Tq-systems Mbls1012al User manual

MBLS1012AL

Preliminary User's Manual

MBLS1012AL UM 0001

29.04.2019

TABLE OF CONTENTS

1. ABOUT THIS MANUAL................................................................................................................................................................................1

1.1 Copyright and licence expenses.............................................................................................................................................................1

1.2 Registered trademarks...............................................................................................................................................................................1

1.3 Disclaimer......................................................................................................................................................................................................1

1.4 Imprint............................................................................................................................................................................................................1

1.5 Tips on safety................................................................................................................................................................................................2

1.6 Symbols and typographic conventions ...............................................................................................................................................2

1.7 Handling and ESD tips...............................................................................................................................................................................2

1.8 Naming of signals........................................................................................................................................................................................3

1.9 Further applicable documents / presumed knowledge .................................................................................................................3

2. BRIEF DESCRIPTION ....................................................................................................................................................................................4

3. TECHNICAL DATA........................................................................................................................................................................................4

3.1 System architecture and functionality..................................................................................................................................................4

3.1.1 Block diagram MBLS1012AL ....................................................................................................................................................................4

3.1.2 Functionality and interfaces ....................................................................................................................................................................5

4. ELECTRONICS................................................................................................................................................................................................6

4.1 System components...................................................................................................................................................................................6

4.1.1 TQMLS1012AL..............................................................................................................................................................................................6

4.1.2 Power supply................................................................................................................................................................................................6

4.1.3 Protective circuit..........................................................................................................................................................................................7

4.1.4 Voltage regulators ......................................................................................................................................................................................8

4.2 Communication interfaces.......................................................................................................................................................................9

4.2.1 DAPLink / OpenSDA ...................................................................................................................................................................................9

4.2.2 Debug UART .................................................................................................................................................................................................9

4.2.3 eMMC..............................................................................................................................................................................................................9

4.2.4 Gigabit Ethernet (Link)............................................................................................................................................................................ 10

4.2.5 Gigabit Ethernet (Switch ports) ........................................................................................................................................................... 11

4.2.6 I2C .................................................................................................................................................................................................................. 12

4.2.7 JTAG.............................................................................................................................................................................................................. 13

4.2.8 Mini PCIe ..................................................................................................................................................................................................... 15

4.2.9 RTC backup supply .................................................................................................................................................................................. 17

4.2.10 SATA ............................................................................................................................................................................................................. 17

4.2.11 SD card......................................................................................................................................................................................................... 18

4.2.12 SPI.................................................................................................................................................................................................................. 18

4.2.13 USB................................................................................................................................................................................................................ 19

4.2.14 WLAN ........................................................................................................................................................................................................... 20

4.3 Reset structure .......................................................................................................................................................................................... 21

4.4 Boot-Mode configuration...................................................................................................................................................................... 22

4.5 Diagnostic and user interfaces............................................................................................................................................................. 23

4.5.1 DIP switch S1 ............................................................................................................................................................................................. 23

4.5.2 GPIOs............................................................................................................................................................................................................ 24

4.5.3 GPIO port expander................................................................................................................................................................................. 25

4.5.4 Header X22................................................................................................................................................................................................. 26

4.5.5 LEDs .............................................................................................................................................................................................................. 28

4.5.6 Push buttons.............................................................................................................................................................................................. 29

4.5.7 Reset Push button.................................................................................................................................................................................... 29

4.5.8 Temperature sensor ................................................................................................................................................................................ 30

TABLE OF CONTENTS (continued)

5. SOFTWARE.................................................................................................................................................................................................. 30

6. MECHANICS................................................................................................................................................................................................ 31

6.1 TQMLS1012AL and MBLS1012AL dimensions ................................................................................................................................ 31

6.2 Housing ....................................................................................................................................................................................................... 31

6.3 Thermal management............................................................................................................................................................................ 32

6.4 Assembly..................................................................................................................................................................................................... 32

7. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS......................................................................................................... 33

7.1 EMC............................................................................................................................................................................................................... 33

7.2 ESD................................................................................................................................................................................................................ 33

7.3 Operational safety and personal security......................................................................................................................................... 33

8. CLIMATIC AND OPERATIONAL CONDITIONS................................................................................................................................... 33

