Texas Instruments LaunchPad MSP430FR2311 User manual

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MSP430FR2311 LaunchPad™ Development Kit (MSP ‑ EXP430FR2311)
User's Guide
SLAU664B–February 2016–Revised August 2017
MSP430FR2311 LaunchPad™ Development Kit
(MSP ‑‑ EXP430FR2311)
Figure 1 shows the MSP430FR2311 LaunchPad™ development kit.
Figure 1. MSP430FR2311 LaunchPad Development Kit

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Contents
1 Getting Started............................................................................................................... 3
2 Hardware...................................................................................................................... 5
3 Software Examples ........................................................................................................ 14
4 Resources................................................................................................................... 17
5 FAQ .......................................................................................................................... 22
6 Schematics.................................................................................................................. 23
List of Figures
1 MSP430FR2311 LaunchPad Development Kit .......................................................................... 1
2 MSP-EXP430FR2311 Overview........................................................................................... 5
3 MSP-EXP430FR2311 Block Diagram..................................................................................... 5
4 MSP430FR2311 MCU PW20 Pinout...................................................................................... 6
5 eZ-FET Emulator ............................................................................................................ 7
6 eZ-FET Isolation Jumper Block Diagram................................................................................. 9
7 Application Backchannel UART in Device Manager .................................................................... 9
8 MSP-EXP430FR2311 Power Block Diagram........................................................................... 10
9 LaunchPad Development Kit To Boosterpack Plug-in Module Connector Pinout................................. 13
10 TI Resource Explorer Cloud .............................................................................................. 17
11 CCS Cloud .................................................................................................................. 18
12 Directing the Project>Import Function to the Demo Project.......................................................... 19
13 When CCS Has Found the Project ...................................................................................... 19
14 Using TI Resource Explorer to Browse MSPWare .................................................................... 21
15 Schematics (1 of 6) ........................................................................................................ 23
16 Schematics (2 of 6) ........................................................................................................ 24
17 Schematics (3 of 6) ........................................................................................................ 25
18 Schematics (4 of 6) ........................................................................................................ 26
19 Schematics (5 of 6) ........................................................................................................ 27
20 Schematics (6 of 6) ........................................................................................................ 28
List of Tables
1 EnergyTrace Software ...................................................................................................... 7
2 Isolation Block Connections................................................................................................ 8
3 Hardware Change Log .................................................................................................... 13
4 Software Examples ........................................................................................................ 14
5 IDE Minimum Requirements for MSP-EXP430FR2311............................................................... 14
6 Source File and Folders................................................................................................... 14
7 Source File and Folders................................................................................................... 15
8 Source File and Folders................................................................................................... 16
9 How MSP Device Documentation is Organized........................................................................ 21
Trademarks
LaunchPad, BoosterPack, Code Composer Studio, EnergyTrace, MSP430, MSPWare, ControlSUITE,
TivaWare, E2E are trademarks of Texas Instruments.
IAR Embedded Workbench, C-SPY are registered trademarks of IAR Systems.
All other trademarks are the property of their respective owners.

