Tq-systems Mbls1012al User manual

MBLS1012AL

Preliminary User's Manual

MBLS1012AL UM 0001

29.04.2019

TABLE OF CONTENTS

1. ABOUT THIS MANUAL................................................................................................................................................................................1

1.1 Copyright and licence expenses.............................................................................................................................................................1

1.2 Registered trademarks...............................................................................................................................................................................1

1.3 Disclaimer......................................................................................................................................................................................................1

1.4 Imprint............................................................................................................................................................................................................1

1.5 Tips on safety................................................................................................................................................................................................2

1.6 Symbols and typographic conventions ...............................................................................................................................................2

1.7 Handling and ESD tips...............................................................................................................................................................................2

1.8 Naming of signals........................................................................................................................................................................................3

1.9 Further applicable documents / presumed knowledge .................................................................................................................3

2. BRIEF DESCRIPTION ....................................................................................................................................................................................4

3. TECHNICAL DATA........................................................................................................................................................................................4

3.1 System architecture and functionality..................................................................................................................................................4

3.1.1 Block diagram MBLS1012AL ....................................................................................................................................................................4

3.1.2 Functionality and interfaces ....................................................................................................................................................................5

4. ELECTRONICS................................................................................................................................................................................................6

4.1 System components...................................................................................................................................................................................6

4.1.1 TQMLS1012AL..............................................................................................................................................................................................6

4.1.2 Power supply................................................................................................................................................................................................6

4.1.3 Protective circuit..........................................................................................................................................................................................7

4.1.4 Voltage regulators ......................................................................................................................................................................................8

4.2 Communication interfaces.......................................................................................................................................................................9

4.2.1 DAPLink / OpenSDA ...................................................................................................................................................................................9

4.2.2 Debug UART .................................................................................................................................................................................................9

4.2.3 eMMC..............................................................................................................................................................................................................9

4.2.4 Gigabit Ethernet (Link)............................................................................................................................................................................ 10

4.2.5 Gigabit Ethernet (Switch ports) ........................................................................................................................................................... 11

4.2.6 I2C .................................................................................................................................................................................................................. 12

4.2.7 JTAG.............................................................................................................................................................................................................. 13

4.2.8 Mini PCIe ..................................................................................................................................................................................................... 15

4.2.9 RTC backup supply .................................................................................................................................................................................. 17

4.2.10 SATA ............................................................................................................................................................................................................. 17

4.2.11 SD card......................................................................................................................................................................................................... 18

4.2.12 SPI.................................................................................................................................................................................................................. 18

4.2.13 USB................................................................................................................................................................................................................ 19

4.2.14 WLAN ........................................................................................................................................................................................................... 20

4.3 Reset structure .......................................................................................................................................................................................... 21

4.4 Boot-Mode configuration...................................................................................................................................................................... 22

4.5 Diagnostic and user interfaces............................................................................................................................................................. 23

4.5.1 DIP switch S1 ............................................................................................................................................................................................. 23

4.5.2 GPIOs............................................................................................................................................................................................................ 24

4.5.3 GPIO port expander................................................................................................................................................................................. 25

4.5.4 Header X22................................................................................................................................................................................................. 26

4.5.5 LEDs .............................................................................................................................................................................................................. 28

4.5.6 Push buttons.............................................................................................................................................................................................. 29

4.5.7 Reset Push button.................................................................................................................................................................................... 29

4.5.8 Temperature sensor ................................................................................................................................................................................ 30

TABLE OF CONTENTS (continued)

5. SOFTWARE.................................................................................................................................................................................................. 30

6. MECHANICS................................................................................................................................................................................................ 31

6.1 TQMLS1012AL and MBLS1012AL dimensions ................................................................................................................................ 31

6.2 Housing ....................................................................................................................................................................................................... 31

6.3 Thermal management............................................................................................................................................................................ 32

6.4 Assembly..................................................................................................................................................................................................... 32

7. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS......................................................................................................... 33

7.1 EMC............................................................................................................................................................................................................... 33

7.2 ESD................................................................................................................................................................................................................ 33

7.3 Operational safety and personal security......................................................................................................................................... 33

8. CLIMATIC AND OPERATIONAL CONDITIONS................................................................................................................................... 33

8.1 Protection against external effects..................................................................................................................................................... 33

8.2 Reliability and service life....................................................................................................................................................................... 33

9. ENVIRONMENT PROTECTION................................................................................................................................................................ 34

9.1 RoHS ............................................................................................................................................................................................................. 34

9.2 WEEE®.......................................................................................................................................................................................................... 34

9.3 REACH®........................................................................................................................................................................................................ 34

9.4 EuP ................................................................................................................................................................................................................ 34

9.5 Packaging ................................................................................................................................................................................................... 34

9.6 Batteries ...................................................................................................................................................................................................... 34

9.6.1 General notes ............................................................................................................................................................................................ 34

9.6.2 Lithium batteries ...................................................................................................................................................................................... 34

