ports (COM and LPT)
titled "XDS110 Class Application/User UART (COMX)", where X is a number. Remember this number for when
you open a serial terminal.
Figure 2-1. LaunchPad XDS110 COM Port
The demo application UART data was tested using PuTTY, which is a free and open-source terminal emulator.
To view the UART data in a serial terminal program open the COM port found using the Windows Device
Manager with the following settings.
115200 Baud, 8 data bits, no parity, 1 stop bit.
After properly opening the serial port in your serial terminal, reset the LaunchPad by pressing the S1 reset button
and observe the serial terminal to see the TI logo in ASCII art.
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Figure 2-2. LaunchPad Demo Serial Terminal - TI Logo
After a few moments, the ADC value sampled on the ADCINA6 pin appears in the bottom right corner of the
terminal and be updated each second. Using a jumper wire connect the ADCINA6 header to a 3.3V, GND, or
other 0-3.3V signal to see the on-screen value change.
Figure 2-3. LaunchPad Demo Serial Terminal - ADC Sampling
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2.3 Programming and Running Other Software on the F280015x LaunchPad
The software packages described in Section 2.1 include example projects that can be loaded
and run on the F280015x LaunchPad. If you installed the C2000WARE software to the default
installation path of C:\ti\c2000\C2000Ware_<version>, you can find driverLib based example applications in
C:\ti\c2000\C2000Ware_<version>\examples\F280015x. The on-board XDS110 is used with the On-Chip Flash
Programmer tool to program applications to the F280015x LaunchPad.
Follow these steps to program example applications onto the F280015x LaunchPad development kit using the
on-board XDS110 debug probe:
1. Install Code Composer Studio (CCS) on a PC running Microsoft Windows.
2. Connect the USB-A cable plug in to an available USB port on the PC and plug the USB Type-C™ plug to the
port (USB101) on the F280015x LaunchPad.
3. Verify the following LEDs are illuminated:
a. LED7, at the top left of the board, indicating 5 V USB power.
b. LED0 indicating 3.3 V power to the XDS110 debug probe.
c. LED1 indicating 3.3 V power to the F2800157 MCU.
4. Install Windows XDS110 and Virtual COM Port drivers if prompted. Installation instructions can be found at
XDS110 Product Page.
5. Run CCS on the PC.
6. Import a F280015x project from C2000WARE, or another installed software package, into the CCS
workspace.
7. Add the _LAUNCHXL_F2800157 predefined symbol to the imported DriverLib example project for the
software to use relevant F280015x LaunchPad signals.
a. Open the projects Properties → Expand the Build tab → Expand the C2000 Compiler tab → Select
Predefined Symbol → Add _LAUNCHXL_F2800157 pre-define NAME.
8. Right click the project name and select Rebuild Project in CCS.
9. Launch the LAUNCHXL-F2800157 Target Configuration file and connect to the F280015x device. Make sure
that the Target Configuration file is configured to use the 2-pin cJTAG advanced configuration. For additional
details, see Frequently Asked Questions.
10. Click 'Load Program' and select the program's binary to load. The binary is loaded onto the device and can
now be run and debugged.
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3 Hardware Description
The F280015x LaunchPad includes a F2800157SPN MCU that is designed for advanced real-time control
applications. A large number of these peripherals are made available to users using the on-board accessories
and the BoosterPack connectors. This section explains how those peripherals operate and interface to the MCU.
Figure 3-1 shows a high-level block diagram of the F280015x LaunchPad.
USB Type-C™
Connector
USB
Isolator
Device XDS110 – device &
Circuitry
5V
Shunt 1
3.3-V Power
Management
F2800157 Device
UART & JTAG Shunts
USB
ESD
Device
Boot Mode
switch –
GPIO 24/32
2x10-pin BP Header
Reset
Button
CAN Header
Crystal
Oscillator
LED
Driver
eQEP 3.3-V 5-V
Level Shifters
eQEP Headers
2x10-pin BP Header
2x10-pin BP Header 2x10-pin BP Header
UART signal
Selection
Circuitry
eQEP Signal Selection
Circuitry
PWR & GND Isolation
Boundary
3.3-V & 5-V Isolation
Boundary
+5V0 (USB side) +3V3 (XDS110 side)
+3V3_MCU
(F280015x side)
CAN Transceiver
5V Shunt 2 3.3V
Shunt
XDS110 14-pin
Connector
GND
Shunt
+5V0_USB
+5V0_XDS110
+5V0_MCU
+3V3_XDS110
Figure 3-1. F280015x LaunchPad™ Development Kit Block Diagram
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3.1 Functional Description and Connections
3.1.1 Microcontroller
The TMS320F2800157SPN is a 32-bit floating-point microcontroller with 256-KB Flash memory, 36-KB RAM,
and operates at 120 MHz. The TMS320F2800157SPN includes advanced control peripherals, differentiated
analog, and various communications peripherals. The device has been optimized for high-performance real-time
control applications. For more details, see TMS320F280015x Real-Time Microcontrollers.
