Toshiba GR 200 Series User manual

6F2S1931 (Rev. 0.20)
Notice: This manual is issued for ‘030’, ‘031’, ‘032’
‘033’, ‘034’software codes, which you can identify
at ’S, G, and T positions’ on Software nameplate.
GRB200---
S, G, and T positions
TOSHIBA ENERGY SYSTEMS&SOLUTIONS CORPORATION
Instruction manual
Centralized Busbar Protection IED
GR200 series (GRB200)

6F2S1931 (0.20)
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Safety Precautions
Before using this equipment, please read this chapter carefully.
This chapter describes the safety precautions recommended when using the GR
equipment. Before installing and using the equipment, this chapter must be thoroughly read
and understood.
Explanation of symbols used
Signal words such as DANGER, WARNING, and CAUTION, will be followed by
important safety information that must be carefully reviewed.
Indicates an imminently hazardous situation which will result in
death or serious injury if you do not follow the instructions.
Indicates a potentially hazardous situation which could result in
death or serious injury if you do not follow the instructions.
CAUTION Indicates a potentially hazardous situation which if not avoided,
may result in minor injury or moderate injury or property damage.
•Current transformer circuit
Never allow the current transformer (CT) secondary circuit connected to this equipment to
be opened while the primary system is live. Opening the CT circuit will produce a
dangerously high voltage.
•Exposed terminals
Do not touch the terminals of this equipment while the power is on, as the high voltage
generated is dangerous.
•Residual voltage
Hazardous voltage can be present in the DC circuit just after switching off the DC power
supply. It takes approximately 30 seconds for the voltage to discharge.
•Fiber optic
CLASS 1 LASER PRODUCT.
DANGER
WARNING
DANGER
WARNING

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CAUTION
•Earth
The earthing terminal of the equipment must be securely earthed.
CAUTION
•Operating environment
The equipment must only be used within the range of ambient temperature, humidity and
dust detailed in the specification and in an environment free of abnormal vibration.
•Ratings
Before applying AC voltage and current or the DC power supply to the equipment, check
that they conform to the equipment ratings.
•Printed circuit board
Do not attach and remove printed circuit boards when the DC power to the equipment is
on, as this may cause the equipment to malfunction.
•External circuit
When connecting the output contacts of the equipment to an external circuit, carefully
check the supply voltage used in order to prevent the connected circuit from overheating.
•Connection cable
Carefully handle the connection cable without applying excessive force.
•Modification
Do not modify this equipment, as this may cause the equipment to malfunction.
•Short-wire (Short-bar)
Do not remove the short-wire/short-bar(s) connected to the frame earth (FG) at the terminal
block on the rear of cases.
•Electric wire between #35 - #37 on the power-supply terminal block
Make sure the wire is connected.
(Exception: This wire needs to be detached for performing the dielectric voltage test.)

6F2S1931 (0.20)
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•Disposal
This equipment contains neither expendable supplies nor parts that can be recycled. When
disposing of this equipment, the customer must contact an operator responsible for
industrial waste disposal, and request that the operator dispose of this equipment in
accordance with the local waste disposal regulations; otherwise the person who disposes
of this equipment may be punished under local regulations. When disposing of this
equipment is practiced by the customer acting on their own behalf, it must be done so in a
safe manner according to local regulations. For further information in terms of the disposal,
the customer shall contact to a local dealer and sales staff at Toshiba Energy Systems &
Solutions Corporation (Toshiba ESS, Japan).
This equipment contains neither expendable supplies nor recyclables.
•Plastics material
This equipment contains the following plastics material.
- ABS, Polycarbonate, Acrylic resins, Nylon 66, and others.
Equipment installation and operation
•Equipment installation
Never remove cables at frame ground terminals (FGs) while the AC/DC power supplies.
•Equipment operation
The user shall have responsibilities to use and install the equipment where the
specifications are designated by the manufacture. Never operate the equipment on the
condition where the manufacture cannot intend. Otherwise, the safety function furnished
into the equipment may not be operated properly.
•Symbols
Symbol
Description
Protective conductor terminal
Caution, risk of electric shock

6F2S1931 (0.20)
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Liability, copyright and others
•Disclaimer of liability
We have checked the description of this manual against the hardware and software
described, but we cannot guarantee that all deviations have been eliminated from the
description completely; hence, no liability can be accepted for any errors or omissions
contained in the information given. We review the information in this manual regularly
and there will be some corrections in subsequent editions. We reserve the right to make
technical improvements without notice.
•Copyright
© Toshiba Energy Systems & Solutions Corporation 2021.
All rights reserved.
•Registered Trademarks
Product/Equipment names (mentioned herein) may be trademarks of their respective
companies.

