TQ-Systems MBa8x User manual

MBa8x
User's Manual
MBa8x UM Rev. 0100
29.11.2021

User's Manual l MBa8x UM 0100 l © 2021, TQ-Systems GmbH Page i
TABLE OF CONTENTS
1. ABOUT THIS MANUAL......................................................................................................................................................................................6
1.1 Copyright and license expenses..................................................................................................................................................................6
1.2 Registered trademarks ....................................................................................................................................................................................6
1.3 Disclaimer ............................................................................................................................................................................................................6
1.4 Imprint...................................................................................................................................................................................................................6
1.5 Tips on safety......................................................................................................................................................................................................7
1.6 Symbols and typographic conventions....................................................................................................................................................7
1.7 Handling and ESD tips.....................................................................................................................................................................................7
1.8 Naming of signals..............................................................................................................................................................................................8
1.9 Further applicable documents / presumed knowledge.....................................................................................................................8
2. BRIEF DESCRIPTION ..........................................................................................................................................................................................9
2.1 MBa8x block diagram......................................................................................................................................................................................9
2.2 MBa8x interfaces ............................................................................................................................................................................................10
3. ELECTRONICS...................................................................................................................................................................................................12
3.1 MBa8x functional groups ............................................................................................................................................................................12
3.2 TQMa8x..............................................................................................................................................................................................................12
3.3 TQMa8x mating connectors.......................................................................................................................................................................13
3.4 TQMa8x pinout ...............................................................................................................................................................................................13
3.5 Boot-Mode configuration ...........................................................................................................................................................................19
3.6 Reset and Power Modes ..............................................................................................................................................................................19
3.7 General purpose push buttons .................................................................................................................................................................20
3.8 Battery ................................................................................................................................................................................................................21
3.9 LEDs.....................................................................................................................................................................................................................21
3.10 I2C devices.........................................................................................................................................................................................................22
3.11 GPIO port expander.......................................................................................................................................................................................23
3.12 Temperature sensor ......................................................................................................................................................................................24
3.13 Further devices................................................................................................................................................................................................24
3.14 Interfaces...........................................................................................................................................................................................................24
3.14.1 Audio ..................................................................................................................................................................................................................24
3.14.2 SPDIF...................................................................................................................................................................................................................25
3.14.3 CAN-FD...............................................................................................................................................................................................................25
3.14.4 MLB......................................................................................................................................................................................................................25
3.14.5 USB debug ........................................................................................................................................................................................................26
3.14.6 Ethernet .............................................................................................................................................................................................................26
3.14.7 GPIO ....................................................................................................................................................................................................................27
3.14.8 Display interfaces ...........................................................................................................................................................................................28
3.14.8.1 DisplayPort .......................................................................................................................................................................................................28
3.14.8.2 HDMI In ..............................................................................................................................................................................................................29
3.14.8.3 LVDS....................................................................................................................................................................................................................29
3.14.8.4 MIPI DSI..............................................................................................................................................................................................................29
3.14.9 MIPI CSI ..............................................................................................................................................................................................................30
3.14.10 Mini PCIe............................................................................................................................................................................................................31
3.14.11 PCIe M.2 .............................................................................................................................................................................................................32
3.14.12 PCIe-Clock.........................................................................................................................................................................................................32
3.14.13 SATA M.2 ...........................................................................................................................................................................................................33
3.14.14 SIM.......................................................................................................................................................................................................................33
3.14.15 USB hosts/hubs...............................................................................................................................................................................................33
3.14.16 USB OTG.............................................................................................................................................................................................................34
3.14.17 SD card...............................................................................................................................................................................................................35
3.14.18 mikroBUS...........................................................................................................................................................................................................36
3.14.19 ADC......................................................................................................................................................................................................................36
3.14.20 MBa8x headers................................................................................................................................................................................................37
3.14.21 JTAG ....................................................................................................................................................................................................................39
3.15 Power supply ...................................................................................................................................................................................................40
3.16 Cooling concept .............................................................................................................................................................................................40
3.17 Fan .......................................................................................................................................................................................................................41
4. SOFTWARE........................................................................................................................................................................................................42
5. MECHANICS......................................................................................................................................................................................................42
5.1 MBa8x dimensions.........................................................................................................................................................................................42
5.2 Notes of treatment ........................................................................................................................................................................................43
5.3 Embedding in the target system..............................................................................................................................................................43

