Texas Instruments SN74LVC2G241 User manual

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2A
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SN74LVC2G241
SCES210O –APRIL 1999–REVISED DECEMBER 2015
SN74LVC2G241 Dual Buffer and Driver With 3-State Outputs
1 Features 3 Description
This dual buffer and line driver is designed for 1.65-V
1• Available in the Texas Instruments to 5.5-V VCC operation.
NanoFree™ Package The SN74LVC2G241 device is designed specifically
• Supports 5-V VCC Operation to improve both the performance and density of 3-
• Inputs Accept Voltages to 5.5 V state memory-address drivers, clock drivers, and bus-
• Max tpd of 4.1 ns at 3.3 V oriented receivers and transmitters.
• Low Power Consumption, 10-µA Maximum ICC NanoFree package technology is a major
• ±24-mA Output Drive at 3.3 V breakthrough in IC packaging concepts, using the die
as the package.
• Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA= 25°C The SN74LVC2G241 device is organized as two 1-bit
• Typical VOHV (Output VOH Undershoot) line drivers with separate output-enable (1OE, 2OE)
>2 V at VCC = 3.3 V, TA= 25°C inputs. When 1OE is low and 2OE is high, the device
passes data from the A inputs to the Y outputs. When
• Ioff Supports Live Insertion, Partial-Power-Down 1OE is high and 2OE is low, the outputs are in the
Mode, and Back-Drive Protection high-impedance state.
• Can Be Used as a Down Translator to Translate To ensure the high-impedance state during power up
Inputs From a Max of 5.5 V Down or power down, OE should be tied to VCC through a
to the VCC Level pullup resistor, and OE should be tied to GND
• Latch-Up Performance Exceeds 100 mA Per through a pulldown resistor; the minimum value of the
JESD 78, Class II resistor is determined by the current-sinking or the
• ESD Protection Exceeds JESD 22 current-sourcing capability of the driver.
– 2000-V Human-Body Model (A114-A) This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the
– 200-V Machine Model (A115-A) outputs, preventing damaging current backflow
– 1000-V Charged-Device Model (C101) through the device when it is powered down.
2 Applications Device Information(1)
• AV Receivers PART NUMBER PACKAGE BODY SIZE (NOM)
• Blu-ray Players and Home Theaters SN74LVC2G241DCT SM8 (8) 2.95 mm × 2.80 mm
• DVD Recorders and Players SN74LVC2G241DCU VSOOP (8) 2.30 mm × 2.00 mm
SN74LVC2G241YZP DSBGA (8) 1.91 mm × 0.91 mm
• Desktop or Notebook PCs
• Digital Radio or Internet Radio Players (1) For all available packages, see the orderable addendum at
the end of the data sheet.
• Digital Video Cameras (DVC)
• Embedded PCs Logic Diagram (Positive Logic)
• GPS: Personal Navigation Devices
• Mobile Internet Devices
• Network Projector Front-Ends
• Portable Media Players
• Pro Audio Mixers
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

SN74LVC2G241
SCES210O –APRIL 1999–REVISED DECEMBER 2015 www.ti.com
Table of Contents
8.2 Functional Block Diagram......................................... 9
1 Features.................................................................. 18.3 Feature Description................................................... 9
2 Applications ........................................................... 18.4 Device Functional Modes.......................................... 9
3 Description............................................................. 19 Application and Implementation ........................ 10
4 Revision History..................................................... 29.1 Application Information............................................ 10
5 Pin Configuration and Functions......................... 39.2 Typical Application ................................................. 10
6 Specifications......................................................... 410 Power Supply Recommendations ..................... 11
6.1 Absolute Maximum Ratings ..................................... 411 Layout................................................................... 11
6.2 ESD Ratings.............................................................. 411.1 Layout Guidelines ................................................. 11
6.3 Recommended Operating Conditions ...................... 411.2 Layout Example .................................................... 11
6.4 Thermal Information.................................................. 512 Device and Documentation Support................. 12
6.5 Electrical Characteristics........................................... 512.1 Documentation Support ........................................ 12