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1 Getting Started
1.1 Introduction
The MSP430FR2311 LaunchPad™ Development Kit (MSP-EXP430FR2311) is an easy-to-use evaluation
module (EVM) for the MSP430FR2311 MCU. It contains everything needed to start developing on the
ultra-low-power MSP430FRx FRAM microcontroller platform, including onboard emulation for
programming, debugging, and energy measurements. The board features onboard buttons and LEDs for
quick integration of a simple user interface as well as an analog photodiode to showcase the integrated
analog peripherals. The MSP430FR2311 MCU device is the world's first MCU with a configurable low-
leakage current sense amplifier, with 50-pA current leakage and 4KB of embedded FRAM (ferroelectric
random access memory), a nonvolatile memory known for its ultra-low power, high endurance, and high-
speed write access.
Rapid prototyping is simplified by the 20-pin BoosterPack™ plug-in module headers, which support a wide
range of available BoosterPack plug-in modules. You can quickly add features like wireless connectivity,
graphical displays, environmental sensing, and much more. Design your own BoosterPack plug-in module
or choose among many already available from TI and third-party developers.
The out-of-box experience provided with the MSP-EXP430FR2311 MCU LaunchPad development kit
features the onboard analog photodiode. The current from the photodiode is converted by an integrated
operational amplifier to a voltage. That voltage is then sensed by an analog-to-digital converter and fed to
a timer module to pulse width modulate LED2. As more light hits the photodiode, LED2 brightens, and as
less light hits the photodiode, LED2 dims.
Free software development tools are also available, such as TI's Eclipse-based Code Composer Studio™
integrated development environment (IDE) and IAR Embedded Workbench®IDE. Both of these IDEs
support EnergyTrace™ technology for real-time power profiling and debugging when paired with the
MSP430FR2311 MCU LaunchPad development kit. More information about the LaunchPad development
kit, the supported BoosterPack plug-in modules, and available resources can be found on TI's LaunchPad
ecosystem portal.
The MSP-EXP430FR2311 is based on Experimental Silicon. The MSP430FR2311IPW20 device used in
this version of the MSP-EXP430FR2311 is a prototype device and has not met or completed Texas
Instruments internal reliability qualification requirements. The device used in this development kit is for
prototyping purposes only and is not intended to be used in production systems. Therefore, the device is
used on an "as is" basis and Texas Instruments makes no warranty of fitness for a specific purpose.
1.2 Key Features
• MSP430™ ultra-low-power FRAM technology based the MSP430FR2311 16-bit MCU
• EnergyTrace software available for ultra-low-power debugging
• 20 pin LaunchPad development kit standard leveraging the BoosterPack ecosystem
• Onboard eZ-FET emulation
• Two buttons and two LEDs for user interaction
1.3 What's Included
1.3.1 Kit Contents
• 1x MSP-EXP430FR2311 MCU LaunchPad development kit
• 1x micro USB cable
• 1x quick start guide
1.3.2 Software Examples
• Out-of-box software
• Blink LED
• Software I2C

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1.4 First Steps: Out-of-Box Experience
An easy way to get familiar with the EVM is by using its preprogrammed out-of-box code. This code
demonstrates some key features from a user level.
1.4.1 Connecting to the Computer
Connect the LaunchPad development kit using the included USB cable to a computer. A green power LED
should illuminate. For proper operation, drivers are needed. TI recommends installing the TI Code
Composer Studio IDE or IAR Embedded Workbench for MSP430 IDE. Drivers are also available at
ti.com/MSPdrivers.
1.4.2 Running the Out-of-Box Demo
When connected to your computer, the LaunchPad development kit powers up and LED2 dims based on
the amount of ambient light hitting the photo diode, D1. Use a light source such as a flashlight or desk
lamp to illuminate D1 and the brightness of LED2 should increase depending on the intensity of the light
source.
1.5 Next Steps: Looking Into the Provided Code
After the EVM features have been explored, the fun can begin. It's time to open an integrated
development environment and start editing the code examples. Refer to Section 4 for available IDEs and
where to download them.
The quickest way to get started using the LaunchPad development kit is to use TI's Cloud Development
Tools,dev.ti.com. The cloud-based Resource Explorer provides access to all of the examples and
resources in MSPWare™ software. Code Composer Studio IDE Cloud is a simple Cloud-based IDE that
enables developing and running applications on the LaunchPad development kit.
The out-of-box source code and more code examples are provided for download from
www.ti.com/tool/msp-exp430fr2311. Code is licensed under BSD, and TI encourages reuse and
modifications to fit specific needs.
Section 3 describes all functions in detail and provides a project structure to help familiarize you with the
code.
Using the onboard eZ-FET emulator, debugging and downloading new code is simple. A USB connection
between the EVM and a PC through the provided USB cable is all that is needed.