8.1 Protection against external effects..................................................................................................................................................... 33

8.2 Reliability and service life....................................................................................................................................................................... 33

9. ENVIRONMENT PROTECTION................................................................................................................................................................ 34

9.1 RoHS ............................................................................................................................................................................................................. 34

9.2 WEEE®.......................................................................................................................................................................................................... 34

9.3 REACH®........................................................................................................................................................................................................ 34

9.4 EuP ................................................................................................................................................................................................................ 34

9.5 Packaging ................................................................................................................................................................................................... 34

9.6 Batteries ...................................................................................................................................................................................................... 34

9.6.1 General notes ............................................................................................................................................................................................ 34

9.6.2 Lithium batteries ...................................................................................................................................................................................... 34

9.7 Other entries.............................................................................................................................................................................................. 34

10. APPENDIX ................................................................................................................................................................................................... 35

10.1 Acronyms and definitions...................................................................................................................................................................... 35

10.2 References .................................................................................................................................................................................................. 37

TABLE DIRECTORY

Table 1: Terms and Conventions.....................................................................................................................................................................2

Table 2: Overview interfaces.............................................................................................................................................................................5

Table 3: Overview Diagnostic and User Interfaces ....................................................................................................................................5

Table 4: Parameter protective circuit.............................................................................................................................................................7

Table 5: Electrical parameters of voltage regulators.................................................................................................................................8

Table 6: Electrical parameters of PCIe and WLAN voltages.....................................................................................................................8

Table 7: DIP switch setting for UART source................................................................................................................................................9

Table 8: Pinout RJ-45 connector X23 for “Link“ ....................................................................................................................................... 10

Table 9: Characteristics Gigabit Ethernet X23 (Link) .............................................................................................................................. 10

Table 10: Pinout RJ-45 connector X12, X13 for “Switch“......................................................................................................................... 11

Table 11: Ethernet Switch, Port-Link Status information ........................................................................................................................ 11

Table 12: Characteristics Gigabit Ethernet (Link)....................................................................................................................................... 11

Table 13: I2C devices, address mapping on TQMLS1012AL and MBLS1012AL ................................................................................ 12

Table 14: JTAG adapters.................................................................................................................................................................................... 13

Table 15: Pinout JTAG header X18................................................................................................................................................................. 14

Table 16: Pinout Mini PCIe X4.......................................................................................................................................................................... 16

Table 17: Maximum permitted currents Mini PCIe X4............................................................................................................................. 16

Table 18: Pinout SIM-Card Connector X5..................................................................................................................................................... 16

Table 19: Electrical characteristics backup battery................................................................................................................................... 17

Table 20: SATA transfer rates ........................................................................................................................................................................... 17

Table 21: Pinout microSD card X9.................................................................................................................................................................. 18

Table 22: Unused CPU USB pins...................................................................................................................................................................... 19

Table 23: Characteristics USB-Host ................................................................................................................................................................ 19

Table 24: Pinout WLAN module /Mini PCIe (USB) X3 ............................................................................................................................... 20

Table 25: Maximum permitted current consumption WLAN ................................................................................................................ 20

Table 26: Reset signals....................................................................................................................................................................................... 21

Table 27: Boot-Mode-Select values for cfg_rcw_src................................................................................................................................. 22

Table 28: DIP switch S1, functions.................................................................................................................................................................. 23

Table 29: Electrical characteristics of 1.8 V GPIOs...................................................................................................................................... 24

Table 30: GPIO assignment............................................................................................................................................................................... 24

Table 31: Function of Port Expanders ........................................................................................................................................................... 25

Table 32: Pinout header X22............................................................................................................................................................................ 26

Table 33: X22, type of header.......................................................................................................................................................................... 27

Table 34: Status LEDs ......................................................................................................................................................................................... 28

Table 35: Push buttons ...................................................................................................................................................................................... 29

Table 36: Electrical characteristics LM75A ................................................................................................................................................... 30

Table 37: TQMSL1012AL dimensions............................................................................................................................................................ 31

Table 38: Climatic and operational conditions MBLS1012AL................................................................................................................ 33

Table 39: Acronyms ............................................................................................................................................................................................ 35

