Tq-systems Mba8mpxl User manual

MBa8MPxL

User's Manual

MBa8MPxL UM 0100

04.08.2022

TABLE OF CONTENTS

1. ABOUT THIS MANUAL......................................................................................................................................................................................1

1.1 Copyright and license expenses.........................................................................................................................................1

1.2 Registered trademarks...........................................................................................................................................................1

1.3 Disclaimer...................................................................................................................................................................................1

1.4 Imprint.........................................................................................................................................................................................1

1.5 Tips on safety ............................................................................................................................................................................2

1.6 Symbols and typographic conventions ...........................................................................................................................2

1.7 Handling and ESD tips ...........................................................................................................................................................2

1.8 Naming of signals....................................................................................................................................................................3

1.9 Further applicable documents / presumed knowledge.............................................................................................3

2. BRIEF DESCRIPTION ..........................................................................................................................................................................................4

2.1 MBa8MPxL block diagram ....................................................................................................................................................4

2.2MBa8MPxL interfaces, overview.........................................................................................................................................5

2.3 MBa8MPxL interfaces, location...........................................................................................................................................6

3. ELECTRONICS......................................................................................................................................................................................................8

3.1 MBa8MPxL functional groups .............................................................................................................................................8

3.1.1 TQMa8MPxL overview.....................................................................................................................................................................................8

3.1.2 TQMa8MPxL pinout..........................................................................................................................................................................................8

3.1.3 I2C devices, address mapping.......................................................................................................................................................................9

3.1.4 RTC backup.......................................................................................................................................................................................................10

3.1.5 Temperature sensor ......................................................................................................................................................................................10

3.1.6 Fan .......................................................................................................................................................................................................................10

3.1.7 Reset....................................................................................................................................................................................................................11

3.2 Power supply..........................................................................................................................................................................12

3.2.1 Protective circuitry.........................................................................................................................................................................................12

3.3Communication interfaces................................................................................................................................................13

3.3.1 Ethernet 1000 Base-T (RGMII) ....................................................................................................................................................................13

3.3.2 SD card interface ............................................................................................................................................................................................14

3.3.3 USB 3.0 Hub......................................................................................................................................................................................................15

3.3.4 USB 3.0 OTG......................................................................................................................................................................................................15

3.3.5 PCIe M.2 .............................................................................................................................................................................................................16

3.3.6 Debug UART.....................................................................................................................................................................................................17

3.3.7 MIPI DSI / DisplayPort...................................................................................................................................................................................18

3.3.8 MIPI CSI ..............................................................................................................................................................................................................19

3.3.9 LVDS....................................................................................................................................................................................................................20

3.3.10 HDMI...................................................................................................................................................................................................................21

3.3.11 CAN FD...............................................................................................................................................................................................................22

3.3.12 Audio ..................................................................................................................................................................................................................23

3.3.13 ECSPI ...................................................................................................................................................................................................................24

3.3.14 SPDIF...................................................................................................................................................................................................................24

3.3.15 GPT ......................................................................................................................................................................................................................24

3.3.16 PWM....................................................................................................................................................................................................................24

3.3.17 CCM.....................................................................................................................................................................................................................24

3.3.18 TSE chip..............................................................................................................................................................................................................24

3.3.19 IO extension .....................................................................................................................................................................................................25

3.3.20 Pin header.........................................................................................................................................................................................................26

3.4 Diagnostic and user interfaces.........................................................................................................................................28

3.4.1 Boot Mode configuration............................................................................................................................................................................28

3.4.2 Push buttons....................................................................................................................................................................................................28

3.4.3 Reset button.....................................................................................................................................................................................................28

3.4.4 Status LEDs .......................................................................................................................................................................................................29

3.4.5 GPIO ....................................................................................................................................................................................................................29

3.4.6 JTAG®..................................................................................................................................................................................................................30

4. SOFTWARE........................................................................................................................................................................................................30

5. MECHANICS......................................................................................................................................................................................................31

5.1 MBa8MPxL dimensions.......................................................................................................................................................31

5.2 Embedding in the overall system....................................................................................................................................31

5.3 Housing....................................................................................................................................................................................31

5.4 Thermal management ........................................................................................................................................................31

5.5 Assembly .................................................................................................................................................................................32

6. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS ............................................................................................................33

6.1 EMC............................................................................................................................................................................................33

6.2 ESD.............................................................................................................................................................................................33

6.3 Operational safety and personal security.....................................................................................................................33

7. CLIMATIC AND OPERATIONAL CONDITIONS .......................................................................................................................................33