T arge t D e vic e
M S P 4 3 0 F R 23 11
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En erg yT ra c e
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2 Hardware
Figure 2 shows an overview of the MSP-EXP430FR2311 hardware.
Figure 2. MSP-EXP430FR2311 Overview
2.1 Block Diagram
Figure 3 shows the block diagram.
Figure 3. MSP-EXP430FR2311 Block Diagram

P1.1/UCB0CLK/ACLK/C1/A1
P1.0/UCB0STE/SMCLK/C0/A0/Veref+
TEST/SBWTCK
RST/NMI/SBWTDIO
DVCC
DVSS
P2.7/TB0CLK/XIN
P2.6/MCLK/XOUT P2.1/TB1.2
P2.0/TB1.1/COUT
P1.7/ /TB0.2/TDO/TRI0+/A7UCA0TXD/UCA0SIMO /VREF+
P1.5/ /TMS/TRI0O/A5UCA0CLK
P1.4/ /TCK/OA0+/A4UCA0STE
P1.3/UCB0SOMI/UCB0SCL/OA0O/A3
P1.2/UCB0SIMO/UCB0SDA/ OA0-/A2/Veref-TB0TRG/
P1.6/ /TB0.1/TDI/TCLK/TRI0-/A6UCA0RXD/UCA0SOMI
MSP430FR2311IPW20
MSP430FR2310IPW20
1
2
3
4
5
6
7
8
9
10 11
12
13
14
15
16
17
18
19
20
P2.5/UCB0SOMI/UCB0SCL
P2.4/UCB0SIMO/UCB0SDA P2.3/UCB0CLK/TB1TRG
P2.2/UCB0STE/TB1CLK
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2.2 Hardware Features
2.2.1 MSP430FR2311 MCU
The MSP430FR2311 MCU is the next device in TI's new ultra-low-power FRAM technology platform.
FRAM is a cutting edge memory technology, combining the best features of flash and RAM into one
nonvolatile memory.
Device features include:
• 1.8-V to 3.6-V operation
• 16-bit RISC architecture with up to 16-MHz system clock and 8-MHz FRAM access
• Up to 3.75KB of nonvolatile FRAM
• 126-µA/MHz active mode and 1-µA standby with RTC
• 8-channel 10-bit ADC
• Operational amplifier that supports multiple modes
• Enhanced comparator with integrated 6-bit DAC as reference voltage
• Transimpedance amplifier
• Three timers
• Direct memory access
• 16 GPIOs
Figure 4. MSP430FR2311 MCU PW20 Pinout

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2.2.2 eZ-FET Onboard Emulator With EnergyTrace™ Software
To keep development easy and cost effective, TI's LaunchPad development kits integrate an onboard
emulator, which eliminates the need for expensive programmers. The MSP-EXP430FR2311 has the eZ-
FET emulator (see Figure 5), which is a simple and low-cost debugger that supports all MSP430 MCU
derivatives.
Figure 5. eZ-FET Emulator
The MSP-EXP430FR2311 MCU LaunchPad development kit features EnergyTrace software. The
EnergyTrace software functionality varies across the MSP portfolio.
Table 1. EnergyTrace Software
Features EnergyTrace Software EnergyTrace++ Software
Current monitoring ✔ ✔
CPU State ✔
Peripheral and system state ✔
Devices supported All MSP430 MCUs MSP430FR59xx and FR69xx
MCUs
Development tool required MSP-FET or eZ-FET MSP-FET or eZ-FET
The eZ-FET also provides a "backchannel" UART-over-USB connection with the host, which can be very
useful during debugging and for easy communication with a PC. The provided UART supports hardware
flow control (RTS and CTS), although by default these signals are not connected to the target.
The dotted line through J101 shown in Figure 5 divides the eZ-FET emulator from the target area. The
signals that cross this line can be disconnected by jumpers on J101, the isolation jumper block. More
details on the isolation jumper block are in Section 2.2.3.
The eZ-FET hardware can be found in the schematics in Section 6 and in the accompanying hardware
design files. The software and more information about the debugger can be found on the eZ-FET wiki.

