Tq-systems Tqma8x User manual

MBa8x

User's Manual

MBa8x UM Rev. 0101

07.07.2022

TABLE OF CONTENTS

1. ABOUT THIS MANUAL................................................................................................................................................................................6

1.1 Copyright and license expenses.............................................................................................................................................................6

1.2 Registered trademarks...............................................................................................................................................................................6

1.3 Disclaimer......................................................................................................................................................................................................6

1.4 Imprint............................................................................................................................................................................................................6

1.5 Tips on safety................................................................................................................................................................................................7

1.6 Symbols and typographic conventions ...............................................................................................................................................7

1.7 Handling and ESD tips...............................................................................................................................................................................7

1.8 Naming of signals........................................................................................................................................................................................8

1.9 Further applicable documents / presumed knowledge .................................................................................................................8

2. BRIEF DESCRIPTION ....................................................................................................................................................................................9

2.1 MBa8x block diagram ................................................................................................................................................................................9

2.2 MBa8x interfaces ...................................................................................................................................................................................... 10

3. ELECTRONICS............................................................................................................................................................................................. 12

3.1 MBa8x functional groups....................................................................................................................................................................... 12

3.2 TQMa8x ....................................................................................................................................................................................................... 12

3.3 TQMa8x mating connectors.................................................................................................................................................................. 13

3.4 TQMa8x pinout ......................................................................................................................................................................................... 13

3.5 Boot-Mode configuration...................................................................................................................................................................... 19

3.6 Reset and Power Modes......................................................................................................................................................................... 19

3.7 General purpose push buttons............................................................................................................................................................ 20

3.8 Battery.......................................................................................................................................................................................................... 21

3.9 LEDs.............................................................................................................................................................................................................. 21

3.10 I2C devices................................................................................................................................................................................................... 22

3.11 GPIO port expander................................................................................................................................................................................. 23

3.12 Temperature sensor ................................................................................................................................................................................ 24

3.13 Further devices ......................................................................................................................................................................................... 24

3.14 Interfaces .................................................................................................................................................................................................... 24

3.14.1 Audio............................................................................................................................................................................................................ 24

3.14.2 SPDIF ............................................................................................................................................................................................................ 25

3.14.3 CAN-FD........................................................................................................................................................................................................ 25

3.14.4 MLB ............................................................................................................................................................................................................... 25

3.14.5 USB debug.................................................................................................................................................................................................. 26

3.14.6 Ethernet....................................................................................................................................................................................................... 26

3.14.7 GPIO.............................................................................................................................................................................................................. 27

3.14.8 Display interfaces..................................................................................................................................................................................... 28

3.14.8.1 DisplayPort................................................................................................................................................................................................. 28

3.14.8.2 HDMI In........................................................................................................................................................................................................ 29

3.14.8.3 LVDS ............................................................................................................................................................................................................. 29

3.14.8.4 MIPI DSI ....................................................................................................................................................................................................... 29

3.14.9 MIPI CSI........................................................................................................................................................................................................ 30

3.14.10 Mini PCIe ..................................................................................................................................................................................................... 32

3.14.11 PCIe M.2....................................................................................................................................................................................................... 32

3.14.12 PCIe-Clock................................................................................................................................................................................................... 32

3.14.13 SATA M.2..................................................................................................................................................................................................... 33

3.14.14 SIM ................................................................................................................................................................................................................ 33

3.14.15 USB hosts/hubs......................................................................................................................................................................................... 33

3.14.16 USB OTG...................................................................................................................................................................................................... 34

3.14.17 SD card......................................................................................................................................................................................................... 35

3.14.18 mikroBUS .................................................................................................................................................................................................... 36

3.14.19 ADC............................................................................................................................................................................................................... 36

3.14.20 MBa8x headers.......................................................................................................................................................................................... 37

3.14.21 JTAG.............................................................................................................................................................................................................. 39

3.15 Power supply............................................................................................................................................................................................. 40

3.16 Cooling concept ....................................................................................................................................................................................... 40

3.17 Fan ................................................................................................................................................................................................................ 41

4. SOFTWARE.................................................................................................................................................................................................. 42

5. MECHANICS................................................................................................................................................................................................ 42

5.1 MBa8x dimensions................................................................................................................................................................................... 42

5.2 Notes of treatment................................................................................................................................................................................... 43

5.3 Embedding in the target system......................................................................................................................................................... 43

5.4 Thermal management............................................................................................................................................................................ 43

5.5 Assembly..................................................................................................................................................................................................... 44

6. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS......................................................................................................... 46

6.1 EMC............................................................................................................................................................................................................... 46

6.2 ESD................................................................................................................................................................................................................ 46

6.3 Operational safety and personal security......................................................................................................................................... 46