9.7 Other entries.............................................................................................................................................................................................. 34

10. APPENDIX ................................................................................................................................................................................................... 35

10.1 Acronyms and definitions...................................................................................................................................................................... 35

10.2 References .................................................................................................................................................................................................. 37

TABLE DIRECTORY

Table 1: Terms and Conventions.....................................................................................................................................................................2

Table 2: Overview interfaces.............................................................................................................................................................................5

Table 3: Overview Diagnostic and User Interfaces ....................................................................................................................................5

Table 4: Parameter protective circuit.............................................................................................................................................................7

Table 5: Electrical parameters of voltage regulators.................................................................................................................................8

Table 6: Electrical parameters of PCIe and WLAN voltages.....................................................................................................................8

Table 7: DIP switch setting for UART source................................................................................................................................................9

Table 8: Pinout RJ-45 connector X23 for “Link“ ....................................................................................................................................... 10

Table 9: Characteristics Gigabit Ethernet X23 (Link) .............................................................................................................................. 10

Table 10: Pinout RJ-45 connector X12, X13 for “Switch“......................................................................................................................... 11

Table 11: Ethernet Switch, Port-Link Status information ........................................................................................................................ 11

Table 12: Characteristics Gigabit Ethernet (Link)....................................................................................................................................... 11

Table 13: I2C devices, address mapping on TQMLS1012AL and MBLS1012AL ................................................................................ 12

Table 14: JTAG adapters.................................................................................................................................................................................... 13

Table 15: Pinout JTAG header X18................................................................................................................................................................. 14

Table 16: Pinout Mini PCIe X4.......................................................................................................................................................................... 16

Table 17: Maximum permitted currents Mini PCIe X4............................................................................................................................. 16

Table 18: Pinout SIM-Card Connector X5..................................................................................................................................................... 16

Table 19: Electrical characteristics backup battery................................................................................................................................... 17

Table 20: SATA transfer rates ........................................................................................................................................................................... 17

Table 21: Pinout microSD card X9.................................................................................................................................................................. 18

Table 22: Unused CPU USB pins...................................................................................................................................................................... 19

Table 23: Characteristics USB-Host ................................................................................................................................................................ 19

Table 24: Pinout WLAN module /Mini PCIe (USB) X3 ............................................................................................................................... 20

Table 25: Maximum permitted current consumption WLAN ................................................................................................................ 20

Table 26: Reset signals....................................................................................................................................................................................... 21

Table 27: Boot-Mode-Select values for cfg_rcw_src................................................................................................................................. 22

Table 28: DIP switch S1, functions.................................................................................................................................................................. 23

Table 29: Electrical characteristics of 1.8 V GPIOs...................................................................................................................................... 24

Table 30: GPIO assignment............................................................................................................................................................................... 24

Table 31: Function of Port Expanders ........................................................................................................................................................... 25

Table 32: Pinout header X22............................................................................................................................................................................ 26

Table 33: X22, type of header.......................................................................................................................................................................... 27

Table 34: Status LEDs ......................................................................................................................................................................................... 28

Table 35: Push buttons ...................................................................................................................................................................................... 29

Table 36: Electrical characteristics LM75A ................................................................................................................................................... 30

Table 37: TQMSL1012AL dimensions............................................................................................................................................................ 31

Table 38: Climatic and operational conditions MBLS1012AL................................................................................................................ 33

Table 39: Acronyms ............................................................................................................................................................................................ 35

Table 40: Further applicable documents ..................................................................................................................................................... 37

ILLUSTRATION DIRECTORY

Illustration 1: Block diagram MBLS1012AL.............................................................................................................................................................4

Illustration 2: Block diagram TQMLS1012AL..........................................................................................................................................................6

Illustration 3: Block diagram protective circuit.....................................................................................................................................................7

Illustration 4: Positon of protective circuit .............................................................................................................................................................7

Illustration 5: Block diagram Debug UART1...........................................................................................................................................................9

Illustration 6: Position of eMMC.................................................................................................................................................................................9

Illustration 7: Block diagram Ethernet Link ......................................................................................................................................................... 10

Illustration 8: Position of Gigabit Ethernet X23 (Link)...................................................................................................................................... 10

Illustration 9: Position of Gigabit Ethernet X12, X13 (Switch) ....................................................................................................................... 11

Illustration 10: Block diagram I2C bus...................................................................................................................................................................... 12

Illustration 11: Block diagram JTAG ......................................................................................................................................................................... 13

Illustration 12: Position of JTAG header X18 ......................................................................................................................................................... 14

Illustration 13: Block diagram Mini PCIe................................................................................................................................................................. 15

Illustration 14: Position of Mini PCIe socket X4 .................................................................................................................................................... 16

Illustration 15: Position of backup battery X7....................................................................................................................................................... 17

Illustration 16: Position of SATA (M.2) connector X10........................................................................................................................................ 17

