Toshiba TPS856 User manual

TPS856
2007-10-01
1
TOSHIBA Photo-IC Silicon Epitaxial Planar
TPS856
Mobile Phones
Notebook PCs, PDAs
Video cameras, Digital Still Cameras
Other Equipment Requiring Luminosity Adjustment
The TPS856 is an ultra-compact surface-mount photo-IC for
illuminance sensors which incorporates a photodiode and current amp
circuit in a single chip.
The sensitivity is superior to that of a phototransistor, and exhibits
little variation.
It has spectral sensitivity closer to luminous efficiency and excellent
output linearity.
With its ultra-compact surface-mount package, this photo-IC can be
used as the power-saving control for domestic appliances or for
backlighting for displays in cellular phones, this device enables low
power consumption to be achieved.
This device includes stand-by function which can reduce the power consumption.
•Ultra-compact and light surface-mount package: 1.6 × 1.6 × 0.55 mm
•Excellent output linearity of illuminance
•Little fluctuation in light current and high level of sensitivity
: IL= 57 μA (typ.) @EV= 100 lx using fluorescent light
: Light current variation width: × 1.67 ( When light current classification is specified.)
: Little temperature fluctuation
•Built-in luminous-efficiency correction function, reduced sensitivity variations due to various light sources
: IL(using incandescent light)/IL(using fluorescent light) = 1.0 (typ.)
•Low supply voltage, making device suitable for battery-powered equipment: VCC = 1.8 V to 5.5 V
Absolute Maximum Ratings (Ta =25°C)
Characteristics Symbol Rating Unit
Supply voltage VCC −0.5 to 6 V
Stand-by voltage Vstb
<
=
VCC V
Output voltage VOUT
<
=
Vstb V
Light current IL5 mA
Permissible power dissipation P 30 mW
Power dissipation derating
(Ta >25°C) ΔP/°C −0.4 mW/°C
Operating temperature range Topr −30 to 85 °C
Storage temperature range Tstg −40 to 100 °C
Soldering temperature range (Note 1) Tsol 260 °C
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings and the operating ranges.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: The reflow time and the recommended temperature profile are shown in the section entitled Handling
Precautions.
TOSHIBA ―
Weight: 0.003 g (typ.)

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Operating Ranges
Characteristics Symbol Min Typ. Max Unit
Supply voltage VCC 1.8 ⎯5.5 V
Stand-by on voltage Vstbon 1.8 ⎯ VCC V
Stand-by off voltage Vstboff 0⎯0.3 V
Electrical and Optical Characteristics (Ta =25°C)
Characteristics Symbol Test Condition Min Typ. Max Unit
Supply voltage VCC ⎯1.8 ⎯5.5 V
Supply current (1) ICC(1) VCC =3 V, Vstb =3 V,EV=1000 lx
RL=1 kΩ(Note 2) (Note 5) ⎯3.0 ⎯μA
Supply current (2) ICC(2) VCC =3 V, Vstb =0.3 V,EV=1000 lx
RL=1 kΩ(Note 2) (Note 5) ⎯3.0 ⎯μA
Light current (1) IL(1)
VCC =3 V, Vstb =3 V,EV=100 lx
(Note 2), (Note 4) ⎯57 ⎯μA
Light current (2) IL(2)
VCC =3 V, Vstb =3 V,EV=10 lx
(Note 3), (Note 4)
4.0 5.7 8.0 μA
Light current (3) IL(3)
VCC =3 V, Vstb =3 V,EV=100 lx
(Note 3), (Note 4)
40 57 80 μA
Light current (4) IL(4)
VCC =3 V, Vstb =0.3 V,EV=100 lx
(Note 3), (Note 4) ⎯0.02 0.1 μA
Light current ratio (3)
L
I
(1)
L
I⎯⎯1.0 ⎯⎯
Dark current ILEAK V
CC =3 V, Vstb =3 V,EV=0 ⎯⎯0.1 μA
Saturation output voltage VOVCC =3 V, Vstb =3 V,RL=150 kΩ,
EV=100 lx (Note 3) ⎯0.70 0.85 V
Waiting time twait VCC =3 V, Vstb =3 V,RL=150 kΩ,
EV=5lx (Note3) ⎯⎯20 ms
Rise time tr ⎯70 ⎯
Fall time tf⎯ 40 ⎯
Delay time td ⎯100 ⎯
Switching time
Storage time ts
VCC =3 V, Vstb =3 V,RL=5 kΩ
(Note 7)
⎯5 ⎯
μs
Note 2: CIE standard A light source is used (color temperature =2856K, approximated incandescence light).
Note 3: F10 of fluorescence light is used as light source. (color temperature =5000K)
However, white LED is substituted in a mass-production process.
IL(3) classification A rank: 44.1 μA to 73.7 μA
Note 4: Light current measurement circuit
Vstb
VCC
IL
TPS856
Light
source
A
OUT