6.6 Switching Characteristics, TA= –40°C to 85°C ........ 612.2 Community Resources.......................................... 12
6.7 Switching Characteristics, TA= –40°C to 125°C ...... 612.3 Trademarks........................................................... 12
6.8 Operating Characteristics.......................................... 712.4 Electrostatic Discharge Caution............................ 12
6.9 Typical Characteristic................................................ 712.5 Glossary................................................................ 12
7 Parameter Measurement Information .................. 813 Mechanical, Packaging, and Orderable
8 Detailed Description.............................................. 9Information........................................................... 12
8.1 Overview................................................................... 9
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision N (November 2013) to Revision O Page
• Added Applications section, Device Information table, ESD Ratings table, Thermal Information table, Typical
Characteristics,Feature Description section, Device Functional Modes,Application and Implementation section,
Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section.................................................................................................. 1
Changes from Revision M (February 2007) to Revision N Page
• Updated document to new TI data sheet format.................................................................................................................... 1
• Removed Ordering Information table. .................................................................................................................................... 1
• Updated Features................................................................................................................................................................... 1
• Updated operating temperature range. .................................................................................................................................. 4
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Product Folder Links: SN74LVC2G241

GND 5
42A
361Y2Y
272OE1A
8VCC
1
1OE
1VCC
8
1OE
27
1A 2OE
3 6
2Y 1Y
45
GND 2A
3 6 1Y2Y
8
1VCC
1OE
5
GND 42A
272OE1A
SN74LVC2G241
www.ti.com SCES210O –APRIL 1999–REVISED DECEMBER 2015
5 Pin Configuration and Functions
DCT Package DCU Package
8-Pin SM8 8-Pin VSSOP
Top View Top View
YZP Package
8-Pin DSBGA
Bottom View
Pin Functions(1)(2)
PIN I/O DESCRIPTION
NAME NO.
1A 2 I Input
1OE 1 I Output enable (Active low)
1Y 6 O Output
2A 5 I Input
2Y 3 O Output
2OE 7 I Output enable (Active high)
GND 4 — Ground
VCC 8 — Power pin
(1) N.C. – No internal connection
(2) See Mechanical, Packaging, and Orderable Information for dimensions
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SN74LVC2G241
SCES210O –APRIL 1999–REVISED DECEMBER 2015 www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage –0.5 6.5 V
VIInput voltage(2) –0.5 6.5 V
VOVoltage applied to any output in the high-impedance or power-off state(2) –0.5 6.5 V
VOVoltage applied to any output in the high or low state(2)(3) –0.5 VCC + 0.5 V
IIK Input clamp current VI< 0 –50 mA
IOK Output clamp current VO< 0 –50 mA
IOContinuous output current ±50 mA
Continuous current through VCC or GND ±100 mA
TJMaximum junction temperature 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of VCC is provided in the Recommended Operating Conditions table.
6.2 ESD Ratings VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000
Electrostatic
V(ESD) V
Charged-device model (CDM), per JEDEC specification JESD22-C101, all
discharge ±1000
pins(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions(1)
MIN MAX UNIT
Operating 1.65 5.5
VCC Supply voltage V
Data retention only 1.5
VCC = 1.65 V to 1.95 V 0.65 × VCC
VCC = 2.3 V to 2.7 V 1.7
VIH High-level input voltage V
VCC = 3 V to 3.6 V 2
VCC = 4.5 V to 5.5 V 0.7 × VCC
VCC = 1.65 V to 1.95 V 0.35 × VCC
VCC = 2.3 V to 2.7 V 0.7
VIL Low-level input voltage V
VCC = 3 V to 3.6 V 0.8
VCC = 4.5 V to 5.5 V 0.3 × VCC
VIInput voltage 0 5.5 V
High or low state 0 VCC
VOOutput voltage V
3-state 0 5.5
VCC = 1.65 V –4
VCC = 2.3 V –8
IOH High-level output current –16 mA
VCC = 3 V –24
VCC = 4.5 V –32
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report
Implications of Slow or Floating CMOS Inputs,SCBA004.