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5.4 Thermal management..................................................................................................................................................................................43
5.5 Assembly ...........................................................................................................................................................................................................44
6. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS ............................................................................................................46
6.1 EMC .....................................................................................................................................................................................................................46
6.2 ESD.......................................................................................................................................................................................................................46
6.3 Operational safety and personal security..............................................................................................................................................46
7. CLIMATIC AND OPERATIONAL CONDITIONS .......................................................................................................................................46
7.1 Protection against external effects..........................................................................................................................................................46
7.2 Reliability and service life............................................................................................................................................................................46
8. ENVIRONMENT PROTECTION.....................................................................................................................................................................47
8.1 RoHS....................................................................................................................................................................................................................47
8.2 WEEE®.................................................................................................................................................................................................................47
8.3 REACH®..............................................................................................................................................................................................................47
8.4 EuP.......................................................................................................................................................................................................................47
8.5 Packaging..........................................................................................................................................................................................................47
8.6 Batteries.............................................................................................................................................................................................................47
8.7 General notes...................................................................................................................................................................................................47
8.8 Lithium batteries ............................................................................................................................................................................................47
8.9 Other entries ....................................................................................................................................................................................................47
9. APPENDIX..........................................................................................................................................................................................................48
9.1 Acronyms and definitions...........................................................................................................................................................................48
9.2 References ........................................................................................................................................................................................................50

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TABLE DIRECTORY
Table 1: Terms and Conventions..................................................................................................................................................................................7
Table 2: MBa8x interfaces and auxiliary functions..............................................................................................................................................10
Table 3: Diagnostic and user interfaces..................................................................................................................................................................11
Table 4: Carrier board mating connectors.............................................................................................................................................................13
Table 5: Pinout TQMa8x connector X1....................................................................................................................................................................14
Table 6: Pinout TQMa8x connector X2....................................................................................................................................................................16
Table 7: Pinout TQMa8x connector X3....................................................................................................................................................................18
Table 8: Boot-Mode configuration ...........................................................................................................................................................................19
Table 9: Reset and Power Mode signals .................................................................................................................................................................20
Table 10: I2C devices, address mapping on TQMa8x and MBa8x ....................................................................................................................23
Table 11: Functions port expander.............................................................................................................................................................................24
Table 12: Placement option Audio .............................................................................................................................................................................24
Table 13: CAN termination.............................................................................................................................................................................................25
Table 14: Pinout X21 ........................................................................................................................................................................................................25
Table 15: Ethernet Reset and Interrupt signals ......................................................................................................................................................26
Table 16: Characteristics Ethernet 0 (X39)................................................................................................................................................................27
Table 17: Characteristics Ethernet 1 (X40)................................................................................................................................................................27
Table 18: GPIO signals......................................................................................................................................................................................................28
Table 19: TQ MIPI-DSI adapter......................................................................................................................................................................................30
Table 20: TQ MIPI-CSI adapter ......................................................................................................................................................................................31
Table 21: Power-Distribution TUSB8041...................................................................................................................................................................34
Table 22: Properties USB host 1 and 2.......................................................................................................................................................................34
Table 23: Properties of USB-OTG .................................................................................................................................................................................35
Table 24: mikroBus signals.............................................................................................................................................................................................36
Table 25: Values ADC circuit..........................................................................................................................................................................................37
Table 26: Current consumption headers ..................................................................................................................................................................37
Table 27: Pinout Header X61.........................................................................................................................................................................................37
Table 28: Pinout Header X62.........................................................................................................................................................................................38
Table 29: Pinout Header X63.........................................................................................................................................................................................38
Table 30: Pinout Header X64.........................................................................................................................................................................................39
Table 31: Labels on MBa8x.............................................................................................................................................................................................45
Table 32: Climatic and operational conditions MBa8x ........................................................................................................................................46
Table 33: Acronyms ..........................................................................................................................................................................................................48
Table 34: Further applicable documents..................................................................................................................................................................50

