TQ-Systems MBa8MPxL User manual
MBa8MPxL
User's Manual
MBa8MPxL UM 0100
04.08.2022
User's Manual l MBa8MPxL UM 0100 l © 2022, TQ-Systems GmbH Page i
TABLE OF CONTENTS
1. ABOUT THIS MANUAL......................................................................................................................................................................................1
1.1 Copyright and license expenses.........................................................................................................................................1
1.2 Registered trademarks...........................................................................................................................................................1
1.3 Disclaimer...................................................................................................................................................................................1
1.4 Imprint.........................................................................................................................................................................................1
1.5 Tips on safety ............................................................................................................................................................................2
1.6 Symbols and typographic conventions ...........................................................................................................................2
1.7 Handling and ESD tips ...........................................................................................................................................................2
1.8 Naming of signals....................................................................................................................................................................3
1.9 Further applicable documents / presumed knowledge.............................................................................................3
2. BRIEF DESCRIPTION ..........................................................................................................................................................................................4
2.1 MBa8MPxL block diagram ....................................................................................................................................................4
2.2MBa8MPxL interfaces, overview.........................................................................................................................................5
2.3 MBa8MPxL interfaces, location...........................................................................................................................................6
3. ELECTRONICS......................................................................................................................................................................................................8
3.1 MBa8MPxL functional groups .............................................................................................................................................8
3.1.1 TQMa8MPxL overview.....................................................................................................................................................................................8
3.1.2 TQMa8MPxL pinout..........................................................................................................................................................................................8
3.1.3 I2C devices, address mapping.......................................................................................................................................................................9
3.1.4 RTC backup.......................................................................................................................................................................................................10
3.1.5 Temperature sensor ......................................................................................................................................................................................10
3.1.6 Fan .......................................................................................................................................................................................................................10
3.1.7 Reset....................................................................................................................................................................................................................11
3.2 Power supply..........................................................................................................................................................................12
3.2.1 Protective circuitry.........................................................................................................................................................................................12
3.3Communication interfaces................................................................................................................................................13
3.3.1 Ethernet 1000 Base-T (RGMII) ....................................................................................................................................................................13
3.3.2 SD card interface ............................................................................................................................................................................................14
3.3.3 USB 3.0 Hub......................................................................................................................................................................................................15
3.3.4 USB 3.0 OTG......................................................................................................................................................................................................15
3.3.5 PCIe M.2 .............................................................................................................................................................................................................16
3.3.6 Debug UART.....................................................................................................................................................................................................17
3.3.7 MIPI DSI / DisplayPort...................................................................................................................................................................................18
3.3.8 MIPI CSI ..............................................................................................................................................................................................................19
3.3.9 LVDS....................................................................................................................................................................................................................20
3.3.10 HDMI...................................................................................................................................................................................................................21
3.3.11 CAN FD...............................................................................................................................................................................................................22
3.3.12 Audio ..................................................................................................................................................................................................................23
3.3.13 ECSPI ...................................................................................................................................................................................................................24
3.3.14 SPDIF...................................................................................................................................................................................................................24
3.3.15 GPT ......................................................................................................................................................................................................................24
3.3.16 PWM....................................................................................................................................................................................................................24
3.3.17 CCM.....................................................................................................................................................................................................................24
3.3.18 TSE chip..............................................................................................................................................................................................................24
3.3.19 IO extension .....................................................................................................................................................................................................25
3.3.20 Pin header.........................................................................................................................................................................................................26
3.4 Diagnostic and user interfaces.........................................................................................................................................28
3.4.1 Boot Mode configuration............................................................................................................................................................................28
3.4.2 Push buttons....................................................................................................................................................................................................28
3.4.3 Reset button.....................................................................................................................................................................................................28
3.4.4 Status LEDs .......................................................................................................................................................................................................29
