Texas Instruments BQ25756 User manual

EVM User's Guide: BQ25756EVM
BQ25756 Evaluation Module
Description
The BQ25756EVM evaluation module (EVM) is a
complete evaluation system for the BQ25756 IC, a
buck-boost battery charge controller with a wide input
range of 4.2 V - 70 V, a wide output voltage range of
up to 70 V, and bi-directional capabilities.
The BQ25756EVM has a max input and output of 55
V and a max charge current of 10 A.
Get Started
1. Order the EVM on ti.com
2. Order the EV2400 to communicate with the EVM
3. Download the BQ25756 BQZ file
4. Download the BQ25756 EVM design files on
ti.com
Features
• Wide input voltage operating range: 4.2 V–55 V
• Wide output operating range: up to 55 V with
CC/CV support for:
– 2– to 13–Cell Li-Ion
– 2– to 14–Cell LiFePO4
• Synchronous buck-boost DC/DC charge controller
with NFET drivers
– Adjustable switching frequency from 200 kHz to
600 kHz
– Optional synchronization to external clock
– Optional gate driver supply input for optimized
efficiency
• Resistor-programmable standalone with added I2C
Mode
• Built in MPPT to maximize power from solar panel
arrays
• Power up from battery (reverse mode) output 4 V
to 55 V
• High safety integration
– Adjustable input overvoltage and undervoltage
protection
– Output Overvoltage and overcurrent protection
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1 Evaluation Module Overview
1.1 Introduction
The BQ25756EVM can be evaluated for the full 240 W range of USB Extended Power Range (EPR) and up to
13 cell Li-Ion battery charging implementing CC/CV profile. Typical applications include USB-PD extended power
range applications, docking station, monitor, and dual-battery charging.
This EVM does not include the EV2400 or USB2ANY interface device and does not provide any electrical
isolation for the digital interfaces. EV2400 or USB2ANY must be ordered separately to evaluate the
BQ25756EVM and electrical safety considerations must be considered when interfacing between the PC and
the EVM board. When interfacing the EVM to the PC through the digital interfaces, digital isolators with isolation
boundary is recommended.
The BQ25756EVM has smaller clearance and creepage than normally used on high voltage boards as well as
not having an isolation boundary. If you apply high voltage to this board, all terminals must be considered high
voltage and hazardous live. Electric shock is possible when connecting the board to live wire. The board must be
handled with care by a professional. For safety, use of isolated test equipment with various protection features
(such as overvoltage and overcurrent) is recommended.
1.2 Kit Contents
This EVM kit includes:
• 1 BQ25756 EVM
1.3 Device Information
The BQ25756EVM evaluation module (EVM) is an evaluation system for the BQ25756 IC. The BQ25756 IC is a
buck-boost battery charge controller with a wide input range of 4.2 V - 70 V, a wide output voltage range of up to
70 V, and bi-directional capabilities.
The device offers high-efficiency battery charging over a wide voltage range with output CC-CV control. The
device integrates all the loop compensation for the buck-boost converter, thereby providing a high density
method with ease of use.
Besides the I2C host-controlled charging mode, the device also supports programmable hardware limits. Input
current, and output current regulation targets can be set with single resistor on the IIN, and IOUT pins,
respectively.
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1.4 General Texas Instruments High Voltage Evaluation (TI HV EMV) User Safety Guidelines
WARNING
Always follow TI's set-up and application instructions, including use of all interface components within their
recommended electrical rated voltage and power limits. Always use electrical safety precautions to help verify
your personal safety and those working around you. Contact TI's Product Information Center http://ti.com/
customer support for further information.
Save all warnings and instructions for future reference.
WARNING
Failure to follow warnings and instructions can result in personal injury, property damage or death
due to electrical shock and burn hazards.
The term TI HV EVM refers to an electronic device typically provided as an open framed, unenclosed printed
circuit board assembly. It is intended strictly for use in development laboratory environments, solely for qualified
professional users having training, expertise and knowledge of electrical safety risks in development and
application of high voltage electrical circuits. Any other use and/or application are strictly prohibited by Texas
Instruments. If you are not suitably qualified, then you need to immediately stop from further use of the HV EVM.
