Thundercomm TurboX CM6125 Instructions for use

Thundercomm TurboX CM6125 Development Kit
Hardware User Manual
Empowering Every IoT Device with Our Technology

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Table of Contents
Chapter 1. Product Overview ............................................................................................ - 2 -
1.1. Features and specifications ............................................................................................................. - 3 -
1.2. Product diagram .............................................................................................................................. - 4 -
1.3. Development kit introduction ......................................................................................................... - 5 -
1.4. DIP switches ................................................................................................................................... - 11 -
Chapter 2. Specifications for CM6125 DK ......................................................................... - 15 -
2.1. Main Board .................................................................................................................................... - 15 -
2.2. Interposer Board ............................................................................................................................ - 29 -
2.3. Audio Board ................................................................................................................................... - 31 -
2.4. Sensor Board.................................................................................................................................. - 32 -
Appendix 1. Compliance and Certificate Information ......................................................... - 34 -
Appendix 2. Contact Information of EU Local Agency ......................................................... - 39 -
Appendix 3. Contact Information of US Local Agency ......................................................... - 40 -
Appendix 4. Notices ........................................................................................................... - 41 -
Appendix 5. Trademarks .................................................................................................... - 43 -

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Chapter 1. Product Overview
The TurboX CM6125 development kit is a cost-effective solution to evaluate the performance and build the
prototype of the smart cameras and intelligent IoT devices quickly. The development kit features rich
interfaces, including Type-C USB, LCD, and camera modules. The development kit supports Android-S
operating system, combining powerful artificial intelligence and machine learning to address increasing
demand for smart cities, commercial and enterprise, homes, and vehicles applications.
 “TurboX” referred to herein is the English text of our registered trademark: .
Figure 1-1. CM6125 Development Kit - Board Identification

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1.1. Features and specifications
Table 1-1. Features and specifications
Item Specification
Processor
CPU:
 Customized 64-bit Arm v-8.0 compliant applications processor (Qualcomm®
Kryo™ 260 CPU)
 Kryo Gold: quad-core (2.0 GHz high-performance)
 Kryo Silver: quad-core (1.8 GHz low-power)
GPU: Qualcomm® Adreno™ GPU 610 at 950 MHz graphics processing unit
(GPU) with 64-bit addressing
DSP: Qualcomm® Hexagon™ DSP with Qualcomm® Hexagon™ Vector
eXtensions (dual HVX 512)
Memory eMCP (eMMC 5.1 + LPDDR4X)
Multimedia
 Alternative of 4-lane MIPI DSI interface or LVDS interface
 Three 4-lane MIPI CSI interfaces.
 HDMI in and HDMI out 2.0 (TBD)
 Native DisplayPort 1.4
 FM (WCN3950/WCN3980)
USB
 1 x USB 3.0 Type-C device port
 1 x Micro USB 2.0 connector (for UART debug)
 Onboard HUB:
 1 x USB host Type-C
 4 x USB Type-A
Ethernet 10BASE-Te/100BASE-Tx/1000BASE-T IEEE 802.3 compliant
SDIO 1 x TF Card
Sensor
 1 x IMU
 1 x ALS + Proximity
 1 x barometer
 1 x Mag sensor
Power supply DC-Jack: 1 x 12 V DC in
Audio
 WCD9335 audio codec
 1 x 3.5 mm audio jack HP jack
 2 x WSA8815 audio amplifiers
 8x DMIC IN
Charger PMI632 + SMB1355
Button
 1 x Power on
 2 x Volume
 1 x Force_USB_boot
SIMs 2x UIM interface
Air interface
 GSM/WCDMA/LTE
 WLAN
 BT
Operating temperature -25℃ to +75℃

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1.2. Product diagram
Figure 1-2. Main Board Block Diagram
 NOTE: Camera module and TFT-LCD are accessories to the development kit.
Figure 1-3. Interposer Board Block Diagram