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2.2.3 Emulator Connection: Isolation Jumper Block
The isolation jumper block at jumper J101 allows the user to connect or disconnect signals that cross from
the eZ-FET domain into the MSP430FR2311 MCU target domain. This includes eZ-FET Spy-Bi-Wire
signals, application UART signals, and 3.3-V and 5-V power.
Reasons to open these connections:
• To remove any and all influence from the eZ-FET emulator for high-accuracy target power
measurements
• To control 3-V and 5-V power flow between the eZ-FET and target domains
• To expose the target microcontroller pins for other use than onboard debugging and application UART
communication
• To expose the programming and UART interface of the eZ-FET so that it can be used for devices other
than the onboard microcontroller
(1) Also see Figure 6.
Table 2. Isolation Block Connections(1)
Jumper Description
GND Ground
5V 5-V VBUS from USB
3V3 3.3-V rail, derived from VBUS in the eZ-FET domain
RXD << Backchannel UART: The target FR2311 receives data through this signal. The arrows indicate the direction of the
signal.
TXD >> Backchannel UART: The target FR2311 sends data through this signal. The arrows indicate the direction of the
signal.
SBW RST Spy-Bi-Wire emulation: SBWTDIO data signal. This pin also functions as the RST signal (active low).
SBW TST Spy-Bi-Wire emulation: SBWTCK clock signal. This pin also functions as the TST signal.

eZ-FET
Debug
Probe
Isolation
Jumper Block
Spy-Bi-Wire (SBW) Emulation
Application UART
3.3V Power
5V Power
Target MSP430
MCU
eZ-FETMSP430 Target
USB Connector
in out
LDO
BoosterPack Header
BoosterPack Header
USB
EnergyTrace
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Figure 6. eZ-FET Isolation Jumper Block Diagram
2.2.4 Application (or "Backchannel") UART
The backchannel UART allows communication with the USB host that is not part of the target application's
main functionality. This is very useful during development, and also provides a communication channel to
the PC host side. This can be used to create graphical user interfaces (GUIs) and other programs on the
PC that communicate with the LaunchPad development kit.
Figure 6 shows the pathway of the backchannel UART. The backchannel UART is the UART on
eUSCI_A0.
On the host side, a virtual COM port for the application backchannel UART is generated when the
LaunchPad development kit enumerates on the host. You can use any PC application that interfaces with
COM ports, including terminal applications like Hyperterminal or Docklight, to open this port and
communicate with the target application. You need to identify the COM port for the backchannel. On
Windows PCs, Device Manager can assist.
Figure 7. Application Backchannel UART in Device Manager

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The backchannel UART is the "MSP Application UART1" port. In this case, Figure 7 shows COM13, but
this port can vary from one host PC to the next. After you identify the correct COM port, configure it in
your host application according to its documentation. You can then open the port and begin
communication to it from the host.
On the target MSP430FR2311 MCU side, the backchannel is connected to the eUSCI_A0 module. The
eZ-FET has a configurable baud rate; therefore, it is important that the PC application configures the baud
rate to be the same as what is configured on the eUSCI_A0.
2.2.5 Special Features
2.2.5.1 Smart Analog Combo (SAC)
The MSP430FR2311 MCU LaunchPad development kit features pins to access the smart analog combo
on the device. These pins are accessed on jumpers J7, J8 and J9 where the smart analog combo
operational amplifier is connected to the onboard photodiode circuit. These pins are also connected to the
BoosterPack plug-in module header pins. For applications that use the SAC and a connected BoosterPack
plug-in module, be sure to check for any pin conflicts. The photodiode circuit can be disconnected from
the SAC using jumpers J7, J8 and J9. The user can connect an external analog sensor circuit to the SAC
by removing jumpers J7, J8 and J9 and connecting their circuit to the appropriate header pins through the
BoosterPack plug-in module headers or the jumpers near the light sensor circuit.
To adjust the light sensor circuits' sensitivity the user can adjust either the software or the hardware. By
changing the value of R3 and C6 the user can change the operational amplifiers low-pass filter and
sensitivity to the photodiodes current. The user can also adjust the calculations performed in the software
to adjust the sensitivity of the circuit to their desired level.
2.3 Power
The board was designed to accommodate various powering methods, including through the onboard eZ-
FET as well as external or BoosterPack power (see Figure 8).
Figure 8. MSP-EXP430FR2311 Power Block Diagram