Illustration 17: Block diagram SD card .................................................................................................................................................................... 18

Illustration 18: Position of microSD card socket X9 ............................................................................................................................................ 18

Illustration 19: Block diagram USB 3.0..................................................................................................................................................................... 19

Illustration 20: Position of USB 3.0 stacked socket X6........................................................................................................................................ 19

Illustration 21: Position of WLAN X3 ........................................................................................................................................................................ 20

Illustration 22: Reset structure................................................................................................................................................................................... 21

Illustration 23: Position of Reset LED ....................................................................................................................................................................... 22

Illustration 24: Position of DIP switch S1................................................................................................................................................................ 23

Illustration 25: Position of Port-Expander .............................................................................................................................................................. 25

Illustration 26: Position of header X22.................................................................................................................................................................... 27

Illustration 27: Position of Status-LEDs ................................................................................................................................................................... 28

Illustration 28: Block diagram push buttons ......................................................................................................................................................... 29

Illustration 29: Position of push buttons ................................................................................................................................................................ 29

Illustration 30: Position of temperature sensor LM75A ..................................................................................................................................... 30

Illustration 31: TQMLS1012AL dimensions............................................................................................................................................................ 31

Illustration 32: MBLS1012AL dimensions............................................................................................................................................................... 31

Illustration 33: MBLS1012AL component placement top................................................................................................................................. 32

Illustration 34: MBLS1012AL component placement bottom......................................................................................................................... 32

REVISION HISTORY

Rev. Date Name Pos. Modification

0001 29.04.2019 Petz First issue

ABOUT THIS MANUAL

1.1

This Preliminary User's Manual may not be copied, reproduced, translated, changed or distributed, completely or partially in

electronic, machine readable, or in any other form without the written consent of TQ-Systems GmbH.

The drivers and utilities for the components used as well as the BIOS are subject to the copyrights of the respective

manufacturers. The licence conditions of the respective manufacturer are to be adhered to.

Bootloader-licence expenses are paid by TQ-Systems GmbH and are included in the price.

Licence expenses for the operating system and applications are not taken into consideration and must be calculated / declared

separately.

1.2

Registered trademarks

TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original

or license-free graphics and texts.

All brand names and trademarks mentioned in this Preliminary User's Manual, including those protected by a third party, unless

specified otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the

present registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by a

third party.

1.3

Disclaimer

TQ-Systems GmbH does not guarantee that the information in this Preliminary User's Manual is up-to-date, correct, complete or

of good quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against TQ-

Systems GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information

given in this Preliminary User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there

is no proven intentional or negligent fault of TQ-Systems GmbH.

TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this Preliminary User's Manual or parts of it

without special notification.

Important Notice:

Before using the Starterkit MBLS1012AL or parts of the MBLS1012AL schematics, you must evaluate it and determine if it is

suitable for your intended application. You assume all risks and liability associated with such use. TQ-Systems GmbH makes no

other warranties including, but not limited to, any implied warranty of merchantability or fitness for a particular purpose. Except

where prohibited by law, TQ-Systems GmbH will not be liable for any indirect, special, incidental or consequential loss or damage

arising from the usage of the Starterkit MBLS1012AL or schematics used, regardless of the legal theory asserted.

1.4

Imprint

TQ-Systems GmbH

Gut Delling, Mühlstraße 2

D-82229 Seefeld

Tel: +49 8153 9308–0

Fax: +49 8153 9308–4223

E-Mail: Info@TQ-Group

Web: TQ-Group

1.5

Tips on safety

Improper or incorrect handling of the product can substantially reduce its life span.

1.6

Symbols and typographic conventions

Table 1: Terms and Conventions

Symbol Meaning

This symbol represents the handling of electrostatic-sensitive modules and / or components. These

components are often damaged / destroyed by the transmission of a voltage higher than about 50 V.

A human body usually only experiences electrostatic discharges above approximately 3,000 V.

This symbol indicates the possible use of voltages higher than 24 V.

Please note the relevant statutory regulations in this regard.

Non-compliance with these regulations can lead to serious damage to your health and also cause

damage / destruction of the component.

This symbol indicates a possible source of danger. Acting against the procedure described can lead to

possible damage to your health and / or cause damage / destruction of the material used.

This symbol represents important details or aspects for working with TQ-products.

Command

A font with fixed-width is used to denote commands, file names, or menu items.

1.7

Handling and ESD tips

General handling of your TQ-products

The TQ-product may only be used and serviced by certified personnel who have taken note of the

information, the safety regulations in this document and all related rules and regulations.

A general rule is: do not touch the TQ-product during operation. This is especially important when

switching on, changing jumper settings or connecting other devices without ensuring beforehand

that the power supply of the system has been switched off.

Violation of this guideline may result in damage / destruction of the MBLS1012AL and be dangerous

to your health.

Improper handling of your TQ-product would render the guarantee invalid.

Proper ESD handling

The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).

Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-

product in an ESD-safe environment. Especially when you switch modules on, change jumper settings,

or connect other devices.

1.8

Naming of signals

A hash mark (#) at the end of the signal name indicates a low-active signal.

Example: RESET#

If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked with

a hash mark and shown at the end.

Example: C / D#

If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring.

The identification of the individual functions follows the above conventions.

Example: WE2# / OE#

1.9

Further applicable documents / presumed knowledge

•

Specifications and manual of the modules used:

These documents describe the service, functionality and special characteristics of the module used (incl. BIOS).

•

Specifications of the components used:

The manufacturer's specifications of the components used, for example CompactFlash cards, are to be taken note of.

They contain, if applicable, additional information that must be taken note of for safe and reliable operation.

These documents are stored at TQ-Systems GmbH.

•

Chip errata:

It is the user's responsibility to make sure all errata published by the manufacturer of each component are taken note of.

The manufacturer’s advice should be followed.

•

Software behaviour:

No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.

•

General expertise:

Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.

The following documents are required to fully comprehend the following contents:

•MBLS1012AL circuit diagram

•TQMLS1012AL User’s Manual

•LS1012A Data Sheet

•U-Boot documentation: www.denx.de/wiki/U-Boot/Documentation

•PTXdist documentation: www.ptxdist.de

•TQ-Support Wiki: support.tq-group.com/doku.php?id=en:arm:TQMLS1012AL

BRIEF DESCRIPTION

This User's Manual describes the hardware of the MBLS1012AL from revision 0200.

The MBLS1012AL is designed as a carrier board for the TQMLS1012AL.

All TQMLS1012AL interfaces, which can be used, are available on the MBLS1012AL. Thus the features of the NXP CPU LS1012A

can be evaluated and software development for a TQMLS1012AL-based project can be started directly.

The MBLS1012AL supports all LS1012A-based TQ-Modules with the NXP CPUs i.MX6UL (G1, G2, G3) and i.MX6ULL (Y0, Y1, Y2).

TECHNICAL DATA

3.1

System architecture and functionality

3.1.1 Block diagram MBLS1012AL

MBLS1012AL

TQMLS1012AL

USB Hub

TUSB8041

2×USB 3.0

Mini PCIe

PCI WLAN

module

USB 3.0

Ethernet

1 Gbit

PHY

DP83867

SerDes A

4×Ethernet

1 Gbit

Switch

KSZ9897

SGMII

SerDes D SATA / M.2

SerDes B PCIe

GPIO GPIO

GPIO

SD card /

eMMC eSDHC

eSDHC1

UART

USB debug

JTAG

USB 3.0

USB 2.0

RGMII

„Link“

„Switch“

JTAG

3 Push

buttons

Reset

push button

Boot Mode

(DIP switches) Status LEDs

100 mil header

Power supply

3.3 V / 5 V

Power supply

1.1 V / 1.5 V

Power supply

2.5 V

Power supply

1.0 V

Power IN

(DC socket)

Input

protection

Temperature

sensor

GPIO Expander

GPIO

I2C

TAMPER

UART

Power supply

1.8 V

Power supply

1.2 V

SIM card

I2C

Kinetis

MK20

Periphery

2 ×LED,

Reset

signals,

Enable

signals Reset

signals,

GPIO

FTDI

USB2UART

USB debug

Illustration 1: Block diagram MBLS1012AL

3.1.2 Functionality and interfaces

Core of the system is the soldered processor module TQMLS1012AL with an ARM Cortex A53 based NXP Layerscape series CPU

LS1012A. In addition to the standard communication interfaces such as USB, Ethernet, etc., more TQMLS1012AL signals are

routed to a 100 mil pin header on the MBLS1012AL.

The MBLS1012AL provides the following interfaces and functions:

Table 2: Overview interfaces

Interface Qty. LS1012A interface Remark

Ethernet 1000 Mbits 1 SGMII (SerDes-Lane A, MAC1) Gigabit PHY DP83867

Ethernet 1000 Mbits 4 RGMII (MAC2) 5-fold Gigabit switch KSZ9897

SATA 1 SATA (SerDes-Lane D) Supply and mounting for M.2 SSD

Mini PCIe 1 PCIe (SerDes-Lane B)

USB 2.0 from TUSB8041 With external SIM card slot

USB 3.0 4 USB 3.0 from TUSB8041

Hub TUSB8041:

1x stacked USB Type A (USB 3.0)

1x WLAN module (USB 2.0)

1x Mini PCIe (USB 2.0)

WLAN 1 USB 2.0 from TUSB8041 As Mini PCIe socket

eMMC11 eSDHC1

On-board 4-bit JEDEC 4.5

5.0 eMMC compatible

Optional instead SD card

SD card 1 eSDHC1 Optional instead eMMC

GPIO (native, 1.8 V) 4 GPIO1 GPIO1_25 u. GPIO1_26 with Pull-Up and Pull-Down at DIP switch