Table 40: Further applicable documents ..................................................................................................................................................... 37

ILLUSTRATION DIRECTORY

Illustration 1: Block diagram MBLS1012AL.............................................................................................................................................................4

Illustration 2: Block diagram TQMLS1012AL..........................................................................................................................................................6

Illustration 3: Block diagram protective circuit.....................................................................................................................................................7

Illustration 4: Positon of protective circuit .............................................................................................................................................................7

Illustration 5: Block diagram Debug UART1...........................................................................................................................................................9

Illustration 6: Position of eMMC.................................................................................................................................................................................9

Illustration 7: Block diagram Ethernet Link ......................................................................................................................................................... 10

Illustration 8: Position of Gigabit Ethernet X23 (Link)...................................................................................................................................... 10

Illustration 9: Position of Gigabit Ethernet X12, X13 (Switch) ....................................................................................................................... 11

Illustration 10: Block diagram I2C bus...................................................................................................................................................................... 12

Illustration 11: Block diagram JTAG ......................................................................................................................................................................... 13

Illustration 12: Position of JTAG header X18 ......................................................................................................................................................... 14

Illustration 13: Block diagram Mini PCIe................................................................................................................................................................. 15

Illustration 14: Position of Mini PCIe socket X4 .................................................................................................................................................... 16

Illustration 15: Position of backup battery X7....................................................................................................................................................... 17

Illustration 16: Position of SATA (M.2) connector X10........................................................................................................................................ 17

Illustration 17: Block diagram SD card .................................................................................................................................................................... 18

Illustration 18: Position of microSD card socket X9 ............................................................................................................................................ 18

Illustration 19: Block diagram USB 3.0..................................................................................................................................................................... 19

Illustration 20: Position of USB 3.0 stacked socket X6........................................................................................................................................ 19

Illustration 21: Position of WLAN X3 ........................................................................................................................................................................ 20

Illustration 22: Reset structure................................................................................................................................................................................... 21

Illustration 23: Position of Reset LED ....................................................................................................................................................................... 22

Illustration 24: Position of DIP switch S1................................................................................................................................................................ 23

Illustration 25: Position of Port-Expander .............................................................................................................................................................. 25

Illustration 26: Position of header X22.................................................................................................................................................................... 27

Illustration 27: Position of Status-LEDs ................................................................................................................................................................... 28

Illustration 28: Block diagram push buttons ......................................................................................................................................................... 29

Illustration 29: Position of push buttons ................................................................................................................................................................ 29

Illustration 30: Position of temperature sensor LM75A ..................................................................................................................................... 30

Illustration 31: TQMLS1012AL dimensions............................................................................................................................................................ 31

Illustration 32: MBLS1012AL dimensions............................................................................................................................................................... 31

Illustration 33: MBLS1012AL component placement top................................................................................................................................. 32

Illustration 34: MBLS1012AL component placement bottom......................................................................................................................... 32

REVISION HISTORY

Rev. Date Name Pos. Modification

0001 29.04.2019 Petz First issue

ABOUT THIS MANUAL

1.1

This Preliminary User's Manual may not be copied, reproduced, translated, changed or distributed, completely or partially in

electronic, machine readable, or in any other form without the written consent of TQ-Systems GmbH.

The drivers and utilities for the components used as well as the BIOS are subject to the copyrights of the respective

manufacturers. The licence conditions of the respective manufacturer are to be adhered to.

Bootloader-licence expenses are paid by TQ-Systems GmbH and are included in the price.

Licence expenses for the operating system and applications are not taken into consideration and must be calculated / declared

separately.

1.2

Registered trademarks

TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original

or license-free graphics and texts.

All brand names and trademarks mentioned in this Preliminary User's Manual, including those protected by a third party, unless

specified otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the

present registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by a

third party.

1.3

Disclaimer

TQ-Systems GmbH does not guarantee that the information in this Preliminary User's Manual is up-to-date, correct, complete or

of good quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against TQ-

Systems GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information

given in this Preliminary User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there

is no proven intentional or negligent fault of TQ-Systems GmbH.

TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this Preliminary User's Manual or parts of it

without special notification.

