TQ-Systems MBa8x User manual

MBa8x
User's Manual
MBa8x UM Rev. 0100
29.11.2021

User's Manual l MBa8x UM 0100 l © 2021, TQ-Systems GmbH Page i
TABLE OF CONTENTS
1. ABOUT THIS MANUAL......................................................................................................................................................................................6
1.1 Copyright and license expenses..................................................................................................................................................................6
1.2 Registered trademarks ....................................................................................................................................................................................6
1.3 Disclaimer ............................................................................................................................................................................................................6
1.4 Imprint...................................................................................................................................................................................................................6
1.5 Tips on safety......................................................................................................................................................................................................7
1.6 Symbols and typographic conventions....................................................................................................................................................7
1.7 Handling and ESD tips.....................................................................................................................................................................................7
1.8 Naming of signals..............................................................................................................................................................................................8
1.9 Further applicable documents / presumed knowledge.....................................................................................................................8
2. BRIEF DESCRIPTION ..........................................................................................................................................................................................9
2.1 MBa8x block diagram......................................................................................................................................................................................9
2.2 MBa8x interfaces ............................................................................................................................................................................................10
3. ELECTRONICS...................................................................................................................................................................................................12
3.1 MBa8x functional groups ............................................................................................................................................................................12
3.2 TQMa8x..............................................................................................................................................................................................................12
3.3 TQMa8x mating connectors.......................................................................................................................................................................13
3.4 TQMa8x pinout ...............................................................................................................................................................................................13
3.5 Boot-Mode configuration ...........................................................................................................................................................................19
3.6 Reset and Power Modes ..............................................................................................................................................................................19
3.7 General purpose push buttons .................................................................................................................................................................20
3.8 Battery ................................................................................................................................................................................................................21
3.9 LEDs.....................................................................................................................................................................................................................21
3.10 I2C devices.........................................................................................................................................................................................................22
3.11 GPIO port expander.......................................................................................................................................................................................23
3.12 Temperature sensor ......................................................................................................................................................................................24
3.13 Further devices................................................................................................................................................................................................24
3.14 Interfaces...........................................................................................................................................................................................................24
3.14.1 Audio ..................................................................................................................................................................................................................24
3.14.2 SPDIF...................................................................................................................................................................................................................25
3.14.3 CAN-FD...............................................................................................................................................................................................................25
3.14.4 MLB......................................................................................................................................................................................................................25
3.14.5 USB debug ........................................................................................................................................................................................................26
3.14.6 Ethernet .............................................................................................................................................................................................................26
3.14.7 GPIO ....................................................................................................................................................................................................................27
3.14.8 Display interfaces ...........................................................................................................................................................................................28
3.14.8.1 DisplayPort .......................................................................................................................................................................................................28
3.14.8.2 HDMI In ..............................................................................................................................................................................................................29
3.14.8.3 LVDS....................................................................................................................................................................................................................29
3.14.8.4 MIPI DSI..............................................................................................................................................................................................................29
3.14.9 MIPI CSI ..............................................................................................................................................................................................................30
3.14.10 Mini PCIe............................................................................................................................................................................................................31
3.14.11 PCIe M.2 .............................................................................................................................................................................................................32
3.14.12 PCIe-Clock.........................................................................................................................................................................................................32
3.14.13 SATA M.2 ...........................................................................................................................................................................................................33
3.14.14 SIM.......................................................................................................................................................................................................................33
3.14.15 USB hosts/hubs...............................................................................................................................................................................................33
3.14.16 USB OTG.............................................................................................................................................................................................................34
3.14.17 SD card...............................................................................................................................................................................................................35
3.14.18 mikroBUS...........................................................................................................................................................................................................36
3.14.19 ADC......................................................................................................................................................................................................................36
3.14.20 MBa8x headers................................................................................................................................................................................................37
3.14.21 JTAG ....................................................................................................................................................................................................................39
3.15 Power supply ...................................................................................................................................................................................................40
3.16 Cooling concept .............................................................................................................................................................................................40
3.17 Fan .......................................................................................................................................................................................................................41
4. SOFTWARE........................................................................................................................................................................................................42
5. MECHANICS......................................................................................................................................................................................................42
5.1 MBa8x dimensions.........................................................................................................................................................................................42
5.2 Notes of treatment ........................................................................................................................................................................................43
5.3 Embedding in the target system..............................................................................................................................................................43

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5.4 Thermal management..................................................................................................................................................................................43
5.5 Assembly ...........................................................................................................................................................................................................44
6. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS ............................................................................................................46
6.1 EMC .....................................................................................................................................................................................................................46
6.2 ESD.......................................................................................................................................................................................................................46
6.3 Operational safety and personal security..............................................................................................................................................46
7. CLIMATIC AND OPERATIONAL CONDITIONS .......................................................................................................................................46
7.1 Protection against external effects..........................................................................................................................................................46
7.2 Reliability and service life............................................................................................................................................................................46
8. ENVIRONMENT PROTECTION.....................................................................................................................................................................47
8.1 RoHS....................................................................................................................................................................................................................47
8.2 WEEE®.................................................................................................................................................................................................................47
8.3 REACH®..............................................................................................................................................................................................................47
8.4 EuP.......................................................................................................................................................................................................................47
8.5 Packaging..........................................................................................................................................................................................................47
8.6 Batteries.............................................................................................................................................................................................................47
8.7 General notes...................................................................................................................................................................................................47
8.8 Lithium batteries ............................................................................................................................................................................................47
8.9 Other entries ....................................................................................................................................................................................................47
9. APPENDIX..........................................................................................................................................................................................................48
9.1 Acronyms and definitions...........................................................................................................................................................................48
9.2 References ........................................................................................................................................................................................................50

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TABLE DIRECTORY
Table 1: Terms and Conventions..................................................................................................................................................................................7
Table 2: MBa8x interfaces and auxiliary functions..............................................................................................................................................10
Table 3: Diagnostic and user interfaces..................................................................................................................................................................11
Table 4: Carrier board mating connectors.............................................................................................................................................................13
Table 5: Pinout TQMa8x connector X1....................................................................................................................................................................14
Table 6: Pinout TQMa8x connector X2....................................................................................................................................................................16
Table 7: Pinout TQMa8x connector X3....................................................................................................................................................................18
Table 8: Boot-Mode configuration ...........................................................................................................................................................................19
Table 9: Reset and Power Mode signals .................................................................................................................................................................20
Table 10: I2C devices, address mapping on TQMa8x and MBa8x ....................................................................................................................23
Table 11: Functions port expander.............................................................................................................................................................................24
Table 12: Placement option Audio .............................................................................................................................................................................24
Table 13: CAN termination.............................................................................................................................................................................................25
Table 14: Pinout X21 ........................................................................................................................................................................................................25
Table 15: Ethernet Reset and Interrupt signals ......................................................................................................................................................26
Table 16: Characteristics Ethernet 0 (X39)................................................................................................................................................................27
Table 17: Characteristics Ethernet 1 (X40)................................................................................................................................................................27
Table 18: GPIO signals......................................................................................................................................................................................................28
Table 19: TQ MIPI-DSI adapter......................................................................................................................................................................................30
Table 20: TQ MIPI-CSI adapter ......................................................................................................................................................................................31
Table 21: Power-Distribution TUSB8041...................................................................................................................................................................34
Table 22: Properties USB host 1 and 2.......................................................................................................................................................................34
Table 23: Properties of USB-OTG .................................................................................................................................................................................35
Table 24: mikroBus signals.............................................................................................................................................................................................36
Table 25: Values ADC circuit..........................................................................................................................................................................................37
Table 26: Current consumption headers ..................................................................................................................................................................37
Table 27: Pinout Header X61.........................................................................................................................................................................................37
Table 28: Pinout Header X62.........................................................................................................................................................................................38
Table 29: Pinout Header X63.........................................................................................................................................................................................38
Table 30: Pinout Header X64.........................................................................................................................................................................................39
Table 31: Labels on MBa8x.............................................................................................................................................................................................45
Table 32: Climatic and operational conditions MBa8x ........................................................................................................................................46
Table 33: Acronyms ..........................................................................................................................................................................................................48
Table 34: Further applicable documents..................................................................................................................................................................50