Most of the microcontroller signals are routed to 0.1 inch (2.54 mm) pitch headers laid out to comply with
the TI BoosterPack standards, with a few exceptions. The F280015x MCU internal multiplexer allows different
peripheral functions to be assigned to each of the general-purpose input/output (GPIO) pins. The multiplexing
options can be found in the device-specific data sheet. When adding external circuitry, consider the additional
load on the development board's power rails.
The F280015x LaunchPad is factory-programmed with a quick start demo program. The quick start program
resides in the on-chip Flash memory and executes each time power is applied, unless the application has been
replaced with a user program. For details on the LaunchPad's demo program, see Section 2.2.
3.1.2 Power Domains
The F280015x LaunchPad has several power domains that can be connected or isolated from each other with
removable shunts. The different 3.3-V and 5-V power domains are described in Figure 3-2 and Figure 3-3.
USB Type-C™
Conn
USB
Isolator
Device
3.3-V Power
Management
+3V3
Shunt
5-V & 3.3-V Isolation
Boundary
+5V0
Shunt 1
+5V0
Shunt 2
PWR & GND
Isolation Boundary
+3V3_MCU
XDS110 Side
MCU Side
+5V0 and GND shunts to enable
or break isolation boundary
Shunts to disconnect +5 V
and/or +3.3 V between
XDS110 and MCU sides
+3.3-V power
only flows from
XDS110 to MCU
side
+5-V power can flow
from either the
XDS110 or MCU
sides
GND
Shunt
+5V0_MCU
JP1
JP2
+5V0_USB +5V0_XDS110
+3V3_XDS110
+5V0 +3V3
+3V3_XDS110
Figure 3-2. LaunchPad Power Distribution Diagram
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3.3-V Plane 1 (XDS110 side)
USB Type C™
Connection
USB
Isolator
Device XDS110 – MSP432
device & Circuitry
5V
Shunt 1
3.3-V Power
Management
SCI & JTAG Shunts
USB
ESD
Device
Isolation Boundary
3.3-V & 5-V Isolation
Boundary
+5V0_MCU
5-V Shunt 2 3.3-V
Shunt
XDS110 14-pin
Connector
+3V3_MCU
GND
Shunt
5 V and USB Plane
3.3-V Plane 2
(F280015x side)
Connector Supports the
Following:
4-pin JTAG
XDS110 Reset OUT
UART/SCI
3.3-V PWR / GND
Figure 3-3. LaunchPad Power Plane Diagram
Table 3-1 describes the usage of the different removable shunts on the LaunchPad board.
Table 3-1. Power Domain Shunts
Shunt Identifier Usage Description
JP1, +5V0 Connects the +5-V power from the USB-C connector (+5V0_USB) to the +5-V power on the
XDS110 side of the board (+5V0_XDS110). Bridges the power and ground isolations between the
two board sides.
JP1, GND Connects the board Ground on the isolated USB-C connector side of the board (USB_GND) to the
rest of the board ground (GND). Bridges the power and ground isolations between the two board
sides.
JP2, +5V0 Connects the +5-V power on the XDS110 side of the board (+5V0_XDS110) to the +5-V power on
the F2800157 side of the board (+5V0_MCU).
JP2, +3V3 Connects the +3.3-V power on the XDS110 side of the board (+3V3_XDS110) to the +3.3-V power
on the F2800157 side of the board (+3V3_MCU).
3.1.3 LEDs
Power indicator LEDs (red) are included on the F280015x LaunchPad board. Table 3-2 shows descriptions of
each LED.
Two user LEDs are provided on the board: LED4 (red) and LED5 (green). These user LEDs are connected to
GPIO20 and GPIO22 of the F2800157, respectively. The signals are connected to the SN74LVC2G07DBVR
LED driver IC and are connected in an active-low configuration; that is, drive the GPIO low to turn on the LED
and high to turn the LED off. These LEDs are dedicated for use by the software application.
Two blue LEDs, LED2 and LED3, are connected to the XDS110 debug probe. These indicate debugger activity
and are not controllable by any application software.