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1.3. Development kit introduction
TurboX CM6125 DK adopts TCSOM_Carrier which consists of various sub boards. CM6125 SOM is connected
to the DK via the Interposer Board.
 Main Board
Core board of TCSOM_Carrier, adaptable to various SOMs via 500-pin connector. It mainly supports
functions of USB, LCM, HDMI out, camera, SD card, SIM card, key, LED, etc. In addition, it can be
connected to other expansion modules via rich peripheral interfaces including low-speed connectors,
camera interface, display connector, PCIe expansion connector, etc.
 Interposer Board
Carrier board of SOM, transferring signal from SOM to the Main Board via 500-pin connector. It also
contains all RF interfaces and special SOM interfaces (for example, eDP).
 Audio Board
This board is used together with the Main Board and is connected to the Main Board via the low-speed
connectors. It contains codec WCD9385, amp WSA8835, and supports speaker, DMIC as well as headset
functions.
 Sensor Board
This board is used together with the Main Board and is connected to the Main Board via the low-speed
connectors. It is mainly used for sensors. In addition, it is fit for applications including battery, NFC, CAN,
FAN, etc.
 To fit all the boards together, refer to Figure 1-1.
Refer to the following sub sections for the detailed description of interfaces on each board.

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1.1.1. Main Board overview
Figure 1-4. Main Board Overview
Table 1-2. Main Board interface list
Item Reference Description
1 J600 12V DC jack input, 2.5mm/5.5mm
2 USB3400 UART debug port, UART to USB
3 J3901 a) USB Type-A port, only as host
17 USB3900 b) Micro USB port, sharing DP/DM with USB Type C connector, adb/download/host/device
4 J3900 USB Type-C port, adb/download/host/device
5 J3800 HDMI out interface, 2.0
6 J3700 c) LCD1 interface (option)
7 J1200 PCIe expansion module connector, 2 x 2-lane
8 J3401 Camera interface #5
9 J3400 Camera interface #4
10 J3300 Camera interface #2
11 J3301 Camera interface #3
12 J3200 Camera interface #0
13 J3201 Camera interface #1
14
LED4408 d) LED4408, Flash LED #3
LED4409 LED4409, Flash LED #2
LED4410 LED4410, Flash LED #1
15 SIM4201 Nano SIM card slot #2
16 SIM4200 Nano SIM card slot #1
19 CON1000 500-pin connector to the Interposer Board
20 J4100 SD card slot

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Item Reference Description
21 SW4404
6-pin switch, boot configuration and CBL
 SW1, SDM_WDOG_DISABLE
 SW2, SDM_FAST_BOOT_0
 SW3, SDM_FAST_BOOT_1
 SW4, SDM_FAST_BOOT_2
 SW5, SDM_FAST_BOOT_3
 SW6, CBL_PWR_N
22 SW4403 Key, Force USB boot button
23 SW4401 Key, Volume up button
24 SW4402 Key, Volume down button
25 SW4400 Key, Power on button
26
 LED4406
 LED4407
 LED4411
3 x RGB LED from PMIC with independent brightness control:
 LED4406, red LED
 LED4407, green LED
 LED4411, blue LED
18
 LED4400
 LED4402
 LED4404
3 x RGB LED from GPIO, for example, BT/Wi-Fi activity:
 LED4400, red LED, no use
 LED4402, green LED, indicating Wi-Fi status
 LED4404, blue LED, indicating BT status
27
 J1100
 J1101
 J1102
 J1103
 Low-speed connector to low-speed expansion board
 4 x 80-pin B2B connector
28 LED4401 LED4401, indicating Main Board 4V2 OK
LED4403 LED4403, indicating SOM power input OK
29 J3500 90-pin B2B connector, for camera interface extension such as HDMI in function and so on
(with HDMI in)
30 J3600 LCD0 interface
31 J5000 90-pin B2B connector, for display interface extension such as LVDs, 4k LCM
40
 SW1300
 SW1301
 SW2100
 SW2101
 SW2200
DIP switches for board function control
a) Only HS 2.0 signal is available on CM6125 SOM.
b) CM6125 USB0 is a complete Type-C port. By default, USB3900 is not used.
c) CM6125 has only one group of DSI0, and thus all LCD1 interfaces are unavailable.
d) Unavailable on CM6125.

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1.1.2. Interposer Board overview
Figure 1-5. Interposer Board Overview
Table 1-3. Interposer Board interface list
Item Reference Description
1 J1600 ANT_2G_5G_WLAN, Wi-Fi 2.4G/5G&BT
2 J1400 a) Camera module connector, CSI4
3 J1602 ANT_DRX, 2G+3G+4G RF Diversity RX
4 J1606 ANT_GPS_L1_IN, GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS
5 J1000 CM6125 SOM
6 J1604 ANT_PRI, 2G+3G+4G Primary RX and TX
a). This connector is reserved for internal CSI signal test only, and is thus unavailable to users.