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FIGURE DIRECTORY
Figure 1: Block diagram MBa8x ......................................................................................................................................................................................9
Figure 2: Block diagram TQMa8x................................................................................................................................................................................12
Figure 3: Block diagram Reset......................................................................................................................................................................................19
Figure 4: Placement push buttons on MBa8X........................................................................................................................................................20
Figure 5: Block diagram GP push buttons ...............................................................................................................................................................20
Figure 6: Block diagram battery ..................................................................................................................................................................................21
Figure 7: Block diagram LEDs.......................................................................................................................................................................................21
Figure 8: Placement .........................................................................................................................................................................................................22
Figure 9: Block diagram I2C bus...................................................................................................................................................................................22
Figure 10: Block diagram Audio.....................................................................................................................................................................................24
Figure 11: Block diagram CAN-FD.................................................................................................................................................................................25
Figure 12: Block diagram USB debug ..........................................................................................................................................................................26
Figure 13: Block diagram Ethernet ...............................................................................................................................................................................26
Figure 14: Block diagram LVDS ......................................................................................................................................................................................29
Figure 15: Block diagram MIPI-DSI................................................................................................................................................................................30
Figure 16: Block diagram MIPI-CSI / TQ Camera Interface ...................................................................................................................................31
Figure 17: Block diagram Mini-PCIe..............................................................................................................................................................................32
Figure 18: Block diagram PCIe M.2 ...............................................................................................................................................................................32
Figure 19: Clock supply PCIe...........................................................................................................................................................................................33
Figure 20: Block diagram SIM card................................................................................................................................................................................33
Figure 21: Block diagram USB hub structure of the MBa8x.................................................................................................................................34
Figure 22: Block diagram USB OTG...............................................................................................................................................................................35
Figure 23: Block diagram SD card .................................................................................................................................................................................35
Figure 24: Pinout microbus (source: MikroElektronika) .......................................................................................................................................36
Figure 25: Block diagram ADC........................................................................................................................................................................................37
Figure 26: Block diagram JTAG.......................................................................................................................................................................................39
Figure 27: Block diagram supply ...................................................................................................................................................................................40
Figure 28: Position of heat sink mounting holes.....................................................................................................................................................41
Figure 29: MBa8x dimensions.........................................................................................................................................................................................42
Figure 30: MBa8x, component placement top.........................................................................................................................................................44
Figure 31: MBa8x, component placement bottom ................................................................................................................................................45

User's Manual l MBa8x UM 0100 l © 2021, TQ-Systems GmbH Page v
REVISION HISTORY
Rev. Date Name Pos. Modification
0100 29.11.2021 Kreuzer First edition

User's Manual l MBa8x UM 0100 l © 2021, TQ-Systems GmbH Page 6
1. ABOUT THIS MANUAL
1.1 Copyright and license expenses
Copyright protected © 2021 by TQ-Systems GmbH.
This User's Manual may not be copied, reproduced, translated, changed or distributed, completely or partially in electronic,
machine readable, or in any other form without the written consent of TQ-Systems GmbH.
The drivers and utilities for the components used as well as the BIOS are subject to the copyrights of the respective
manufacturers. The licence conditions of the respective manufacturer are to be adhered to.
Bootloader-licence expenses are paid by TQ-Systems GmbH and are included in the price.
Licence expenses for the operating system and applications are not taken into consideration and must be calculated / declared
separately.
1.2 Registered trademarks
TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original
or license-free graphics and texts.
All brand names and trademarks mentioned in this User's Manual, including those protected by a third party, unless specified
otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the present
registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by a third
party.
1.3 Disclaimer
TQ-Systems GmbH does not guarantee that the information in this User's Manual is up-to-date, correct, complete or of good
quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against TQ-Systems
GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information given in this
User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven intentional
or negligent fault of TQ-Systems GmbH.
TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this User's Manual or parts of it without
special notification.
Important Notice:
Before using the MBa8x or parts of the MBa8x schematics, you must evaluate it and determine if it is suitable for your intended
application. You assume all risks and liability associated with such use. TQ-Systems GmbH makes no other warranties including,
but not limited to, any implied warranty of merchantability or fitness for a particular purpose. Except where prohibited by law,
TQ-Systems GmbH will not be liable for any indirect, special, incidental or consequential loss or damage arising from the usage of
the MBa8x or schematics used, regardless of the legal theory asserted.
1.4 Imprint
TQ-Systems GmbH
Gut Delling, Mühlstraße 2
D-82229 Seefeld
Tel: [phone]
Fax: [phone]
E-Mail: [e-mail]
Web: www.tq-group.com

User's Manual l MBa8x UM 0100 l © 2021, TQ-Systems GmbH Page 7
1.5 Tips on safety
Improper or incorrect handling of the product can substantially reduce its life span.
1.6 Symbols and typographic conventions
Table 1: Terms and Conventions
Symbol Meaning
This symbol represents the handling of electrostatic-sensitive modules and / or components. These
components are often damaged / destroyed by the transmission of a voltage higher than about 50 V.
A human body usually only experiences electrostatic discharges above approximately 3,000 V.
This symbol indicates the possible use of voltages higher than 24 V.
Please note the relevant statutory regulations in this regard.
Non-compliance with these regulations can lead to serious damage to your health and also cause
damage / destruction of the component.
This symbol indicates a possible source of danger. Acting against the procedure described can lead to
possible damage to your health and / or cause damage / destruction of the material used.
This symbol represents important details or aspects for working with TQ-products.
Command
A font with fixed-width is used to denote commands, file names, or menu items.
1.7 Handling and ESD tips
General handling of your TQ-products
The TQ-product may only be used and serviced by certified personnel who have taken note of the
information, the safety regulations in this document and all related rules and regulations.
A general rule is: do not touch the TQ-product during operation. This is especially important when
switching on, changing jumper settings or connecting other devices without ensuring beforehand
that the power supply of the system has been switched off.
Violation of this guideline may result in damage / destruction of the MBa8x and be dangerous
to your health.
Improper handling of your TQ-product would render the guarantee invalid.
Proper ESD handling
The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).
Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-
product in an ESD-safe environment. Especially when you switch modules on, change jumper settings,
or connect other devices.

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1.8 Naming of signals
A hash mark (#) at the end of the signal name indicates a low-active signal.
Example: RESET#
If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked with
a hash mark and shown at the end.
Example: C / D#
If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring.
The identification of the individual functions follows the above conventions.
Example: WE2# / OE#
1.9 Further applicable documents / presumed knowledge
•Specifications and manual of the modules used:
These documents describe the service, functionality and special characteristics of the module used (incl. BIOS).
•Specifications of the components used:
The manufacturer’s specifications of the components used, for example CompactFlash cards, are to be taken note of.
They contain, if applicable, additional information that must be taken note of for safe and reliable operation.
These documents are stored at TQ-Systems GmbH.
•Chip errata:
It is the user’s responsibility to make sure all errata published by the manufacturer of each component are taken note of.
The manufacturer’s advice should be followed.
•Software behaviour:
No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.
•General expertise:
Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.
The following documents are required to fully comprehend the following contents:
•MBa8x schematics
•TQMa8x User’s Manual
•i.MX 8 Data Sheet
•i.MX 8 Reference Manual
•U-Boot documentation: www.denx.de/wiki/U-Boot/Documentation
•Yocto documentation: www.yoctoproject.org/docs/
•TQ-Support Wiki: Support-Wiki TQMa8x