Important Notice:

Before using the Starterkit MBLS1012AL or parts of the MBLS1012AL schematics, you must evaluate it and determine if it is

suitable for your intended application. You assume all risks and liability associated with such use. TQ-Systems GmbH makes no

other warranties including, but not limited to, any implied warranty of merchantability or fitness for a particular purpose. Except

where prohibited by law, TQ-Systems GmbH will not be liable for any indirect, special, incidental or consequential loss or damage

arising from the usage of the Starterkit MBLS1012AL or schematics used, regardless of the legal theory asserted.

1.4

Imprint

TQ-Systems GmbH

Gut Delling, Mühlstraße 2

D-82229 Seefeld

Tel: +49 8153 9308–0

Fax: +49 8153 9308–4223

E-Mail: Info@TQ-Group

Web: TQ-Group

1.5

Tips on safety

Improper or incorrect handling of the product can substantially reduce its life span.

1.6

Symbols and typographic conventions

Table 1: Terms and Conventions

Symbol Meaning

This symbol represents the handling of electrostatic-sensitive modules and / or components. These

components are often damaged / destroyed by the transmission of a voltage higher than about 50 V.

A human body usually only experiences electrostatic discharges above approximately 3,000 V.

This symbol indicates the possible use of voltages higher than 24 V.

Please note the relevant statutory regulations in this regard.

Non-compliance with these regulations can lead to serious damage to your health and also cause

damage / destruction of the component.

This symbol indicates a possible source of danger. Acting against the procedure described can lead to

possible damage to your health and / or cause damage / destruction of the material used.

This symbol represents important details or aspects for working with TQ-products.

Command

A font with fixed-width is used to denote commands, file names, or menu items.

1.7

Handling and ESD tips

General handling of your TQ-products

The TQ-product may only be used and serviced by certified personnel who have taken note of the

information, the safety regulations in this document and all related rules and regulations.

A general rule is: do not touch the TQ-product during operation. This is especially important when

switching on, changing jumper settings or connecting other devices without ensuring beforehand

that the power supply of the system has been switched off.

Violation of this guideline may result in damage / destruction of the MBLS1012AL and be dangerous

to your health.

Improper handling of your TQ-product would render the guarantee invalid.

Proper ESD handling

The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).

Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-

product in an ESD-safe environment. Especially when you switch modules on, change jumper settings,

or connect other devices.

1.8

Naming of signals

A hash mark (#) at the end of the signal name indicates a low-active signal.

Example: RESET#

If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked with

a hash mark and shown at the end.

Example: C / D#

If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring.

The identification of the individual functions follows the above conventions.

Example: WE2# / OE#

1.9

Further applicable documents / presumed knowledge

•

Specifications and manual of the modules used:

These documents describe the service, functionality and special characteristics of the module used (incl. BIOS).

•

Specifications of the components used:

The manufacturer's specifications of the components used, for example CompactFlash cards, are to be taken note of.

They contain, if applicable, additional information that must be taken note of for safe and reliable operation.

These documents are stored at TQ-Systems GmbH.

•

Chip errata:

It is the user's responsibility to make sure all errata published by the manufacturer of each component are taken note of.

The manufacturer’s advice should be followed.

•

Software behaviour:

No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.

•

General expertise:

Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.

The following documents are required to fully comprehend the following contents:

•MBLS1012AL circuit diagram

•TQMLS1012AL User’s Manual

•LS1012A Data Sheet

•U-Boot documentation: www.denx.de/wiki/U-Boot/Documentation

•PTXdist documentation: www.ptxdist.de

•TQ-Support Wiki: support.tq-group.com/doku.php?id=en:arm:TQMLS1012AL

BRIEF DESCRIPTION

This User's Manual describes the hardware of the MBLS1012AL from revision 0200.

The MBLS1012AL is designed as a carrier board for the TQMLS1012AL.

All TQMLS1012AL interfaces, which can be used, are available on the MBLS1012AL. Thus the features of the NXP CPU LS1012A

can be evaluated and software development for a TQMLS1012AL-based project can be started directly.

The MBLS1012AL supports all LS1012A-based TQ-Modules with the NXP CPUs i.MX6UL (G1, G2, G3) and i.MX6ULL (Y0, Y1, Y2).