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Table 3-2. Power LED Indication Descriptions
LED Number Indication Description
LED7 +5-V power from the USB Type-C™ connector
LED0 +3.3-V power on the XDS110 side of the PCB
LED1 +3.3-V power on the F280015x side of the PCB
LED6 +5 V-power on the F280015x side of the PCB
3.1.4 Encoder Connectors
The F280015x LaunchPad includes two headers, J12 and J13, which are used for connecting linear or rotary
incremental encoders. These headers take the 5-V input signals that are stepped down to 3.3 V and wired to
the F2800157 MCU. These signals are connected to the eQEP modules on the device when switch S5 is set
appropriately, see Table 3-5. Each header has the EQEPA, EQEPB, and EQEPI signals available for each eQEP
module (1 and 2) as well as pins for GND and 5 V.
3.1.5 Controller Area Network (CAN)
The F280015x LaunchPad includes a connector (J14) for a Controller Area Network (CAN). GPIO4 and GPIO5
are routed from the F2800157PN to J14 through the on-board CAN Transceiver. Both standard CAN and
CAN-FD Mux options exist on these F280015x device pins. Switch S4 is used to route GPIO4 and GPIO5 to
either the CAN transceiver and connector or the boosterpack headers. The F280015x LaunchPad also features
a jumper (JP9) that can be used to easily connect and disconnect the CAN termination resistor. For more details,
see Section 3.3.4.
3.1.6 Boot Modes
The F2800157 boot ROM contains bootloading software that executes every time the device is powered on or
reset. Two pins, GPIO24 and GPIO32, are wired to the Boot Select switch (S3). By default, both pins are set
HIGH (1) so the device boots from Flash, see Table 3-3. For more information on the F280015x boot modes, see
TMS320F280015x Real-Time Microcontrollers.
Table 3-3. Boot Select Switch Table - S3
Boot Mode GPIO24 (LEFT) GPIO32 (RIGHT)
Boot from Parallel GPIO 0 0
Boot from SCI / Wait boot 0 1
Boot from CAN 1 0
Boot from Flash (default) 1 1
3.1.7 BoosterPack Sites
The F280015x LaunchPad features two fully independent BoosterPack XL connectors. Both BoosterPack sites
1 and 2 are compliant with the BoosterPack standard. To expand the functions available to the user on this
LaunchPad, some signals are also routed to alternate locations on the board. These alternate routes can be
selected by manipulating the on-board switches or by adding and removing 0-ohm resistors. This is described in
Section 3.3.
The GPIO pin numbers as well as the BoosterPack compliant features can be viewed in the LAUNCHXL-
F2800157 LaunchPad Kit Pinout Map. Each GPIO has multiple functions available through the F280015x device
GPIO mux. Some specific functions have been listed in the Pinout Map; the full GPIO mux table can be found in
TMS320F280015x Real-Time Microcontrollers.
All of the analog signals (denoted ADCIN) of the F280015x MCU are routed to the J1/J3 and J5/J7 BoosterPack
headers on the left side of the board. Close to the respective BoosterPack header each ADC input signal has
component pads for a series resistor and parallel capacitor to create an RC filter. By default, a 0-ohm resistor
is populated and the capacitor is left unpopulated. Users can populate these components with specific values to
filter out noise arriving at the device ADC input.
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3.1.8 Analog Voltage Reference Header
The analog subsystem of the F280015x allows for flexible voltage reference sources. The ADC modules are
referenced to the VREFHIx and VREFLOx pin voltages. VREFHIx can either be driven externally or can be
generated by an internal bandgap voltage reference. An external voltage can be supplied to header J15 as an
external voltage source for VREFHIx. Note that there is no signal conditioning circuitry in place for the voltage
reference. For best performance, some additional circuitry can be required.
3.1.9 Other Headers and Jumpers
The LaunchPad has multiple jumpers to select different power sources for the board. This LaunchPad also
provides a way to isolate the connected USB from the device, allowing for safe operation and debugging in
higher voltage applications.
3.1.9.1 USB Isolation Block
JP1 is provided to enable isolation between the device and the connected USB in higher-voltage applications.
The area of isolation is defined by the white outline in the upper-left corner of the LaunchPad. JP1 has two
removable shunts to separate the GND and 5 V power of the USB region and the XDS110 and F280015x MCU
region of the LaunchPad. By default, both shunts are populated and the power is supplied by the connected
USB, meaning that the USB is not isolated from the XDS110 and F280015x MCU regions. If power isolation is
desired, remove the supplied shunts from JP1. In this configuration, one of the two external power options below
are required:
• An external 5-V supply to power the 3.3 V LDO (TPS7A3701), which provides 3.3 V to the XDS110 and
F280015x MCU regions of the board.