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Recommended Operating Conditions(1) (continued)
MIN MAX UNIT
VCC = 1.65 V 4
VCC = 2.3 V 8
IOL Low-level output current 16 mA
VCC = 3 V 24
VCC = 4.5 V 32
VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V 20
Δt/Δv Input transition rise or fall rate VCC = 3.3 V ± 0.3 V 10 ns/V
VCC = 5 V ± 0.5 V 5
TAOperating free-air temperature –40 85 °C
6.4 Thermal Information SN74LVC2G241
DCT DCU YZP
THERMAL METRIC(1) UNIT
(SM8) (VSSOP) (DSBGA)
8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 220 227 102 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.5 Electrical Characteristics
over recommended operating free-air temperature range, TA= –40ºC to 125°C (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC TAMIN TYP(1) MAX UNIT
IOH = –100 µA 1.65 V to 5.5 V VCC – 0.1
IOH = –4 mA 1.65 V 1.2
IOH = –8 mA 2.3 V 1.9
VOH V
IOH = –16 mA 2.4
3 V
IOH = –24 mA 2.3
IOH = –32 mA 4.5 V 3.8
IOL = 100 µA 1.65 V to 5.5 V 0.1
IOL = 4 mA 1.65 V 0.45
IOL = 8 mA 2.3 V 0.3
IOL = 16 mA 0.4
3 V
VOL V
IOL = 24 mA 0.55
TA= –40ºC to
85°C
IOL = 32 mA 4.5 V 0.55
TA= –40ºC to
125°C
A or control
IIVI= 5.5 V or GND 0 to 5.5 V ±5 µA
inputs
Ioff VIor VO= 5.5 V 0 ±10 µA
IOZ VO= 0 to 5.5 V 3.6 V 10 µA
ICC VI= 5.5 V or GND, IO= 0 1.65 V to 5.5 V 10 µA
One input at VCC – 0.6 V,
ΔICC 3 V to 5.5 V 500 µA
Other inputs at VCC or GND
TA= –40ºC to
CiVI= VCC or GND 3.3 V 3.5 pF
85°C
TA= –40ºC to
CoVO= VCC or GND 3.3 V 6.5 pF
85°C
(1) All typical values are at VCC = 3.3 V, TA= 25°C.
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SN74LVC2G241
SCES210O –APRIL 1999–REVISED DECEMBER 2015 www.ti.com
6.6 Switching Characteristics, TA= –40°C to 85°C
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 2)
FROM TO
PARAMETER VCC MIN MAX UNIT
(INPUT) (OUTPUT)
VCC = 1.8 V ± 0.15 V 3.3 8.8
VCC = 2.5 V ± 0.2 V 1.5 4.8
tpd A Y ns
VCC = 3.3 V ± 0.3 V 1.4 4.3
VCC = 5 V ± 0.5 V 1 3.7
VCC = 1.8 V ± 0.15 V 4 9.9
VCC = 2.5 V ± 0.2 V 1.9 5.6
ten OE Y ns
VCC = 3.3 V ± 0.3 V 1.2 4.7
VCC = 5 V ± 0.5 V 1.2 3.8
VCC = 1.8 V ± 0.15 V 1.5 11.6
VCC = 2.5 V ± 0.2 V 1 5.8
tdis OE Y ns
VCC = 3.3 V ± 0.3 V 1.4 1.4
VCC = 5 V ± 0.5 V 1 3.4
VCC = 1.8 V ± 0.15 V 3.2 8.8
VCC = 2.5 V ± 0.2 V 1.5 4.7
ten OE Y ns
VCC = 3.3 V ± 0.3 V 1.6 4.1
VCC = 5 V ± 0.5 V 1.1 3.3
VCC = 1.8 V ± 0.15 V 1.7 12.5
VCC = 2.5 V ± 0.2 V 1 5.2
tdis OE Y ns
VCC = 3.3 V ± 0.3 V 1 4.2
VCC = 5 V ± 0.5 V 1 3.3
6.7 Switching Characteristics, TA= –40°C to 125°C
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 2)
FROM TO
PARAMETER VCC MIN MAX UNIT
(INPUT) (OUTPUT)
VCC = 1.8 V ± 0.15 V 3.3 9.8
VCC = 2.5 V ± 0.2 V 1.5 5.8
tpd A Y ns
VCC = 3.3 V ± 0.3 V 1.4 5.3
VCC = 5 V ± 0.5 V 1 4.2
VCC = 1.8 V ± 0.15 V 4 10.9
VCC = 2.5 V ± 0.2 V 1.9 6.6
ten OE Y ns
VCC = 3.3 V ± 0.3 V 1.2 5.7
VCC = 5 V ± 0.5 V 1.2 4.3
VCC = 1.8 V ± 0.15 V 1.5 12.6
VCC = 2.5 V ± 0.2 V 1 6.8
tdis OE Y ns
VCC = 3.3 V ± 0.3 V 1.4 5.4
VCC = 5 V ± 0.5 V 1 4.4
VCC = 1.8 V ± 0.15 V 3.2 9.8
VCC = 2.5 V ± 0.2 V 1.5 5.7
ten OE Y ns
VCC = 3.3 V ± 0.3 V 1.6 5.1
VCC = 5 V ± 0.5 V 1.1 3.8
VCC = 1.8 V ± 0.15 V 1.7 13.5
VCC = 2.5 V ± 0.2 V 1 6.2
tdis OE Y ns
VCC = 3.3 V ± 0.3 V 1 5.2
VCC = 5 V ± 0.5 V 1 4.3
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0
0.5
1
1.5
2
2.5
3
3.5
0 1 2 3 4 5 6
Propagation Delay (tPD)
Supply Voltage [VCC] (V)
Typ. Char.