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2. BRIEF DESCRIPTION
This User's Manual describes the hardware of the MBa8x as of revision 02xx. The MBa8x is designed as a carrier board for the TQ-
Minimodule TQMa8x and essentially serves as a design basis for customer-specific product ideas, as well as a platform to support
development. CPU features and interfaces can be evaluated, software development for a TQMa8x based project can start
immediately.
Core of the MBa8x is the TQMa8x with an NXP i.MX 8 CPU. Currently two i.MX 8 derivatives are supported:
1. i.MX 8QuadPlus (1 × Cortex®-A72, 4 × Cortex®-A53)
2. i.MX 8QuadMax (2 × Cortex®-A72, 4 × Cortex®-A53)
The TQMa8x connects all peripheral components. In addition to the standard communication interfaces such as USB, Ethernet,
etc., all other available signals of the TQMa8x are routed on 100 mil standard pin headers on the MBa8x.
2.1 MBa8x block diagram
TQMa8x module
USB SS3
ENET[1:0]
OTG1
SAI1
MLB
USDHC1
M41 UART
PCIE0
LVDS 1 (x2)
MIPI CSI[1:0]
MIPI DSI 0
JTAG
SCU UART
Lane 1
2x
M.2
Key „B“
Mini-PCIe
Pin header
0.8 mm
OTG2
USB 2.0
(Typ Micro)
GPIO on pin strip
HDMI socket
DisplayPort
socket
SD-Card (Push-
Pull)
JTAG pin header
TQ camara
adapter
(60-pin)
TQ-display-
adapter
(60-pin)
2x DF19 HF
connector
2x 2x Ethernet
(RJ45)
2x
mikroBUS
socket
(two 1x8
socket strips )
USB (Micro )
Pin header
2,54 mm
Micro-SIM
(Push-Pull)
FLEXCAN[1:0]
CAN 1
(3-Pin socket )
CAN
transceiver
CAN
transceiver
CAN 2
(3-Pin socket )
3 x 3,5 mm
Jack socket Audio codec
1GBit Ethernet
PHY
RefClock
generator
PCIe M.2
Key „E“
Lane 2
USB, I2C1
USB, CTRL, PWR
FTDI
fourfold
SPI0
UART 2
I2C
PWM0
GPIO
ADC0
ESAI0
SPDIF
UART 1
GPIO
PWM[3:1]
SPI[2:1]
FTM
CAN2
TAMPER
I2C1, CTRL, USB,PWR
HDMI/DP TX
LVDS 0 (x2)
2x DF19 HF
connector I2C1, PWM, USB, PWR
Micro-SIM
(Push-Pull)
I2C1
M40 UART
UART 0
5 V, I2C, CTRL
ADC[2:1]
SATA
HDMI RX
SIM
USB HSIC
MIPI DSI 1
Voltage
supply
SCU-LED SCU
USB 3.0
hub 1x internal
FAN connector
PWM, FTM, GPIO
Buttons ,
LEDs,...
GPIO
2x USB 3.0
(double Typ A )
2x
I2C1
I2C2
Level converter
USB 2.0
hub 5x internal
PCIE1
Figure 1: Block diagram MBa8x

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2.2 MBa8x interfaces
The following interfaces and auxiliary functions are provided on the MBa8x:
Table 2: MBa8x interfaces and auxiliary functions
Interface Connector Type
Audio
X15
X16
X17
3.5 mm jack
MIC (mono, pink)
Line-in (stereo, blue)
Line-out (stereo, green)
CAN-FD X18, X19 3-pin, Phoenix (galvanically isolated)
Coin cell X56 CR2032 holder
External battery X55 2-pin, header, optional
V_LICELL ⇔V_BAT X23 2-pin, header
USB debug X28 USB, Micro AB
DisplayPort X43 DisplayPort connector
Ethernet, 1000 Base-T X39, X40 RJ-45, integrated magnetics
LVDS0 X11 30-pin, DF19G
LVDS0 CMD X7 20-pin, DF19G
LVDS1 X8 30-pin, DF19G
LVDS1 CMD X4 20-pin, DF19G
MIPI CSI X57 60-pin, Board-to-Board, header
mPCIe X45 Mini PCIe slot (USB included)
X46 SIM card slot
Power In X13 DC jack (2.5 mm / 5.5 mm)
X14 2-pin screw terminal block
SD card (UHS-Modes up to 52 MHz) X42 Micro SD (Push-Pull type)
USB 2.0 Hi-Speed Host X4, X7, X45, X47 2 × 20-pin, DF19G, mPCIe, PCIe M.2
USB 2.0 Hi-Speed OTG X29 USB, Micro AB
USB 3.0 SS Host X36 2 x USB, stacked Type A (max. 900 mA per port)
SATA M.2 X48 M.2, B key
PCIe M.2 X47 M.2, E key
HDMI-In X44 HDMI connector
MIPI DSI X60 60-pin, Board-to-Board, receptacle
MLB X21 40-pin, Board-to-Board, header
mikroBUS® D29 2 × 8-pin, 100 mil
Fan X24 4-pin, 100 mil, friction lock
Extension header 1 X62 40-pin, 100 mil (see chapter 3.2.13)
Extension header 2 X63 40-pin, 100 mil (see chapter 3.2.13)
Extension header 3 X61 40-pin, 100 mil (see chapter 3.2.13)
Extension header 4 X64 40-pin, 100 mil (see chapter 3.2.13)

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The MBa8x provides the following diagnostic and user interfaces:
Table 3: Diagnostic and user interfaces
Interface Component Remark
Status LEDs
9 × Green LED Power LEDs (24 V, 12 V, 5 V-Mainboard, 5 V-Modul, 3,3 V, 3,3
V-Mainboard, 3,3 V-Modul, 1,8 V, 3,3 V-MPCIe, 1,5 V-MPCIe)
3 × Green LED 2 × VBUS USB Host, 1 × VBUS USB OTG
1 × Green LED Debug LED for USB debug interface
2 × Green LED GP LEDs at port expander
1 x Orange LED GP LED of SCU
3 × Green LED WWAN, WLAN, WPAN
1 x Green LED SATA-M.2
2 x Green LED PCIe-M.2
1 × Red LED Reset LED
2 × Green / Yellow LED Ethernet LEDs (Activity / Speed)
Temperature sensor
1 × SE97BTP
Digital I
2
C temperature sensor
Power / Reset buttons 3 × Push button RESET-IN#, PMIC_PWRON, IMX_ONOFF
GP buttons 2 × Push button GP push buttons at port expander
Boot-Mode configuration 1 × 6-fold DIP switch Boot-Mode configuration
CAN-FD/RS485 termination 2 × 2-fold DIP switch –
JTAG 1 × 20-pin, 100 mil header –

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3. ELECTRONICS
3.1 MBa8x functional groups
The following chapters describe the interfaces on the MBa8x as of revision 02xx in connection with a TQMa8x with maximum
configuration.
3.2 TQMa8x
The TQMa8x is the central system on the MBa8x. It provides LPDDR4 SDRAM, eMMC, NOR flash, RTC, an EEPROM, power supply
and power management functionality.
All TQMa8x internal voltages are derived from the 5 V supply voltage. All functionally relevant pins of the CPU are routed to the
TQMa8x connectors. This enables the user to use the TQMa8x with all the freedom that comes with a customer-specific design-in
solution. Further information can be found in the TQMa8x User’s Manual.
On the MBa8x the standard interfaces like USB, Ethernet, etc., provided by the TQMa8x are routed to industry standard
connectors. All other signals and buses provided by the TQMa8x are routed to 100 mil headers.
The boot behaviour of the TQMa8x can be configured. The Boot-Mode configuration is set by a DIP switch on the MBa8x, see
chapter 3.1.1.3.
Furthermore the MBa8x provides all power supplies and configurations required for the operation of the TQMa8x.
Figure 2: Block diagram TQMa8x

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3.3 TQMa8x mating connectors
The TQMa8x is connected to the MBa8x with 560 pins on three connectors. The following table shows some suitable mating
connectors for a carrier board:
Table 4: Carrier board mating connectors
Manufacturer Part number Remark Stack height
EPT 220-pin: 401-51101-51
120-pin: 401-51401-51 On MBa8x 5 mm
If a different board-to-board distance is required, connectors with a different height can be used. Suitable types can be found on
the manufacturer's website.
To avoid damaging the connectors of the MBa8x or the TQMa8x while removing the TQMa8x, the use of the extraction tool
MOZIA8X is strongly recommended.
Note: Component placement on carrier board
2.5 mm should be kept free on the carrier board, on both long sides of the MBa8x
for the extraction tool MOZIA8X.
3.4 TQMa8x pinout
All available TQMa8x signals are available at three connectors on the MBa8x.
Note: Available interfaces
Depending on the TQMa8x derivative not all interfaces are available.
More information about available interfaces can be found in the TQMa8x User’s Manual.