1. Work Area Safety:
a. Keep work area clean and orderly.
b. Qualified observers must be present anytime circuits are energized.
c. Effective barriers and signage must be present in the area where the TI HV EVM and the interface
electronics are energized, indicating operation of accessible high voltages can be present, for the
purpose of protecting inadvertent access.
d. All interface circuits, power supplies, evaluation modules, instruments, meters, scopes, and other related
apparatus used in a development environment exceeding 50Vrms/75VDC must be electrically located
within a protected Emergency Power Off EPO protected power strip.
e. Use stable and non-conductive work surface.
f. Use adequately insulated clamps and wires to attach measurement probes and instruments. No
freehand testing whenever possible.
2. Electrical Safety:
a. As a precautionary measure, a good engineering practice to assume is that the entire EVM can have
fully accessible and active high voltages.
b. De-energize the TI HV EVM and all the inputs, outputs and electrical loads before performing any
electrical or other diagnostic measurements. Revalidate that TI HV EVM power has been safely de-
energized.
c. With the EVM confirmed de-energized, proceed with required electrical circuit configurations, wiring,
measurement equipment hook-ups and other application needs, while still assuming the EVM circuit and
measuring instruments are electrically live.
d. Once EVM readiness is complete, energize the EVM as intended.
WARNING
While the EVM is energized, never touch the EVM or the electrical circuits, as the electrical
circuits and EVM can be at high voltages capable of causing electrical shock hazard.
3. Personal Safety
a. Wear personal protective equipment e.g. latex gloves or safety glasses with side shields or protect EVM
in an adequate lucent plastic box with interlocks from accidental touch.
Limitation for safe use:
EVMs are not to be used as all or part of a production unit.
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1.4.1 General Safety Information
The following warnings and cautions are noted for the safety of anyone using or working close to the BQ25758
EVM. Observe all safety precautions.
Warning. Caution
The BQ25758EVM circuit module can become hot during operation due to
dissipation of heat. Avoid contact with the board. Follow all applicable safety
procedures applicable to your laboratory.
CAUTION
Hot surface. Contact can cause burns. Do not touch!
Warning
The BQ25758EVM has smaller clearance and creepage than normally used on
high voltage boards as well as not having an isolation boundary. If the user applies
high voltage to this board, then all terminals are considered high voltage and
hazardous live. Electric shock is possible when connecting the board to live wire.
The board needs to be handled with care by a professional. For safety, use of
isolated test equipment with various protection features (such as overvoltage and
overcurrent) is recommended.
Warning
High voltages that can cause injury exist on this evaluation module (EVM). Please
verify all safety procedures are followed when working on this EVM. Never leave a
powered EVM unattended.
Warning High voltage can be present on board capacitors after power down. Properly check
and discharge all on-board energy reservoir after EVM power down.
!
Caution Do not leave EVM powered when unattended.
CAUTION
The communication interfaces are not isolated on the EVM. The use of digital isolators is
recommended. Verify all high voltage safety precautions are observed during testing.
CAUTION
Connections for rated current must be made at the terminal block. Test points are not rated for the
board current.
CAUTION
The circuit module can be damaged by over temperature. To avoid damage, monitor the temperature
during evaluation and provide cooling, as needed, for your system environment. Do not operate
beyond the current and voltage limits in the Section 2.3.
CAUTION
Test equipment can be damaged by application of external voltages. Check your equipment
requirements and use blocking diodes or other isolation techniques, as needed, to prevent damage
to your equipment.
CAUTION
The circuit module has signal traces, components, and component leads on the bottom of the board.
This can result in exposed voltages, hot surfaces or sharp edges. Do not reach under the board
during operation.
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CAUTION
The default settings of the BQ25758 is possibly not designed for the user's application. Verify
the EVM settings are set appropriately for test setup before device power up. Set all protections
appropriately and limit current for safe operation.
CAUTION
The board has no fuse installed and relies on the external voltage source current limit to verify circuit
protection.