• An external 3.3-V supply to power the XDS110 and F280015x MCU regions of the board.
Some applications do not require 5 V to be supplied to the MCU region. In an isolated power application with
JP1 shunts removed, supplying 5 V to the XDS110 and F280015x MCU regions is optional.
3.1.9.2 BoosterPack Site 2 Power Isolation
JP8 is included to isolate 3.3 V and 5 V from the BoosterPack site 2 headers. This can be required if two
BoosterPacks are simultaneously connected to the LaunchPad and both provide power to the LaunchPad. If this
is the case, power can be isolated by removing the shunts on JP8 and there is no contention between the two
BoosterPacks.
3.1.9.3 Alternate Power
Additional jumpers are provided outside of the BoosterPack connector for additional external power connections
for 3.3 V or 5 V. These can be used to supply an external board or for powering the LaunchPad with an external
supply. When using these connection points, make sure that no other power supplies are connected.
•JP4 and JP6 are provided as extra connection points for a 3.3-V supply to be connected to the LaunchPad.
•JP5 and JP7 are provided as extra connection points for a 5-V supply to be connected to the LaunchPad.
CAUTION
The F280015x LaunchPad features a VDD pin located on header JP4 that can only be used to
monitor the voltage of the 1.2-V VDD rail of the TMS320F2800157PN device. This pin can not be
used to supply power to an external device nor connected to an external supply.
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3.2 Debug Interface
3.2.1 XDS110 Debug Probe
The F280015x LaunchPad includes an on-board XDS110 Debug Probe. The XDS110 allows for the
programming and debugging of the F2800157 using Code Composer Studio (CCS) IDE, or any other supported
tool chains. In the default configuration, the XDS110 is only wired to support 2-pin cJTAG mode. This uses only
the TMS and TCK JTAG pins and allows the TDI and TDO pins of the F280015x device to be reallocated for
other application needs. TDI and TDO are available on GPIO35 and GPIO37. These pins are not routed to the
debug probe by default, but can be connected by populating resistors R34 and R36.
3.2.2 XDS110 Output
The connector J102 is provided to debug an external target with the on-board XDS110 debug probe. This
connector allows the LaunchPad to be used as a stand-alone XDS110 debug probe. For mating connector and
cable, see Samtec FFSD or equivalent.
If the LaunchPad is being used in this manner, make sure that all of the jumpers are removed from J101. This
isolates the JTAG signals from going to the F2800157 MCU. The UART TX and RX signals from the XDS110
device are also included on this connector.
3.2.3 Virtual COM Port
When plugged into a USB host, the XDS110 enumerates as both a debugger and a virtual COM port. J101
allows the user to connect the SCI UART from the F2800157 to the debug probe to be passed on to the USB
host. By default, the F280015x SCIA maps to the virtual COM port of the XDS110 using GPIO28 and GPIO29.
Alternately, GPIO23 and GPIO40 can be used for SCIB. This is accomplished by manipulating the on-board
switch S2. For the appropriate switch settings, see Section 3.3.2.
3.3 Alternate Routing
3.3.1 Overview
The F2800157 MCU is a very versatile device in a mid-size package. To balance compatibility with BoosterPack
standards, as well as showcasing the versatility of the F2800157, some complexity was added to the design.
Most features aligning with the BoosterPack standard are available by default. The additional functions are
configured using switches or static resistors that can be added or removed. This section covers the alternate
functions and how to enable them. Note that by enabling certain alternate features, standard BoosterPack
functionality can be lost. The switches and resistors are configured such that it is not possible to connect multiple
functions to the same header.
3.3.2 UART Routing
This LaunchPad allows for one of two sets of pins to be used for the SCIA UART routed to the virtual COM port
of the XDS110. By default, GPIO28 (SCIA_RX) and GPIO29 (SCIA_TX) are routed to the virtual COM port and
not available on the BoosterPack connector. Alternately, GPIO23 (SCIB_RX) and GPIO40 (SCIB_TX) can be
routed to the virtual COM port. When UART functionality is not needed at the virtual COM port, the GPIOs can
be routed to the BoosterPack connectors for BoosterPack standard functions.
The routing destination of these signal pairs are selected using the on-board switch S2, as described in Table
3-4.