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1.1.3. Audio Board overview
Figure 1-6. Audio Board Overview
Table 1-4. Audio Board interface list
Item Reference Description
1
J900
J901
J902
J903
 Low-speed connector to low-speed expansion board
 4 x 80-pin B2B connector
2
SW3400
SW3401
SW3402
SW3403
SW3404
DIP switch for DMIC connection selection
3
SW3100
SW3101
SW3102
DIP switch to control Audio Board configuration
4 J3505 Speaker connector
5 J3301M a) Right WSA881x speaker connector
6 J3300M a) Left WSA881x speaker connector
7 J3201M a) Right WSA883x speaker connector
8 J3200M a) Left WSA883x speaker connector
9 J3504 Ear out connector
10 J3503 Line out connector
11 J3500 Analog microphone connector 1
12 J3501 Analog microphone connector 3
13 J3502 Headset connector
21
J1000
J1100
J1101
J1102
 Low-speed connector to Main Board
 4 x 80-pin B2B connector
a) CM6125 uses WSA8835 as the speaker amplifier, and thus J3201M and J3200M are available for CM6125
speaker connection.

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1.1.4. Sensor Board overview
Figure 1-7. Sensor Board Overview
Table 1-5. Sensor Board interface list
Item Reference Description
1
J900
J901
J902
J903
 Low-speed connector to low-speed expansion board
 4 x 80-pin B2B connector
2 J4102
J4103 NFC antenna connector
3 U3103 ALS+ PROXIMITY sensor, TMD2755
4 U3100 Magnetic, SK09915C
5 U3101 ACC+GYRO sensor, LSM6DS3TR-C
6 U3102 Pressure sensor, BMP280
7 U3104 SAR sensor
8 J1001 a) Battery connector
9 J4200 b) CAN connector
10 J1500 FAN connector
21
J1000
J1100
J1101
J1102
 Low-speed connector to Main Board
 4 x 80-pin B2B connector
22 SW1100 DIP switch
a) CM6125 DK uses DCDC to supply CM6125 SOM by default. To use battery as the supply source, please
refer to Main Board circuit and rework the related resistors.
b) Unavailable on CM6125 SOM.

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1.4. DIP switches
1.4.1. DIP switches on Main Board
 SW1300 and SW1301 (for function configuration)
Table 1-6. State description of SW1300
No. Name Function default
1 CSI0_HDMI_SEL
Control CSI0 switch for CAM0 or Camera Expansion Board
 OFF: Use CAM0 on Main Board
 ON: Use Camera Expansion Board
OFF
2 CSI1_HDMI_SEL
Control CSI1 switch for CAM1 or Camera Expansion Board
 OFF-use CAM1 on Main Board
 ON -use Camera Expansion Board
OFF
3 - - OFF
4 NFC_GPIO_SEL
Control GPIO switch for NFC function or PCIE Expansion Board
 OFF-connect NFC related GPIO to NFC IC
 ON - connect NFC related GPIO to pcie board for control
OFF
5 - - OFF
6 HS_SW_TYPEC_MICROUSB
Control USB0 HS switch for Type C or Micro USB
 OFF-use Type-C port
 ON -use Micro USB port
OFF
Table 1-7. State description of SW1301
No. Name Function Default
1 DSI0_HDMI_SEL
Control DSI0 switch for LCD0 on board or HDMI OUT
 OFF-use LCD0 on Main Board
 ON –use HDMI OUT as display
OFF
2 DSI0_HDMI_EXT_SEL
Control DSI0 switch for HDMI OUT or Display Expansion Board
 OFF- use HDMI OUT as display
 ON –use Display Expansion Board
OFF
3 DSI1_HDMI_SEL
Control DSI1 switch for LCD1 on board or HDMI OUT
 OFF-use LCD1 on Main Board
 ON –use HDMI OUT as display
OFF
4 DSI1_HDMI_EXT_SEL
Control DSI1 switch for HDMI OUT or Display Expansion Board
 OFF- use HDMI OUT as display
 ON –use Display Expansion Board
OFF
5 LCD0_PWR_SEL_BL
Select LCD0 backlight source, supplied by SOM or DK
 OFF-select SOM backlight for LCD0
 ON –select DK backlight generator for LCD0
ON
6 LCD0_PWR_SEL_DISP
Select LCD0 BIAS source, supplied by SOM or DK
 OFF-select SOM bias for LCD0
 ON –select DK bias generator for LCD0
ON