7.1 Protection against external effects.................................................................................................................................33

7.2 Reliability and service life...................................................................................................................................................33

8. ENVIRONMENT PROTECTION.....................................................................................................................................................................34

8.1 RoHS..........................................................................................................................................................................................34

8.2 WEEE®.......................................................................................................................................................................................34

8.3 REACH®.....................................................................................................................................................................................34

8.4 EuP.............................................................................................................................................................................................34

8.5 Packaging................................................................................................................................................................................34

8.6 Batteries ...................................................................................................................................................................................34

8.6.1 General notes...................................................................................................................................................................................................34

8.6.2 Lithium batteries ............................................................................................................................................................................................34

8.7 Other entries...........................................................................................................................................................................34

9. APPENDIX..........................................................................................................................................................................................................35

9.1 Acronyms and definitions..................................................................................................................................................35

9.2 References...............................................................................................................................................................................37

TABLE DIRECTORY

Table 1: Terms and conventions ..................................................................................................................................................................................2

Table 2: Data interfaces ...................................................................................................................................................................................................5

Table 3: Diagnostic and user interfaces.....................................................................................................................................................................5

Table 4: I2C devices, address mapping on TQMa8MPxL and MBa8MPxL......................................................................................................9

Table 5: Temperature sensor SE97BTP, D1............................................................................................................................................................10

Table 6: Pinout fan connector, X24 ..........................................................................................................................................................................10

Table 7: Reset signals.....................................................................................................................................................................................................11

Table 8: Pinout RJ45 Ethernet connector, X66 .....................................................................................................................................................13

Table 9: Pinout microSD card, X42 ...........................................................................................................................................................................14

Table 10: Pinout SIM card connector, X46................................................................................................................................................................16

Table 11: Pinout M.2, X48...............................................................................................................................................................................................17

Table 12: Pinout DisplayPort, X65 ...............................................................................................................................................................................18

Table 13: Pinout MIPI CSI, X57 ......................................................................................................................................................................................19

Table 14: Pinout LVDS data, X11..................................................................................................................................................................................20

Table 15: Pinout LVDS control, X7...............................................................................................................................................................................20

Table 16: Pinout HDMI connector, X44 .....................................................................................................................................................................21

Table 17: Pinout CAN FD connectors, X18, X19......................................................................................................................................................22

Table 18: Pinout audio connectors, X15, X16, X17................................................................................................................................................23

Table 19: Pinout IO extension connector, X555 .....................................................................................................................................................25

Table 20: Current load at pin headers........................................................................................................................................................................26

Table 21: Signals with IO functionality ......................................................................................................................................................................26

Table 22: Pinout header X61 .........................................................................................................................................................................................27

Table 23: Pinout header X63 .........................................................................................................................................................................................27

Table 25: Boot Source options TQMa8MPxL ...........................................................................................................................................................28

Table 26: Status LEDs .......................................................................................................................................................................................................29

Table 27: Pinout JTAG®pin header, X22...................................................................................................................................................................30

Table 28: Labels on MBa8MPxL....................................................................................................................................................................................32

Table 29: Climatic and operational conditions MBa8MPxL ...............................................................................................................................33

Table 30: Acronyms ..........................................................................................................................................................................................................35

Table 31: Further applicable documents..................................................................................................................................................................37

FIGURE DIRECTORY

Figure 1: Block diagram MBa8MPxL .............................................................................................................................................................................4

Figure 2: MBa8MPxL interfaces top ..............................................................................................................................................................................6

Figure 3: MBa8MPxL interfaces bottom ......................................................................................................................................................................7

Figure 4: Block diagram TQMa8MPxL ..........................................................................................................................................................................8

Figure 5: Block diagram I2C bus......................................................................................................................................................................................9

Figure 6: Block diagram MBa8MPxL Reset structure ...........................................................................................................................................11

Figure 7: Block diagram power supply MBa8MPxL..............................................................................................................................................12

Figure 8: MBa8MPxL protective circuit .....................................................................................................................................................................12

Figure 9: Block diagram Ethernet 1000 Base-T ......................................................................................................................................................13

Figure 10: Block diagram SD card interface, MBa8MPxL ......................................................................................................................................14

Figure 11: Block diagram USB 3.0 Hub........................................................................................................................................................................15

Figure 12: Block diagram USB 3.0 OTG........................................................................................................................................................................15

Figure 13: Block diagram PCIe M.2 ...............................................................................................................................................................................16