Table 3-4. SCI UART Select Table - S2
SEL1 (Left) SEL2 (Right) GPIO28/29 GPIO23/40
0 0 XDS110 COM Port BP Headers
0 1 XDS110 COM Port No Connect
1 0 BP Headers BP Headers
1 1 BP Headers XDS110 COM Port
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3.3.3 EQEP Routing
The LaunchPad has the ability to connect to two independent linear or rotary encoders through the F280015x
on-chip eQEP interfaces: Header J12 is connected to eQEP1 and header J13 is connected to eQEP2. By
default, this connection is not active and the GPIOs are routed to the BoosterPack connectors. The 5 V eQEP
input signals from the J12 and J13 connectors are stepped down through a TI SN74LVC8T245 Level Translator
(U13) to 3.3 V. The signals are then routed through TI SN74LV4053A Triple 2-Channel Analog Multiplexer/
Demultiplexer ICs (U11/U14). Switch S5 controls the select inputs of the ICs to configure the eQEP signal
destinations to be either the J12/J13 connectors or BoosterPack headers, as described in Table 3-5.
Table 3-5. QEP Select Table - S5
QEP1 SEL (LEFT) QEP2 SEL (RIGHT)
QEP1 Signals
(GPIO20/21/43)
QEP2 Signals
(GPIO14/33/26)
0 (down) 0 (down) J12 J13
0 (down) 1 (up) J12 BP Headers
1 (up) 0 (down) BP Headers J13
1 (up) 1 (up) BP Headers BP Headers
3.3.4 CAN Routing
The LaunchPad can be connected to a CAN bus through J14. GPIO4 and GPIO5 are routed to the on-board TI
TCAN332DR 3.3V CAN Transceiver, U15. By setting S4 to DOWN (on), GPIO4 and GPIO5 are routed to the
transceiver. If S4 is set to UP (off), the GPIOs are routed to the BoosterPack connectors (default case).
3.3.5 X1/X2 Routing
The F2800157 crystal oscillator output signal, X2, is multiplexed with GPIO18 and the crystal oscillator input,
X1, is multiplexed with GPIO19. By default, the Launchpad uses an on-board crystal oscillator, Y2, as the clock
source for the on-chip Phase-Locked Loop (PLL) that requires both X1 and X2 signals of the MCU. To balance
the requirement of having cleanly routed oscillator signals and bringing all possible GPIOs to the BoosterPack
connectors, both GPIO18/X2 and GPIO19/X1 can be routed to the BoosterPack connectors through 0 Ω
resistors. If GPIO18 or GPIO19 are needed at the BoosterPack connectors, the on-chip zero-pin oscillators
must be used as the clock source for the on-chip PLL. For more information on the X1/X2 configurations, see
TMS320F280015x Real-Time Microcontrollers.
If GPIO18 functionality is needed at the BoosterPack Connector:
1. Remove R10 to separate GPIO18 from Y2.
2. Populate R12 to connect GPIO18 to the BoosterPack connector
If GPIO19 functionality is needed at the BoosterPack Connector:
1. Remove R11 to separate GPIO19 from Y2.
2. Populate R13 to connect GPIO19 to the BoosterPack connector.
3.3.6 PWM DAC
The LaunchPad provides two PWM DAC signals at the BoosterPack headers using GPIO22 (BP pin 30) and
GPIO31 (BP pin 70) buffered outputs through U18. The intended purpose of the PWM DAC signals are to utilize
PWMs of the F280015x device as digitial-to-analog converters (DAC). This method involves low-pass filtering
the PWM signal to remove the high-frequency components and ideally leave only the DC component. For more
information, see Using PWM Output as a Digital-to-Analog Converter on a TMS320F280x Digital Signal Control.
By default, GPIO22 and GPIO31 are connected to the U18 dual buffer through 0-ohm resistors R78 and R83 for
the PWM DAC outputs. These resistors can be removed to disconnect the signals from U18 and PWM DAC pins
as needed.
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4 Board Design
The entire LAUNCHXL-F2800157 design files are available for download at this link: LAUNCHXL-F2800157
design files.
4.1 Schematic
The LaunchPad's schematic can be found at this link: LAUNCHXL-F2800157 Schematic.
4.2 PCB Layout
The layout source files for the LAUNCHXL-F2800157 are included in the LAUNCHXL-F2800157 design files
download.
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Figure 4-1. Top Signal - Layer 1
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Figure 4-2. GND - Layer 2
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Figure 4-3. PWR - Layer 3
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Figure 4-4. Bottom Signal - Layer 4
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