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3.1.1.2 TQMa8x pinout (continued)
Table 5: Pinout TQMa8x connector X1
i.MX 8 ball DIR. Level Group Signal Pin Signal Group Level DIR. i.MX 8 ball
– – – Ground GND(FIXED) A1 B1 GND(FIXED) Ground – – –
– P 5 V Power V_5V_IN A2 B2 V_5V_IN Power 5 V P –
– P 5 V Power V_5V_IN A3 B3 V_5V_IN Power 5 V P –
– P 5 V Power V_5V_IN A4 B4 V_5V_IN Power 5 V P –
– P 5 V Power V_5V_IN A5 B5 V_5V_IN Power 5 V P –
– P 5 V Power V_5V_IN A6 B6 V_5V_IN Power 5 V P –
– – – Ground GND A7 B7 GND Ground – – –
– P VAR Power V_ENET_IN A8 B8 V_SIM_IN Power VAR P AK42
– P 1.8 V Power V_1V8_OUT A9 B9 V_ADC_IN Power 1.8 V P –
– P 1.8 V Power V_1V8_OUT A10 B10 V_3V3_OUT Power 3.3 V P –
– – – Ground GND(FIXED) A11 B11 GND(FIXED) Ground – – –
BC3 I 1.8 V MCLK MCLK_IN A12 B12 PWM3_OUT PWM 1.8 V O AW53
– – – Ground GND A13 B13 PWM2_OUT PWM 1.8 V O BA51
– OD VAR SYSTEM RESET_OUT# A14 B14 PMIC_I2C_SCL I2C 1.8 V O AY46
– I 1.8 V SYSTEM RESET_IN# A15 B15 PMIC_I2C_SDA I2C 1.8 V I/O BG51
J11 O 1.8 V QSPI QSPI1A_SS[0]# A16 B16 FTM_CH[0] FTM 1.8 V I/O BF2
G11 O 1.8 V QSPI QSPI1A_SS[1]# A17 B17 FTM_CH[1] FTM 1.8 V I/O BE5
H12 I 1.8 V QSPI QSPI1A_DQS A18 B18 FTM_CH[2] FTM 1.8 V I/O BG5
– – – Ground GND A19 B19 GPIO2_IO[17] GPIO 1.8 V I/O BF6
F10 O 1.8 V QSPI QSPI1A_SCLK A20 B20 GPIO2_IO[21] GPIO 1.8 V I/O BD8
– – – Ground GND(FIXED) A21 B21 GND(FIXED) Ground – – –
E11 I/O 1.8 V QSPI QSPI1A_DATA[3] A22 B22 CAN2_RX CAN 1.8 V I C3
E13 I/O 1.8 V QSPI QSPI1A_DATA[2] A23 B23 CAN2_TX CAN 1.8 V O E7
D14 I/O 1.8 V QSPI QSPI1A_DATA[1] A24 B24 CAN1_RX CAN 1.8 V I E5
D12 I/O 1.8 V QSPI QSPI1A_DATA[0] A25 B25 CAN1_TX CAN 1.8 V O G7
– – – Ground GND A26 B26 CAN0_RX CAN 1.8 V I C5
D2 O 1.8 V MLB MLB_CLK A27 B27 CAN0_TX CAN 1.8 V O H6
– – – Ground GND A28 B28 GND Ground – – –
E1 O 1.8 V MLB MLB_SIG A29 B29 PCIE0_REFCLK100M_P PCIE 1.8 V I/O F26
E3 O 1.8 V MLB MLB_DATA A30 B30 PCIE0_REFCLK100M_N PCIE 1.8 V I/O E25
–
–
–
Ground
GND(FIXED)
A31
B31
GND(FIXED)
Ground
–
–
–
A9 O 1.8 V ENET ENET0_MDC A32 B32 USB_HSIC_DATA HSIC 1.8 V I/O H26
D10 I/O 1.8 V ENET ENET0_MDIO A33 B33 GND Ground – – –
– – – Ground GND A34 B34 USB_HSIC_STROBE HSIC 1.8 V I/O F28
B10 O 1.8 V ENET ENET0_REFCLK_125M_25M A35 B35 GND Ground – – –
–
–
–
Ground
GND
A36
B36
PCIE1_RX_P
PCIE
1.8 V
I
A21
A11 O 1.8 V ENET ENET1_REFCLK_125M_25M A37 B37 PCIE1_RX_N PCIE 1.8 V I B22
– – – Ground GND A38 B38 GND Ground – – –
A13 O VAR ENET ENET1_MDC A39 B39 PCIE1_TX_P PCIE 1.8 V O B24
C13 I/O VAR ENET ENET1_MDIO A40 B40 PCIE1_TX_N PCIE 1.8 V O C25
– – – Ground GND(FIXED) A41 B41 GND(FIXED) Ground – – –
D20 O 3.3 V PCIE PCIE0_PERST# A42 B42 PCIE1_PERST# PCIE 3.3 V O G25
A15 I 3.3 V PCIE PCIE0_WAKE# A43 B43 PCIE1_WAKE# PCIE 3.3 V I A27
A17 I 3.3 V PCIE PCIE0_CLKREQ# A44 B44 PCIE1_CLKREQ# PCIE 3.3 V I A25
– – – DNC NC A45 B45 GND Ground – – –
H22 I 1.8 V QSPI QSPI0B_DQS A46 B46 PCIE0_TX_P PCIE 1.8 V O B26
F16 O 1.8 V QSPI QSPI0A_SS[1]# A47 B47 PCIE0_TX_N PCIE 1.8 V O C27
H24 O 1.8 V QSPI QSPI0B_SS[1]# A48 B48 GND Ground – – –
A5 I/O 1.8 V GPIO GPIO4_IO[07] A49 B49 PCIE0_RX_P PCIE 1.8 V I A29
J43 I/O VAR GPIO GPIO5_IO[23] A50 B50 PCIE0_RX_N PCIE 1.8 V I B30
– – – Ground GND(FIXED) A51 B51 GND(FIXED) Ground – – –
J39 I/O VAR SD USDHC1_CLK A52 B52 USB_SS_TX_N USB 1.8 V O B32
– – – Ground GND A53 B53 USB_SS_TX_P USB 1.8 V O A33
G41 I/O VAR SD USDHC1_CMD A54 B54 GND Ground – – –
H42 I/O VAR SD USDHC1_CD# A55 B55 USB_SS_RX_N USB 1.8 V I B34

