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TableofContents
1.Overview..............................................................................................................................11
1.1KeyFeatures...............................................................................................................11
1.2FunctionalOverview..................................................................................................12
1.3BasicOperation..........................................................................................................12
1.4BootModeandBootConfigurationSwitchSetting..................................................13
1.5PowerSupply.............................................................................................................14
2.IntroductiontotheTMDSEVM6678Lboard........................................................................15
2.1MemoryMap.............................................................................................................15
2.2EVMBootModeandBootConfigurationSwitchSettings........................................18
2.3JTAG‐EmulationOverview........................................................................................18
2.4ClockDomains............................................................................................................19
2.5I2CBootEEPROM/SPINORFlash.............................................................................20
2.6FPGA...........................................................................................................................21
2.7GigabitEthernetConnections....................................................................................22
2.8SerialRapidIO(SRIO)Interface..................................................................................22
2.9DDR3ExternalMemoryInterface..............................................................................23
2.1016‐bitAsynchronousExternalMemoryInterface(EMIF‐16)...................................23
2.11HyperLinkInterface..................................................................................................24
2.12PCIeInterface...........................................................................................................25
2.13TelecomSerialInterfacePort(TSIP)........................................................................25
2.14UARTInterface.........................................................................................................26
2.15ModuleManagementController(MMC)forIPMI..................................................26
2.16ExpansionHeader....................................................................................................27
3.TMDSEVM6678LBoardPhysicalSpecifications...................................................................28
3.1BoardLayout..............................................................................................................28
3.2ConnectorIndex.........................................................................................................29
3.2.1560V2_PWR1,XDS560v2MezzaninePowerConnector..............................30
3.2.2AMC1,AMCEdgeConnector.......................................................................30
3.2.3COM1,UART3PinConnector.......................................................................32
3.2.4COM_SEL1,UARTRouteSelectConnector..................................................32
3.2.5DC_IN1,DCPowerInputJackConnector.....................................................33
3.2.6EMU1,TI60‐PinDSPJTAGConnector..........................................................33
3.2.7FAN1,FANConnector...................................................................................34
3.2.8HyperLink1,HyperLinkConnector...............................................................35
3.2.9LAN1,EthernetConnector...........................................................................37
3.2.10PMBUS1,PMBUSConnectorforSmart‐ReflexControl.............................37
3.2.11TAP_FPGA1,FPGAJTAGConnector(ForFactoryUseOnly).......................38
3.2.12SBW_MMC1,MSP430SpyBiWireConnector(ForFactoryUseOnly).......39
3.2.13TEST_PH1,ExpansionHeader(EMIF‐16,SPI,GPIO,TimerI/O,I2C,and
UART).......................................................................................................................39
3.2.14USB1,Mini‐USBConnector........................................................................41
3.3DIPandPushbuttonSwitches....................................................................................41