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2.3.1 eZ-FET USB Power
The most common power-supply scenario is from USB through the eZ-FET debugger. This provides 5-V
power from the USB and also regulates this power rail to 3.3 V for eZ-FET operation and 3.3 V to the
target side of the LaunchPad development kit. Power from the eZ-FET is controlled by jumper J101. For
3.3 V, make sure that a jumper is connected across the J101 3V3 terminal.
2.3.2 BoosterPack Plug-In-Module and External Power Supply
Header J5 is present on the board to supply external power directly. It is important to comply with the
device voltage operation specifications when supplying external power. The MSP430FR2311 MCU has an
operating range of 1.8 V to 3.6 V. More information can be found in MSP430FR231x Mixed-Signal
Microcontrollers.
2.4 Measure MSP430 MCU Current Draw
To measure the current draw of the MSP430FR2311 MCU using a multi-meter, use the 3V3 jumper on the
jumper isolation block. The current measured includes the target device and any current drawn through
the BoosterPack headers.
To measure ultra-low power, follow these steps:
1. Remove the 3V3 jumper in the isolation block, and attach an ammeter across this jumper.
2. Consider the effect that the backchannel UART and any circuitry attached to the MSP430FR2311 MCU
may have on current draw. Consider disconnecting these at the isolation jumper block, or at least
consider their current sinking and sourcing capability in the final measurement.
3. Make sure there are no floating inputs/outputs (I/Os). These cause unnecessary extra current draw.
Every I/O should either be driven out or, if it is an input, should be pulled or driven to a high or low
level.
4. Begin target execution.
5. Measure the current. Keep in mind that if the current levels are fluctuating, it may be difficult to get a
stable measurement. It is easier to measure quiescent states.
EnergyTrace software allows you to compare various current profiles and better optimize your energy
performance!
2.5 Clocking
The MSP-EXP430FR2311 provides an input for an external clock in addition to the internal clocks in the
device. No crystal is populated by default to allow all pins to connect to the BoosterPack header. The user
can choose to populate any 32.768 kHz crystal that will fit onto the provided footprint. One option is
recommended below:
• Y1: 32-kHz Epson FC-135R 12.5pF crystal, Part #: X1A0001410014
The 32-kHz crystal allows for lower LPM3 sleep currents than do the other low-frequency clock sources.
Therefore, the presence of the crystal allows the full range of low-power modes to be used. If using the
external Y1 crystal footprint the user will need to remove the 0-ohm resistors R4 and R5 and populate C2
and C3 with the appropriate tuning capacitors for the crystal that is used.
The internal clocks in the device default to the following configuration:
• MCLK: DCO at 1 MHz
• SMCLK: DCO at 1 MHz
• ACLK: REFO at 32.768 kHz
For more information about configuring internal clocks and using the external oscillators, see the
MSP430FR4xx and MSP430FR2xx Family User's Guide.