C001
SN74LVC2G241
www.ti.com SCES210O –APRIL 1999–REVISED DECEMBER 2015
6.8 Operating Characteristics
TA= 25°C PARAMETER TEST CONDITIONS VCC TYP UNIT
VCC = 1.8 V 19
VCC = 2.5 V 19
Outputs enabled pF
VCC = 3.3 V 20
Power dissipation VCC = 5 V 22
Cpd capacitance f = 10 MHz VCC = 1.8 V 2
per buffer/driver VCC = 2.5 V 2
Outputs disabled pF
VCC = 3.3 V 2
VCC = 5 V 3
6.9 Typical Characteristic
Figure 1. tpd vs Vcc Over Full Temperature Range
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th tsu
From Output
Under Test
C
(see Note A)
L
LOAD CIRCUIT
S1
VLOAD
Open
GND
RL
Data Input
Timing Input
0 V
0 V
0 V
tW
Input
0 V
Input
Output
Waveform 1
S1 at V
(see Note B)
LOAD
Output
Waveform 2
S1 at GND
(see Note B)
VOL
VOH
0 V
»0 V
Output
Output
TEST S1
t /t
PLH PHL Open
Output
Control
VM
VMVM
VM
VM
1.8 V 0.15 V±
2.5 V 0.2 V±
3.3 V 0.3 V±
5 V 0.5 V±
1 kW
500 W
500 W
500 W
VCC RL
2 × VCC
2 × VCC
6 V
2 × VCC
VLOAD CL
30 pF
30 pF
50 pF
50 pF
0.15 V
0.15 V
0.3 V
0.3 V
VD
3 V
VI
VCC/2
VCC/2
1.5 V
VCC/2
VM
£2 ns
£2 ns
£2.5 ns
£2.5 ns
INPUTS
RL
t /t
r f
VCC
VCC
VCC
VLOAD
t /t
PLZ PZL
GND
t /t
PHZ PZH
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
NOTES: A. C includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 .
D. The outputs are measured one at a time, with one transition per measurement.
E. t and t are the same as t .
F. t and t are the same as t .
G. t and t are the same as t .
H. All parameters and waveforms are not applicable to all devices.
L
O
PLZ PHZ dis
PZL PZH en
PLH PHL pd
£ W
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VI
VI
VI
VM
VM
V /2
LOAD
tPZL tPLZ
tPHZ tPZH
V – V
OH D
V + V
OL D
VM
VMVM
VM
VOL
VOH
VI
VI
VOH
VOL
VM
VM
VM
VM
tPLH tPHL
tPLH tPHL
SN74LVC2G241
SCES210O –APRIL 1999–REVISED DECEMBER 2015 www.ti.com
7 Parameter Measurement Information
Figure 2. Load Circuit and Voltage Waveforms
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1
2 6 1Y
1OE
1A
7
5 3 2Y
2OE
2A
SN74LVC2G241
www.ti.com SCES210O –APRIL 1999–REVISED DECEMBER 2015
8 Detailed Description
8.1 Overview
The SN74LVC2G241 device is designed specifically to improve both the performance and density of 3-state
memory-address drivers, clock drivers, and bus-oriented receivers and transmitters. The SN74LVC2G241 device
is organized as two 1-bit line drivers with separate output-enable (1OE, 2OE) inputs. When 1OE is low and 2OE
is high, the device passes data from the A inputs to the Y outputs. When 1OE is high and 2OE is low, the
outputs are in the high-impedance state.