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2 Hardware
2.1 Board Parameters
Table 2-1. Default board setup for BQ25756EVM
Description Value Unit
ACUV Input undervoltage 4.2 V
ACOV Input overvoltage 55 V
IIN Input current of the EVM 8 A
IOUT Output current of the EVM 10 A
FSW_SYNC Switching frequency of the power stage 250 KHz
Table 2-2. PCB and Mechanical Parameters
Value Unit
Board Size (X dimension, or length) 112 mm
Board Size (Y dimension, or width) 84 mm
IC + power stage max height 5 mm
Total Copper Layers 6 layer
Copper weight per layer 2 oz
Total board thickness 62 mil
2.2 IO and Jumper Descriptions
Table 2-3. Connector/Port Description
Jack Description
J1-VIN Input: positive terminal
J1-PGND Input: negative terminal (ground terminal)
J3-VOUT Connected to battery pack output
J3-PGND Ground
J4-EXT_I2C Communication port for the USB2ANY
J5-I2C Communication port for the EV2400
J6-EXT_DRV Connection for external gate drive
J7-Power Connector Connection for VAC and BAT
J8-Communication Port Connection for EXT_DRV, /INT, I2C, /PG, and 3.3 V
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Table 2-4. Jumper Description
Jumper Description Factory Default
JP1 Use JP1 to connect the default feedback resistor and set the charger to the default 7
cell battery Installed
JP2 Use JP2 to connect a new feedback resistor to program a different cell count Not installed
JP3 Use JP3 to connect external IOUT resistor. JP3 can be shorted to PGND to disable
hardware output current limiting.
Not installed
JP4 Shunt JP4 to use default IOUT resistor. By closing JP4, the default IOUT current is
set to 10 A.
Not installed
JP5 Shunt JP5 to bias TS. Installed
JP6 With JP5 shunted (REGN connected for voltage divider). Shunt JP6 to set TS status
to normal.
Installed
JP7 With JP5 shunted (REGN connected for voltage divider). Use JP7 to connect
external resistor to change TS status.
Not installed
JP8 Use JP8 to connect external FSW_SYNC resistor. Not installed
JP9 Shunt JP9 to use default FSW_SYNC resistor. By closing JP9, the default switching
frequency is set to 250 kHz.
Installed
JP10 Shunt JP10 to use default IIN resistor. By closing JP10, the maximum input current
is set to 8 A.
Installed
JP11 Use JP11 to connect external IIN resistor. JP11 can be shorted to PGND to disable
hardware input current limiting.
Not installed
JP12
Use JP12 to select the gate driver source. Shunt pin1 to pin2 to use IC internal
LDO REGN output. Shunt pin2 to pin3 to use external gate drive supply. Maximum
external gate drive supply can be up to 11 V.
Pin1 and pin2 shunted
JP13 Shunt JP13 to enable controller in forward mode. Open JP13 to disable controller.
The /CE pin can also be used as a general purpose indicator.
Installed
JP14 Shunt JP14 to connect /INT to a pullup rail. Installed
JP15 Shunt JP15 to connect STAT1 to a pullup rail. The STAT1 pin can also be used as a
general purpose indicator.
Installed
JP16 Shunt JP16 to generate on board 3.3-V pullup rail. Installed
2.3 Recommended Operating Conditions
Table 2-5. Recommended Operating Conditions for BQ25756EVM
Description MIN TYP MAX UNIT
VIN (J1) Input voltage to the EVM 4.2 55(1) V
VOUT (J3) Output voltage of the EVM 3.3 55(1) V
IIN (J1) Input current of the EVM 10(3) (4) A
IOUT (J3) Output current of the EVM 10(3) A
Regulator output power Output power of the EVM 400(3) W
EXT_DRV (J6) Voltage applied to DRV_SUP pin of the regulator 4 11 V
EVM Operating Ambient
Temperature (TA) 25(2) °C
(1) Due to the high di/dt and dv/dt electrical flow associated with switch-mode power supplies, nodes on the EVM can have high spike
above input voltage (in buck mode) or output voltage (in boost mode) level. Switch node voltage can swing up to "input or output +
inductive spike" level. High side gate drives can swing up to "switch node voltage + 11 V (DRV_SUP supply voltage dependent) + gate
drive inductive spike" level. Safety precautions must be observed at all times.
(2) Connectors, bump-ons, jumpers on the EVM are not a good choice for evaluation under temperature greatly deviated from room
temperature of 25°C. Please refer to BOM for temperature rating of board components.
(3) Thermal monitoring (for example, using a thermal camera) is recommended if power stage output current > 5 A or total output power >
100 W.
(4) Default EVM input current limit is set to 8 A through the IIN pin. The current limiting feature can be disabled by setting EN_IIN_PIN bit
to '0', changing IIN pin resistor, or shorting IIN pin to PGND through JP11.
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2.4 Equipment
There are two recomended ways to test the EVM. The first and preferred way to test the EVM is to use a
four-quadrant power supply. The second is to use a electronic load in constant voltage mode. Testing with a
constant voltage load is covered in a later section. The following list of equipment is recommended when testing
with a four-quadrant power supply.