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2.6 Using the eZ-FET Emulator With a Different Target
The eZ-FET emulator on the LaunchPad development kit can interface to most MSP430 MCU derivative
devices, not just the onboard MSP430FR2311 MCU target device.
To do this, disconnect every jumper in the isolation jumper block. This is necessary, because the emulator
cannot connect to more than one target at a time over the Spy-Bi-Wire (SBW) connection.
Next, make sure the target board has proper connections for SBW. Note that to be compatible with SBW,
the capacitor on RST/SBWTDIO cannot be greater than 2.2 nF. The documentation for designing MSP430
MCU JTAG interface circuitry is the MSP430 Hardware Tools User's Guide.
Finally, wire together these signals from the emulator side of the isolation jumper block to the target
hardware:
• 5 V (if 5 V is needed)
• 3.3 V
• GND
• SBWTDIO
• SBWTCK
• TXD (if the UART backchannel is to be used)
• RXD (if the UART backchannel is to be used)
This wiring can be done either with jumper wires or by designing the board with a connector that plugs into
the isolation jumper block.
2.7 BoosterPack Plug-in Module Pinout
The LaunchPad development kit adheres to the 20-pin LaunchPad pinout standard. A standard was
created to aid compatibility between the LaunchPad development kit and BoosterPack plug-in module
tools across the TI ecosystem.
The 40-pin standard is compatible with the 20-pin standard that is used by other LaunchPad development
kit's like the MSP-EXP430FR6989. This allows some subset of functionality of 40-pin BoosterPack
modules to be used with 20-pin LaunchPad development kits.
While most BoosterPack plug-in modules are compliant with the standard, some are not. The MSP-
EXP430FR2311 MCU LaunchPad development kit is compatible with all 20-pin BoosterPacks plug-in
modules that are compliant with the standard. If the reseller or owner of the BoosterPack plug-in module
does not explicitly indicate compatibility with the MSP-EXP430FR2311 MCU LaunchPad development kit,
compare the schematic of the candidate BoosterPack with the LaunchPad to ensure compatibility. Keep in
mind that sometimes conflicts can be resolved by changing the MSP430FR2311 MCU pin function
configuration in software. More information about compatibility can also be found at
www.ti.com/launchpad.
Figure 9 shows the 20-pin pinout of the MSP430FR2311 MCU LaunchPad development kit.
Note that software configuration of the pin functions plays a role in compatibility. The LaunchPad
development kit side of the dashed line in Figure 9 shows all of the functions for which the
MSP430FR2311 MCU's pins can be configured. This can also be seen in the MSP430FR2311 MCU data
sheet. The BoosterPack plug-in module side of the dashed line shows the standard. The LaunchPad
development kit function whose color matches the BoosterPack plug-in module function shows the specific
software-configurable function by which the MSP430FR2311 LaunchPad development kit adheres to the
standard.

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Figure 9. LaunchPad Development Kit To Boosterpack Plug-in Module Connector Pinout
2.8 Design Files
2.8.1 Hardware
Section 6 shows the schematics. All design files including schematics, layout, bill of materials (BOM),
Gerber files, and documentation are available in the MSP-EXP430FR2311 Hardware Design Files.
2.8.2 Software
All design files including TI-TXT object-code firmware images, software example projects, and
documentation are available in the MSP-EXP430FR2311 Software Examples.
2.9 Hardware Change log
Table 3. Hardware Change Log
PCB Revision Description
1.0 Initial release
1.1 Updated rear silkscreen to current LaunchPad standards.
Added CE marking to silkscreen.

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3 Software Examples
Three software examples are included with the MSP430FR2311 MCU LaunchPad development kit (see
Table 4), which can be found in the zip source folder in the MSP-EXP430FR2311 Software Examples and
are also available inside MSPWare.
Table 4. Software Examples
Demo Name BoosterPack Plug-In Module
Required Description More Details
OutOfBox_MSP430FR2311 None The out-of-box demo preprogrammed on the LaunchPad development kit from the factory. Demonstrates features of
MSP430FR2311 MCU device. Section 3.1
BlinkLED_MSP430FR2311 None Blinks an LED on the LaunchPad development kit at a fixed
interval. Section 3.2
BOOSTXL-
EDUMKII_SoftwareI2C_
MSP430FR2311 BOOSTXL-
EDUMKII Reads digital ambient light sensor utilizing software I2C master example. Section 3.3
To use any of the software examples with the LaunchPad development kit, you must have an integrated
development environment (IDE) that supports the MSP430FR2311 microcontroller (see Table 5).
Table 5. IDE Minimum Requirements for MSP-EXP430FR2311
Code Composer Studio™ IDE IAR Embedded Workbench® IDE
Version 6.1 or later Version 6.40.2 or later
For more details on how to get started quickly, and where to download the latest Code Composer Studio
and IAR Embedded Workbench IDEs, see Section 4.1.
3.1 Out-of-Box Software Example
This section describes the functionality and structure of the out-of-box software that is preloaded on the
EVM.
This demo shows how to use the op-amp module, combined with the timer, ADC, and LED, to implement
a simple light sensor circuit for ultra-low-power applications.
Upon powering up the out-of-box demo, LED1 will toggle at startup and then LED2 will dim based on the
amount of ambient light in the area. If the user covers the photo diode, D1, with a piece of paper or their
hand the brightness of LED2 should dim based on the amount of light. If the user illuminates the photo
diode with a light source LED2 should increase in brightness until the ADC saturates and the LED reaches
full brightness. The current ADC reading is saved to FRAM memory before the device re-enters LPM3.
3.1.1 Source File Structure
The project is split into multiple files. This makes it easier to navigate and reuse parts of it for other
projects.
Table 6. Source File and Folders
Name Description
main.c The out-of-box demo main function, initializations, shared ISRs, and so on.
Library: Driverlib Device driver library