User's Manual l MBa8x UM 0100 l © 2021, TQ-Systems GmbH Page 15
3.1.1.2 TQMa8x pinout (continued)
Table 5: Pinout TQMa8x connector X1 (continued)
i.MX 8 ball DIR. Level Group Signal Pin Signal Group Level DIR. i.MX 8 ball
E37 I/O VAR SD USDHC1_DATA0 A56 B56 USB_SS_RX_P USB 1.8 V I C35
F38 I/O VAR SD USDHC1_DATA1 A57 B57 GND Ground – – –
E39 I/O VAR SD USDHC1_DATA2 A58 B58 NC DNC – – –
F40 I/O VAR SD USDHC1_DATA3 A59 B59 USB_OTG2_OC OTG 3.3 V I H10
– – – Ground GND(FIXED) A60 B60 GND(FIXED) Ground – – –
H40 I/O VAR GPIO GPIO5_IO[19] A61 B61 USB_OTG2_PWR OTG 3.3 V O L9
G43 I/O VAR GPIO GPIO5_IO[20] A62 B62 USB_OTG2_ID OTG 3.3 V I F30
F42 I/O VAR SD USDHC1_WP A63 B63 USB_OTG2_VBUS OTG 3.3 V P A35
– – – Ground GND A64 B64 GND Ground – – –
D30 O 1.8 V MLB MLB_SIG_P A65 B65 USB_OTG2_DN OTG 3.3 V I/O C37
E31 O 1.8 V MLB MLB_SIG_N A66 B66 USB_OTG2_DP OTG 3.3 V I/O B38
– – – Ground GND A67 B67 GND Ground – – –
D32 O 1.8 V MLB MLB_CLK_P A68 B68 USB_OTG1_DN OTG 3.3 V I/O C39
E33 O 1.8 V MLB MLB_CLK_N A69 B69 USB_OTG1_DP OTG 3.3 V I/O B40
– – – Ground GND(FIXED) A70 B70 GND(FIXED) Ground – – –
F34 O 1.8 V MLB MLB_DATA_P A71 B71 USB_OTG1_OC OTG 3.3 V I F8
E35 O 1.8 V MLB MLB_DATA_N A72 B72 USB_OTG1_PWR OTG 3.3 V O J9
– – – Ground GND A73 B73 USB_OTG1_ID OTG 1.8 V I A37
– – – DNC NC A74 B74 USB_OTG1_VBUS OTG 5 V P A39
– – – Ground GND A75 B75 GND Ground – – –
A41 O 1.8 V ENET ENET0_TXC A76 B76 ENET1_TXC ENET 1.8 V O D46
– – – Ground GND A77 B77 GND Ground – – –
E41 O 1.8 V ENET ENET0_TX_CTL A78 B78 ENET1_TX_CTL ENET 1.8 V O B48
A43 O 1.8 V ENET ENET0_TXD[0] A79 B79 ENET1_TXD[0] ENET 1.8 V O A49
– – – Ground GND(FIXED) A80 B80 GND(FIXED) Ground – – –
B42 O 1.8 V ENET ENET0_TXD[1] A81 B81 ENET1_TXD[1] ENET 1.8 V O C47
A45 O 1.8 V ENET ENET0_TXD[2] A82 B82 ENET1_TXD[2] ENET 1.8 V O G47
D42 O 1.8 V ENET ENET0_TXD[3] A83 B83 ENET1_TXD[3] ENET 1.8 V O D48
– – – Ground GND A84 B84 GND Ground – – –
B44 I 1.8 V ENET ENET0_RXC A85 B85 ENET1_RXC ENET 1.8 V I B50
–
–
–
Ground
GND
A86
B86
GND
Ground
–
–
–
E43 I 1.8 V ENET ENET0_RX_CTL A87 B87 ENET1_RX_CTL ENET 1.8 V I E49
A47 I 1.8 V ENET ENET0_RXD[0] A88 B88 ENET1_RXD[0] ENET 1.8 V I E51
D44 I 1.8 V ENET ENET0_RXD[1] A89 B89 ENET1_RXD[1] ENET 1.8 V I C51
– – – Ground GND(FIXED) A90 B90 GND(FIXED) Ground – – –
C45
I
1.8 V
ENET
ENET0_RXD[2]
A91
B91
ENET1_RXD[2]
ENET
1.8 V
I
D52
E45 I 1.8 V ENET ENET0_RXD[3] A92 B92 ENET1_RXD[3] ENET 1.8 V I E53
– – – Ground GND A93 B93 GND Ground – – –
AL45 O VAR SIM SIM_CLK A94 B94 M41_GPIO0_00 M4 GPIO 1.8 V I/O AP44
AL43 I VAR SIM SIM_PD A95 B95 M41_GPIO0_01 M4 GPIO 1.8 V I/O AU47
AN45 I/O VAR SIM SIM_IO A96 B96 M41_UART_TX M4 UART 1.8 V O AU49
AP46 I/O VAR SIM GPIO0_IO[05] A97 B97 M41_UART_RX M4 UART 1.8 V I AR45
AP48 O VAR SIM SIM_RST A98 B98 M40_UART_RX M4 UART 1.8 V I AM44
AT48 O VAR SIM SIM_PWR_EN A99 B99 M40_UART_TX M4 UART 1.8 V O AU51
– – – Ground GND(FIXED) A100 B100 GND(FIXED) Ground – – –
BC51 O 1.8 V JTAG JTAG_TCK A101 B101 UART0_RX UART 1.8 V I AV50
BA49 I 1.8 V JTAG JTAG_TMS A102 B102 UART0_TX UART 1.8 V O AV48
BD52 O 1.8 V JTAG JTAG_TDO A103 B103 UART0_CTS# UART 1.8 V I AV46
BE53 I 1.8 V JTAG JTAG_TRST# A104 B104 UART0_RTS# UART 1.8 V O AU45
BE51 I 1.8 V JTAG JTAG_TDI A105 B105 GND Ground – – –
– – – Ground GND A106 B106 UART1_RX UART 1.8 V I AT44
– – – DNC NC A107 B107 UART1_TX UART 1.8 V O AY48
– OD VAR SYSTEM RTC_EVENT# A108 B108 UART1_CTS# UART 1.8 V I AV46
BE47 I 1.8 V JTAG IMX_ONOFF A109 B109 UART1_RTS# UART 1.8 V O AR43
– – – Ground GND(FIXED) A110 B110 GND(FIXED) Ground – – –

