VIA Technologies SOM-7000 User manual

USER MANUAL
VIA SOM-7000
Fanless and low-power Edge AI plaorm with
MediaTek Genio 1200 Octa-Core processor
1.00-26092023

Copyright
Copyright ©2023 VIA Technologies Incorporated. All rights reserved.
No part of this document may be reproduced, transmied, transcribed, stored in a retrieval system, or translated into any language, in any
form or by any means, electronic, mechanical, magnec, opcal, chemical, manual or otherwise without the prior wrien permission of
VIA Technologies, Incorporated.
Trademarks
All trademarks are the property of their respecve holders.
Disclaimer
No license is granted, implied or otherwise, under any patent or patent rights of VIA Technologies. VIA Technologies makes no warranes,
implied or otherwise, in regard to this document and to the products described in this document. The informaon provided in this
document is believed to be accurate and reliable as of the publicaon date of this document. However, VIA Technologies assumes no
responsibility for the use or misuse of the informaon (including use or connecon of extra device/equipment/add-on card) in this
document and for any patent infringements that may arise from the use of this document. The informaon and product specicaons
within this document are subject to change at any me, without noce and without obligaon to nofy any person of such change.
VIA Technologies, Inc. reserves the right the make changes to the products described in this manual at any me without prior noce.
Regulatory Compliance
FCC-A Radio Frequency Interference Statement
This equipment has been tested and found to comply with the limits for a class A digital device, pursuant to part 15 of the FCC rules.
These limits are designed to provide reasonable protecon against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the
instrucon manual, may cause harmful interference to radio communicaons. Operaon of this equipment in a residenal area is likely to
cause harmful interference, in which case the user will be required to correct the interference at his personal expense.
Noce 1
The changes or modicaons not expressly approved by the party responsible for compliance could void the user's authority to operate
the equipment.
Noce 2
Shielded interface cables and A.C. power cord, if any, must be used in order to comply with the emission limits.
Noce 3
The product described in this document is designed for general use, VIA Technologies assumes no responsibility for the conicts or
damages arising from incompability of the product. Check compability issue with your local sales representaves before placing an
order.

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VIA SOM-7000 User Manual
Baery Recycling and Disposal
• Only use the appropriate baery specied for this product.
• Do not re-use, recharge, or reheat an old baery.
• Do not aempt to force open the baery.
• Do not discard used baeries with regular trash.
• Discard used baeries according to local regulaons.
Safety Precauons
• Always read the safety instrucons carefully.
• Keep this document for future reference.
• All cauons and warnings on the equipment should be noted.
• Keep this equipment away from humidity.
• Put this equipment on a reliable at surface before seng it up.
• Check the voltage of the power source and adjust to 110/220V before connecng the equipment to
the power inlet.
• Do not place the power cord where people will step on it.
• Always unplug the power cord before inserng any add-on card or module.
• If any of the following situaons arise, get the equipment checked by authorized service personnel:
− The power cable is damaged.
− Liquid has entered into the equipment.
− The equipment has been exposed to moisture.
− The equipment is faulty or you cannot get it work according to User's Manual.
− The equipment has been dropped and damaged.
− The equipment has an obvious sign of breakage.
• Do not leave this equipment in extreme temperatures or in a storage temperature above 60°C (140°F).
The equipment may be damaged.
• Do not leave this equipment in direct sunlight.
• Never pour any liquid into the opening. Liquid can cause damage or electrical shock.
• Do not place anything over the power cable.
• Do not cover the venlaon holes. The openings on the enclosure protect the equipment from
overheang.