1. Power Supplies:
A power supply capable of supplying 40 V at 8 A is required. While this part can handle larger voltage and
current, larger power levels are not necessary for this procedure.
2. Load #1:
A Kepco load: BOP36-6M, DC 0 to ±36 V, 0 to ±6 A (or higher), or equivalent. When testing without a real
battery, connect 2000 uF of capacitance across the input.
3. Meters:
Six Fluke 75 multimeters, (equivalent or better) or: Three equivalent voltage meters and three equivalent
current meters.
4. Computer:
A computer with at least one USB port and a USB cable.
5. EV2400 Communication Kit:
6. Software:
Download and properly install bqStudio from https://www.ti.com/tool/BQSTUDIO.
2.4.1 Equipment Set Up
EV2400
USB
+
–
+
–
A
VAC
IAC
VBAT
IBAT
Op  onal Gate
Drive Supply
DMM
VAC
A
DMM
I2C
Use the following guidelines to set up the equipment:
1. Set power supply #1 for 23 V DC, 8 A current limit and then turn off the supply.
2. Connect the output of power supply #1 in series with a current meter to J1 (VIN and PGND).
3. Connect a voltage meter across J1 (VIN) and J1 (PGND).
4. Connect load #1 in series with a current meter to J3 (VBAT and PGND).
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5. Connect a voltage meter across J5 (VBAT and PGND).
6. Set 23 V at KEPCO load output. Limit KEPCO to 6 A. Use load #2 to power EVM from the VOUT output.
7. Connect J5 to the EV2400. Connect J5 to the I2C PORT 2 on the EV2400.
8. Make sure the jumpers are installed as indicated in IO and Jumper Descriptions.
9. Turn on the computer and load #2. Open the bqStudio software.
a. Select Charger and click the Next button.
b. Select Charger_1_00_BQ25756.bqz on the Select a Target Page.
c. After selecting the target device, click Field View and then click the Read Register button.
10. Set WATCHDOG and EN_CHG to disabled.
11. In 16 Bit Registers, set ICHG_REG to 4000 mA and IPRECHG to 1000 mA.
12. Turn on power supply #1, measure
V(J1(VAC)) = 23 V ± 0.5 V
I(J1(IAC)) = 4.1 A ± 0.5 A
V(J3(VBAT)) = 23 V ± 0.5 V
I(J3(IBAT)) = 3.9 A ± 0.5 A
13. Set power supply #1 for 40 V, measure
V(J1(VAC)) = 40 V ± 0.5 V
I(J1(IAC)) = 2.4 A ± 0.5 A
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V(J3(VBAT)) = 23 V ± 0.5 V
I(J3(IBAT)) = 3.9 A ± 0.5 A
14. Set power supply #1 for 19 V, measure
V(J1(VAC)) = 19 V ± 0.5 V
I(J1(IAC)) = 5.0 A ± 0.5 A
V(J3(VBAT)) = 23 V ± 0.5 V
I(J3(IBAT)) = 3.9 A ± 0.5 A
2.4.2 Equipment - Using a CV Load
The following list of equipment is recommended when testing with a constant voltage electronic load.
1. Power Supplies:
A power supply capable of supplying 40 V at 8 A is required. While this part can handle larger voltage and
current, larger power levels are not necessary for this procedure.
2. Load #1:
Kikusui PLZ164WA 0-150V, 0-33A When testing without a real battery, connect 2000 uF of capacitance
across the input.
3. Meters:
Six Fluke 75 multimeters, (equivalent or better) or: Three equivalent voltage meters and three equivalent
current meters.
4. Computer:
A computer with at least one USB port and a USB cable.
5. EV2400 Communication Kit:
6. Software:
Download and properly install bqStudio from https://www.ti.com/tool/BQSTUDIO.
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2.4.3 Equipment Setup - Using a CV Load
EV2400
USB
+
–
+
–
A
VAC
IAC
VBAT
IBAT
Op  onal Gate
Drive Supply
DMM
VAC
A
DMM
I2C
Use the following guidelines to set up the equipment:
1. Set power supply #1 for 40 VDC, 6 A current limit and then turn off the supply.
2. Connect the output of power supply #1 in series with a current meter to J1 (VIN and PGND).
3. Connect a voltage meter across J1 (VIN) and J1 (PGND).
4. Connect load #1 in series with a current meter to J3 (VBAT and PGND).
5. Connect a voltage meter across J5 (VBAT and PGND).
6. Set 23.5 V at electronic load input.
7. Connect J5 to the EV2400. Connect J5 to the I2C PORT 2 on the EV2400.
8. Make sure the jumpers are installed as indicated in IO and Jumper Descriptions.
9. Unplug Jumper 13.
10. Turn on the computer and power supply #1. Open the bqStudio software.
a. Select Charger and click the Next button.
b. Select Charger_1_00_BQ25756.bqz on the Select a Target Page.
c. After selecting the target device, click Field View and then click the Read Register button.