GPIO (Port-Expander, 3.3 V) 3 – Provided via GPIO-Expander, control via I2C_3V3

Debug 1 UART 3.3V UART, switchable between FTDI-USB2UART/pin header and

OpenSDA (USB) via DIP switch

JTAG 1 JTAG 10-pin header and over OpenSDA via USB

I2C 1 I2C1_3V3 On pin header

Table 3: Overview Diagnostic and User Interfaces

Interface Qty. Device Remark

Status LEDs

6 LED green

•24 V

•5 V

•3.3 V

•3.3 V PCIE

•3.3 V WLAN

•2.5 V

3 LED green Mini PCIe, WLAN, SATA (M.2)

1 LED green GPIO LED at Port-Expander

1 LED green GPIO LED at Port-Expander with light guide

1 LED red Reset LED with light guide

Temperature sensor 1 – Digital I2C temperature sensor

Reset button 1 Push button CPU-/MBLS1012AL-Reset

User push button 3 Push button GPIO push button at Port-Expander

Boot-Mode configuration 1 DIP switch See chapter 4.4

JTAG 1 10-pin, 100 mil header –

1: eMMC functionality prepared. Currently not supported.

ELECTRONICS

The TQ-Minimodule TQMLS1012AL with its LS1012A CPU is the central system component. It provides DDR3L SDRAM, eMMC,

NOR flash and EEPROM memory. All voltages required by the TQMLS1012AL are derived from the supply voltage of 3.3 V.

The available signals are routed to two connectors on the MBLS1012AL. More detailed information is to be taken from the

TQMLS1012AL User’s Manual. The boot behaviour of the TQMLS1012AL can be customised.

The required boot-mode configuration can be set with DIP switches, see section 4.4.

4.1

System components

4.1.1 TQMLS1012AL

The TQ-Minimodule TQMLS1012AL with the LS1012A CPU is the central system component. It provides DDR3L SDRAM, NOR

flash and an EEPROM. All TQMLS1012AL internal voltages are derived from the 3.3 V supply voltage. Further information can be

found in the TQMLS1012AL User's Manual. The boot behaviour of the TQMLS1012AL can be modified. The configuration is

defined by DIP switches on the MBLS1012AL, see chapter 4.4. The available signals of the TQMLS1012AL are routed to the

MBLS1012AL. The signal assignment can be found in the TQMLS1012AL User's Manual.

LS1012A

DDR3L SDRAM

TQMLS1012AL, 155 LGA contacts

EEPROM

Temp. sensor

+ EEPROM

PMIC

VR5100

QSPI NOR flash

3.3 V

RTC (optinal)

PCIe

SATA

SGMII

RGMII

eSDHC

USB 3.0

JTAG

UART

I2C

GPIO

Tamper

Illustration 2: Block diagram TQMLS1012AL

4.1.2 Power supply

The MBLS1012AL has to be supplied with 16 V to 28 V at X21. The typical supply voltage is 24 V.

The MBLS1012AL has a maximum power consumption of approx. 51 W at the 24 V supply. This corresponds to a typical

maximum current consumption of 2.1 A. The power supply used must be dimensioned accordingly. In most applications,

however, the power consumption will be significantly lower. The largest part of the possible power consumption results from

the standard-compliant supply of the USB, PCIe and SATA (M.2) interfaces, as well as from the power available at the pin header.

3.3 V (1.5 A), 5 V (0.75 A) and 24 V (maximum current not defined) are available on pin header X22. The current drawn must be

added to the input current. It has to be ensured that the permissible limit values of the input circuit are not exceeded.

4.1.3 Protective circuit

The input supply of the MBLS1012AL supplies the 3.3 V / 5 V regulators.

The protection circuit (see Illustration 3) features the following characteristics:

•Overcurrent protection by fuse 4 A, slow blow

•Overvoltage protection diode

•PI filter

•Reverse polarity protection by MOSFET

•Capacitors for voltage smoothing

Power IN Fuse Filter

Reverse

Polarity

Protection

TVS Diode

Illustration 3: Block diagram protective circuit

The protective circuit has the following electrical characteristics:

Table 4: Parameter protective circuit

Parameter Min. Typ. Max. Unit

Overcurrent limitation by fuse (slow blow) – 4 – A

Overvoltage limitation 28.9 – 42.1 V

Illustration 4: Positon of protective circuit

4.1.4 Voltage regulators

The following table show the electrical parameters of the voltage regulators.