The SN74LVC2G241 is also an effective redriver, with a maximum output current drive of 32 mA.
8.2 Functional Block Diagram
Figure 3. Logic Diagram (Positive Logic)
8.3 Feature Description
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor, and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is
determined by the current-sinking or the current-sourcing capability of the driver.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
8.4 Device Functional Modes
Table 1 and Table 2 list the functional modes of the SN74LVC2G241.
Table 1. Gate 1 Functional Table
INPUTS OUTPUT
1Y
1OE 1A
L H H
L L L
H X Z
Table 2. Gate 2 Functional Table
INPUTS OUTPUT
2Y
2OE 2A
H H H
H L L
L X Z
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SN74LVC2G241
(One driver)
Physical Push
Button Microprocessor
VCC
SN74LVC2G241
SCES210O –APRIL 1999–REVISED DECEMBER 2015 www.ti.com
9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
Typical Application shows a simple application where a physical push button is connected to the
SN74LVC2G241. The push button is in a physical location far enough away from the processor that the input
signal is weak and needs to be redriven. The SN74LVC2G241 acts as a redriver, providing a strong input signal
to the processor with as little as 1 ns of propagation delay.
9.2 Typical Application
Figure 4. SN74LVC2G241 Application
9.2.1 Design Requirements
This device uses CMOS technology and has balanced output drive. Take care to avoid bus contention because it
can drive currents that would exceed maximum limits. The high drive also creates fast edges into light loads, so
routing and load conditions must be considered to prevent ringing.
9.2.2 Detailed Design Procedure
1. Recommended Input Conditions
– Rise time and fall time specs. See (Δt/ΔV) in Recommended Operating Conditions.
– Specified high and low levels. See (VIH and VIL)inRecommended Operating Conditions.
– Inputs are overvoltage tolerant allowing them to go as high as (VImax) in Recommended Operating
Conditions at any valid VCC.
2. Recommend Output Conditions
– Load currents must not exceed (IOmax) per output and must not exceed (Continuous current through VCC
or GND) total current for the part. These limits are located in Absolute Maximum Ratings.
– Outputs must not be pulled above VCC during normal operation or 5.5 V in high-z state.
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VCC
Unused Input
Input
Output Output
Input
Unused Input
Frequency - MHz
Icc - µA
0 20 40 60 80
0
200
400
600
800
1000
1200
1400
1600
D001
Icc 1.8V
Icc 2.5V
Icc 3.3V
Icc 5V
SN74LVC2G241
www.ti.com SCES210O –APRIL 1999–REVISED DECEMBER 2015
Typical Application (continued)
9.2.3 Application Curve
Figure 5. ICC vs Frequency
10 Power Supply Recommendations
The power supply can be any voltage between the minimum and maximum supply voltage rating located in
Recommended Operating Conditions.
Each VCC pin should have a good bypass capacitor to prevent power disturbance. For devices with a single
supply, a 0.1-μF capacitor is recommended and if there are multiple VCC pins then a 0.01-μF or 0.022-μF
capacitor is recommended for each power pin. It is ok to parallel multiple bypass capacitors to reject different
frequencies of noise. 0.1-μF and 1-μF capacitors are commonly used in parallel. The bypass capacitor should be
installed as close to the power pin as possible for best results.
11 Layout
11.1 Layout Guidelines
When using multiple bit logic devices inputs must not ever float. In many cases, functions or parts of functions of
digital logic devices are unused; for example, when only two inputs of a triple-input AND gate are used or only 3
of the 4 buffer gates are used. Such input pins must not be left unconnected because the undefined voltages at
the outside connections result in undefined operational states. Specified below are the rules that must be
observed under all circumstances. All unused inputs of digital logic devices must be connected to a high or low
bias to prevent them from floating. The logic level that should be applied to any particular unused input depends
on the function of the device. Generally they will be tied to GND or VCC, whichever make more sense or is more
convenient.