3.4.5 GPIO ....................................................................................................................................................................................................................29
3.4.6 JTAG®..................................................................................................................................................................................................................30
4. SOFTWARE........................................................................................................................................................................................................30
5. MECHANICS......................................................................................................................................................................................................31
5.1 MBa8MPxL dimensions.......................................................................................................................................................31
5.2 Embedding in the overall system....................................................................................................................................31
5.3 Housing....................................................................................................................................................................................31
5.4 Thermal management ........................................................................................................................................................31
User's Manual l MBa8MPxL UM 0100 l © 2022, TQ-Systems GmbH Page ii
5.5 Assembly .................................................................................................................................................................................32
6. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS ............................................................................................................33
6.1 EMC............................................................................................................................................................................................33
6.2 ESD.............................................................................................................................................................................................33
6.3 Operational safety and personal security.....................................................................................................................33
7. CLIMATIC AND OPERATIONAL CONDITIONS .......................................................................................................................................33
7.1 Protection against external effects.................................................................................................................................33
7.2 Reliability and service life...................................................................................................................................................33
8. ENVIRONMENT PROTECTION.....................................................................................................................................................................34
8.1 RoHS..........................................................................................................................................................................................34
8.2 WEEE®.......................................................................................................................................................................................34
8.3 REACH®.....................................................................................................................................................................................34
8.4 EuP.............................................................................................................................................................................................34
8.5 Packaging................................................................................................................................................................................34
8.6 Batteries ...................................................................................................................................................................................34
8.6.1 General notes...................................................................................................................................................................................................34
8.6.2 Lithium batteries ............................................................................................................................................................................................34
8.7 Other entries...........................................................................................................................................................................34
9. APPENDIX..........................................................................................................................................................................................................35
9.1 Acronyms and definitions..................................................................................................................................................35
9.2 References...............................................................................................................................................................................37
User's Manual l MBa8MPxL UM 0100 l © 2022, TQ-Systems GmbH Page iii
TABLE DIRECTORY
Table 1: Terms and conventions ..................................................................................................................................................................................2
Table 2: Data interfaces ...................................................................................................................................................................................................5
Table 3: Diagnostic and user interfaces.....................................................................................................................................................................5
Table 4: I2C devices, address mapping on TQMa8MPxL and MBa8MPxL......................................................................................................9
Table 5: Temperature sensor SE97BTP, D1............................................................................................................................................................10
Table 6: Pinout fan connector, X24 ..........................................................................................................................................................................10
Table 7: Reset signals.....................................................................................................................................................................................................11
Table 8: Pinout RJ45 Ethernet connector, X66 .....................................................................................................................................................13
Table 9: Pinout microSD card, X42 ...........................................................................................................................................................................14
Table 10: Pinout SIM card connector, X46................................................................................................................................................................16
Table 11: Pinout M.2, X48...............................................................................................................................................................................................17
Table 12: Pinout DisplayPort, X65 ...............................................................................................................................................................................18
Table 13: Pinout MIPI CSI, X57 ......................................................................................................................................................................................19
Table 14: Pinout LVDS data, X11..................................................................................................................................................................................20
Table 15: Pinout LVDS control, X7...............................................................................................................................................................................20
Table 16: Pinout HDMI connector, X44 .....................................................................................................................................................................21
Table 17: Pinout CAN FD connectors, X18, X19......................................................................................................................................................22
Table 18: Pinout audio connectors, X15, X16, X17................................................................................................................................................23
Table 19: Pinout IO extension connector, X555 .....................................................................................................................................................25
Table 20: Current load at pin headers........................................................................................................................................................................26
Table 21: Signals with IO functionality ......................................................................................................................................................................26
Table 22: Pinout header X61 .........................................................................................................................................................................................27
Table 23: Pinout header X63 .........................................................................................................................................................................................27
Table 25: Boot Source options TQMa8MPxL ...........................................................................................................................................................28
Table 26: Status LEDs .......................................................................................................................................................................................................29