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Note 5: Supply current measurement circuit
Note 6: Waiting time measurement method
Note 7: Switching time measurement method
Vstb
VCC
ICC
TPS856
Light
source
A
RL
Vstb
VOUT
10%
twait
Vstb
VCC
TPS856
Light
source RL
VOUT
0V
Vstb
White LED
Pulse drive
Vstb
VCC
TPS856
RL
VOUT
tftr
IF
VOUT
90%
10%
tdts
IF
Vstb
OUT

TPS856
2007-10-01
4
Package Dimensions
Weight: 0.003 g (typ.)
Block Diagram
Unit: mm
Tolerance: ± 0.1
( ): Reference value
Pin connection
1. VCC
2. GND
3. GND
4. GND
5. GND
6. OUT (Vstb)
1.20 1.60
0.20 0.20
0.55
0.10
0.10
max0.2max0.2 (0.8)
0.20
0.3Typ.
0.50 0.50
1.60
5°
5°
5°
123
4 56
Equivalent circuit in output part
V
CC
GND
OUT
V
CC
GND
OUT
Vcc
OUT
GND
PD
PD with
filter
←
Vcc
OUT
GND
PD
PD with
filter
←

TPS856
2007-10-01
5
Handling Precautions
Insert a bypass condenser of up to 0.1μFbetween VCC and GND near the device to stabilize the power supply line.
Please put the bypass capacitor of 0.1uF between OUT and GND near the device if you use it as a current output
(There is no load resistance).
When VCC is turned on it takes at least 20 ms for the internal circuit to stabilize. During this time the output
signal is unstable. Please do not use the unstable signal as the output signal.
Moisture-Proof Packing
(1) To avoid moisture absorption by the resin, the product is packed in an aluminum envelope with silica
gel.
(2) Since the optical characteristics of the device can be affected during soldering by vaporization
resulting from prior absorption of moisture and they should therefore be stored under the following
conditions:
Temperature: 5°C to 30°C, Relative humidity: 70% (max), Time: 168 h (max)
(3) Baking in taping with reel is required if the devices have been store unopened for more than six
months or if the aluminum envelope has been opened for more than 168 h.
These devices are packed on tapes; hence, please avoid baking at high temperature.
Recommended baking conditions: 60°C for 12 h or longer, Perform baking only once
Mounting Precautions
TPS856usesaclearresin,anddelicatehandlingisnecessaryforit.
The characteristic change or the product might be damaged by the handling method of mounting.
Please note the following and handle the product.
(1) Do not apply stress to the resin at high temperature.
Time until the product returns at the normal temperature after mounting of
the reflow is different according to the mounting substrate and the environment.
Please do not give the stress with heat remained in the product.
(2) The resin part is easily scratched, so avoid friction with hard materials.
(3) When installing the assembly board in equipment, ensure that this product does not come into
contact with other components.
(4) Please confirm the heat contraction of the substrate of the reflow mounting doesn't influence the
product. The load is given to the product by mounting that the heat contraction is large on the
substrate and the installation position of the substrate. Please note that the characteristic changes
or the product might be damaged.
Mounting Methods
(1) Example of reflow soldering
•Please perform the first reflow soldering within 168 h after opening the package with reference to
the above temperature profile.
30 s to 50 s Heating part
Time (s) →
60∼120 s
Temperature (°C) →
260°C max (*)
230°C
190°C
180°C Preheatin
g
p
art
10s max (*)
4°C/s max (*)
4°C/s max (*)
(
*
)
The product is evaluated using above reflow soldering conditions. No additional test is performed
exceed the condition (i.e. the condition more than MAX values) as an evaluation.
Please perform reflow soldering under the above conditions. Perform reflow soldering no more than
twice.