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Contents
1Introduction ............................................................................................................................................ 1
Configuration................................................................................................................................... 2
Protection functions ........................................................................................................................ 7
Recording function .......................................................................................................................... 7
Metering function............................................................................................................................ 7
Summary of GRB200 ...................................................................................................................... 9
Symbols used in logical diagrams................................................................................................ 10
Abbreviation .................................................................................................................................. 14
Function Block (FB), Function ID, Signal number (Data ID).................................................... 16
2Relay application .................................................................................................................................. 18
Current differential protection (DIF)........................................................................................... 19
2.1.1 Check-zone-protection and Discriminating-zone-protection............................................... 19
2.1.2 Selection of protection-characteristic ................................................................................... 24
2.1.3 Stabilization for CT saturation with through-fault current............................................... 25
2.1.4 Current transformer requirements ...................................................................................... 27
2.1.5 DIF slope settings .................................................................................................................. 28
2.1.6 Protection for respective zones (DIFCH, DIFZA to DIFZF)................................................ 30
2.1.7 Blind zone protection............................................................................................................. 36
2.1.8 CT circuit failure detection (Open circuit) ........................................................................... 38
2.1.9 Supervision of differential current (DIF-IdSV) ................................................................... 42
2.1.10 Setting..................................................................................................................................... 44
2.1.11 Signal (DataID) ...................................................................................................................... 45
Circuit breaker failure protection (CBF)..................................................................................... 52
2.2.1 Detecting the failure of circuit breakers .............................................................................. 53
2.2.2 Protection scheme .................................................................................................................. 53
2.2.3 Scheme logic and setting ....................................................................................................... 56
2.2.4 CBF operation by faults occurrence...................................................................................... 65
2.2.5 Setting..................................................................................................................................... 69
2.2.6 Signal (Data ID)..................................................................................................................... 70
Fail safe (FS).................................................................................................................................. 96
2.3.1 Under-voltage element for phase-to-earth voltage (UVFS) ................................................ 97
2.3.2 Under-voltage element for phase-to-phase voltage (UVSFS)............................................. 97
2.3.3 Under-voltage change detection element (UVDFS) ............................................................ 97
2.3.4 Scheme logic ........................................................................................................................... 97
2.3.5 Setting................................................................................................................................... 100
2.3.6 Signal (Data ID)................................................................................................................... 101