Table 27: Pinout JTAG®pin header, X22...................................................................................................................................................................30
Table 28: Labels on MBa8MPxL....................................................................................................................................................................................32
Table 29: Climatic and operational conditions MBa8MPxL ...............................................................................................................................33
Table 30: Acronyms ..........................................................................................................................................................................................................35
Table 31: Further applicable documents..................................................................................................................................................................37
User's Manual l MBa8MPxL UM 0100 l © 2022, TQ-Systems GmbH Page iv
FIGURE DIRECTORY
Figure 1: Block diagram MBa8MPxL .............................................................................................................................................................................4
Figure 2: MBa8MPxL interfaces top ..............................................................................................................................................................................6
Figure 3: MBa8MPxL interfaces bottom ......................................................................................................................................................................7
Figure 4: Block diagram TQMa8MPxL ..........................................................................................................................................................................8
Figure 5: Block diagram I2C bus......................................................................................................................................................................................9
Figure 6: Block diagram MBa8MPxL Reset structure ...........................................................................................................................................11
Figure 7: Block diagram power supply MBa8MPxL..............................................................................................................................................12
Figure 8: MBa8MPxL protective circuit .....................................................................................................................................................................12
Figure 9: Block diagram Ethernet 1000 Base-T ......................................................................................................................................................13
Figure 10: Block diagram SD card interface, MBa8MPxL ......................................................................................................................................14
Figure 11: Block diagram USB 3.0 Hub........................................................................................................................................................................15
Figure 12: Block diagram USB 3.0 OTG........................................................................................................................................................................15
Figure 13: Block diagram PCIe M.2 ...............................................................................................................................................................................16
Figure 14: Block diagram UARTs....................................................................................................................................................................................17
Figure 15: Block diagram DisplayPort..........................................................................................................................................................................18
Figure 16: Block diagram MIPI CSI.................................................................................................................................................................................19
Figure 17: Block diagram LVDS ......................................................................................................................................................................................20
Figure 18: Block diagram HDMI .....................................................................................................................................................................................21
Figure 19: Block diagram CAN FD interface ..............................................................................................................................................................22
Figure 20: Block diagram audio interface ..................................................................................................................................................................23
Figure 21: Block diagram IO extension........................................................................................................................................................................25
Figure 22: Block diagram pushbuttons.......................................................................................................................................................................28
Figure 23: Block diagram JTAG.......................................................................................................................................................................................30
Figure 24: MBa8MPxL dimensions................................................................................................................................................................................31
Figure 25: MBa8MPxL component placement top.................................................................................................................................................32
Figure 26: MBa8MPxL component placement bot.................................................................................................................................................32
User's Manual l MBa8MPxL UM 0100 l © 2022, TQ-Systems GmbH Page v
REVISION HISTORY
Rev. Date Name Pos. Modification
0001 06.03.2021 Petz First edition
0002 16.03.2021 Petz
All
Figure 1
Table 2
Table 22, Table 23, Table 24
5.1
Figure 24
Non-functional changes, expressions, phrases
Updated
“3.3 V” for X555 removed
“Level” and “Dir.” for 1.8 V, 3.3 V, and 5 V added
Weight corrected (147 grams 143 grams)
Corrected
0100 04.08.2022 Kreuzer All Update to board revision 02xx and 03xx
User's Manual l MBa8MPxL UM 0100 l © 2022, TQ-Systems GmbH Page 1
1. ABOUT THIS MANUAL
1.1 Copyright and license expenses
Copyright protected © 2022 by TQ-Systems GmbH.
This Preliminary User's Manual may not be copied, reproduced, translated, changed or distributed, completely or partially in
electronic, machine readable, or in any other form without the written consent of TQ-Systems GmbH.
The drivers and utilities for the components used as well as the BIOS are subject to the copyrights of the respective
manufacturers. The licence conditions of the respective manufacturer are to be adhered to.
Bootloader-licence expenses are paid by TQ-Systems GmbH and are included in the price.
Licence expenses for the operating system and applications are not taken into consideration and must be calculated / declared
separately.
1.2 Registered trademarks
TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original
or license-free graphics and texts.
All brand names and trademarks mentioned in this Preliminary User's Manual, including those protected by a third party, unless
specified otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the
present registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by a
third party.
1.3 Disclaimer
TQ-Systems GmbH does not guarantee that the information in this Preliminary User's Manual is up-to-date, correct, complete or
of good quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against TQ-
Systems GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information
given in this Preliminary User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there
is no proven intentional or negligent fault of TQ-Systems GmbH.
TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this Preliminary User's Manual or parts of it
without special notification.
Important Notice:
Before using the MBa8MPxL or parts of the MBa8MPxL schematics, you must evaluate it and determine if it is suitable for your
intended application. You assume all risks and liability associated with such use. TQ-Systems GmbH makes no other warranties
including, but not limited to, any implied warranty of merchantability or fitness for a particular purpose. Except where prohibited
by law, TQ-Systems GmbH will not be liable for any indirect, special, incidental or consequential loss or damage arising from the
usage of the MBa8MPxL or schematics used, regardless of the legal theory asserted.
1.4 Imprint
TQ-Systems GmbH
Gut Delling, Mühlstraße 2
D-82229 Seefeld
Tel: +49 8153 9308–0
Fax: +49 8153 9308–4223
E-Mail: Info@TQ-Group
Web: TQ-Group
User's Manual l MBa8MPxL UM 0100 l © 2022, TQ-Systems GmbH Page 2
1.5 Tips on safety
Improper or incorrect handling of the product can substantially reduce its life span.
1.6 Symbols and typographic conventions
Table 1: Terms and conventions
Symbol Meaning
This symbol represents the handling of electrostatic-sensitive modules and / or components. These
components are often damaged / destroyed by the transmission of a voltage higher than about 50 V.
A human body usually only experiences electrostatic discharges above approximately 3,000 V.
This symbol indicates the possible use of voltages higher than 24 V.
Please note the relevant statutory regulations in this regard.
Non-compliance with these regulations can lead to serious damage to your health and cause damage
/ destruction of the component.
This symbol indicates a possible source of danger. Acting against the procedure described can lead to
possible damage to your health and / or cause damage / destruction of the material used.
This symbol represents important details or aspects for working with TQ-products.
Command
A font with fixed-width is used to denote commands, file names, or menu items.