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 SW2200 (for display function configuration)
No. Name Function Default
1 PM_PWM_A_LS
Connect PM_PWM_A to low speed interface as GPIO
 OFF - /
 ON –connect this signal to low speed con
OFF
2 LCD0_BL_PWM_T
Connect PM_PWM_A to LCD0 for dimming backlight
 OFF- /
 ON – LCD0 backlight dimming
ON
3 CON_GPIO_A9_LS
Connect CON_GPIO_A9 to low speed interface as GPIO
 OFF- /
 ON –connect this signal to low speed con
OFF
4 LCD0_TE_T
Connect CON_GPIO_A9 to LCD0 for TE
 OFF- /
 ON –LCD0 use TE signal
OFF
5 CON_GPIO_A10_LS
Connect CON_GPIO_A10 to low speed interface as GPIO
 OFF- /
 ON –connect this signal to low speed con
OFF
6 LCD1_TE_T
Connect CON_GPIO_A10 to LCD1 for TE
 OFF- /
 ON –LCD1 use TE signal
OFF
 SW2100 and SW2101 (for camera function configuration)
Table 1-8. State description of SW2100
No. Name Function Default
1 CAM0_STROBE_LS
Connect CAM0_STROBE to low speed interface as GPIO
 OFF- /
 ON –connect this signal to low speed con
OFF
2 CAM0_STROBE_CON
Connect CAM0_STROBE to CAM0 for strobe
 OFF- /
 ON –CAM0 uses flash strobe
OFF
3 CAM0_DOVDD_1V8_EN_LS
Connect CAM0_DOVDD_1V8_EN to low speed interface as
GPIO
 OFF- /
 ON –connect this signal to low speed con
OFF
4 CAM0_DOVDD_1V8_EN_CON
Connect CAM0_DOVDD_1V8_EN to CAM0 for power control
 OFF- /
 ON –CAM0 power-on control
ON
5 SLEEP_CLK_LS
Connect SLEEP_CLK to low speed interface for other function
 OFF- /
 ON –connect this signal to low speed con
OFF
6 SLEEP_CLK_CON
Connect SLEEP_CLK to CAM0 for low power mode
 OFF- /
 ON –CAM0 uses sleep clock for low power mode
OFF

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Table 1-9. State description of SW2101
No. Name Function Default
1 / OFF
2 / OFF
3 CAM1_SPI_CS_LS
Connect CAM1_SPI_CS to low speed interface as GPIO
 OFF- /
 ON –connect this signal to low speed con
OFF
4 CAM1_SPI_CS_CON
Connect CAM1_SPI_CS to CAM1 for SPI communication
 OFF- /
 ON –CAM1 use SPI as communication interface
OFF
5 CAM0_SPI_CS_LS
Connect CAM0_SPI_CS to low speed interface as GPIO
 OFF- /
 ON –connect this signal to low speed con
OFF
6 CAM0_SPI_CS_CON
Connect CAM0_SPI_CS to LCD1 for SPI communication
 OFF- /
 ON –CAM1 use SPI as communication interface
OFF
1.4.2. DIP switches on Audio Board
Figure 1-8. DIP Switches on Audio Board
By default, these DIP switches are set per the sequence of pin#1~pin#6.
 Board function settings:
 SW3101: OFF/OFF/OFF/ON/OFF/ON, enabling WCD9385 and WSA8835
 SW3100: OFF/OFF/OFF/OFF/OFF/OFF
 SW3102: OFF/OFF/OFF/OFF/OFF/OFF

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 DMIC connection settings:
 SW3400: ON/ON/OFF/OFF/OFF/OFF, connecting SOM DMIC01
 SW3401: OFF/OFF/OFF/OFF/ON/ON, connecting SOM DMIC23
 SW3403: OFF/OFF/ON/ON/OFF/OFF, connecting SOM DMIC45
 SW3402 & SW3404: OFF/OFF/OFF/OFF/OFF/OFF

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Chapter 2. Specifications for CM6125 DK
2.1. Main Board
2.1.1. Power-on
Step 1. Connect the device (via the UART debug port, No. 2 in Figure 1-4) to a PC with a Micro USB cable.
Step 2. Run the serial console tool on host PC (for example: minicom).
 NOTE:
 Set the Bps/Par/Bits to 115200 8N1
 If the UART log is not required, skip Steps 1 and 2.
Step 3. Connect the power adapter to the board.
Figure 2-1. Connect Power Adapter
Step 4. Press and hold the power on button (No. 25 in Figure 1-4) for at least six seconds.
Afterwards, the board will start the bootup process.