Figure 14: Block diagram UARTs....................................................................................................................................................................................17

Figure 15: Block diagram DisplayPort..........................................................................................................................................................................18

Figure 16: Block diagram MIPI CSI.................................................................................................................................................................................19

Figure 17: Block diagram LVDS ......................................................................................................................................................................................20

Figure 18: Block diagram HDMI .....................................................................................................................................................................................21

Figure 19: Block diagram CAN FD interface ..............................................................................................................................................................22

Figure 20: Block diagram audio interface ..................................................................................................................................................................23

Figure 21: Block diagram IO extension........................................................................................................................................................................25

Figure 22: Block diagram pushbuttons.......................................................................................................................................................................28

Figure 23: Block diagram JTAG.......................................................................................................................................................................................30

Figure 24: MBa8MPxL dimensions................................................................................................................................................................................31

Figure 25: MBa8MPxL component placement top.................................................................................................................................................32

Figure 26: MBa8MPxL component placement bot.................................................................................................................................................32

REVISION HISTORY

Rev. Date Name Pos. Modification

0001 06.03.2021 Petz First edition

0002 16.03.2021 Petz

All

Figure 1

Table 2

Table 22, Table 23, Table 24

5.1

Figure 24

Non-functional changes, expressions, phrases

Updated

“3.3 V” for X555 removed

“Level” and “Dir.” for 1.8 V, 3.3 V, and 5 V added

Weight corrected (147 grams 143 grams)

Corrected

0100 04.08.2022 Kreuzer All Update to board revision 02xx and 03xx

1. ABOUT THIS MANUAL

1.1 Copyright and license expenses

This Preliminary User's Manual may not be copied, reproduced, translated, changed or distributed, completely or partially in

electronic, machine readable, or in any other form without the written consent of TQ-Systems GmbH.

The drivers and utilities for the components used as well as the BIOS are subject to the copyrights of the respective

manufacturers. The licence conditions of the respective manufacturer are to be adhered to.

Bootloader-licence expenses are paid by TQ-Systems GmbH and are included in the price.

Licence expenses for the operating system and applications are not taken into consideration and must be calculated / declared

separately.

1.2 Registered trademarks

TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original

or license-free graphics and texts.

All brand names and trademarks mentioned in this Preliminary User's Manual, including those protected by a third party, unless

specified otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the

present registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by a

third party.

1.3 Disclaimer

TQ-Systems GmbH does not guarantee that the information in this Preliminary User's Manual is up-to-date, correct, complete or

of good quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against TQ-

Systems GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information

given in this Preliminary User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there

is no proven intentional or negligent fault of TQ-Systems GmbH.

TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this Preliminary User's Manual or parts of it

without special notification.

Important Notice:

Before using the MBa8MPxL or parts of the MBa8MPxL schematics, you must evaluate it and determine if it is suitable for your

intended application. You assume all risks and liability associated with such use. TQ-Systems GmbH makes no other warranties

including, but not limited to, any implied warranty of merchantability or fitness for a particular purpose. Except where prohibited

by law, TQ-Systems GmbH will not be liable for any indirect, special, incidental or consequential loss or damage arising from the

usage of the MBa8MPxL or schematics used, regardless of the legal theory asserted.

1.4 Imprint

TQ-Systems GmbH

Gut Delling, Mühlstraße 2

D-82229 Seefeld

Tel: +49 8153 9308–0

Fax: +49 8153 9308–4223

E-Mail: Info@TQ-Group

Web: TQ-Group

1.5 Tips on safety

Improper or incorrect handling of the product can substantially reduce its life span.

1.6 Symbols and typographic conventions

Table 1: Terms and conventions

Symbol Meaning

This symbol represents the handling of electrostatic-sensitive modules and / or components. These

components are often damaged / destroyed by the transmission of a voltage higher than about 50 V.

A human body usually only experiences electrostatic discharges above approximately 3,000 V.

This symbol indicates the possible use of voltages higher than 24 V.

Please note the relevant statutory regulations in this regard.

Non-compliance with these regulations can lead to serious damage to your health and cause damage

/ destruction of the component.

This symbol indicates a possible source of danger. Acting against the procedure described can lead to

possible damage to your health and / or cause damage / destruction of the material used.

This symbol represents important details or aspects for working with TQ-products.

Command

A font with fixed-width is used to denote commands, file names, or menu items.

1.7 Handling and ESD tips

General handling of your TQ-products

The TQ-product may only be used and serviced by certified personnel who have taken note of the

information, the safety regulations in this document and all related rules and regulations.