User's Manual l MBa8x UM 0100 l © 2021, TQ-Systems GmbH Page 16
3.1.1.2 TQMa8x pinout (continued)
Table 6: Pinout TQMa8x connector X2
i.MX 8 ball DIR. Level Group Signal Pin Signal Group Level DIR. i.MX 8 ball
– – – Ground GND(FIXED) A1 B1 GND(FIXED) Ground – – –
BC1 O 1.8 V SPI SPI0_CS[0] A2 B2 ADC_IN[0] ADC 1.8 V A AP10
BA3 O 1.8 V SPI SPI0_CS[1] A3 B3 ADC_IN[1] ADC 1.8 V A AN11
BA5 I 1.8 V SPI SPI0_SDI A4 B4 ADC_IN[2] ADC 1.8 V A AP8
AY6 O 1.8 V SPI SPI0_SDO A5 B5 GND Ground – – –
BB4 O 1.8 V SPI SPI0_SCK A6 B6 IMX_MEMC_ON SYSTEM 1.8 V O BC53
AL9 O 1.8 V SPI SPI1_CS[0] A7 B7 PMIC_PWR_ON SYSTEM 1.8 V I –
AP6 O 1.8 V SPI SPI1_CS[1] A8 B8 GND Ground – – –
AR7 I 1.8 V SPI SPI1_SDI A9 B9 HDMI_TX_AUX_N HDMI 1.8 V O BG3
AN9 O 1.8 V SPI SPI1_SDO A10 B10 HDMI_TX_AUX_P HDMI 1.8 V O BH2
– – – Ground GND(FIXED) A11 B11 GND(FIXED) Ground – – –
AR9 O 1.8 V SPI SPI1_SCK A12 B12 GND Ground – – –
AW1 O 1.8 V SPI SPI2_CS[0] A13 B13 HDMI_TX_CLK_N HDMI 1.8 V O BK2
AY2 O 1.8 V SPI SPI2_CS[1] A14 B14 HDMI_TX_CLK_P HDMI 1.8 V O BL3
AY4 I 1.8 V SPI SPI2_SDI A15 B15 GND Ground – – –
BA1 O 1.8 V SPI SPI2_SDO A16 B16 HDMI_TX_DATA[0]_N HDMI 1.8 V O BM4
AW5 O 1.8 V SPI SPI2_SCK A17 B17 HDMI_TX_DATA[0]_P HDMI 1.8 V O BL5
AU1 O 1.8 V SAI SAI1_TXD A18 B18 GND Ground – – –
AV2 O 1.8 V SAI SAI1_TXFS A19 B19 HDMI_TX_DATA[1]_N HDMI 1.8 V O BM6
AU5 O 1.8 V SAI SAI1_TXC A20 B20 HDMI_TX_DATA[1]_P HDMI 1.8 V O BL7
– – – Ground GND(FIXED) A21 B21 GND(FIXED) Ground – – –
AU3 I 1.8 V SAI SAI1_RXFS A22 B22 HDMI_TX_DATA[2]_N HDMI 1.8 V O BM8
AV6 I 1.8 V SAI SAI1_RXC A23 B23 HDMI_TX_DATA[2]_P HDMI 1.8 V O BL9
AV4 I 1.8 V SAI SAI1_RXD A24 B24 GND Ground – – –
BN35 I/O 1.8 V GPIO GPIO1_IO[15] A25 B25 HDMI_TX_DDC_SCL HDMI 1.8 V O BG1
– – – Ground GND A26 B26 HDMI_TX_DDC_SDA HDMI 1.8 V I/O BN5
AT10 I/O 1.8 V ESAI ESAI1_TX5_RX0 A27 B27 HDMI_TX_CEC HDMI 1.8 V O BJ1
AY12 I/O 1.8 V ESAI ESAI1_TX4_RX1 A28 B28 HDMI_TX_HPD HDMI 1.8 V O BH8
AV10 I/O 1.8 V ESAI ESAI1_TX3_RX2 A29 B29 GPIO2_IO[02] GPIO 3.3 V I/O BN9
AU11 I/O 1.8 V ESAI ESAI1_TX2_RX3 A30 B30 GPIO2_IO[03] GPIO 3.3 V I/O BN7
–
–
–
Ground
GND(FIXED)
A31
B31
GND(FIXED)
Ground
–
–
–
BA11 O 1.8 V ESAI ESAI1_TX1 A32 B32 MCLK_OUT MCLK 1.8 V O BD4
BF10 O 1.8 V ESAI ESAI1_TX0 A33 B33 GND Ground – – –
BD12 O 1.8 V ESAI ESAI1_SCKR A34 B34 GPIO1_IO[14] GPIO 1.8 V I/O BD32
BE11 O 1.8 V ESAI ESAI1_FSR A35 B35 PMIC2_FSOB SYSTEM 1.8 V O –
AY10
O
1.8 V
ESAI
ESAI1_SCKT
A36
B36
PMIC2_PGOOD
SYSTEM
1.8 V
OD
–
BF12 O 1.8 V ESAI ESAI1_FST A37 B37 V_LICELL Power 3.3 V P –
– – – Ground GND A38 B38 GND Ground – – –
AR47 I/O 1.8 V M4 GPIO M40_GPIO0_00 A39 B39 MIPI_CSI0_SDA CSI 1.8 V I/O BN19
AU53 I/O 1.8 V M4 GPIO M40_GPIO0_01 A40 B40 MIPI_CSI0_SCL CSI 1.8 V O BH24
– – – Ground GND(FIXED) A41 B41 GND(FIXED) Ground – – –
– P 1.8 V Power V_1V8_ANA_OUT A42 B42 NC DNC – – –
– – – Ground GND A43 B43 GND Ground – – –
BN15 I/O 1.8 V CSI MIPI_CSI1_RST# A44 B44 MIPI_CSI0_MCLK_OUT CSI 1.8 V O BJ23
BN13 O 1.8 V CSI MIPI_CSI1_EN A45 B45 GND Ground – – –
BM22 O 1.8 V CSI MIPI_CSI0_EN A46 B46 MIPI_CSI0_DATA[3]_N CSI 1.8 V I BE17
BL23 I/O 1.8 V CSI MIPI_CSI0_RST# A47 B47 MIPI_CSI0_DATA[3]_P CSI 1.8 V I BF16
– OD VAR SYSTEM TEMP_EVENT# A48 B48 GND Ground – – –
– – – Ground GND A49 B49 MIPI_CSI0_DATA[2]_N CSI 1.8 V I BE25
BN23 O 1.8 V CSI MIPI_CSI1_MCLK_OUT A50 B50 MIPI_CSI0_DATA[2]_P CSI 1.8 V I BF24
– – – Ground GND(FIXED) A51 B51 GND(FIXED) Ground – – –
– O 1.8 V SYSTEM PMIC1_FSOB A52 B52 MIPI_CSI0_CLK_N CSI 1.8 V I BE21
– OD 1.8 V SYSTEM PMIC1_PGOOD A53 B53 MIPI_CSI0_CLK_P CSI 1.8 V I BF20
– – – Ground GND A54 B54 GND Ground – – –
BH12 I 1.8 V CSI MIPI_CSI1_DATA[3]_N A55 B55 MIPI_CSI0_DATA[1]_N CSI 1.8 V I BE19