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11. Set WATCHDOG and EN_CHG to disabled.
12. In 16 Bit Registers, set ICHG_REG to 4000 mA and IPRECHG to 1000 mA.
13. Set EN_CHG to enabled. Plug in Jumper 13.
14. Set power supply #1 to 40 V, measure
V(J1(VAC)) = 40 V ± 0.5 V
I(J1(IAC)) = 1.2 A ± 0.5 A
V(J3(VBAT)) = 23.5 V ± 0.5 V
I(J3(IBAT)) = 2 A ± 0.5 A
15. Set power supply #1 for 23 V, measure
V(J1(VAC)) = 23 V ± 0.5 V
I(J1(IAC)) = 2.1 A ± 0.5 A
V(J3(VBAT)) = 23.5 V ± 0.5 V
I(J3(IBAT)) = 2 A ± 0.5 A
16. Set power supply #1 for 10 V, measure
V(J1(VAC)) = 10 V ± 0.5 V
I(J1(IAC)) = 5 A ± 0.5 A
V(J3(VBAT)) = 23.5 V ± 0.5 V
I(J3(IBAT)) = 2 A ± 0.5 A
3 Hardware Design Files
The following sections includes the hardware design files for BQ25756EVM. This section includes the
schematics, board layouts, and Bill of Materials (BOM).
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3.1 Schematic
PGND
PGND
1
2
JP2
PGNDPGND
PGND
PGND
100nF
C10
100V
100nF
100V
C11
100nF
100V
C19
100nF
100V
DNPC20
100nF
C21
100V
100nF
C23
100V
100nF
100V
DNPC32
750mW
R1
DN 4
3
P
.30
750mW
R1
DN 5
3
P
.30
100V
33pF
DNPC14
100V
33pF
DNPC15
100V
100pF
DNPC25
R5
DN 9
0
P
TP45 6TP4
1TP4
PGND
5m
5W
R24
100nF
25V
C18
100nF
25V
C12
10uH
L1
2
1
J1
1
2
J3
ACDRV
DRV_SUP
BAT _DRV
BAT _SRC
MODE
ACP
ACN
ACUV
ACOV
/CE
/INT
SDA
SCL
/PG
STAT1
STAT2
HIDRV1
SW1
LODRV1
SYS
LODRV2
SW2
BTST2
HIDRV2
SRP
SRN
FB
FBG
TS
ILIM_HIZ
FSW_SYNC
ICHG
VAC
REGN
BAT
10
R10
4STAT1
5STAT2
NC
15
16 NC
28
SW1
18
SW2
27
HIDRV1
19
HIDRV2
26
BTST1
20
BTST2
25
LODRV1
21
LODRV2
CE
7
3INT
PG
6
31 NC
29 ACN
35 ACOV
30 ACP
34 ACUV
23 DRV_SUP
12
FB
11
FBG
36
FSW_SYNC
9
ICHG
10
ILIM_HIZ
17 MODE
24 REGN
SCL
1
2SDA
13
SRN
14
SRP
32
VAC
TS 8
33 VAC
22 PGND
37
BQ25756
PGND
U1
1
2
JP1
VBAT~29.4V
PGND
25V
C26
4.7µF
25V
C22
4.7µF
P
100k
R15
DN 1
PGND
1.00M
R21
4.7uF
100V
C2
10
R5
10
R6
10
R22
10
R25
100nF
C200
100V
DNP
BTST1
100V
C16
1µF
100V
C74
DNP
1µF
0
R3
0
R8
0
R13
0
R23
0
R17
0
R20
VIN
GND
GND
*
VOUT/VBAT
snubber c ircuit as place holders only
*perform c omponent va lue ca lculation se parately
SW2
BTST2
DRV_SUP
BTST1
SW1
100V
C13
2.2µF
0.1%
249k
R28
0.1%
13.7k
R64
ACP ACN
HIDRV1
LODRV1
SW1
HIDRV2
SW2
LODRV2
FB
FBG
MODE
ACUV
ACOV
1
3
2
D7
DNP
FSV12100V
1
3
2
D8
DNP
FSV12100V
10uH
L2
DNP
470nF