7. CLIMATIC AND OPERATIONAL CONDITIONS................................................................................................................................... 46

7.1 Protection against external effects..................................................................................................................................................... 46

7.2 Reliability and service life....................................................................................................................................................................... 46

8. ENVIRONMENT PROTECTION................................................................................................................................................................ 47

8.1 RoHS ............................................................................................................................................................................................................. 47

8.2 WEEE®.......................................................................................................................................................................................................... 47

8.3 REACH®........................................................................................................................................................................................................ 47

8.4 EuP ................................................................................................................................................................................................................ 47

8.5 Packaging ................................................................................................................................................................................................... 47

8.6 Batteries ...................................................................................................................................................................................................... 47

8.7General notes ............................................................................................................................................................................................ 47

8.8 Lithium batteries ...................................................................................................................................................................................... 47

8.9 Other entries.............................................................................................................................................................................................. 47

9. APPENDIX ................................................................................................................................................................................................... 48

9.1 Acronyms and definitions...................................................................................................................................................................... 48

9.2 References.................................................................................................................................................................................................. 50

TABLE DIRECTORY

Table 1: Terms and Conventions ............................................................................................................................................................................7

Table 2: MBa8x interfaces and auxiliary functions......................................................................................................................................... 10

Table 3: Diagnostic and user interfaces............................................................................................................................................................. 11

Table 4: Carrier board mating connectors........................................................................................................................................................ 13

Table 5: Pinout TQMa8x connector X1 .............................................................................................................................................................. 14

Table 6: Pinout TQMa8x connector X2 .............................................................................................................................................................. 16

Table 7: Pinout TQMa8x connector X3 .............................................................................................................................................................. 18

Table 8: Boot-Mode configuration...................................................................................................................................................................... 19

Table 9: Reset and Power Mode signals ............................................................................................................................................................ 20

Table 10: I2C devices, address mapping on TQMa8x and MBa8x................................................................................................................. 23

Table 11: Functions port expander ....................................................................................................................................................................... 24

Table 12: Placement option Audio........................................................................................................................................................................ 24

Table 13: CAN termination....................................................................................................................................................................................... 25

Table 14: Pinout X21.................................................................................................................................................................................................. 25

Table 15: Ethernet Reset and Interrupt signals.................................................................................................................................................. 26

Table 16: Characteristics Ethernet 0 (X39)........................................................................................................................................................... 27

Table 17: Characteristics Ethernet 1 (X40)........................................................................................................................................................... 27

Table 18: GPIO signals ............................................................................................................................................................................................... 28

Table 19: TQ MIPI-DSI adapter ................................................................................................................................................................................ 30

Table 20: TQ MIPI-CSI adapter................................................................................................................................................................................. 31

Table 21: Power-Distribution TUSB8041.............................................................................................................................................................. 34

Table 22: Properties USB host 1 and 2.................................................................................................................................................................. 34

Table 23: Properties of USB-OTG............................................................................................................................................................................ 35

Table 24: mikroBus signals....................................................................................................................................................................................... 36

Table 25: Values ADC circuit.................................................................................................................................................................................... 37

Table 26: Current consumption headers............................................................................................................................................................. 37

Table 27: Pinout Header X61................................................................................................................................................................................... 37

Table 28: Pinout Header X62................................................................................................................................................................................... 38

Table 29: Pinout Header X63................................................................................................................................................................................... 38

Table 30: Pinout Header X64................................................................................................................................................................................... 39

Table 31: Labels on MBa8x....................................................................................................................................................................................... 45

Table 32: Climatic and operational conditions MBa8x.................................................................................................................................... 46

Table 33: Acronyms.................................................................................................................................................................................................... 48

Table 34: Further applicable documents............................................................................................................................................................. 50

FIGURE DIRECTORY

Figure 1: Block diagram MBa8x.................................................................................................................................................................................9

Figure 2: Block diagram TQMa8x........................................................................................................................................................................... 12

Figure 3: Block diagram Reset................................................................................................................................................................................ 19

Figure 4: Placement push buttons on MBa8X................................................................................................................................................... 20

Figure 5: Block diagram GP push buttons.......................................................................................................................................................... 20

Figure 6: Block diagram battery............................................................................................................................................................................. 21

Figure 7: Block diagram LEDs ................................................................................................................................................................................. 21

Figure 8: Placement................................................................................................................................................................................................... 22

Figure 9: Block diagram I2C bus ............................................................................................................................................................................. 22

Figure 10: Block diagram Audio............................................................................................................................................................................... 24

Figure 11: Block diagram CAN-FD........................................................................................................................................................................... 25

Figure 12: Block diagram USB debug..................................................................................................................................................................... 26

Figure 13: Block diagram Ethernet.......................................................................................................................................................................... 26