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Command trip function (COMTP).............................................................................................. 105
2.4.1 Operation of Command-trip ................................................................................................ 106
2.4.2 Operation of Command-transfer-trip ................................................................................. 106
2.4.3 Scheme logic and setting ..................................................................................................... 107
2.4.4 Operation example of Command-transfer-trip ...................................................................111
2.4.5 Setting................................................................................................................................... 112
2.4.6 Data ID ................................................................................................................................. 113
End fault protection (EFP) ......................................................................................................... 116
2.5.1 Operation of EFP-trip.......................................................................................................... 117
2.5.2 Scheme logic and setting ..................................................................................................... 119
2.5.3 Setting................................................................................................................................... 123
2.5.4 Data ID ................................................................................................................................. 124
Non-directional overcurrent protection (OC) ............................................................................ 131
2.6.1 Characteristic of non-directional OC.................................................................................. 132
2.6.2 Inverse time and definite time delay and characteristic .................................................. 132
2.6.3 Threshold value for each CH............................................................................................... 141
2.6.4 Reset ratio............................................................................................................................. 141
2.6.5 Miscellaneous functions....................................................................................................... 142
2.6.6 Scheme logic and settings ................................................................................................... 143
2.6.7 Setting................................................................................................................................... 146
2.6.8 Signal (Data ID)................................................................................................................... 150
Trip circuit (TRC) ........................................................................................................................ 169
2.7.1 General trip1 (GEN.TRIP1_CH*)....................................................................................... 170
2.7.2 General trip2 (GEN.TRIP2_CH*)....................................................................................... 170
2.7.3 Transfer trip (TR.TRIP_CH*) ............................................................................................. 170
2.7.4 Scheme logic ......................................................................................................................... 170
2.7.5 Setting................................................................................................................................... 173
2.7.6 Signal (Data ID)................................................................................................................... 174
Miscellaneous .............................................................................................................................. 180
2.8.1 Contact supervision (Contact SV)....................................................................................... 180
2.8.2 Blocking coupler (CoupTpBlk) ............................................................................................ 187
Exclusing zone evaluation (Exclusion_CH)............................................................................... 188
3General control function .................................................................................................................... 189
Control scheme ............................................................................................................................ 190
Control mode................................................................................................................................ 193
3.2.1 Select-before-operation mode (SBO)................................................................................... 193
3.2.2 Direct-operation mode (DIR)............................................................................................... 194
Control hierarchy ........................................................................................................................ 196
3.3.1 Control level and control point............................................................................................ 197

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3.3.2 Selector switches and bay operations................................................................................. 197
3.3.3 Programming of control-right distributions....................................................................... 197
Common controls (CMNCTRL) .................................................................................................. 199
3.4.1 Double command blocking (DCB) ....................................................................................... 199
3.4.2 Provision of selected status ................................................................................................. 200
3.4.3 Miscellaneous settings......................................................................................................... 200
Local, remote and PLC control................................................................................................... 202
3.5.1 Local control ......................................................................................................................... 203
3.5.2 Remote control...................................................................................................................... 203
3.5.3 Programmable logic control (PLC)...................................................................................... 203
3.5.4 Connection and mapping for local/remote control............................................................. 203
3.5.5 Signal (DataID).................................................................................................................... 204
LED reset function (LEDR)........................................................................................................ 205
3.6.1 Select logic for resetting LEDs............................................................................................ 206
3.6.2 Cancel logic in SBO mode.................................................................................................... 208
3.6.3 Operate logic for SBO/DIR mode ........................................................................................ 209
3.6.4 Settings in LED logics ......................................................................................................... 210
3.6.5 Mapping for IEC61850 communication.............................................................................. 212
3.6.6 Setting................................................................................................................................... 216
3.6.7 Signal (DataID).................................................................................................................... 216
Counter function for the general (GCNT) ................................................................................. 217
3.7.1 Counter setting for a signal................................................................................................. 218
3.7.2 Select logics for SBO/DIR modes ........................................................................................ 220
3.7.3 Cancel logic for SBO mode .................................................................................................. 225
3.7.4 Operate logic for SBO/DIR modes....................................................................................... 227
3.7.5 Mapping for IEC61850 communication.............................................................................. 231
3.7.6 Setting................................................................................................................................... 235
3.7.7 Signal (DataID).................................................................................................................... 236
Mode control function (MDCTRL).............................................................................................. 238
3.8.1 Function................................................................................................................................ 239
3.8.2 Mapping for IEC61850 communication.............................................................................. 240
3.8.3 Setting................................................................................................................................... 244
3.8.4 Signal (DataID).................................................................................................................... 245
4Technical description.......................................................................................................................... 247
Case and module slots in MainUnit and SubUnits .................................................................. 249
Transformer module for AC analog input (VCT)....................................................................... 254
4.2.1 VCT23B................................................................................................................................. 255
4.2.2 VCT48B................................................................................................................................. 256
4.2.3 VCT21B................................................................................................................................. 257