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FIGURE DIRECTORY
Figure 1: Block diagram MBa8x ......................................................................................................................................................................................9
Figure 2: Block diagram TQMa8x................................................................................................................................................................................12
Figure 3: Block diagram Reset......................................................................................................................................................................................19
Figure 4: Placement push buttons on MBa8X........................................................................................................................................................20
Figure 5: Block diagram GP push buttons ...............................................................................................................................................................20
Figure 6: Block diagram battery ..................................................................................................................................................................................21
Figure 7: Block diagram LEDs.......................................................................................................................................................................................21
Figure 8: Placement .........................................................................................................................................................................................................22
Figure 9: Block diagram I2C bus...................................................................................................................................................................................22
Figure 10: Block diagram Audio.....................................................................................................................................................................................24
Figure 11: Block diagram CAN-FD.................................................................................................................................................................................25
Figure 12: Block diagram USB debug ..........................................................................................................................................................................26
Figure 13: Block diagram Ethernet ...............................................................................................................................................................................26
Figure 14: Block diagram LVDS ......................................................................................................................................................................................29
Figure 15: Block diagram MIPI-DSI................................................................................................................................................................................30
Figure 16: Block diagram MIPI-CSI / TQ Camera Interface ...................................................................................................................................31
Figure 17: Block diagram Mini-PCIe..............................................................................................................................................................................32
Figure 18: Block diagram PCIe M.2 ...............................................................................................................................................................................32
Figure 19: Clock supply PCIe...........................................................................................................................................................................................33
Figure 20: Block diagram SIM card................................................................................................................................................................................33
Figure 21: Block diagram USB hub structure of the MBa8x.................................................................................................................................34
Figure 22: Block diagram USB OTG...............................................................................................................................................................................35
Figure 23: Block diagram SD card .................................................................................................................................................................................35
Figure 24: Pinout microbus (source: MikroElektronika) .......................................................................................................................................36
Figure 25: Block diagram ADC........................................................................................................................................................................................37
Figure 26: Block diagram JTAG.......................................................................................................................................................................................39
Figure 27: Block diagram supply ...................................................................................................................................................................................40
Figure 28: Position of heat sink mounting holes.....................................................................................................................................................41
Figure 29: MBa8x dimensions.........................................................................................................................................................................................42
Figure 30: MBa8x, component placement top.........................................................................................................................................................44
Figure 31: MBa8x, component placement bottom ................................................................................................................................................45

User's Manual l MBa8x UM 0100 l © 2021, TQ-Systems GmbH Page v
REVISION HISTORY
Rev. Date Name Pos. Modification
0100 29.11.2021 Kreuzer First edition

User's Manual l MBa8x UM 0100 l © 2021, TQ-Systems GmbH Page 6
1. ABOUT THIS MANUAL
1.1 Copyright and license expenses
Copyright protected © 2021 by TQ-Systems GmbH.
This User's Manual may not be copied, reproduced, translated, changed or distributed, completely or partially in electronic,
machine readable, or in any other form without the written consent of TQ-Systems GmbH.
The drivers and utilities for the components used as well as the BIOS are subject to the copyrights of the respective
manufacturers. The licence conditions of the respective manufacturer are to be adhered to.
Bootloader-licence expenses are paid by TQ-Systems GmbH and are included in the price.
Licence expenses for the operating system and applications are not taken into consideration and must be calculated / declared
separately.
1.2 Registered trademarks
TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original
or license-free graphics and texts.
All brand names and trademarks mentioned in this User's Manual, including those protected by a third party, unless specified
otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the present
registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by a third
party.
1.3 Disclaimer
TQ-Systems GmbH does not guarantee that the information in this User's Manual is up-to-date, correct, complete or of good
quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against TQ-Systems
GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information given in this
User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven intentional
or negligent fault of TQ-Systems GmbH.
TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this User's Manual or parts of it without
special notification.
Important Notice:
Before using the MBa8x or parts of the MBa8x schematics, you must evaluate it and determine if it is suitable for your intended
application. You assume all risks and liability associated with such use. TQ-Systems GmbH makes no other warranties including,
but not limited to, any implied warranty of merchantability or fitness for a particular purpose. Except where prohibited by law,
TQ-Systems GmbH will not be liable for any indirect, special, incidental or consequential loss or damage arising from the usage of
the MBa8x or schematics used, regardless of the legal theory asserted.
1.4 Imprint
TQ-Systems GmbH
Gut Delling, Mühlstraße 2
D-82229 Seefeld
Tel: [phone]
Fax: [phone]
E-Mail: [e-mail]
Web: www.tq-group.com

User's Manual l MBa8x UM 0100 l © 2021, TQ-Systems GmbH Page 7
1.5 Tips on safety
Improper or incorrect handling of the product can substantially reduce its life span.
1.6 Symbols and typographic conventions
Table 1: Terms and Conventions
Symbol Meaning
This symbol represents the handling of electrostatic-sensitive modules and / or components. These
components are often damaged / destroyed by the transmission of a voltage higher than about 50 V.
A human body usually only experiences electrostatic discharges above approximately 3,000 V.
This symbol indicates the possible use of voltages higher than 24 V.
Please note the relevant statutory regulations in this regard.
Non-compliance with these regulations can lead to serious damage to your health and also cause
damage / destruction of the component.
This symbol indicates a possible source of danger. Acting against the procedure described can lead to
possible damage to your health and / or cause damage / destruction of the material used.
This symbol represents important details or aspects for working with TQ-products.
Command
A font with fixed-width is used to denote commands, file names, or menu items.
1.7 Handling and ESD tips
General handling of your TQ-products
The TQ-product may only be used and serviced by certified personnel who have taken note of the
information, the safety regulations in this document and all related rules and regulations.
A general rule is: do not touch the TQ-product during operation. This is especially important when
switching on, changing jumper settings or connecting other devices without ensuring beforehand
that the power supply of the system has been switched off.
Violation of this guideline may result in damage / destruction of the MBa8x and be dangerous
to your health.
Improper handling of your TQ-product would render the guarantee invalid.
Proper ESD handling
The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).
Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-
product in an ESD-safe environment. Especially when you switch modules on, change jumper settings,
or connect other devices.