Table 5: Electrical parameters of voltage regulators

Voltage Parameter Min. Typ. Max. Unit Remark

24 V

Input voltage 16 24 28 V –

Max. input current – – 3.2 A –

Idle current – 0.19 – A U-Boot / Linux Idle @24 V

5 V Output voltage 4.918 4.98 5.124 V Over input voltage and load range

Max. current

4 A

3.3 V Output voltage 3.281 3.31 3.392 V Over input voltage and load range

Max. current – – 8 A

2.5 V Output voltage 2.44 2.48 2.55 V Over load range

Max. current

1 A

1.2 V Output voltage 1.18 1.22 1.23 V Over input voltage and load range

Max. current – – 1.5 A

1.5 V Output voltage 1.46 1.49 1.52 V Over load range

Max. Current

1 A

1.1 V Output voltage 1.08 1.08 1.11 V Over input voltage and load range

Max. Current – – 1 A

1.8 V Output voltage 1.827 1.88 1.895 V Over load range

Max. Current

0.5 A

1.0 V Output voltage 1.02 1.04 1.044 V Over input voltage and load range

Max. Current – – 0.25 A

The following table shows the voltage drop under full load:

Table 6: Electrical parameters of PCIe and WLAN voltages

Voltage Min. Typ. Max. Unit Remark

V_1V5_PCIE – 3 – mV IOUT = 0.375 A

V_3V3_PCIE – 9 – mV IOUT = 1.1 A

V_1V5_WLAN – 3 – mV IOUT = 0.375 A

V_3V3_WLAN – 9 – mV IOUT = 1.1 A

4.2

Communication interfaces

4.2.1 DAPLink / OpenSDA

A circuit for a DAPLink/OpenSDA programmer is prepared on the MBLS1012AL. Currently this circuit is not supported.

4.2.2 Debug UART

TQMLS1012AL

UART1_SOUT

UART1_SIN

33 Ω

1.8 V to 3.3 V OpenSDA K20

Header for

FTDI TTL-

232R-3V3

FTDI

UART-2-USB

Mini USB

MUX

3.3 V to 1.8 V

33 Ω

10 pF

Illustration 5: Block diagram Debug UART1

A debug interface is available via UART1. This UART is provided as a virtual COM port via USB. Parallel to this, the UART can also

be accessed at a 6-pin pin header.

UART1 is optionally available on the DAPLink / OpenSDA interface2(see 4.2.1).

The input signal for the TQMLS1012AL can be switched between OpenSDA and USB/pin header with a DIP switch. The output

level is adapted to 3.3 V using a level converter.

Table 7: DIP switch setting for UART source

DIP switch OFF ON

S1, Slot 3 Debug-UART on OpenSDA Debug-UART on USB / header

4.2.3 eMMC

An eMMC can be used instead of the SD card. The use of an eMMC is currently not supported.

Illustration 6: Position of eMMC

2: The DAPLink / OpenSDA interface is currently not supported.

4.2.4 Gigabit Ethernet (Link)

TQMLS1012AL DP83867

SGMII

RJ45

(X23)

ETH_LNK_RST#

ETH_LINK_PWRDWN#

EMI1

Illustration 7: Block diagram Ethernet Link

When using the MBLS1012AL e.g. as router or switch, the single port can be used as LINK interface e.g. to a modem.

The single Ethernet port is provided via the PHY DP83867 at the SGMII interface (SerDes-Lane A).

The PHY has boot straps to start with configurable default values. Some boot straps can be customized with assembly options.

Further information is available in the latest circuit diagram of the MBLS1012AL.

The following table shows the pin assignment of the Ethernet connector.

Table 8: Pinout RJ-45 connector X23 for “Link“

Pin Name Target pin / Net Remark

1 GND GND –

2 TD1+ TD_P_A –

3 TD1– TD_M_A –

4 TD2+ TD_P_B –

5 TD2– TD_M_B –

6 TD3+ TD_P_C –

7 TD3– TD_M_C –

8 TD4+ TD_P_D –

9 TD4– TD_M_D –

10 GND GND –

11 GREEN_ANODE V_2V5 82 Ω in series

GREEN_KATODE

LED_0 (DP83867)

Switched with transistor

13 YELLOW_ANODE V_2V5 82 Ω in series

14 YELLOW_KATODE LED_2 (DP83867) Switched with transistor

The possible data throughput is influenced by the system load and the software platform used.

With the MBLS1012AL and the standard BSP, the following transfer rates can be achieved.

Table 9: Characteristics Gigabit Ethernet X23 (Link)

Parameter Min. Typ. Max. Unit

Upstream – – 940 Mbit/s

Downstream – – 840 Mbit/s

Illustration 8: Position of Gigabit Ethernet X23 (Link)

4.2.5 Gigabit Ethernet (Switch ports)

Up to four Ethernet interfaces (1000Base-T) are available via Microchip's KSZ9897 gigabit switch. Connection is via RGMII.

The switch is managed via I2C. In contrast to MIIM (EMI), this enables full control of the device. The connection of the EMI1 bus is

possible via assembly option. The switch has boot straps to start with configurable default values. Some boot straps can be

configured with assembly options. Further information is available in the latest circuit diagram of the MBLS1012AL.