Figure 14: Block diagram LVDS ................................................................................................................................................................................ 29

Figure 15: Block diagram MIPI-DSI .......................................................................................................................................................................... 30

Figure 16: Block diagram MIPI-CSI / TQ Camera Interface............................................................................................................................... 31

Figure 17: Block diagram Mini-PCIe........................................................................................................................................................................ 32

Figure 18: Block diagram PCIe M.2.......................................................................................................................................................................... 32

Figure 19: Clock supply PCIe..................................................................................................................................................................................... 33

Figure 20: Block diagram SIM card.......................................................................................................................................................................... 33

Figure 21: Block diagram USB hub structure of the MBa8x............................................................................................................................. 34

Figure 22: Block diagram USB OTG ......................................................................................................................................................................... 35

Figure 23: Block diagram SD card............................................................................................................................................................................ 35

Figure 24: Pinout microbus (source: MikroElektronika)................................................................................................................................... 36

Figure 25: Block diagram ADC.................................................................................................................................................................................. 37

Figure 26: Block diagram JTAG................................................................................................................................................................................. 39

Figure 27: Block diagram supply.............................................................................................................................................................................. 40

Figure 28: Position of heat sink mounting holes ................................................................................................................................................ 41

Figure 29: MBa8x dimensions................................................................................................................................................................................... 42

Figure 30: MBa8x, component placement top.................................................................................................................................................... 44

Figure 31: MBa8x, component placement bottom............................................................................................................................................ 45

REVISION HISTORY

Rev. Date Name Pos. Modification

0100 29.11.2021 Kreuzer First edition

0101 07.07.2022 Kreuzer Added footnotes to MIPI_CSI1_SCL/SDA

ABOUT THIS MANUAL

1.1 Copyright and license expenses

This User's Manual may not be copied, reproduced, translated, changed or distributed, completely or partially in electronic,

machine readable, or in any other form without the written consent of TQ-Systems GmbH.

The drivers and utilities for the components used as well as the BIOS are subject to the copyrights of the respective

manufacturers. The licence conditions of the respective manufacturer are to be adhered to.

Bootloader-licence expenses are paid by TQ-Systems GmbH and are included in the price.

Licence expenses for the operating system and applications are not taken into consideration and must be calculated / declared

separately.

1.2 Registered trademarks

TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original

or license-free graphics and texts.

All brand names and trademarks mentioned in this User's Manual, including those protected by a third party, unless specified

otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the present

registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by a third

party.

1.3 Disclaimer

TQ-Systems GmbH does not guarantee that the information in this User's Manual is up-to-date, correct, complete or of good

quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against TQ-Systems

GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information given in this

User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven intentional

or negligent fault of TQ-Systems GmbH.

TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this User's Manual or parts of it without

special notification.

Important Notice:

Before using the MBa8x or parts of the MBa8x schematics, you must evaluate it and determine if it is suitable for your intended

application. You assume all risks and liability associated with such use. TQ-Systems GmbH makes no other warranties including,

but not limited to, any implied warranty of merchantability or fitness for a particular purpose. Except where prohibited by law,

TQ-Systems GmbH will not be liable for any indirect, special, incidental or consequential loss or damage arising from the usage of

the MBa8x or schematics used, regardless of the legal theory asserted.

1.4 Imprint

TQ-Systems GmbH

Gut Delling, Mühlstraße 2

D-82229 Seefeld

Tel: +49 8153 9308–0

Fax: +49 8153 9308–4223

E-Mail: info@tq-group.com

Web: www.tq-group.com

1.5 Tips on safety

Improper or incorrect handling of the product can substantially reduce its life span.

1.6 Symbols and typographic conventions

Table 1: Terms and Conventions

Symbol Meaning

This symbol represents the handling of electrostatic-sensitive modules and / or components. These

components are often damaged / destroyed by the transmission of a voltage higher than about 50 V.

A human body usually only experiences electrostatic discharges above approximately 3,000 V.

This symbol indicates the possible use of voltages higher than 24 V.

Please note the relevant statutory regulations in this regard.

Non-compliance with these regulations can lead to serious damage to your health and also cause

damage / destruction of the component.

This symbol indicates a possible source of danger. Acting against the procedure described can lead to

possible damage to your health and / or cause damage / destruction of the material used.

This symbol represents important details or aspects for working with TQ-products.

Command

A font with fixed-width is used to denote commands, file names, or menu items.

1.7 Handling and ESD tips

General handling of your TQ-products

The TQ-product may only be used and serviced by certified personnel who have taken note of the

information, the safety regulations in this document and all related rules and regulations.

A general rule is: do not touch the TQ-product during operation. This is especially important when

switching on, changing jumper settings or connecting other devices without ensuring beforehand

that the power supply of the system has been switched off.