16V
C35
470nF
16V
C34
133k
R27
25.5k
R30
PGND PGND
PGND
PGND
PGND
PGND
PGND
PGNDPGND
PGND
PGND
PGND
0
R1000
0
R1001
0
R1002
DNP
0
R1003
DNP
5m
1W
R2
4
1
2
5-6-7-8
3
Q1
SIR680LDP 4
1
2
5-6-7-8
3
Q3
SIR680LDP
4
1 5-6-7-8
3 2
Q4
SIR680LDP
4
1 5-6-7-8
2 3
Q2
SIR680LDP
AC_OUT
P_OUT
VSYS
SRP SRN PGND
BAT
Voltage Divider
PGND
VSYS
1
J2
2
DNP
100nF
100V
DNPC63
100V
DNPC77
1µF
1nF
100V
DNPC151
GND
PGND
VAC
0DNP
R100
0
R101
SYS
4
15-6-7-8
3
2
100V
Q5
DNP
AONS66917
4
1 5-6-7-8
2
3
100V
Q6
DNP
AONS66917
13
2NC
15V
D1
DNP 1nF
50V
SZBZX84C15LT3G
DNPC9
R1
DNP
0
2
ACDRV
BAT _DRV 0
R9
DNP
4
1
2
5-6-7-8
3
100V
Q7
DNP AONS66917
1nF
50V
C36
DNP
BAT _SRC
4
15-6-7-8
2 3
100V
Q8
DNP AONS66917
R1004
0
P
DN DNP
0
R1005
21
D3
V1FM10
2 1
D2
V1FM10
0
R120
3.00k
R32
+
56uF
80V
C39 +
56uF
80V
C38+
56uF
80V
C57
PGND
+
56uF
80V
56uF
C44 +
80V
C7
PGND
+
56uF
80V
C70
PGND
Figure 3-1. BQ25756 EVM Schematic
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4.7uF
100V
C5
4.7uF
100V
C8
100V
10uF
C42
100V
10uF
C150
4.7uF
100V
C3
DNP 100V
10uF
C4
100V
10uF
C6
DNP
4.7uF
100V
0C6
DNP
VSYS
PGND
100V
100pF
C43
100nF
C80
100V
100V
C81
1µF
P
100k
R15 R15 R15
DN 2 DNP
100k
3
DNP
100k
4
+
15uF
75V
C502
DNP
+
15uF
75V
C503
DNP
100V
100pF
C152
4.7uF
100V
C45
DNP 100V
10uF
C46
DNP 100V
10uF
C53
4.7uF
100V
C54
DNP
100nF
100V
C17
100V
C82
1µF
4.7uF
100V
C28
100V
10uF
C29
4.7uF
100V
C40
100V
10uF
C56
+
15uF
75V
C504
DNP +
15uF
75V
C505
DNP
P_OUT
PGND
100V
C24
1nF
100V
C31
100V
C78
1µF
+
15uF
75V
C507
DNP
+
15uF
75V
C506
ND P
PGND
BAT
+
15uF
75V
C500
ND P +
15uF
75V
C501
ND P
PGND
AC_OUT
R40
P
100k
100nF
DR40 N1 DNP
100k
0
+
15uF
75V
C509
ND P +
15uF
75V
C510
ND P
+
15uF
75V
C508
ND P
+
15uF
75V
C511
DNP
+
15uF
75V
C513
DNP
+
15uF
75V
C512
ND P
+
15uF
75V
C514
DNP +
15uF
75V
C515
ND P
+
15uF
75V
C516
DNP +
15uF
75V
C517
DNP +
15uF
75V
C518
DNP +
15uF
75V
C519
DNP
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4
3
2
1
J5
0022053041
1 2
3 4
5 6
7 8
9 10
J4
NORMAL
TS
1
2
JP6
1
2
JP5
1
2
JP7
1
2
JP9
1
2
JP3
1
2
JP11
1
2
3
JP12
PGND
2
1
J6
TP22TP21 TP29 TP30 TP31 TP32 TP33 TP34
TP35 TP36 TP39
PGND PGND
TP38
PGND
TP6TP4 TP7TP5 TP8 TP16TP9 TP10 TP11 TP12 TP13 TP14 TP15
TP23
TP17
TP24 TP25 TP26 TP27 TP28
TP18 TP19 TP20
TP42
TP43
Green
TP44
21
D4
Green
21
150060VS75000
D5