1.7 Handling and ESD tips
General handling of your TQ-products
The TQ-product may only be used and serviced by certified personnel who have taken note of the
information, the safety regulations in this document and all related rules and regulations.
A general rule is not to touch the TQ-product during operation. This is especially important when
switching on, changing jumper settings or connecting other devices without ensuring beforehand
that the power supply of the system has been switched off.
Violation of this guideline may result in damage / destruction of the MBa8MPxL and be dangerous
to your health.
Improper handling of your TQ-product would render the guarantee invalid.
Proper ESD handling
The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).
Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-
product in an ESD-safe environment. Especially when you switch modules on, change jumper settings,
or connect other devices.
User's Manual l MBa8MPxL UM 0100 l © 2022, TQ-Systems GmbH Page 3
1.8 Naming of signals
A hash mark (#) at the end of the signal name indicates a low-active signal.
Example: RESET#
If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked with
a hash mark and shown at the end.
Example: C / D#
If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring.
The identification of the individual functions follows the above conventions.
Example: WE2# / OE#
1.9 Further applicable documents / presumed knowledge
•Specifications and manual of the modules used:
These documents describe the service, functionality and special characteristics of the module used (incl. BIOS).
•Specifications of the components used:
The manufacturer’s specifications of the components used, for example CompactFlash cards, are to be taken note of.
They contain, if applicable, additional information that must be taken note of for safe and reliable operation.
These documents are stored at TQ-Systems GmbH.
•Chip errata:
It is the user’s responsibility to make sure all errata published by the manufacturer of each component are taken note of.
The manufacturer’s advice should be followed.
•Software behaviour:
No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.
•General expertise:
Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.
The following documents are required for full comprehension of this Preliminary User's Manual:
•MBa8MPxL schematics
•TQMa8MPxL Preliminary User's Manual
•i.MX 8M Plus Data Sheet
•i.MX 8M Plus Reference Manual
•U-Boot documentation: www.denx.de/wiki/U-Boot/Documentation
•Yocto documentation: www.yoctoproject.org/docs/
•TQ-Support Wiki: https://support.tq-group.com/en/layerscape/tqma8mpxl
User's Manual l MBa8MPxL UM 0100 l © 2022, TQ-Systems GmbH Page 4
2. BRIEF DESCRIPTION
This User's Manual describes the hardware of the MBa8MPxL as of revision 02xx and 03xx.
The MBa8MPxL is designed as a carrier board for the TQMa8MPxL. The TQMa8MPxL is directly soldered on the MBa8MPxL.
Core of the MBa8MPxL is the TQMa8MPxL with an NXP i.MX 8M Plus CPU based on a Dual or Quad Cortex®-A53.
The TQMa8MPxL connects all peripheral components. In addition to the standard communication interfaces such as USB,
Ethernet, SD card, etc., most other available TQMa8MPxL signals are routed on 50 mil pin headers on the MBa8MPxL.
CPU features and interface can be evaluated, software development for a TQMa8MPxL-based project can start immediately.
Currently four i.MX 8M Plus derivatives are supported:
1) i.MX 8M Plus Dual (Dual Cortex®-A53)
2) i.MX 8M Plus Quad 4 Lite (Quad Cortex®-A53)
3) i.MX 8M Plus Quad 6 Video (Quad Cortex®-A53)
4) i.MX 8M Plus Quad 8 ML/AI (Quad Cortex®-A53)
2.1 MBa8MPxL block diagram
TQMa8MPxL
(LGA-Modul)
Ethernet
10/100/1k
ENET TSN
SD-Card uSDHC2
SDHC
MIPI DSI
MIPI CSI1
MIPI-CSI1
I2C
SAI #3
USB OTG
Boot
RAM
Power
Supply
PCIe M2-
Slot
RGMII
PCIe Data
Boot
Config
USB Hub
USB3.0 #2 USB
2x USB3.0
Touch
(LVDS)
Temp.
Sensor I2C
Button/
LED/ FAN GPIO
3x 3,5 mm
jack
Audio
Codec
DSI
MIPI-CSI
GPIO
V_5V_IN
DSI-to-eDP
Converter
Display-
port
Gigabit ETH
PHY
NOR Flash
E-MMC
HDMI
USB
MIPI CSI2
MIPI-CSI
LVDS
LVDS
UART
50 mil
headers
MIPI-CSI2
Mirco-USB
USB3.0 #1
PCIe
HDMI
LVDS
CAN
ENET QOS
CAN FD
CAN
Ethernet
10/100/1k
RGMII
Gigabit ETH
PHY
2x CAN
Transceiver
Bustrenner
& FTDI-Chip
2x
Micro-SIM
PCIe
RefClock
HDMI signal
conditioning
HDMI
UART
ECSPI
ECSPI
Module
Power Rails
3,5 mm
IO conn.