Violation of this guideline may result in damage / destruction of the MBa8x and be dangerous

to your health.

Improper handling of your TQ-product would render the guarantee invalid.

Proper ESD handling

The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).

Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-

product in an ESD-safe environment. Especially when you switch modules on, change jumper settings,

or connect other devices.

1.8 Naming of signals

A hash mark (#) at the end of the signal name indicates a low-active signal.

Example: RESET#

If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked with

a hash mark and shown at the end.

Example: C / D#

If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring.

The identification of the individual functions follows the above conventions.

Example: WE2# / OE#

1.9 Further applicable documents / presumed knowledge

•

Specifications and manual of the modules used:

These documents describe the service, functionality and special characteristics of the module used (incl. BIOS).

•

Specifications of the components used:

The manufacturer’s specifications of the components used, for example CompactFlash cards, are to be taken note of.

They contain, if applicable, additional information that must be taken note of for safe and reliable operation.

These documents are stored at TQ-Systems GmbH.

•

Chip errata:

It is the user’s responsibility to make sure all errata published by the manufacturer of each component are taken note of.

The manufacturer’s advice should be followed.

•

Software behaviour:

No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.

•

General expertise:

Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.

The following documents are required to fully comprehend the following contents:

•MBa8x schematics

•TQMa8x User’s Manual

•i.MX 8 Data Sheet

•i.MX 8 Reference Manual

•U-Boot documentation: www.denx.de/wiki/U-Boot/Documentation

•Yocto documentation: www.yoctoproject.org/docs/

•TQ-Support Wiki: Support-Wiki TQMa8x

BRIEF DESCRIPTION

This User's Manual describes the hardware of the MBa8x as of revision 02xx. The MBa8x is designed as a carrier board for the TQ-

Minimodule TQMa8x and essentially serves as a design basis for customer-specific product ideas, as well as a platform to support

development. CPU features and interfaces can be evaluated, software development for a TQMa8x based project can start

immediately.

Core of the MBa8x is the TQMa8x with an NXP i.MX 8 CPU.Currently two i.MX 8 derivatives are supported:

1. i.MX 8QuadPlus (1 × Cortex®-A72, 4 × Cortex®-A53)

2. i.MX 8QuadMax (2 × Cortex®-A72, 4 × Cortex®-A53)

The TQMa8x connects all peripheral components. In addition to the standard communication interfaces such as USB, Ethernet,

etc., all other available signals of the TQMa8x are routed on 100 mil standard pin headers on the MBa8x.

2.1 MBa8x block diagram

TQMa8x module

USB SS3

ENET[1:0]

OTG1

SAI1

MLB

USDHC1

M41 UART

PCIE0

LVDS1 (x2)

MIPI CSI[1:0]

MIPI DSI0

JTAG

SCU UART

Lane 1

M.2

Key „B“

Mini-PCIe

Pin header

0.8 mm

OTG2

USB 2.0

(Typ Micro)

GPIO on pin strip

HDMI socket

DisplayPort

socket

SD-Card (Push-

Pull)

JTAG pin header

TQ camara

adapter

(60-pin)

TQ-display-

adapter

(60-pin)

2x DF19 HF

connector

2x 2x Ethernet

(RJ45)

mikroBUS

socket

(two 1x8

socket strips)

USB (Micro)

Pin header

2,54 mm

Micro-SIM

(Push-Pull)

FLEXCAN[1:0]

CAN 1

(3-Pin socket)CAN

transceiver

CAN

transceiver

CAN 2

(3-Pin socket)

3 x 3,5 mm

Jack socket Audio codec

1GBit Ethernet

PHY

RefClock

generator PCIe M.2

Key „E“

Lane 2

USB, I2C1

USB, CTRL, PWR

FTDI

fourfold

SPI0

UART2

I2C

PWM0

GPIO

ADC0

ESAI0

SPDIF

UART1

GPIO

PWM[3:1]

SPI[2:1]

FTM

CAN2

TAMPER

I2C1, CTRL, USB,PWR

HDMI/DP TX

LVDS0 (x2)

2x DF19 HF

connector I2C1, PWM, USB, PWR

Micro-SIM

(Push-Pull)

I2C1

M40 UART

UART05 V, I2C, CTRL

ADC[2:1]

SATA

HDMI RX

SIM

USB HSIC

MIPI DSI1

Voltage

supply

SCU-LED SCU

USB 3.0

hub 1x internal

FAN connector

PWM, FTM, GPIO

Buttons,

LEDs,...

GPIO

2x USB 3.0

(double Typ A )

I2C1

I2C2

Level converter

USB 2.0

hub 5x internal

PCIE1

Figure 1: Block diagram MBa8x

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