Green
21
150060VS75000
D6
LDO to generate pull-up voltage
VDC = 8V to 55V
3.3VDC@10mA
150060VS75000
TP1 TP2 TP3
PGND
2 1
JP16
USB2ANY Connector
5SHDN
IN
8OUT 1
NC
3
NC
6
NC
7
2
ADJ
4
GND 9
GND
U2
LT3010EMS8E#PBF
499k
R48
220pF
50V
C50
25V
C48
1µF
PGND
1
2
JP8
1
2
JP14
1
2
JP15
1
2
JP13
30.1k
R65
5.23k
R34
EXT_DRV
3V3_PULLUP
PGND
1
2
JP10
1
2
JP4
2.21k
R50
2.21k
R51
2.21k
R52
100V
1uF
C49
DNP 100V
1uF
C33
316k
R49
20
R46
0
R45
1.5
DNP
R300
BQStudio Connector
2.49k
R66
4.99k
R67
5%
1.8k
R201
5%
1.8k
R200
PGND
PGND
PGND
100nF
10V
C202
100nF
10V
C201
10.0k
R56
10.0k
R55
10.0k
R41
BAT
VAC
SCL SDA
SDA
SCL
REGN
TS
FSW_SYNC
ICHG
REGN
DRV_SUP
ILIM_HIZ
SCL SDA
/CE
/INT
/PG
STAT1 STAT2
LODRV2
LODRV1
FBG
REGN SYS BAT ACDRV BAT _DRV BAT _SRC ILIM_HIZ TS /PG ACP ACN VAC ACUV ACOV DRV_SUP FSW_SYNC ICHG SW1 SW2 MODE
/CE SRP SRN FB HIDRV1 BTST1 HIDRV2 BTST2 STAT1 /INT STAT2 SCL SDA
133k
R36
PGND
PGND
PGND
PGND
PGND
10.0k
R53
10.0k
R54
2 1
D10
2
VS-1EMH01HM3/5AT
1
D9
VS-1EMH01HM3/5AT
TP47
PGND
0
R160
1
2
3
4
5
MNT_1
MNT_2
J7
109159005101916 PGND
PGND
1 2
3 4
5 6
7 8
J8
TSW-104-07-G-D
0
R68
EXT_DRV
PP5V
0
R69
VIN3V3
PGND
PGND
3V3_PULLUP
BAT
VAC
3V3_PULLUP
EXT_DRV
/INT
SCL
SDA
/PG
TP37 TP40
PGND PGND
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BMS042
A
PCB Number:
PCB Rev:
ZZ1
Assembly Note
ZZ2
Assembly Note
These assemblies are ESD sensitive, ESD precautions shall be observed.
ZZ3
Assembly Note
These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
SH-JP1 SH-JP2 SH-JP3
These assemblies must comply with workmanship standards IPC-A-610 Class 2, unless otherwise specified.
SH-JP4 SH-JP9SH-JP7 SH-JP10 SH-JP11SH-JP6 SH-JP8
LOGO
PCB
LOGO7
WEEE logo
LOGO5
LOGO
PCB
CE Mark
LOGO4
LOGO
PCB
LOGO6
Texas Instruments
PCB Label
FCC disclaimer
LBL1
THT-14-423-10
LOGO3
PCB
LOGO
CAUTION. READ USER GUIDE BEFORE USE
H1 H2
SJ-5303 (CLEAR)
H3
SJ-5303 (CLEAR)
H4
SJ-5303 (CLEAR) SJ-5303 (CLEAR)
SH-JP5
ZZ5
Assembly Note
FID1
Fiducial
ZZ4
Assembly Note
For BQ25750 variant, Install JP1, JP4, JP5, JP6, JP9, JP10, pin 1-2 of JP12, JP13, JP14, JP15, and JP16
FID2
Fiducial
FID3
Fiducial
FID4
Fiducial
FID5
Fiducial
FID6
Fiducial
Install label in silkscreened box after final wash. Text shall be 8 pt font. Text shall be per the Label Table in the PDF schematic.