User's Manual l MBa8x UM 0100 l © 2021, TQ-Systems GmbH Page 17
3.1.1.2 TQMa8x pinout (continued)
Table 6: Pinout TQMa8x connector X2 (continued)
i.MX 8 ball DIR. Level Group Signal Pin Signal Group Level DIR. i.MX 8 ball
BJ13 I 1.8 V CSI MIPI_CSI1_DATA[3]_P A56 B56 MIPI_CSI0_DATA[1]_P CSI 1.8 V I BF18
– – – Ground GND A57 B57 GND Ground – – –
BH20 I 1.8 V CSI MIPI_CSI1_DATA[2]_N A58 B58 MIPI_CSI0_DATA[0]_N CSI 1.8 V I BE23
BJ21 I 1.8 V CSI MIPI_CSI1_DATA[2]_P A59 B59 MIPI_CSI0_DATA[0]_P CSI 1.8 V I BF22
– – – Ground GND(FIXED) A60 B60 GND(FIXED) Ground – – –
BH16 I 1.8 V CSI MIPI_CSI1_CLK_N A61 B61 I2C2_SCL I2C 1.8 V O BA53
BJ17 I 1.8 V CSI MIPI_CSI1_CLK_P A62 B62 I2C2_SDA I2C 1.8 V I/O AY50
– – – Ground GND A63 B63 MIPI_DSI0_GPIO0_01 DSI 1.8 V I/O BD28
BH14 I 1.8 V CSI MIPI_CSI1_DATA[1]_N A64 B64 MIPI_DSI0_PWM DSI 1.8 V O BD30
BJ15 I 1.8 V CSI MIPI_CSI1_DATA[1]_P A65 B65 MIPI_DSI0_SCL DSI 1.8 V O BE29
– – – Ground GND A66 B66 MIPI_DSI0_SDA DSI 1.8 V I/O BE31
BH18 I 1.8 V CSI MIPI_CSI1_DATA[0]_N A67 B67 GND Ground – – –
BJ19 I 1.8 V CSI MIPI_CSI1_DATA[0]_P A68 B68 MIPI_DSI0_DATA[3]_N DSI 1.8 V O BN25
– – – Ground GND A69 B69 MIPI_DSI0_DATA[3]_P DSI 1.8 V O BL25
– – – Ground GND(FIXED) A70 B70 GND(FIXED) Ground – – –
BE15 I/O 1.8 V CSI MIPI_CSI1_SDA A71 B71 GND Ground – – –
BN17 O 1.8 V CSI MIPI_CSI1_SCL A72 B72 MIPI_DSI0_DATA[2]_N DSI 1.8 V O BN29
BE39 O 1.8 V LVDS LVDS0_PWM A73 B73 MIPI_DSI0_DATA[2]_P DSI 1.8 V O BL29
BD40 I/O 1.8 V LVDS LVDS0_GPIO01 A74 B74 GND Ground – – –
BD36 I/O 1.8 V LVDS LVDS0_I2C0_SDA A75 B75 MIPI_DSI0_CLK_N DSI 1.8 V O BN27
BD38 O 1.8 V LVDS LVDS0_I2C0_SCL A76 B76 MIPI_DSI0_CLK_P DSI 1.8 V O BL27
– – – Ground GND A77 B77 GND Ground – – –
BG37 O 1.8 V LVDS LVDS0_CH1_TX[3]_N A78 B78 MIPI_DSI0_DATA[1]_N DSI 1.8 V O BM26
BH38 O 1.8 V LVDS LVDS0_CH1_TX[3]_P A79 B79 MIPI_DSI0_DATA[1]_P DSI 1.8 V O BK26
– – – Ground GND(FIXED) A80 B80 GND(FIXED) Ground – – –
– – – Ground GND A81 B81 GND Ground – – –
BG39 O 1.8 V LVDS LVDS0_CH1_TX[2]_N A82 B82 MIPI_DSI0_DATA[0]_N DSI 1.8 V O BM28
BH40 O 1.8 V LVDS LVDS0_CH1_TX[2]_P A83 B83 MIPI_DSI0_DATA[0]_P DSI 1.8 V O BK28
– – – Ground GND A84 B84 GND Ground – – –
BG41 O 1.8 V LVDS LVDS0_CH1_TX[1]_N A85 B85 SCU_UART_RX SCU 1.8 V I AU43
BH42
O
1.8 V
LVDS
LVDS0_CH1_TX[1]_P
A86
B86
SCU_UART_TX
SCU
1.8 V
O
AV44
– – – Ground GND A87 B87 SCU_GPIO0_[02] SCU 1.8 V I/O AW45
BG43 O 1.8 V LVDS LVDS0_CH1_TX[0]_N A88 B88 SCU_GPIO0_[03] SCU 1.8 V I/O BB46
BH44 O 1.8 V LVDS LVDS0_CH1_TX[0]_P A89 B89 SCU_GPIO0_[04] SCU 1.8 V I/O BC47
– – – Ground GND(FIXED) A90 B90 GND(FIXED) Ground – – –
BG45
O
1.8 V
LVDS
LVDS0_CH1_CLK_N
A91
B91
SCU_GPIO0_[05]
SCU
1.8 V
I/O
AY44
BH46 O 1.8 V LVDS LVDS0_CH1_CLK_P A92 B92 SCU_GPIO0_[06] SCU 1.8 V I/O BG49
– – – Ground GND A93 B93 SCU_GPIO0_[07] SCU 1.8 V I/O BF48
BL41 O 1.8 V LVDS LVDS0_CH0_CLK_N A94 B94 BOOT_MODE[0] BOOT 1.8 V I BB44
BN41 O 1.8 V LVDS LVDS0_CH0_CLK_P A95 B95 BOOT_MODE[1] BOOT 1.8 V I BC45
– – – Ground GND A96 B96 BOOT_MODE[2] BOOT 1.8 V I BJ53
BK42 O 1.8 V LVDS LVDS0_CH0_TX[0]_N A97 B97 BOOT_MODE[3] BOOT 1.8 V I BA43
BM42 O 1.8 V LVDS LVDS0_CH0_TX[0]_P A98 B98 BOOT_MODE[4] BOOT 1.8 V I AY42
– – – Ground GND A99 B99 BOOT_MODE[5] BOOT 1.8 V I BK52
– – – Ground GND(FIXED) A100 B100 GND(FIXED) Ground – – –
BL43 O 1.8 V LVDS LVDS0_CH0_TX[1]_N A101 B101 I2C1_SDA I2C 1.8 V I/O AV52
BN43 O 1.8 V LVDS LVDS0_CH0_TX[1]_P A102 B102 I2C1_SCL I2C 1.8 V O AY52
– – – Ground GND A103 B103 TAMPER_IN[0] SNVS 1.8 V I BE41
BK44 O 1.8 V LVDS LVDS0_CH0_TX[2]_N A104 B104 TAMPER_IN[1] SNVS 1.8 V I BE43
BM44 O 1.8 V LVDS LVDS0_CH0_TX[2]_P A105 B105 TAMPER_OUT[0] SNVS 1.8 V O BD46
– – – Ground GND A106 B106 TAMPER_OUT[1] SNVS 1.8 V O BD42
BL45 O 1.8 V LVDS LVDS0_CH0_TX[3]_N A107 B107 UART2_TX UART 1.8 V O BE37
BN45 O 1.8 V LVDS LVDS0_CH0_TX[3]_P A108 B108 UART2_RX UART 1.8 V I BE35
– – – Ground GND A109 B109 V_VBAT Power 3.3 V P –
– – – Ground GND(FIXED) A110 B110 GND(FIXED) Ground – – –