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3.1.2 Power Measurement
The MSP430FR2311 MCU is ultra-low-power and its out-of-box software provides an example of an ultra-
low-power application. To measure the applications power we will use EnergyTrace software integrated in
Code Composer Studio IDE v6.1 or later.
After importing the out-of-box project into Code Composer Studio IDE and connecting the LaunchPad
development kit, follow the instructions below. For more information on how to import a project, see
Section 4.1.2.
1. Click Debug to program the LaunchPad development kit and start the
Debug session.
2. Click Proceed on the ULP Advisor to continue to the Debug session.
3. Select View →Other →EnergyTrace →EnergyTrace software from the menu bar at the top and then
click OK.
4. Click the Set measurement duration icon and select "10 sec" from the drop-down menu.
5. Remove the following jumpers from the LaunchPad development kit:
J11 at LED2
RXD at J101
TXD at J101
6. Select Run →Free Run (Ctrl+F8) from the menu bar at the top.
7. When finished, review the power profile of the application and note the battery life of more than 400
days when using a CR2032.
3.2 Blink LED Example
This very simple software example shows how to software toggle a GPIO to blink an LED on the
LaunchPad development kit.
3.2.1 Source File Structure
The project is split into multiple files (see Table 7). This makes it easier to navigate and reuse parts of it
for other projects.
Table 7. Source File and Folders
Name Description
main.c The blink LED main function
Library: Driverlib Device driver library
The main code uses the MSP430 Driver Library to halt the watchdog timer and to configure or toggle the
GPIO pin connected to the LED inside a software loop.

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3.3 Software I2C Example
This simple software example shows how to implement software controlled I2C master communication on
the LaunchPad development kit.
3.3.1 Source File Structure
The project is split into multiple files (see Table 8). This makes it easier to navigate and reuse parts of it
for other projects.
Table 8. Source File and Folders
Name Description
main.c The out-of-box demo main function, initializations, shared ISR's, etc
MSP430_SWI2C_Master.c Main function file for software I2C master communication
opt3001.c Ambient light sensor library
Library: Driverlib Device driver library

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4 Resources
4.1 Integrated Development Environments
Although the source files can be viewed with any text editor, more can be done with the projects if they're
opened with a development environment like Code Composer Studio IDE, IAR Embedded Workbench
IDE, or Energia.
4.1.1 TI Cloud Development Tools
TI's Cloud-based software development tools provide instant access to MSPWare software content and a
web-based IDE.
4.1.1.1 TI Resource Explorer Cloud
TI Resource Explorer Cloud provides a web interface for browsing examples, libraries and documentation
found in MSPWare software without having to download files to your local drive (see Figure 10).
Go check out TI Resource Explorer Cloud now at https://dev.ti.com/.
Figure 10. TI Resource Explorer Cloud

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4.1.1.2 Code Composer Studio Cloud
Code Composer Studio Cloud (CCS Cloud) is a web-based IDE that enables you to quickly create, edit,
build, and debug applications for the LaunchPad development kit (see Figure 11). No need to download
and install large software packages, simply connect the LaunchPad development kit and begin. Select
from a large variety of examples in MSPWare software and Energia or develop your own application. CCS
Cloud supports debug features such as execution control, breakpoints, and viewing variables.
A full comparison between CCS Cloud and CCS Desktop is available at
https://dev.ti.com/about#cloudordesktop.
Go check out Code Composer Studio Cloud now at https://dev.ti.com/.
Figure 11. CCS Cloud
4.1.2 Code Composer Studio IDE
Code Composer Studio Desktop is a professional integrated development environment that supports TI's
microcontroller and embedded processors portfolio. Code Composer Studio IDE comprises a suite of tools
used to develop and debug embedded applications. It includes an optimizing C/C++ compiler, source code
editor, project build environment, debugger, profiler, and many other features.
Learn more about CCS IDE and download it at www.ti.com/tool/ccstudio.
CCS v6.1 or higher is required. When CCS has been launched, and a workspace directory chosen, use
Project>Import Existing CCS Eclipse Project. Direct it to the desired demo's project directory that contains
main.c (see Figure 12).