(Analog In,
Digital In,
Digital Out)
Figure 1: Block diagram MBa8MPxL
User's Manual l MBa8MPxL UM 0100 l © 2022, TQ-Systems GmbH Page 5
2.2 MBa8MPxL interfaces, overview
The following interfaces/functions and user interfaces are available on the MBa8MPxL:
Table 2: Data interfaces
Interface Connector Type Remark
Audio X15, X16,
X17 3 × 3.5 mm jack MIC (mono), Line-in (stereo), Line-out (stereo)
CAN FD X18, X19 MC 1,5/ 3-G-3,5 X18: CAN0 | X19: CAN1
eDP / DP X65 DisplayPort DSI-to-DP bridge
Eth 1000 Base-T X66 Double RJ45 Gigabit PHY DP83867 and socket with integrated
transformers
GPIO / ADC X555 DMC 1,5/15-G1F-3,5-LR
P20THR Connected to IO bank, usage up to 24 V (GPIO)
HDMI X44 HDMI –
I2C X61 40-pin, 50 mil pin header 4 × I2C
JTAG X22 10-pin, 50 mil pin header JTAG
LVDS CMD X7 20-pin, DF19G ZIF connector + USB 2.0
LVDS Data X11 30-pin, DF19G ZIF connector
MIPI CSI X57 60-pin, 0.8 mm, TE
Connectivity CSI1 and CSI2
PCIe / M.2 X48 M.2 PCIe + USB 2.0
SIM card X46 SIM card holder SIM card slot
SD card X42 USDHC2 Optional boot source and supply of module
USB 3.0 X36 Stacked Type A USB 3.0 H1, top, USB 3.0 H2, bot
USB 3.0 OTG X29 USB1-Interface at USB Micro-B USB OTG or Serial Download Mode
USB Debug X28 UART3, UART4 Via FTDI chip to micro USB AB socket
The MBa8MPxL provides the following diagnostic and user interfaces:
Table 3: Diagnostic and user interfaces
Interface Reference Component Remark
Status LEDs
1 × Red LED Reset
7 × Green LED Voltages on MBa8MPxL
2 × Green LED General purpose LEDs
3 × Orange LED V_3V3_MOD, V_3V3_SD, V_1V8_MOD
1 × Yellow LED General purpose LED
Temperature sensor D1 1 × SE97BTP Digital I2C temperature sensor
Power / Reset
S7
S8
S9
3 × Pushbutton
Reset
PMIC reset
CPU-ON/OFF
GP button S12, S13 2 × Pushbutton General purpose pushbuttons
Boot-Mode S1 1 × 4-fold DIP switch Boot Device selection
Coin cell X56 1 × battery socket Standard CR2032, RTC buffer
User's Manual l MBa8MPxL UM 0100 l © 2022, TQ-Systems GmbH Page 6
2.3 MBa8MPxL interfaces, location
Figure 2: MBa8MPxL interfaces top
User's Manual l MBa8MPxL UM 0100 l © 2022, TQ-Systems GmbH Page 8
3. ELECTRONICS
3.1 MBa8MPxL functional groups
The following chapters describe the interfaces of the MBa8MPxL in connection with a TQMa8MPxL.
3.1.1 TQMa8MPxL overview
The MBa8MPxL provides all power supplies and configurations required for the operation of the TQMa8MPxL.
The TQMa8MPxL is the central system on the MBa8MPxL. It provides LPDDR4 SDRAM, eMMC, NOR flash, RTC, an EEPROM, power
supply and power management functionality. All TQMa8MPxL internal voltages are derived from the 5 V supply voltage.
All functionally relevant pins of the i.MX 8M Plus are routed to the TQMa8MPxL connectors or LGA pads. This enables to use the
TQMa8MPxL with all the freedom that comes with a customer-specific design-in solution. Further information can be found in
the TQMa8MPxL User’s Manual.
On the MBa8MPxL the standard interfaces like USB, Ethernet, etc., provided by the TQMa8MPxL are routed to industry standard
connectors. All other relevant signals and buses provided by the TQMa8MPxL are routed to 50 mil pin headers on the MBa8MPxL.
The boot behaviour of the TQMa8MPxL can be controlled. The boot mode configuration is set with a DIP switch on the
MBa8MPxL.
i.MX 8M Plus
366 LGA Pads
eMMC 5.1 (optional)
EEPROM (optional)
Temperature sensor / EEPROM
PMIC
NXP PCA9450C
QSPI NOR Flash (optional)
RTC (optional)
LPDDR4 SDRAM
5 V
TSE (optional)
Supervisor
5 V
Figure 4: Block diagram TQMa8MPxL
3.1.2 TQMa8MPxL pinout
All relevant TQMa8MPxL signals are routed to 50 mil pin headers on the MBa8MPxL.