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VIA SOM-7000 User Manual
Packing List
Items for STK-SOM700-00A0
• 1 x VIA SOM-7000 module
• 1 x VIA SOMDB7 reference carrier board
• 1 x Heatsink
• 1 x Audio cable
• 1 x Power cable
• 1 x Debug console cable
Ordering Informaon
Part Number SoC Frequency Descripon
10GPZ22M30020 MediaTek Genio 1200
Octa-Core SoC @
2.2GHz/2.0GHz
VIA SOM-7000 module with 2.2/2.0GHz MediaTek Genio 1200
Octa-Core SoC, 16GB eMMC, 4GB LPDDR4 SDRAM, CSI, audio
(headphone out and MIC-in), Wi-Fi 6+ Bluetooth 5.2, 3 Wi-Fi/
Bluetooth antenna I-PEX connectors
STK-SOM700-00A0 VIA SOM-7000 starter kit with VIA SOM-7000 module, VIA
SOMDB7 reference carrier board and accessory kit
Oponal Accessories
Development Opons
Part Number Descripon
SOM-ACK-00A0 Development Pack including 5MP CMOS camera, Wi-FI/BT antenna and 12V 3A
worldwide AC adapter
99G47-01025F 10.1" 1920x1200 MIPI LCD + touch panel display
Wireless Module Opons
Part Number Descripon
EMIO-2576-00A0 4G LTE mobile broadband M.2 module with two antennas and assembly

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VIA SOM-7000 User Manual
Table of Contents
1. Product Overview ........................................................................................................................................... 1
1.1 Key Features .......................................................................................................................................... 1
1.2 Product Specicaons ........................................................................................................................... 2
1.3 Layout Diagram ..................................................................................................................................... 4
1.4 Product Dimensions .............................................................................................................................. 4
1.5 Height Distribuon ................................................................................................................................ 5
2. Onboard I/O Connectors ................................................................................................................................ 6
2.1 4-Lane MIPI CSI Connector ................................................................................................................... 6
2.2 I-PEX Antenna Connectors .................................................................................................................... 8
2.3 Audio-Out Connector ............................................................................................................................ 9
3. Soware and Technical Support ................................................................................................................... 10
3.1 Android and Yocto Support ................................................................................................................. 10
3.2 Technical Support and Assistance ....................................................................................................... 10
Appendix A SOMDB7 Carrier Board Reference ................................................................................................ 11
A.1 SOMDB7 Specicaons ....................................................................................................................... 11
A.2 SOMDB7 Layout Diagram .................................................................................................................... 13
A.3 SOMDB7 Dimensions .......................................................................................................................... 15
A.4 SOMDB7 Height Distribuon .............................................................................................................. 16
A.5 SOMDB7 External I/O Pin Descripons and Funconality .................................................................. 17
A.5.1 MicroSD Slot ................................................................................................................................ 17
A.5.2 USB 3.1 Ports ............................................................................................................................... 17
A.5.3 Micro USB 2.0 Port ....................................................................................................................... 18
A.5.4 Gigabit LAN Ports ......................................................................................................................... 18
A.5.5 HDMI® Port .................................................................................................................................. 19
A.5.6 Power Buon ............................................................................................................................... 19
A.5.7 Reset Buon ................................................................................................................................ 20
A.5.8 Headphone Jack ........................................................................................................................... 20
A.6 SOMDB7 Onboard I/O ......................................................................................................................... 21
A.6.1 MXM 3.0 Connector ..................................................................................................................... 21
A.6.2 Audio-In Connector ...................................................................................................................... 25
A.6.3 LVDS Connectors .......................................................................................................................... 26
A.6.4 LVDS Backlight Connector ............................................................................................................ 27
A.6.5 4-Lane MIPI DSI Connector .......................................................................................................... 28
A.6.6 4-Lane MIPI CSI Connector .......................................................................................................... 29
A.6.7 2-Lane MIPI CSI Connector .......................................................................................................... 31
A.6.8 Touchscreen Panel Connector ..................................................................................................... 32
A.6.9 Volume Buons ........................................................................................................................... 33
A.6.10 DC-in Power Connector ............................................................................................................... 34
A.6.11 GPIO/ADC Expansion Header ....................................................................................................... 35
A.6.12 M.2 Slot ........................................................................................................................................ 36
A.6.13 SIM Card Slot ............................................................................................................................... 37
A.6.14 Debug Console Connector ........................................................................................................... 38

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A.7 SOMDB7 Onboard Jumpers ................................................................................................................ 39
A.7.1 Watchdog Jumper ........................................................................................................................ 40