User's Manual l MBa8x UM 0100 l © 2021, TQ-Systems GmbH Page 18
3.1.1.2 TQMa8x pinout (continued)
Table 7: Pinout TQMa8x connector X3
i.MX 8 ball DIR. Level Group Signal Pin Signal Group Level DIR. i.MX 8 ball
–
–
–
Ground
GND
A1
B1
GND
Ground
–
–
–
C17
O
1.8 V
SATA
SATA_TX_N
A2
B2
SATA_RX_N
SATA
1.8 V
I
B20
B16
O
1.8 V
SATA
SATA_TX_P
A3
B3
SATA_RX_P
SATA
1.8 V
I
A19
–
–
–
Ground
GND
A4
B4
GND
Ground
–
–
–
BD6
O
1.8 V
S/PDIF
SPDIF_EXT_CLK
A5
B5
GPIO4_IO[10]
SD / GPIO
1.8 V
I/O
A7
–
–
–
Ground
GND(FIXED)
A6
B6
GND(FIXED)
Ground
–
–
–
BC7
I
1.8 V
S/PDIF
SPDIF_RX
A7
B7
HDMI_RX_CLK_N
HDMI
1.8 V
I
BL11
BC9
O
1.8 V
S/PDIF
SPDIF_TX
A8
B8
HDMI_RX_CLK_P
HDMI
1.8 V
I
BM12
BH10
O
1.8 V
HDMI
HDMI_RX_DDC_SCL
A9
B9
GND
Ground
–
–
–
BE13
I/O
1.8 V
HDMI
HDMI_RX_DDC_SDA
A10
B10
HDMI_RX_ARC_N
HDMI
1.8 V
I
BL13
BN11
I
1.8 V
HDMI
HDMI_RX_MON_5V
A11
B11
HDMI_RX_ARC_P
HDMI
1.8 V
I
BM14
BE33
I/O
1.8 V
LVDS
LVDS1_I2C0_SDA
A12
B12
GND
Ground
–
–
–
BL35
O
1.8 V
LVDS
LVDS1_I2C0_SCL
A13
B13
HDMI_RX_DATA[0]_N
HDMI
1.8 V
I
BL15
BH36
I/O
1.8 V
LVDS
LVDS1_GPIO01
A14
B14
HDMI_RX_DATA[0]_P
HDMI
1.8 V
I
BM16
BD34
O
1.8 V
LVDS
LVDS1_PWM
A15
B15
GND
Ground
–
–
–
–
–
–
Ground
GND(FIXED)
A16
B16
GND(FIXED)
Ground
–
–
–
BK30
O
1.8 V
LVDS
LVDS1_CH1_TX[3]_N
A17
B17
HDMI_RX_DATA[1]_N
HDMI
1.8 V
I
BL17
BM30
O
1.8 V
LVDS
LVDS1_CH1_TX[3]_P
A18
B18
HDMI_RX_DATA[1]_P
HDMI
1.8 V
I
BM18
–
–
–
Ground
GND
A19
B19
GND
Ground
–
–
–
BL31
O
1.8 V
LVDS
LVDS1_CH1_TX[2]_N
A20
B20
HDMI_RX_DATA[2]_N
HDMI
1.8 V
I
BL19
BN31
O
1.8 V
LVDS
LVDS1_CH1_TX[2]_P
A21
B21
HDMI_RX_DATA[2]_P
HDMI
1.8 V
I
BM20
–
–
–
Ground
GND
A22
B22
GND
Ground
–
–
–
BK32
O
1.8 V
LVDS
LVDS1_CH1_TX[1]_N
A23
B23
HDMI_RX_CEC
HDMI
1.8 V
I
BJ9
BM32
O
1.8 V
LVDS
LVDS1_CH1_TX[1]_P
A24
B24
HDMI_RX_HPD
HDMI
1.8 V
I
BF14
–
–
–
Ground
GND
A25
B25
GND
Ground
–
–
–
–
–
–
Ground
GND(FIXED)
A26
B26
GND(FIXED)
Ground
–
–
–
BL33
O
1.8 V
LVDS
LVDS1_CH1_TX[0]_N
A27
B27
ESAI0_TX5_RX0
ESAI
1.8 V
I/O
AU7
BN33
O
1.8 V
LVDS
LVDS1_CH1_TX[0]_P
A28
B28
ESAI0_TX4_RX1
ESAI
1.8 V
I/O
AV8
–
–
–
Ground
GND
A29
B29
ESAI0_TX3_RX2
ESAI
1.8 V
I/O
BC5
BK34
O
1.8 V
LVDS
LVDS1_CH1_CLK_N
A30
B30
ESAI0_TX2_RX3
ESAI
1.8 V
I/O
AU9
BM34
O
1.8 V
LVDS
LVDS1_CH1_CLK_P
A31
B31
GND
Ground
–
–
–
–
–
–
Ground
GND
A32
B32
ESAI0_TX1
ESAI
1.8 V
O
BA7
BK36
O
1.8 V
LVDS
LVDS1_CH0_CLK_N
A33
B33
ESAI0_TX0
ESAI
1.8 V
O
BA9
BM36
O
1.8 V
LVDS
LVDS1_CH0_CLK_P
A34
B34
ESAI0_SCKR
ESAI
1.8 V
O
BB8
–
–
–
Ground
GND(FIXED)
A35
B35
GND(FIXED)
Ground
–
–
–
BL37
O
1.8 V
LVDS
LVDS1_CH0_TX[0]_N
A36
B36
ESAI0_FSR
ESAI
1.8 V
O
AW9
BN37
O
1.8 V
LVDS
LVDS1_CH0_TX[0]_P
A37
B37
ESAI0_SCKT
ESAI
1.8 V
O
AY8
–
–
–
Ground
GND
A38
B38
ESAI0_FST
ESAI
1.8 V
O
BG9
BK38
O
1.8 V
LVDS
LVDS1_CH0_TX[1]_N
A39
B39
NC
DNC
–
–
–
BM38
O
1.8 V
LVDS
LVDS1_CH0_TX[1]_P
A40
B40
GND
Ground
–
–
–
–
–
–
Ground
GND
A41
B41
MIPI_DSI1_SCL
DSI
1.8 V
O
BE27
BL39
O
1.8 V
LVDS
LVDS1_CH0_TX[2]_N
A42
B42
MIPI_DSI1_SDA
DSI
1.8 V
I/O
BG25
BN39
O
1.8 V
LVDS
LVDS1_CH0_TX[2]_P
A43
B43
MIPI_DSI1_PWM
DSI
1.8 V
O
BM24
–
–
–
Ground
GND
A44
B44
MIPI_DSI1_GPIO0_01
DSI
1.8 V
I/O
BK24
–
–
–
Ground
GND(FIXED)
A45
B45
GND(FIXED)
Ground
–
–
–
BK40
O
1.8 V
LVDS
LVDS1_CH0_TX[3]_N
A46
B46
MIPI_DSI1_DATA[3]_N
DSI
1.8 V
O
BH26
BM40
O
1.8 V
LVDS
LVDS1_CH0_TX[3]_P
A47
B47
MIPI_DSI1_DATA[3]_P
DSI
1.8 V
O
BG27
–
–
–
Ground
GND
A48
B48
GND
Ground
–
–
–
F46
I/O
VAR
SD / GPIO
GPIO5_IO[24]
A49
B49
MIPI_DSI1_DATA[2]_N
DSI
1.8 V
O
BH34
–
–
–
Ground
GND
A50
B50
MIPI_DSI1_DATA[2]_P
DSI
1.8 V
O
BG35
B8
I/O
1.8 V
SD / GPIO
GPIO4_IO[12]
A51
B51
GND
Ground
–
–
–
C7
I/O
1.8 V
SD / GPIO
GPIO4_IO[09]
A52
B52
MIPI_DSI1_CLK_N
DSI
1.8 V
O
BH30
D8
I/O
1.8 V
SD / GPIO
GPIO4_IO[11]
A53
B53
MIPI_DSI1_CLK_P
DSI
1.8 V
O
BG31
H44
I/O
VAR
SD / GPIO
GPIO5_IO[25]
A54
B54
GND
Ground
–
–
–
–
–
–
Ground
GND(FIXED)
A55
B55
GND(FIXED)
Ground
–
–
–
H48
I/O
VAR
SD / GPIO
GPIO5_IO[26]
A56
B56
MIPI_DSI1_DATA[1]_N
DSI
1.8 V
O
BH28
G45
I/O
VAR
SD / GPIO
GPIO5_IO[27]
A57
B57
MIPI_DSI1_DATA[1]_P
DSI
1.8 V
O
BG29
L45
I/O
VAR
SD / GPIO
GPIO5_IO[28]
A58
B58
GND
Ground
–
–
–
J45
I/O
VAR
SD / GPIO
GPIO5_IO[29]
A59
B59
MIPI_DSI1_DATA[0]_N
DSI
1.8 V
O
BH32
–
–
–
Ground
GND
A60
B60
MIPI_DSI1_DATA[0]_P
DSI
1.8 V
O
BG33

User's Manual l MBa8x UM 0100 l © 2021, TQ-Systems GmbH Page 19
3.5 Boot-Mode configuration
The Boot-Mode of the i.MX 8 is set with signals BOOT_MODE[5:0], which can be set with DIP switch SW1.
The MBa8x supports the following TQMa8x boot sources.
•eMMC (on TQMa8x)
•QSPI NOR flash (on TQMa8x)
•SD card (on MBa8x)
•Serial downloader via USB OTG
Table 8: Boot-Mode configuration
Boot-Mode SW1-1
(Boot-Mode0) SW1-2 (Boot-Mode1) SW1-3 (Boot-Mode2) SW1-4 (Boot-Mode3) SW1-5 (Boot-Mode4) SW1-6 (Boot-Mode5)
Boot from eFuses
0
0
0
0
0
0
Serial Downloader (USB OTG1)
0
0
1
0
0
0
eMMC
0
0
0
1
0
0
SD card (USDHC1)
0
0
1
1
0
0
Flash / 3-byte read (not supported)
0
0
0
1
1
0
Flash / 4-byte read (not supported)
0
1
1
1
1
0
Hyperflash 1.8 V (not supported)
0
1
0
1
1
0
Note: Boot from NAND
Booting from NAND is not supported on the MBa8x.
3.6 Reset and Power Modes
RESET_IN#, IMX_ONOFF and PMIC_PWRON can be pulled to GND by push buttons.
RESET_OUT has a pull-up to V_1V8_ANA. The resulting reset signal is linked to an LED.
TQMa8x
RESET_IN#
Button
IMX_ONOFF
RESET_OUT#
System
PMIC_PWRON
Button
Button
Figure 3: Block diagram Reset