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1.8 Naming of signals
A hash mark (#) at the end of the signal name indicates a low-active signal.
Example: RESET#
If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked with
a hash mark and shown at the end.
Example: C / D#
If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring.
The identification of the individual functions follows the above conventions.
Example: WE2# / OE#
1.9 Further applicable documents / presumed knowledge
•Specifications and manual of the modules used:
These documents describe the service, functionality and special characteristics of the module used (incl. BIOS).
•Specifications of the components used:
The manufacturer’s specifications of the components used, for example CompactFlash cards, are to be taken note of.
They contain, if applicable, additional information that must be taken note of for safe and reliable operation.
These documents are stored at TQ-Systems GmbH.
•Chip errata:
It is the user’s responsibility to make sure all errata published by the manufacturer of each component are taken note of.
The manufacturer’s advice should be followed.
•Software behaviour:
No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.
•General expertise:
Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.
The following documents are required to fully comprehend the following contents:
•MBa8x schematics
•TQMa8x User’s Manual
•i.MX 8 Data Sheet
•i.MX 8 Reference Manual
•U-Boot documentation: www.denx.de/wiki/U-Boot/Documentation
•Yocto documentation: www.yoctoproject.org/docs/
•TQ-Support Wiki: Support-Wiki TQMa8x

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2. BRIEF DESCRIPTION
This User's Manual describes the hardware of the MBa8x as of revision 02xx. The MBa8x is designed as a carrier board for the TQ-
Minimodule TQMa8x and essentially serves as a design basis for customer-specific product ideas, as well as a platform to support
development. CPU features and interfaces can be evaluated, software development for a TQMa8x based project can start
immediately.
Core of the MBa8x is the TQMa8x with an NXP i.MX 8 CPU. Currently two i.MX 8 derivatives are supported:
1. i.MX 8QuadPlus (1 × Cortex®-A72, 4 × Cortex®-A53)
2. i.MX 8QuadMax (2 × Cortex®-A72, 4 × Cortex®-A53)
The TQMa8x connects all peripheral components. In addition to the standard communication interfaces such as USB, Ethernet,
etc., all other available signals of the TQMa8x are routed on 100 mil standard pin headers on the MBa8x.
2.1 MBa8x block diagram
TQMa8x module
USB SS3
ENET[1:0]
OTG1
SAI1
MLB
USDHC1
M41 UART
PCIE0
LVDS 1 (x2)
MIPI CSI[1:0]
MIPI DSI 0
JTAG
SCU UART
Lane 1
2x
M.2
Key „B“
Mini-PCIe
Pin header
0.8 mm
OTG2
USB 2.0
(Typ Micro)
GPIO on pin strip
HDMI socket
DisplayPort
socket
SD-Card (Push-
Pull)
JTAG pin header
TQ camara
adapter
(60-pin)
TQ-display-
adapter
(60-pin)
2x DF19 HF
connector
2x 2x Ethernet
(RJ45)
2x
mikroBUS
socket
(two 1x8
socket strips )
USB (Micro )
Pin header
2,54 mm
Micro-SIM
(Push-Pull)
FLEXCAN[1:0]
CAN 1
(3-Pin socket )
CAN
transceiver
CAN
transceiver
CAN 2
(3-Pin socket )
3 x 3,5 mm
Jack socket Audio codec
1GBit Ethernet
PHY
RefClock
generator
PCIe M.2
Key „E“
Lane 2
USB, I2C1
USB, CTRL, PWR
FTDI
fourfold
SPI0
UART 2
I2C
PWM0
GPIO
ADC0
ESAI0
SPDIF
UART 1
GPIO
PWM[3:1]
SPI[2:1]
FTM
CAN2
TAMPER
I2C1, CTRL, USB,PWR
HDMI/DP TX
LVDS 0 (x2)
2x DF19 HF
connector I2C1, PWM, USB, PWR
Micro-SIM
(Push-Pull)
I2C1
M40 UART
UART 0
5 V, I2C, CTRL
ADC[2:1]
SATA
HDMI RX
SIM
USB HSIC
MIPI DSI 1
Voltage
supply
SCU-LED SCU
USB 3.0
hub 1x internal
FAN connector
PWM, FTM, GPIO
Buttons ,
LEDs,...
GPIO
2x USB 3.0
(double Typ A )
2x
I2C1
I2C2
Level converter
USB 2.0
hub 5x internal
PCIE1
Figure 1: Block diagram MBa8x