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4.2.4 Constitution of VCT............................................................................................................. 258
4.2.5 Setting of VCT...................................................................................................................... 260
4.2.6 VCT combinations................................................................................................................ 263
Signal processing and communication modules (CPU)............................................................ 267
4.3.1 Upstream communication ................................................................................................... 268
4.3.2 MainUnit-SubUnit communication.................................................................................... 269
4.3.3 Type of COM modules.......................................................................................................... 270
4.3.4 OPT2 modules (OPT2)......................................................................................................... 274
Binary IO module (BIO).............................................................................................................. 275
4.4.1 Binary input (BI) feature in BI1A and BIO5A................................................................... 276
4.4.2 Binary input (BI) circuit...................................................................................................... 276
4.4.3 Binary output (BO) feature in BO1A and BIO5A.............................................................. 283
4.4.4 Binary output (BO) circuit .................................................................................................. 284
4.4.5 BIO structure ....................................................................................................................... 289
4.4.6 Settings of binary input circuits ......................................................................................... 292
4.4.7 Signals of binary input circuits........................................................................................... 293
4.4.8 Settings of binary output circuits ....................................................................................... 295
4.4.9 Signals of binary output circuits......................................................................................... 297
Power supply module (PWS) ...................................................................................................... 299
4.5.1 PWS structure...................................................................................................................... 299
4.5.2 Input and output items of PWS .......................................................................................... 301
4.5.3 DC voltage monitoring......................................................................................................... 302
Human Machine Interface (HMI) .............................................................................................. 304
4.6.1 Outlook.................................................................................................................................. 304
4.6.2 LED Indicators..................................................................................................................... 305
4.6.3 Function keys with LEDs.................................................................................................... 310
4.6.4 Monitoring jacks................................................................................................................... 315
4.6.5 Operation keys ..................................................................................................................... 317
Clock function.............................................................................................................................. 318
4.7.1 Clock setting......................................................................................................................... 318
4.7.2 Selection of date and time formats ..................................................................................... 318
4.7.3 Time Synchronization.......................................................................................................... 319
4.7.4 Setting time zone ................................................................................................................. 325
4.7.5 DST setting (Summer time setting).................................................................................... 326
4.7.6 Setting................................................................................................................................... 328
Group setting for protection functions....................................................................................... 329
5Engineering tool.................................................................................................................................. 332
Overview of GR-TIEMS .............................................................................................................. 333
Connection ................................................................................................................................... 334

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Common tools .............................................................................................................................. 335
Monitoring tools........................................................................................................................... 335
Record tools.................................................................................................................................. 335
Generic configuration tools......................................................................................................... 336
IEC 61850 configuration tool...................................................................................................... 336
IEC 60870-5-103 configuration tool........................................................................................... 337
Modbus configuration tool .......................................................................................................... 337
Busbar configuration tools.......................................................................................................... 337
6PLC function ....................................................................................................................................... 338
Overview of PLC function........................................................................................................... 339
PLC data error............................................................................................................................. 339
PLC driver.................................................................................................................................... 340
6.3.1 Monitoring point for PLC driver......................................................................................... 340
Timer variable settings using PLC drivers ............................................................................... 344
7Recording function.............................................................................................................................. 349
Fault recorder.............................................................................................................................. 350
7.1.1 Types of recording information ........................................................................................... 350
7.1.2 Screen information............................................................................................................... 351
7.1.3 Operation identifiers (ID1–ID128) ..................................................................................... 352
Event recorder ............................................................................................................................. 359
7.2.1 Trigger signals...................................................................................................................... 359
7.2.2 Trigger modes....................................................................................................................... 368
7.2.3 Screen information............................................................................................................... 369
7.2.4 Setup for the event recorder................................................................................................ 369
Disturbance recorder................................................................................................................... 370
7.3.1 Recording time and amount................................................................................................ 370
7.3.2 Trigger settings for PLC programming.............................................................................. 378
7.3.3 Screen information............................................................................................................... 378
7.3.4 Setting................................................................................................................................... 380
7.3.5 Signal (Data ID)................................................................................................................... 382
Transferred information during fault........................................................................................ 386
7.4.1 Transferred metering values............................................................................................... 387
7.4.2 Transferred information about tripped phase and mode.................................................. 393
7.4.3 Transferred state information............................................................................................. 393
7.4.4 Transferring record value and information ....................................................................... 394
8Metering function ............................................................................................................................... 423
Outline ......................................................................................................................................... 424
Metering data (Metering group)................................................................................................. 424
Metering information on the screen........................................................................................... 425