The following table shows the pin assignment of the Ethernet connectors:

Table 10: Pinout RJ-45 connector X12, X13 for “Switch“

Switch pin Pin name RJ-45 pin Remark

Ports 4-1 Gigabit Ethernet Pins

1, 12, 24, 34 TXRX[4:1]P_A TD0+[4:1] –

2, 13, 25, 35 TXRX[4:1]M_A TD0–[4:1] –

4, 15, 26, 37 TXRX[4:1]P_B TD1+[4:1] –

5, 16, 27, 38

TXRX[4:1]M_B

TD1–[4:1]

–

6, 17, 28, 39

TXRX[4:1]P_C

TD2+[4:1]

–

7, 18, 29, 40 TXRX[4:1]M_C TD2–[4:1] –

8, 20, 31, 42 TXRX[4:1]P_D TD3+[4:1] –

9, 21, 32, 43 TXRX[4:1]M_D TD3–[4:1] –

85, 88, 91, 105 LED[4:1]_0 LED1_K[4:1] –

86, 89, 92, 106 LED[4:1]_1 LED2_K[4:1] –

– – LED1_A[4:1] V_2V5, 100 Ω in series

–

LED2_A[4:1]

V_2V5, 100 Ω in series

Table 11: Ethernet Switch, Port-Link Status information

LED1 LED2 Status

OFF

Link off

OFF

1000 Mbps Link / No Activity

OFF

Blinking

1000 Mbps Link / Activity

OFF

100 Mbps Link / No Activity

Blinking

OFF

100 Mbps Link / Activity

10 Mbps Link / No Activity

Blinking

10 Mbps Link / Activity

The possible data throughput is influenced by the system load and the software platform used.

With the MBLS1012AL and the standard BSP, the following transfer rates can be achieved.

Table 12: Characteristics Gigabit Ethernet (Link)

Parameter Min. Typ. Max. Unit

Upstream

–

TBD

1,000

Mbit/s

Downstream

–

TBD

1,000

Mbit/s

Illustration 9: Position of Gigabit Ethernet X12, X13 (Switch)

4.2.6 I2C

The TQMLS1012AL provides an I2C bus on the MBLS1012AL. This I2C bus is implemented with a 1.8 V and a 3.3 V branch.

The 3.3 V branch is routed to a 100 mil pin header and terminated with 4.7 kΩ Pull-Ups. Table 13 lists all I2C addresses used.

MBLS1012AL

TQMLS1012AL

100 mil header

Temperature

sensor

GPIO

Expander

I2C_3V3

USB Hub PCIe RefCLK

PCIe card

Ethernet

Switch

I2C_1V8

Illustration 10: Block diagram I2C bus

The following table shows the I2C address mapping on TQMLS1012AL and MBLS1012AL.

Table 13: I2C devices, address mapping on TQMLS1012AL and MBLS1012AL

Location Device Function Address Remark

MBLS1012AL

KSZ9897R Ethernet Switch

0x5F / 101 1111b

Optional, not connected

TUSB8041 USB-Hub

0x44 / 100 0100b

Optional, not connected

LM75ADP Temperature sensor

0x48 / 100 1000b

–

9FGV0241 PCIe RefClk

0x69 / 110 1001b

Optional, not connected

– PCIe Card

–

Defined by PCIe card

– WLAN Card

–

Defined by PCIe card

PCA9555 GPIO Expander

0x20 / 010 0000b

–

TQMLS1012AL

DS1339U-33 RTC

0x68 / 110 1000b

–

SE97B

Temperature sensor

0x19 / 001 1001b

–

EEPROM, unprotected

0x51 / 101 0001b

–

EEPROM. protected

0x31 / 011 0001b

–

24LC64T EEPROM

0x50 / 101 0000b

–

VR5100 PMIC

0x08 / 000 1000b

–

4.2.7 JTAG

The JTAG signals of the TQMLS1012AL are available on a standard ARM 10-pin JTAG connector. The JTAG interface of the

microcontroller for the OpenSDA interface is also equipped with a 10-pin JTAG connector with standard ARM assignment.

For the OpenSDA circuit see section 4.2.1.

A Lauterbach debugger can be used to program the TQMLS1012AL. NXP recommends the "Code Warrior Development Studio

for QorIQ LS series" and the "CodeWarrior TAP" programmer for development and programming of the LS1012A processor.

The following table shows possible adapters.

Table 14: JTAG adapters

Debugger Details

Lauterbach JTAG-ARMV8-A/R, LA-3743 −TRACE32 Debugger for LS1012A

−Debugger for Cortex-A/R (ARMv8 32/64-bit)

Lauterbach CONV-ARM20/MIPI34, LA-3770

−ARM Converter ARM-20 to MIPI-10/20/34

−Converter to connect a Debug Cable to 10/20/34 pin connectors specified by MIPI

−Converts to CombiProbe connector

NXP, CWH-CTP-BASE-HE, 935328292598 −CodeWarrior TAP

NXP, CWH-CTP-CTX10-YE, 935327448598 −Code Warrior TAP removable probe tip for LS1 &L S2 Processors

−ARM Mini 10-Pin JTAG

TQMLS1012AL

OpenSDA

Debug

USB

10-pin

ARM JTAG

OpenSDA

X19

10-pin

ARM JTAG

TQMLS1012AL

X18

Level

shifter

1.8 V

3.3 V

Illustration 11: Block diagram JTAG

The JTAG test reset pin (TP18, JTAG_TRST#) must be grounded simultaneously with PORESET# during normal operation. This is

achieved by using a 0 Ω bridge on the MBLS1012AL. If a boundary-scan is to be performed, this bridge must be removed and

both signals must be controlled accordingly. The JTAG interface is not ESD protected.

