
Robotics RB5 Development Kit Hardware User Manual
Copyright©2020 Thundercomm Technology Co., Ltd. All rights reserved.
II
3.18.1 Ethernet Connector .................................................................................................................. 13
3.18.2 Inertial Sensors.......................................................................................................................... 14
3.18.3 DIP Switch.................................................................................................................................. 14
3.18.4 Extra Low Speed Expansion Connector.................................................................................. 14
3.18.5 Extra High Speed Expansion Connectors............................................................................... 15
4Low speed Expansion connector........................................................................................16
4.1 Primary Low Speed Expansion Connector: LS1............................................................................. 16
4.1.1 UART .......................................................................................................................................... 17
4.1.2 I2C............................................................................................................................................... 17
4.1.3 GPIO ........................................................................................................................................... 17
4.1.4 SPI............................................................................................................................................... 18
4.1.5 PCM/I2S ..................................................................................................................................... 18
4.1.6 Power and Reset ....................................................................................................................... 18
4.1.7 Power Supplies.......................................................................................................................... 19
4.2 Secondary Low Speed Connector: LS2 .......................................................................................... 19
4.2.1 Audio.......................................................................................................................................... 20
4.2.2 Stereo speaker .......................................................................................................................... 20
4.2.3 Digital Microphones................................................................................................................. 21
4.2.4 CAN ............................................................................................................................................ 21
4.2.5 I2C............................................................................................................................................... 21
4.2.6 GPIOs.......................................................................................................................................... 22
4.2.7 Other signals on Secondary Low Speed Connector ............................................................. 22
4.3Tertiary Low Speed Connector: LS3 ............................................................................................... 23
4.3.1 SSC SPI ....................................................................................................................................... 24
4.3.2 SSC I2C....................................................................................................................................... 24
4.3.3 Sensor interrupt ........................................................................................................................ 25
4.3.4 Other signals on Tertiary Low Speed Connector .................................................................. 25
5High speed expansion connectors ....................................................................................26
5.1 Primary high speed expansion connector: HS1 ............................................................................ 26
5.1.1 MIPI DSI ..................................................................................................................................... 27
5.1.2 MIPI CSI...................................................................................................................................... 28
5.1.3 I2C............................................................................................................................................... 28
5.1.4 HSIC............................................................................................................................................ 28
5.1.5 Reserved .................................................................................................................................... 28
5.1.6 SD/SPI ........................................................................................................................................ 28
5.1.7 Camera Clocks........................................................................................................................... 29
5.1.8 USB ............................................................................................................................................. 29
5.2 Secondary High Speed Connector: HS2 ........................................................................................ 29