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VIA SOM-7000 User Manual
List of Figures
Figure 01: Layout diagram of the VIA SOM-7000 module's top layer .................................................................. 4
Figure 02: Dimensions of the VIA SOM-7000 module .......................................................................................... 4
Figure 03: Height distribuon on the VIA SOM-7000 module's top layer ............................................................ 5
Figure 04: MIPI CSI connector 'CSI3' .................................................................................................................... 6
Figure 05: I-PEX antenna connectors ................................................................................................................... 8
Figure 06: Audio-out connector 'AUDIO_CON' .................................................................................................... 9
Figure 07: Layout diagram of the SOMDB7 carrier board's top layer I/O ........................................................... 13
Figure 08: Layout diagram of the SOMDB7 carrier board's boom layer I/O .................................................... 13
Figure 09: Layout diagram of the SOMDB7 carrier board's front panel I/O ....................................................... 14
Figure 10: Layout diagram of the SOMDB7 carrier board's back panel I/O........................................................ 14
Figure 11: Dimensions of the SOMDB7 carrier board ........................................................................................ 15
Figure 12: Dimensions of the SOMDB7 carrier board's front panel I/O ............................................................. 15
Figure 13: Dimensions of the SOMDB7 carrier board's back panel I/O.............................................................. 15
Figure 14: Height distribuon on the SOMDB7 carrier board's top layer .......................................................... 16
Figure 15: Height distribuon on the SOMDB7 carrier board's boom layer .................................................... 16
Figure 16: MicroSD card slot diagram ............................................................................................................... 17
Figure 17: USB 3.1 diagram .............................................................................................................................. 17
Figure 18: Micro USB 2.0 port diagram ............................................................................................................. 18
Figure 19: Gigabit LAN port diagram .................................................................................................................. 18
Figure 21: Power buon diagram ....................................................................................................................... 19
Figure 20: HDMI port diagram ........................................................................................................................... 19
Figure 22: Reset buon diagram ........................................................................................................................ 20
Figure 23: Headphone jack diagram ................................................................................................................... 20
Figure 24: MXM 3.0 connector 'U37' ................................................................................................................. 21
Figure 25: Audio-in connector 'AUDIO_CON' ..................................................................................................... 25
Figure 26: LVDS connectors 'LVDS1' and 'LVDS2' ................................................................................................ 26
Figure 27: LVDS backlight connector 'J6' ............................................................................................................ 27
Figure 28: MIPI DSI connector 'JDSI1' ................................................................................................................. 28
Figure 29: MIPI CSI connector 'CSI1' .................................................................................................................. 29
Figure 30: MIPI CSI connector 'CSI2' .................................................................................................................. 31
Figure 31: Touchscreen panel connector 'JTOUCH1' .......................................................................................... 32
Figure 32: Volume buons 'SW1' and 'SW2' ...................................................................................................... 33
Figure 33: DC-in power connector 'J7' ............................................................................................................... 34
Figure 34: GPIO/ADC header 'JGPIO' .................................................................................................................. 35
Figure 35: M.2 B-key slot ' J2' ............................................................................................................................. 36
Figure 36: SIM card slot 'SIM1' ........................................................................................................................... 37
Figure 37: Jumper sengs example ................................................................................................................... 39
Figure 38: Watchdog jumper diagram ................................................................................................................ 40