Note: Available interfaces
Depending on the TQMa8MPxL derivative, not all interfaces are available.
More information about available interfaces can be found in the TQMa8MPxL User’s Manual
and pinout tables.
User's Manual l MBa8MPxL UM 0100 l © 2022, TQ-Systems GmbH Page 9
3.1.3 I2C devices, address mapping
The TQMa8MPxL provides four I2C buses. Of these, only I2C6 is provided on a pin header. All other buses are used by different
components on the module or the mainboard. All I2C buses provided by the TQMa8MPxL have a 3.3 V level. In order to be able
to connect 1.8 V components as well, two level converters are used on the MBa8MPxL. One is permanently connected to I2C4,
the second can be varied in its connection, but uses I2C2 by default.
The following block diagram shows the I2C bus structure.
Video
Connectors
TQMa8MPxL
SE97BTP
Header
24LC64T
PCF85063
I2C1
I2C2
I2C6
Temperature
PCIe (M.2)
Level
shifter
PCIe Clock
MIPI_CSI[1..0]_I2C
I2C6
HDMI_I2C
3V3
1V8
HDMI_DDC
AudioCodec
PCA9450
DP Bridge USB Hub
I2C4
Level
shifter
3V3
3V3
HDMI signal
conditioning chip
1V8
NP
N
P
NP
Figure 5: Block diagram I2C bus
The following table shows the addresses used on the TQMa8MPxL and the MBa8MPxL.
Table 4: I2C devices, address mapping on TQMa8MPxL and MBa8MPxL
Location Device Function 7-bit address Remark
TQMa8MPxL
PCA9450 System Controller 0x25 / 010 0101b Should not be altered
PCF85063 RTC 0x51 / 101 0001b Optional
24LC64T EEPROM 0x57 / 101 0111b Optional
SE97BTP
Temperature sensor 0x1B / 001 1011b –
EEPROM 0x33 / 011 0011b R/W access in Protected Mode
0x53 / 101 0011b R/W access in Normal Mode
SE050 Trust Secure Element 0x48 / 100 1000b Optional
MBa8MPxL
TLV320AIC3204 Audio Codec 0x18 / 001 1000b N7
SE97B
Temperature sensor 0x1C / 001 1100b D1
EEPROM 0x34 / 011 0100b D1, R/W access in Protected Mode
0x54 / 101 0100b D1, R/W access in Normal Mode
TUSB8041 USB 3.0 Hub 0x44 / 100 0100b D39, optional
9FGV0441A Clock Generator 0x6A / 110 1010b D47
TC9595XBG MIPI DSI to DP 0x0F / 000 1111b D43
Socket PCIe M.2 (Device dependent) X48
User's Manual l MBa8MPxL UM 0100 l © 2022, TQ-Systems GmbH Page 10
3.1.4 RTC backup
In case of power failure or power down, a lithium battery type CR2032 on the MBa8MPxL supplies the RTC on the TQMa8MPxL,
which can be supplied with 2.1 V to 3.7 V, typical 3.0 V. The TQMa8MPxL features an i.MX 8M Plus-internal RTC or a discrete RTC
PCF85063A. The RTC is supplied in either way.
3.1.5 Temperature sensor
For temperature monitoring on the TQMa8MPxL and the MBa8MPxL, there is one SE97BTP sensor each.
The sensors are connected to I2C1; see Table 4. The I2C address of the sensor on the MBa8MPxL can be adapted by rearranging
0 Ω bridges. When changing the address, care must be taken to avoid address conflicts with existing I2C devices.
The assembly options are documented in the MBa8MPxL schematics.
The temperature sensor D1 is located on the top side of the MBa8MPxL; see Figure 2.
Table 5: Temperature sensor SE97BTP, D1
Manufacturer Device Resolution Accuracy Temperature range
NXP SE97BTP 11 bits
Max. ±1 °C +75 °C to +95 °C
Max. ±2 °C +40 °C to +125 °C
Max. ±3 °C –40 °C to +125 °C
3.1.6 Fan
Depending on the load of the CPU and other module components, it may be necessary to use a fan for active cooling in addition
to the use of a heat sink. A corresponding circuit is provided on the MBa8MPxL.
The RPM signal of the fan is connected to GPT2_CLK, the PWM signal for speed control to PWM3. Both are 3.3 V signals.
The FAN PWR signal for switching the fan is connected to the module as 1.8 V GPIO signal GPIO4_IO27.