LOGO2
CAUTION HOT SURFACE
LOGO1
DANGER HIGH VOLTAGE
ZZ6
Assembly Note
ZZ7
Assembly Note
For BQ25758 variant, Install JP4, JP5, JP6, JP9, JP10, pin 1-2 of JP12, JP13, JP14, JP15, and JP16
For BQ25756 variant, Install JP1, JP4, JP5, JP6, JP9, JP10, pin 1-2 of JP12, JP13, JP14, JP15, and JP16
1. DNP means "Do Not Populate".
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3.2 PCB Layout
Figure 3-2. Top Layer and Overlay
Figure 3-3. Layer 2 -GND
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Figure 3-4. Single Layer 1
Figure 3-5. Signal Layer 2
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Figure 3-6. Layer 5 - GND
Figure 3-7. Bottom Layer
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BQ25756 Evaluation Module 19
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3.3 Bill of Materials
Table 3-1. Bill of Materials
Item
Number Designator Quantity Value Part Number Manufacturer Description Package Reference
1 C2, C5, C8,
C28, C40
5 4.7µF GCJ32DC72A475KE01L Murata 4.7uF ±10% 100 V Ceramic Capacitor X7S
1210 (3225 Metric)
1210
2 C4, C29, C42,
C53, C56, C150
6 10 µF C3225X7R2A106K250AC TDK 10 µF ±10% 100 V Ceramic Capacitor X7R
1210 (3225 Metric)
1210
3 C7, C38, C39,
C44, C57, C70
6 56uF 80SXV56M Panasonic 56 µF 80 V Aluminum - Polymer Capacitors
Radial, Can - SMD 28mOhm 1000 Hrs @
125°C
SMT
4 C10, C11, C17,
C19, C21, C23,
C24, C80
8 0.1uF HMK107B7104KAHT Taiyo Yuden CAP, CERM, 0.1 µF, 100 V,+/- 10%, X7R,
AEC-Q200 Grade 1, 0603
603
5 C12, C18 2 0.1uF 06033C104KAT2A AVX CAP, CERM, 0.1 uF, 25 V, +/- 10%, X7R, 0603 603
6 C13 1 2.2uF CGA6N3X7R2A225K230AE TDK Corporation Cap Ceramic 2.2uF 100 V X7R 10% SMD
1210 FlexiTerm 125C Plastic T/R
1210
7 C16, C78, C81,
C82
4 1uF 08051C105K4Z2A AVX CAP, CERM, 1 µF, 100 V,+/- 10%, X7R, AEC-
Q200 Grade 1, 0805
805
8 C22, C26 2 4.7µF CGA4J1X7R1E475K125AE TDK Corporation Cap Ceramic 4.7uF 25 V X7R 10% Pad SMD
0805 +125°C Automotive T/R
805
9 C31 1 1000 pF CGA3E2X7R2A102K080AA TDK Multilayer Ceramic Capacitors MLCC -
SMD/SMT CGA 0603 100 V 1000 pF X7R
10% AEC-Q200
603
10 C33 1 1 µF 12101C105KAT2A AVX General Purpose Ceramic Capacitor, 1210,
1uF, 10%, X7R, 15%, 100 V
1210
11 C34, C35 2 0.47uF C0603C474K4RACTU Kemet CAP, CERM, 0.47 uF, 16 V, +/- 10%, X7R,
0603
603
12 C43, C152 2 100 pF CGA3E2C0G2A101J080AA TDK Multilayer Ceramic Capacitors MLCC -
SMD/SMT CGA 0603 100 V 100 pF C0G 5%
AEC-Q200
603
13 C48 1 1uF C0805C105K3RACTU Kemet CAP, CERM, 1 uF, 25 V, +/- 10%, X7R, 0805 805
14 C50 1 220 pF C0603C221K5RACTU Kemet CAP, CERM, 220 pF, 50 V, +/- 10%, X7R,
0603
603
15 C201, C202 2 0.1uF C0603C104K8RACTU Kemet CAP, CERM, 0.1 uF, 10 V, +/- 10%, X7R, 0603 603
16 D2, D3 2 V1FM10-M3/H Vishay Diode Schottky 1 A Surface Mount DO-219AB
(SMF)
DO-219AB
17 D4, D5, D6 3 Green 150060VS75000 Wurth Elektronik LED, Green, SMD LED_0603
18 D9, D10 2 VS-1EMH01HM3/5AT Vishay Diode Standard 100 V 1 A Surface Mount
DO-214AC (SMA)
DO-214AC
20 H1, H2, H3, H4 4 SJ-5303 (CLEAR) 3M Bumpon, Hemisphere, 0.44 X 0.20, Clear Transparent Bumpon
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