TECHNICAL DATA

3.1

System architecture and functionality

3.1.1 Block diagram MBLS1012AL

MBLS1012AL

TQMLS1012AL

USB Hub

TUSB8041

2×USB 3.0

Mini PCIe

PCI WLAN

module

USB 3.0

Ethernet

1 Gbit

PHY

DP83867

SerDes A

4×Ethernet

1 Gbit

Switch

KSZ9897

SGMII

SerDes D SATA / M.2

SerDes B PCIe

GPIO GPIO

GPIO

SD card /

eMMC eSDHC

eSDHC1

UART

USB debug

JTAG

USB 3.0

USB 2.0

RGMII

„Link“

„Switch“

JTAG

3 Push

buttons

Reset

push button

Boot Mode

(DIP switches) Status LEDs

100 mil header

Power supply

3.3 V / 5 V

Power supply

1.1 V / 1.5 V

Power supply

2.5 V

Power supply

1.0 V

Power IN

(DC socket)

Input

protection

Temperature

sensor

GPIO Expander

GPIO

I2C

TAMPER

UART

Power supply

1.8 V

Power supply

1.2 V

SIM card

I2C

Kinetis

MK20

Periphery

2 ×LED,

Reset

signals,

Enable

signals Reset

signals,

GPIO

FTDI

USB2UART

USB debug

Illustration 1: Block diagram MBLS1012AL

3.1.2 Functionality and interfaces

Core of the system is the soldered processor module TQMLS1012AL with an ARM Cortex A53 based NXP Layerscape series CPU

LS1012A. In addition to the standard communication interfaces such as USB, Ethernet, etc., more TQMLS1012AL signals are

routed to a 100 mil pin header on the MBLS1012AL.

The MBLS1012AL provides the following interfaces and functions:

Table 2: Overview interfaces

Interface Qty. LS1012A interface Remark

Ethernet 1000 Mbits 1 SGMII (SerDes-Lane A, MAC1) Gigabit PHY DP83867

Ethernet 1000 Mbits 4 RGMII (MAC2) 5-fold Gigabit switch KSZ9897

SATA 1 SATA (SerDes-Lane D) Supply and mounting for M.2 SSD

Mini PCIe 1 PCIe (SerDes-Lane B)

USB 2.0 from TUSB8041 With external SIM card slot

USB 3.0 4 USB 3.0 from TUSB8041

Hub TUSB8041:

1x stacked USB Type A (USB 3.0)

1x WLAN module (USB 2.0)

1x Mini PCIe (USB 2.0)

WLAN 1 USB 2.0 from TUSB8041 As Mini PCIe socket

eMMC11 eSDHC1

On-board 4-bit JEDEC 4.5

5.0 eMMC compatible

Optional instead SD card

SD card 1 eSDHC1 Optional instead eMMC

GPIO (native, 1.8 V) 4 GPIO1 GPIO1_25 u. GPIO1_26 with Pull-Up and Pull-Down at DIP switch

GPIO (Port-Expander, 3.3 V) 3 – Provided via GPIO-Expander, control via I2C_3V3

Debug 1 UART 3.3V UART, switchable between FTDI-USB2UART/pin header and

OpenSDA (USB) via DIP switch

JTAG 1 JTAG 10-pin header and over OpenSDA via USB

I2C 1 I2C1_3V3 On pin header

Table 3: Overview Diagnostic and User Interfaces

Interface Qty. Device Remark

Status LEDs

6 LED green

•24 V

•5 V

•3.3 V

•3.3 V PCIE

•3.3 V WLAN

•2.5 V

3 LED green Mini PCIe, WLAN, SATA (M.2)

1 LED green GPIO LED at Port-Expander

1 LED green GPIO LED at Port-Expander with light guide

1 LED red Reset LED with light guide

Temperature sensor 1 – Digital I2C temperature sensor

Reset button 1 Push button CPU-/MBLS1012AL-Reset

User push button 3 Push button GPIO push button at Port-Expander

Boot-Mode configuration 1 DIP switch See chapter 4.4

JTAG 1 10-pin, 100 mil header –

1: eMMC functionality prepared. Currently not supported.

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