Table 6: Pinout fan connector, X24
Pin Signal Remark
1 DGND –
2 V_FAN 12 V via R249 on MBa8MPxL (default), optional 5 V via R250 on MBa8MPxL
3 RPM GPT2_CLK of TQMa8MPxL, 3.3 V
4 PWM PWM3 of TQMa8MPxL, 3.3 V
User's Manual l MBa8MPxL UM 0100 l © 2022, TQ-Systems GmbH Page 11
3.1.7 Reset
The RESET_OUT# signal of the TQMa8MPxL is available on the MBa8MPxL.
A red LED (V59) on the MBa8MPxL indicates a reset condition; see Table 26.
On the MBa8MPxL a partial reset of the TQMa8MPxL is possible, e.g. with signals PMIC_WDOG_IN# and RESET_IN#.
TQMa8MPxL
RESET_IN# Button
IMX_ONOFF
RESET_OUT# System
PMIC_RST#
Button
Button
M7_NMI
PMIC_WDOG# Header
Figure 6: Block diagram MBa8MPxL Reset structure
Attention: RESET_OUT# / PMIC_RST#
Attention: The signal RESET_OUT# is designed as a reset triggering signal.
To feed a reset signal into the system, it is mandatory to use the signal PMIC_RST#.
Table 7: Reset signals
Signal Dir. Source Default Remark
RESET_OUT# O TQMa8MPxL High
•Open drain output; low-active
•Activates RESET of MBa8MPxL components
•Requires pull-up on carrier board (max. 6.5 V)
RESET_3V3# O MBa8MPxL High •Generated on MBa8MPxL from RESET_OUT#
IMX_ONOFF I MBa8MPxL High
•ON/OFF function; see i.MX 8M Plus data sheet (1)
•No pull-up on carrier board required; low-active
•Connect 5 s to GND to activate
PMIC_RST# I MBa8MPxL High •No pull-up on carrier board required; low-active
•Programmable PMIC response (warm reset, cold reset)
RESET_IN# I MBa8MPxL High •Activates POR_B of the i.MX 8M Plus; low-active
•Connect to GND to activate
M7_NMI I MBa8MPxL High •Multiplexed to GPIO1_IO05 pin of i.MX 8M Plus
•Interrupt signal for M7 Sub-CPU with defined priority
PMIC_WDOG_IN# I MBa8MPxL High
•No pull-up on carrier board required; low-active
•Disabled by default on PMIC side
•Programmable PMIC response (warm reset, cold reset)
PMIC_WDOG_OUT# O TQMa8MPxL – •Multiplexed to GPIO1_IO02 pin of i.MX 8M Plus
•Connected to PMIC_WDOG_IN# via 0 Ω bridge
User's Manual l MBa8MPxL UM 0100 l © 2022, TQ-Systems GmbH Page 12
3.2 Power supply
At X13, the MBa8MPxL has to be supplied with 24 V +10 % / –33 % (16 V to 26.4 V). All other voltages required on the MBa8MPxL
are derived from the supply voltage. 5 V (2.2 A), 3.3 V (1.75 A) and 1.8 V (0.75 A) are available at pin headers X61 and X63. It must
be ensured that the permissible limit values of the input circuitry are not exceeded.
The MBa8MPxL has a theoretical maximum power consumption of approx. 158.4 W at its 24 V supply connection. This
corresponds to a maximum typical current of 6.6 A at 24 V. The power supply unit used must be selected accordingly. In most
applications, however, the power consumption will be significantly lower and the MBa8MPxL including TQMa8MPxL consumes
approx. 5 W to 6 W when the i.MX 8M Plus operates at 100 % load. Most of the theoretically possible power consumption results
from the standard-compliant supply of the USB, PCIe (M.2) and LVDS interfaces, as well as from the power available at the pin
headers.
V_24V
(max. 6.6 A)
V_5V_MOD
(max. 10 A)
LM25119
V_3V3_MB
(max. 7 A)
V_1V2_DP
AP7173
AP7361C
TPS54335
V_1V8
V_2V5_ETH
Buck
Key:
LDO/Switch
V_12V
(max. 1.3 A)
TQMa8MPxL
(PCA9450)
V_5V_SW
Power Rail
Optional usage
on MBa8MPxL
V_1V8_MOD
(max. 0.5 A)
PFET
V_3V3_MOD
(max. 0.5 A)
AP7361C V_1V1_USB
AP7361C
V_1V0_ETH
V_3V3_SD
(max. 0.4 A)
Optional usage
on MBa8MPxL
Supply for SD card
on MBa8MPxL
AP7361C
V_24V_OUT V_24V_HSS_IN
Component
High side
switch
Optional bridge
at X555
Figure 7: Block diagram power supply MBa8MPxL
3.2.1 Protective circuitry
The protective circuit (see Figure 8) features the following characteristics:
•Overcurrent protection by fuse 7 A, Slow Blow
•Overvoltage protection
•PI filter
•Reverse polarity protection
•Capacitors for voltage smoothing
V_24V
(max. 6.6 A) 7 A fuse,
Slow Blow Filter Reverse
Polarity
Protection
TVS Diode
Figure 8: MBa8MPxL protective circuit
User's Manual l MBa8MPxL UM 0100 l © 2022, TQ-Systems GmbH Page 13
3.3 Communication interfaces
3.3.1 Ethernet 1000 Base-T (RGMII)
The i.MX 8M Plus CPU has two independent RGMII interfaces. On the MBa8MPxL both interfaces are used to provide two Gigabit
Ethernet ports by means of two DP83867 Ethernet PHYs.