TPS856
2007-10-01
6
•Second reflow soldering
In case of second reflow soldering, it should be performed within 168 h after first reflow under the
above conditions.
Storage conditions before second reflow soldering: 30°C, 70% RH or lower
•Do not perform flow soldering.
•Make any necessary soldering correction manually.
(Do not do this more than once for any given pin.)
Temperature: no more than 350°C (25 W for soldering iron)
Time: within 5 s
(2) Recommended soldering pattern
(3) Cleaning conditions
When cleaning is required after soldering
Chemicals: AK225 alcohol
Temperature and time: 50°C ×30 s or 30°C ×3 min
Ultrasonic cleaning: 300 W or less
Packing Specification
(1) Packing quantity
Reel (minimum packing quantity) 3,000 devices
Carton 5 reels (15,000 devices)
(2) Packing format
Silica gel and reel are packed into sealed aluminum envelope.
Pack shock-absorbent materials around the aluminum envelopes in the cartons to cushion them.
•Carton specification
Carton dimensions
(W) 81 mm ×(L) 280 mm ×(H) 280 mm
Unit: mm
0.5
1.35
0.5
0.3
0.45
1.0
Label

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2007-10-01
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Tape Packing Specifications
(1) Reel dimensions
Reel material: Plastic
φ180 -1.0
φ60 -0
11.4±1.0
9.0±0.3
Unit: mm
5.0
Enlarged view of reel center
5.0
120°
φ13 ±0.2
2 ±0.5
φ21 ±0.8
+1.0
+0

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2007-10-01
8
(2) Tape dimensions
Tape material: Plastic (anti-electrostatic)
Product direction
Unit: mm
1.75±0.1
φ1.5 +0.1
−0
4.0±0.1
2.0±0.05
4.0±0.1φ1.1±0.1
3.5±0.1
(2.75)
8.0±0.2
A A'
A A'
B
B'
B
B'
max 6°
1.7 ±0.1
max 6°
0.25 ±0.05
0.85 ±0.1
1.8 ±0.1
max 6°max 6°

TPS856
2007-10-01
9
Reel Label
The label markings may include product number, quantity and seal date.
P/N
TYPE TPS856
ADDC Q’TY 3,000 pcs.
NOTE
Leader and Trailer Sections of Tape
Note 1 : The leader portion shell consist of cover tape minimum length of 300 mm and a piece of carrier
tape with empty portion of 100 mm minimum.
Note 2 : The trailer portion shall consist of empty carrier of more than 10 cavities.
Position of label
Sensor hole

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2007-10-01
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Relative light current
Ambient temperature Ta (°C)
P – Ta
Power dissipation P (mW)
Luminance EV(lx)
I
L– EV(typ.)
Light current IL(μA)
Supply voltage VCC (V)
Relative IL– VCC (typ.)
0
0
40
20 40 60 80 100
30
20
10
5
35
25
15
Ta =25°C
VCC =Vstb
0.8
1
1.2
6
2 3 4 5
1.1
1.0
0.9
Ta =25°C
VCC =3 V
Vstb =3 V
A light source
Fluorescent light
1
10000
1000
100
10
0.1
1 10 100 1000 10000
Relative light current
Standby Voltage Vstb (V)
Relative IL– Vstb (typ.)
Ta =25°C
VCC =5.5V
0.8
1
1.2
6
2 3 4 5
1.1
1.0
0.9
Luminance EV(lx)
I
L– EV(typ.)
Light current IL(nA)
Ta =25°C
VCC =3 V
Vstb =0.3 V
A light source
Fluorescent light
1
10000
1000
100
10
0.1
1 10 100 1000 10000
Ambient temperature Ta (°C)
ILEAK – Ta (typ.)
Dark current ILEAK (μA)
1
0.0001
20
VCC =3 V
Vstb =3 V
0.1
0.01
0.001
40 60 80 100