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2.1.2. Camera interface
Camera interfaces: No.8 to No.13 in Figure 1-4.
There are 6 x 4L camera BTB (Board to Board) interfaces on the Main Board. Also, there is a 90-pin connector
to expand camera or HDMI in interface on the camera module (see Figure 1-2. Main Board Block Diagram).
CM6125 SOM supports five integrated MIPI CSIs.
Figure 2-2. Camera Interfaces
All camera interfaces have the same pin definition (refer to Table 3-1) and all camera modules need
dedicated FPC to enable connection to the interface. In other words, the camera interface is not directly
adaptive to any camera.

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Table 3-1. Camera interface description
No. Name Description
1 STROBE Camera strobe for flash driver (FLASH_STROBE), only for CAM0
2 SPI_CLK Reserved for Camera SPI communication interface, only for CAM0
3 AVDD_2V8 -
4 SPI_MOSI Reserved for Camera SPI communication interface, only for CAM0
5 RST -
6 GND -
7 CSI_C1_LN2_P -
8 CSI_A2_LN2_M -
9 GND -
10 CSI_B0_LN0_P -
11 CSI_C0_LN0_M -
12 GND -
13 CSI_B2_LN3_P -
14 CSI_C2_LN3_M -
15 PWR_SWITCH a) Used for DVDD power selection.
16 GND -
17 CSI_B1_LN1_M -
18 CSI_A1_LN1_P -
19 GND -
20 CSI_A0_CLK_M -
21 CSI_NC_CLK_P -
22 GND -
23 MCLK -
24 GND -
25 I2C_SCL -
26 I2C_SDA -
27 SPI_CS b) Reserved for Camera SPI communication interface, only for CAM0;
Share with AFVDD (Auto Focus VDD), 5V, only for CAM0 and CAM1.
28 DOVDD 1.8V
29 SPI_MISO Reserved for Camera SPI communication interface, only for CAM0
30 DVDD_1V1_1V2 Camera DVDD supports 1.1V and 1.2V selection.
 NOTE:
a) When the DVDD of camera module is 1.1V, the PIN-15 of FPC should be pulled up to DOVDD, then
PIN-30 DVDD will output 1.1V for Camera; otherwise, PIN-30 outputs 1.2V for Camera by default.
b) On CAM0 and CAM1, the interface adds AFVDD power supply, which shares with SPI_CS PIN-27. The
voltage of AFVDD is 5V.

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2.1.3. Display interface
 LCD0: No.30 in Figure 1-4
 HDMI out interface: No.5 in Figure 1-4
2.1.3.1. LCM
The LCM on the Main Board is connected to 5-inch 1280*720 TFT-LCD with touch panel, fixed by a dedicated
holder.
Check the connection between the LCD panel (accessory) and the board, refer to Figure 2-3.
For detailed information on how to open LCM, refer to the relevant software user manual.
Figure 2-3. Display Panel Connection

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Table 3-2. LCM pin definition
No. Symbol Description
1 LED- Backlight cathode
2 LED+ Backlight anode
3 GND Ground
4 TP-SDA IIC signal of TP
5 TP-SCL
6 TP-INT INT signal of TP
7 TP-RST Reset signal of TP
8 TP-VDD(2.8V) Power supply 2.8V for TP
9 LCD-ID1 NC
10 AVDD5.5V Power supply of 5.5V
11 AVEE-5.5V Power supply of -5.5V
12 VDD1.8V Power supply 1.8V for LCD
13 LCM-RSTN Reset Singal for LCD
14 N25530738(PWM) LCD backlight control PWM output Pin
15 LCM-FMARK(TE) Tearing effect output pin
16 GND Ground
17 MIPI_D0P MIPI DSI Data0+ signal
18 MIPI_D0N MIPI DSI Data0- signal
19 GND Ground
20 MIPI_D1P MIPI DSI Data1+ signal
21 MIPI_D1N MIPI DSI Data1- signal
22 GND Ground
23 MIPI_CLKP MIPI DSI CLK+ signal
24 MIPI_CLKN MIPI DSI CLK- signal
25 GND Ground
26 MIPI_D2P MIPI DSI Data2+ signal
27 MIPI_D2N MIPI DSI Data2- signal
28 GND Ground
29 MIPI_D3P MIPI DSI Data3+ signal
30 MIPI_D3N MIPI DSI Data3- signal