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Figure 12. Directing the Project>Import Function to the Demo Project
Selecting the \CCS subdirectory also works. The CCS-specific files are located there.
When you click OK, Code Composer Studio should recognize the project and allow you to import it. The
indication that Code Composer Studio has found it is that the project appears in the box shown in
Figure 13, and it has a checkmark to the left of it.
Figure 13. When CCS Has Found the Project

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Sometimes Code Composer Studio IDE finds the project but does not show a checkmark; this might mean
that your workspace already has a project by that name. You can resolve this by renaming or deleting that
project. (Even if you do not see it in the Code Composer Studio IDE workspace, be sure to check the
workspace directory on the file system.)
4.1.3 IAR Embedded Workbench for Texas Instruments MSP430
IAR Embedded Workbench for MSP430 is another very powerful integrated development environment that
allows you to develop and manage complete embedded application projects. It integrates the IAR C/C++
Compiler, IAR Assembler, IAR ILINK Linker, editor, project manager, command line build utility, and IAR
C-SPY®Debugger.
Learn more about IAR Embedded Workbench for MSP430 and download it at
supp.iar.com/Download/SW/?item=EW430-EVAL.
IAR 6.10 or higher is required. To open the demo in IAR, click File>Open>Workspace…, and browse to
the *.eww workspace file inside the \IAR subdirectory of the desired demo. All workspace information is
contained within this file.
The subdirectory also has an *.ewp project file. This file can be opened into an existing workspace by
clicking Project>Add-Existing-Project….
Although the software examples have all of the code required to run them, IAR users may download and
install MSPWare software, which contains MSP430 MCU libraries and the TI Resource Explorer. These
are already included in a Code Composer Studio IDE installation (unless the user selected otherwise).
4.1.4 Energia
Energia is a simple, open-source, and community-driven code editor that is based on the Wiring and
Arduino framework. Energia provides unmatched ease of use through very high-level APIs that can be
used across hardware platforms. Energia is a light-weight IDE that does not have the full feature set of
Code Composer Studio IDE or IAR. However, Energia is great for anyone who wants to get started very
quickly or who does not have significant coding experience.
Learn more about Energia and download it at www.energia.nu.
4.2 LaunchPad Websites
More information about the LaunchPad development kit, supported BoosterPacks plug-in modules, and
available resources can be found at:
•MSP-EXP430FR2311 Tool Folder: Resources specific to this particular LaunchPad development kit
•TI's LaunchPad development kit portal: Information about all LaunchPad development kits from TI
4.3 MSPWare Software and TI Resource Explorer
TI Resource Explorer is a tool integrated into Code Composer Studio IDE that allows you to browse
through available design resources (see Figure 14). TI Resource Explorer will help you quickly find what
you need inside packages including MSPWare software, ControlSUITE™ software, TivaWare™ software,
and more. TI Resource Explorer is well organized to find everything that you need quickly, and you can
import software projects into your workspace in one click!
TI Resource Explorer Cloud is one of the TI Cloud Development tools, and is tightly integrated with CCS
Cloud. See Section 4.1.1.2 for more information.
MSPWare software is a collection of code examples, software libraries, data sheets, and other design
resources for all MSP devices delivered in a convenient package – essentially everything developers need
to become MSP experts!
In addition to providing a complete collection of existing MSP design resources, MSPWare software also
includes a high level API called MSP Driver Library. This library makes it easy to talk to MSP hardware.
More information can be found at www.ti.com/tool/mspware.