The PHY has boot straps to start with adjustable default values. Some boot straps can be customized with placement options.
More information is available in the latest MBa8MPxL schematic.
Both interfaces additionally provide event signals according to IEEE 1588, which can be used to realize high precision
synchronizations between Ethernet components. These signals are available from ENET0 at X63 by default. If required, the event
signals of ENET1 can be used via assembly option.
TQMa8MPxL
RJ45
ENET_TSN
RGMII0
ENET_QOS
RGMII1
PHY #1
DP83867
PHY #2
DP83867
RJ45
EVENT1
EVENT2
SAI2
Pin
header
Figure 9: Block diagram Ethernet 1000 Base-T
Table 8: Pinout RJ45 Ethernet connector, X66
X66, left RJ45 X66, right RJ45 Remark
Pin Pin name Signal Pin Pin name Signal
1A GND GND 1B GND GND –
2A TD0+ ENET0_A+ 2B TD0+ ENET1_A+ –
3A TD0– ENET0_A– 3B TD0– ENET1_A– –
6A TD1+ ENET0_B+ 6B TD1+ ENET1_B+ –
4A TD1– ENET0_B– 4B TD1– ENET1_B– –
5A TD2+ ENET0_C+ 5B TD2+ ENET1_C+ –
7A TD2– ENET0_C– 7B TD2– ENET1_C– –
8A TD3+ ENET0_D+ 8B TD3+ ENET1_D+ –
9A TD4– ENET0_D– 9B TD4– ENET1_D– –
10A CHS.GND GND 10B CHS.GND GND –
11A GREEN_ANODE V_3V3_MB 11B GREEN_ANODE V_3V3_MB 120 Ω in series
12A GREEN_CATHODE ENET0_LED_0 12B GREEN_CATHODE ENET1_LED_0 Switched by transistor
13A YELLOW_ANODE V_3V3_MB 13B YELLOW_ANODE V_3V3_MB 120 Ω in series
14A YELLOW_CATHODE ENET0_LED_2 14B YELLOW_CATHODE ENET1_LED_2 Switched by transistor
User's Manual l MBa8MPxL UM 0100 l © 2022, TQ-Systems GmbH Page 14
3.3.2 SD card interface
The MBa8MPxL offers a microSD card slot that can also be used as boot source. All signals are directly connected to the USDHC2
interface of the i.MX 8M Plus.
The TQMa8MPxL voltage V_3V3_SD supplies the microSD card slot. Since this voltage is controlled by SD_RESET#, the microSD
card is automatically reset in case of a Reset. An external switch is not required. Signal USDHC2_CD# has a pull-up on the
MBa8MPxL. All data lines are ESD protected.
Standard, High and Extended capacity card types are supported. Default Speed, High Speed, and SD UHS-1 Speed Mode SDR104
with theoretically max.104 MB/s are supported. UHS-1 Speed Modes SDR12, SDR25, SDR50 and DDR50 are theoretically
supported but not verified.
The TQMa8MPxL sets USDHC2 is to 1.8 V or 3.3 V automatically, depending on the transfer mode. The corresponding driver
handles the changeover; it does not have to be done explicitly.
USDHC2_WP is not used and is terminated accordingly.
TQMa8MPxL
SD Card Slot
USDHC2
3.3 V / 400 mAV_3V3_SD
Figure 10: Block diagram SD card interface, MBa8MPxL
Table 9: Pinout microSD card, X42
Pin Pin name Signal Remark
1 DAT2 USDHC2_DATA2 10 kΩ PU
2 DAT3 USDHC2_DATA3 10 kΩ PU
3 CMD USDHC2_CMD 10 kΩ PU
4 VDD V_3V3_SD Supply from TQMa8MPxL
5 CLK USDHC2_CLK –
6 GND GND –
7 DAT0 USDHC2_DATA0 10 kΩ PU
8 DAT1 USDHC2_DATA1 10 kΩ PU
SW1 CD# GND –
SW2 CD# USDHC2_CD# 10 kΩ PU
M1…4 Shield GND –
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