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VIA SOM-7000 User Manual
List of Tables
Table 01: MIPI CSI connector 'CSI3' pinouts ....................................................................................................... 7
Table 02: Audio-out connector 'AUDIO_CON' pinouts ....................................................................................... 9
Table 03: MicroSD card slot pinouts ................................................................................................................. 17
Table 04: USB 3.1 pinouts ................................................................................................................................. 17
Table 07: Gigabit LAN port LED color denion ................................................................................................ 18
Table 05: Micro USB 2.0 port pinouts ............................................................................................................... 18
Table 06: Gigabit LAN port pinouts ................................................................................................................... 18
Table 09: Power buon behavior descripon ................................................................................................... 19
Table 08: HDMI port pinouts ............................................................................................................................ 19
Table 10: MXM 3.0 connector 'U37' pinouts .................................................................................................... 24
Table 11: Audio-in connector 'AUDIO_CON' pinouts ........................................................................................ 25
Table 12: 'LVDS1' connector pinouts ................................................................................................................. 26
Table 13: 'LVDS2' connector pinouts ................................................................................................................. 27
Table 14: LVDS backlight connector 'J6' pinouts ............................................................................................... 27
Table 15: MIPI DSI connector 'JDSI1' pinouts .................................................................................................... 28
Table 16: MIPI CSI connector 'CSI1' pinouts ..................................................................................................... 30
Table 17: MIPI CSI connector 'CSI2' pinouts ..................................................................................................... 31
Table 18: Touchscreen panel connector 'JTOUCH1' pinouts ............................................................................. 32
Table 19: DC-in power connector 'J7' pinouts .................................................................................................. 34
Table 20: GPIO/ADC header 'JGPIO' pinouts ..................................................................................................... 35
Table 21: M.2 B-key slot 'J2' pinouts ................................................................................................................. 36
Table 22: SIM card slot 'SIM1' pinouts .............................................................................................................. 37
Table 23: Debug console connector 'J14' .......................................................................................................... 38
Table 24: Debug console connector 'J14' pinouts ............................................................................................. 38
Table 25: Watchdog jumper sengs ................................................................................................................ 40

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VIA SOM-7000 User Manual
1. Product Overview
Accelerate your me-to-market for groundbreaking Edge AI devices with the feature-rich VIA SOM-7000 Edge
AI module. Propelled by four powerful ARM Cortex® A78 cores (up to 2.2GHz) and four ultra-ecient ARM
Cortex® A55 cores (up to 2.0GHz) of the MediaTek Genio 1200 premium SoC, the VIA SOM-7000 module
delivers advanced compung, networking, graphics and AI processing performance, plus mulple 4K display
support and I/O peripheral integraon capabilies on a fanless module. A dual-core AI engine is also integrated
in the SoC for deep learning, neural network acceleraon, and computer vision applicaons, including facial
recognion, object idencaon, and OCR.
Measuring just 8.2cm x 8cm (3.22" x 3.15"), the VIA SOM-7000 Edge AI module features onboard 4GB LPDDR4
SDRAM and 16GB eMMC ash memory. Mulmedia capabilies include support for hardware-accelerated
H.265/H.264 4K video processing, headphone-out and MIC-in, as well as mulple MIPI/HDMI/LVDS displays
and CSI cameras - making it the ideal soluon for an unlimited array of home, commercial, industrial, and
educaonal applicaons. High-speed network connecvity is delivered through dual-band Wi-Fi 6, Bluetooth
5.2, alomng with support for Gigabit LAN and 4G LTE mobile broadband. Furthermore, supported I/O and
expansion interfaces include three USB 2.0, one USB 3.1, two SPI, two I2S, three I2C, two UART, one single-lane
PCIe, and one SD card.
To boost Edge AI applicaon development, the VIA SOM-7000 module comes with a Linux BSP that supports
Android 11.0 and Yocto 4.0.6 operang systems. Other features of the BSP include a toolchain to make
adjustments to the kernel, and to support the VIA SOMDB7 carrier board I/O and other hardware features.
1.1 Key Features
• Powerful and ultra-ecient 2.2GHz/2.0GHz MediaTek Genio 1200 Octa-core SoC with integrated dual-
core AI processor
• Onboard 4GB LPDDR4 SDRAM and 16GB eMMC ash memory
• High-speed network connecvity with dual-band Wi-Fi 6 and Bluetooth 5.2
• Supports hardware accelerated H.265/H.264 4K video processing at high frame rates
• Supports Headphone-out and Mic-in
• Supports mulple displays (MIPI DSI/HDMI/LVDS), and cameras (CSI)
• Supports Gigabit Ethernet and 4G LTE.
• Supports three USB 2.0, one USB 3.1, two SPI, two I2S, three I2C, two UART, one single-lane PCIe, and
SD card.
• Supports Android 11 and Yocto 4.0.6 operang systems
• Carrier board available