11.2 Layout Example
Figure 6. Layout Diagram
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12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation, see the following:
Implications of Slow or Floating CMOS Inputs,SCBA004
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks
NanoFree, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser based versions of this data sheet, refer to the left hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com 17-Aug-2015
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
74LVC2G241DCTRE4 ACTIVE SM8 DCT 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C41 Z
74LVC2G241DCTRG4 ACTIVE SM8 DCT 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C41 Z
74LVC2G241DCURE4 ACTIVE VSSOP DCU 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C41R
74LVC2G241DCUTE4 ACTIVE VSSOP DCU 8 TBD Call TI Call TI -40 to 125
74LVC2G241DCUTG4 ACTIVE VSSOP DCU 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C41R
SN74LVC2G241DCTR ACTIVE SM8 DCT 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 C41 Z
SN74LVC2G241DCUR ACTIVE VSSOP DCU 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 (C41Q ~ C41R)
SN74LVC2G241DCUT ACTIVE VSSOP DCU 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 (C41Q ~ C41R)
SN74LVC2G241YZPR ACTIVE DSBGA YZP 8 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 125 (C2 ~ C27)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

PACKAGE OPTION ADDENDUM
www.ti.com 17-Aug-2015
Addendum-Page 2
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package Drawing Pins SPQ Reel Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant
74LVC2G241DCUTG4 VSSOP DCU 8 250 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3
SN74LVC2G241DCTR SM8 DCT 8 3000 180.0 13.0 3.35 4.5 1.55 4.0 12.0 Q3
SN74LVC2G241DCUR VSSOP DCU 8 3000 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3
SN74LVC2G241YZPR DSBGA YZP 8 3000 180.0 8.4 1.02 2.02 0.63 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 1-Apr-2017
Pack Materials-Page 1

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
74LVC2G241DCUTG4 VSSOP DCU 8 250 202.0 201.0 28.0
SN74LVC2G241DCTR SM8 DCT 8 3000 182.0 182.0 20.0
SN74LVC2G241DCUR VSSOP DCU 8 3000 202.0 201.0 28.0
SN74LVC2G241YZPR DSBGA YZP 8 3000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 1-Apr-2017
Pack Materials-Page 2

MECHANICAL DATA
MPDS049B – MAY 1999 – REVISED OCTOBER 2002
POST OFFICE BOX 655303 •DALLAS, TEXAS 75265
DCT (R-PDSO-G8) PLASTIC SMALL-OUTLINE PACKAGE
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
0,60
0,20
0,25
0°– 8°
0,15 NOM
Gage Plane
4188781/C 09/02
4,25
5
0,30
0,15
2,90 3,75
2,70
8
4
3,15
2,75
1
0,10
0,00
1,30 MAX
Seating Plane
0,10
M
0,13
0,65
PIN 1
INDEX AREA
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion
D. Falls within JEDEC MO-187 variation DA.

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PACKAGE OUTLINE
C
0.5 MAX
0.19
0.15
1.5
TYP
0.5 TYP
8X 0.25
0.21
0.5
TYP
B E A
D
4223082/A 07/2016
DSBGA - 0.5 mm max heightYZP0008
DIE SIZE BALL GRID ARRAY
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
BALL A1
CORNER
SEATING PLANE
BALL TYP 0.05 C
B
1 2
0.015 C A B
SYMM
SYMM
C
A
D
SCALE 8.000
D: Max =
E: Max =
1.918 mm, Min =
0.918 mm, Min =
1.858 mm
0.858 mm

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EXAMPLE BOARD LAYOUT
8X ( 0.23) (0.5) TYP
(0.5) TYP
( 0.23)
METAL
0.05 MAX ( 0.23)
SOLDER MASK
OPENING
0.05 MIN
4223082/A 07/2016
DSBGA - 0.5 mm max heightYZP0008
DIE SIZE BALL GRID ARRAY
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).
SYMM
SYMM
LAND PATTERN EXAMPLE
SCALE:40X
12
A
B
C
D
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
SOLDER MASK
OPENING
SOLDER MASK
DEFINED
METAL UNDER
SOLDER MASK