A general rule is not to touch the TQ-product during operation. This is especially important when

switching on, changing jumper settings or connecting other devices without ensuring beforehand

that the power supply of the system has been switched off.

Violation of this guideline may result in damage / destruction of the MBa8MPxL and be dangerous

to your health.

Improper handling of your TQ-product would render the guarantee invalid.

Proper ESD handling

The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).

Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-

product in an ESD-safe environment. Especially when you switch modules on, change jumper settings,

or connect other devices.

1.8 Naming of signals

A hash mark (#) at the end of the signal name indicates a low-active signal.

Example: RESET#

If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked with

a hash mark and shown at the end.

Example: C / D#

If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring.

The identification of the individual functions follows the above conventions.

Example: WE2# / OE#

1.9 Further applicable documents / presumed knowledge

•Specifications and manual of the modules used:

These documents describe the service, functionality and special characteristics of the module used (incl. BIOS).

•Specifications of the components used:

The manufacturer’s specifications of the components used, for example CompactFlash cards, are to be taken note of.

They contain, if applicable, additional information that must be taken note of for safe and reliable operation.

These documents are stored at TQ-Systems GmbH.

•Chip errata:

It is the user’s responsibility to make sure all errata published by the manufacturer of each component are taken note of.

The manufacturer’s advice should be followed.

•Software behaviour:

No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.

•General expertise:

Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.

The following documents are required for full comprehension of this Preliminary User's Manual:

•MBa8MPxL schematics

•TQMa8MPxL Preliminary User's Manual

•i.MX 8M Plus Data Sheet

•i.MX 8M Plus Reference Manual

•U-Boot documentation: www.denx.de/wiki/U-Boot/Documentation

•Yocto documentation: www.yoctoproject.org/docs/

•TQ-Support Wiki: https://support.tq-group.com/en/layerscape/tqma8mpxl

2. BRIEF DESCRIPTION

This User's Manual describes the hardware of the MBa8MPxL as of revision 02xx and 03xx.

The MBa8MPxL is designed as a carrier board for the TQMa8MPxL. The TQMa8MPxL is directly soldered on the MBa8MPxL.

Core of the MBa8MPxL is the TQMa8MPxL with an NXP i.MX 8M Plus CPU based on a Dual or Quad Cortex®-A53.

The TQMa8MPxL connects all peripheral components. In addition to the standard communication interfaces such as USB,

Ethernet, SD card, etc., most other available TQMa8MPxL signals are routed on 50 mil pin headers on the MBa8MPxL.

CPU features and interface can be evaluated, software development for a TQMa8MPxL-based project can start immediately.

Currently four i.MX 8M Plus derivatives are supported:

1) i.MX 8M Plus Dual (Dual Cortex®-A53)

2) i.MX 8M Plus Quad 4 Lite (Quad Cortex®-A53)

3) i.MX 8M Plus Quad 6 Video (Quad Cortex®-A53)

4) i.MX 8M Plus Quad 8 ML/AI (Quad Cortex®-A53)

2.1 MBa8MPxL block diagram

TQMa8MPxL

(LGA-Modul)

Ethernet

10/100/1k

ENET TSN

SD-Card uSDHC2

SDHC

MIPI DSI

MIPI CSI1

MIPI-CSI1

I2C

SAI #3

USB OTG

Boot

RAM

Power

Supply

PCIe M2-

Slot

RGMII

PCIe Data

Boot

Config

USB Hub

USB3.0 #2 USB

2x USB3.0

Touch

(LVDS)

Temp.

Sensor I2C

Button/

LED/ FAN GPIO

3x 3,5 mm

jack

Audio

Codec

DSI

MIPI-CSI

GPIO

V_5V_IN

DSI-to-eDP

Converter

Display-

port

Gigabit ETH

PHY

NOR Flash

E-MMC

HDMI

USB

MIPI CSI2

MIPI-CSI

LVDS

UART

50 mil

headers

MIPI-CSI2

Mirco-USB

USB3.0 #1

PCIe

HDMI

LVDS

CAN

ENET QOS

CAN FD

CAN

Ethernet

10/100/1k

RGMII

Gigabit ETH

PHY

2x CAN

Transceiver

Bustrenner

& FTDI-Chip

Micro-SIM

PCIe

RefClock

HDMI signal

conditioning

HDMI

UART

ECSPI

Module

Power Rails

3,5 mm

IO conn.

(Analog In,

Digital In,

Digital Out)

Figure 1: Block diagram MBa8MPxL

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