The following table shows the pin assignment of the JTAG connector.

Table 15: Pinout JTAG header X18

Pin Pin name Target pin / Net

1 VTref / (VCC V_1V8

2 JTAG_CPU_TMS JTAG_TMS (TP17)

3 GND GND

4 JTAG_CPU_TCK JTAG_TCK (TP16)

5 GND GND

6 JTAG_CPU_TDO JTAG_TDO (TP15)

7 KEY NC

8 JTAG_CPU_TDI JTAG_TDI (TP14)

9 GND_DETECT_1V8 GND_DETECT_3V3

10 JTAG_CPU_RESET# RESET_IN#

Illustration 12: Position of JTAG header X18

4.2.8 Mini PCIe

PCIe X1

USB

Sim

Card

I2C

LED

TQMLS1012AL

Mini PCIe

connector

(X4)

Hub

USB

Clock

Generator

PCIE_DIS#

PCIE_WAKE#

PCIE_RST#

Illustration 13: Block diagram Mini PCIe

The processor provides a PCIe Gen2 interface with one lane (x1) via the SerDes interface. In standard muxing, this Lane occupies

Lane B of the SerDes interface. It is compatible to the PCI Express Base Specification, Revision 3.0 and supports transfer rates of

2.5 GT/s as well as 5 GT/s.

In addition to the PCIe-Lane, a USB host (from the USB hub) and an I2C interface are connected to the Mini PCIe interface. The

power supply is implemented with 3.3 V and 1.5 V and must be activated separately on the port expander via VCC_PCIE_EN_1V5

and VCC_PCIE_EN_3V3.

When using the I2C functionality, check in advance whether the I2C address used by the plug-in card is not yet being used by a

peripheral on the MBLS1012AL. See also Table 13.

The reference clock is provided by a special PCIe clock generator 9FGV0241. The clock generator can optionally be connected to

the I2C bus with 0 Ω resistors. Individual outputs can be switched off and the slew rate and amplitude can be changed via the I2C

bus. The I2C address can be taken from Table 13.

The control lines PCIE_WAKE# and PCIE_DIS# can be switched via the port expander.

There is only one LED, which can be connected to one of the pins 42, 44 or 46 via the pre-resistor. By default LED_WWAN# is

assembled.

The layout has been designed to allow both full-size and half-size Mini PCI Express cards to be used. The full-size form factor is

available as standard.

The interface is wired with all signals provided by the standard (e.g. USB, I2C, and PCIe).

Any standard compliant Mini PCIe card can be used3.

A micro SIM card holder is also provided for the use of a GSM card. SIM cards that require 5 V supply/signal level are not

supported.

The voltages provided for the Mini PCIe card must not exceed the currents specified in Table 17.

3: Where required drivers are available.

Table of contents

Other TQ-Systems Single Board Computer manuals

TQ-Systems

TQ-Systems MBa8x User manual

TQ-Systems

TQ-Systems MBa8MPxL User manual

TQ-Systems

TQ-Systems TQMa8x User manual

TQ-Systems

TQ-Systems TQMLS1028A User manual

TQ-Systems

TQ-Systems MBLS1028A User manual

Popular Single Board Computer manuals by other brands

Aaeon

Aaeon GENE-TGU6 user manual

GIGAIPC

GIGAIPC QBiP-7100A user manual

Vecow

Vecow EMBC-5000 Series user manual

IEI Technology

IEI Technology NOVA-9152 Quick installation guide

Artesyn

Artesyn ATCA-7370 Installation and use

BOSER Technology

BOSER Technology HS-5011 manual

Connect Tech

Connect Tech GraphiteVPX/CPU-TX1 user guide

Boser

Boser HS-6250 manual

Kontron

Kontron SBC-845D-VEA user guide

DFI

DFI GH551 quick reference

E-TOP

E-TOP PISA-E1 user manual

Cypress

Cypress CY8C28 series Technical reference manual

Seco

Seco SBC-C20 user manual

ICS Advent

ICS Advent 486MBS Series product manual

Digi

Digi i.MX6UL Hardware reference manual

IEI Technology

IEI Technology NANO-945GSE Quick installation guide

Vantron

Vantron IBOX3588 Edge AI user manual

Advantech

Advantech PCM-9389 Startup manual

TQ-Systems MBLS1012AL User manual

Popular Single Board Computer manuals by other brands