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VIA SOM-7000 User Manual
1.2 Product Specicaons
Processor
• MediaTek Genio 1200 Octa-Core SoC
− Four Cortex-A78 @ 2.2GHz
− Four Cortex A55 @ 2.0GHz
System Memory
• 4GB LPDDR4 SDRAM
Storage
• 16GB eMMC Flash Memory
Graphics
• ARM Mali-G57 MCS High Performance GPU
• 3D graphics accelerator capable of processing 17600M pixel/sec @ 880MHz
• Graphics engine supporng OpenGL® ES 3.2, OpenCL ES 2.2, and Vulkan 1.1 hardware acceleraon
• Supports H.265 and H.264 video decoding up to 4K@90fps
• Supports H.265 and H.264 video encoding up to 4K@60fps
AI Processor
• MediaTek dual-core AI Processor
Audio
• Supports Cadence® Tensilica® Vision HiFi 4 DSP
• MediaTek MT6365
Wireless Connecvity
• MediaTek MT7921
• Dual-band Wi-Fi 6 with MU-MIMO
• Bluetooth 5.2
Ethernet
• Realtek RTL8211F(I)-CG 10/100/1000M Ethernet Transceiver
HDMI
• Integrated HDMI 2.0 Transmier
Supported I/O
• 2 x MIPI DSI
• 2 x MIPI CSI (1 x 4-Lane, 1 x 2-Lane)
• 1 x HDMI
• 1 x Display Port
• 1 x USB 3.1
• 3 x USB 2.0
• 1 x GLAN

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VIA SOM-7000 User Manual
• 1 x SPI
• 2 x I2S
• 3 I2C
• 2 x UART
• 1 x single-lane PCIe
• 1 x SD card
• 1 x 5V DC-in
Onboard I/O
• 1 x MIPI CSI connector
• 3 x I-PEX connectors for Wi-Fi and Bluetooth antennas
• 1 x Audio connector for Headphone-out and MIC-in
Operang System
• Android 11 and Yocto 4.0.6
System Monitoring and Management
• Watchdog Timer, System Management, Boot Select
Operang Temperature
• 0°C ~ 60°C
Operang Humidity
• 0% ~ 95% (relave humidity ; non-condensing)
Form Factor
• 82mm x 80mm (3.22" x 3.15")
Compliance
• CE, FCC, TELEC, UKCA
Notes:
1. As the operang temperature provided in the specicaons is a result of tesng performed in a tesng
chamber, and a number of variables can inuence this result. Please note that the working temperature may
vary depending on the actual situaon and environment. It is highly recommended to execute a solid tesng
program and take all variables into consideraon when building the system. Please ensure that the system is
stable under the required operang temperature in terms of the target applicaon.
2. Please note that the lifespan of the onboard eMMC memory chip may vary depending on the amount of
access. More frequent and larger data access on the eMMC memory will shorten its lifespan. It is highly
recommended to use a replaceable external storage (e.g., MicroSD card) for large data access.

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VIA SOM-7000 User Manual
1.3 Layout Diagram
I-PEX Antenna
Connectors
Wi-Fi + BT
MediaTek Genio 1200
Octa-core SoC
LPDDR4 SDRAM
PMIC
Audio Connector
eMMC
MIPI CSI
PMIC/Audio Codec
Figure 01: Layout diagram of the VIA SOM-7000 module's top layer
1.4 Product Dimensions
82mm
74mm
37mm
80mm
64mm
30mm
6.95mm
39mm
4mm
12mm
Figure 02: Dimensions of the VIA SOM-7000 module

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VIA SOM-7000 User Manual
1.5 Height Distribuon
1.34mm
4.25mm
Figure 03: Height distribuon on the VIA SOM-7000 module's top layer

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VIA SOM-7000 User Manual
2. Onboard I/O Connectors
2.1 4-Lane MIPI CSI Connector
The VIA SOM-7000 module is equipped with a 4-lane MIPI CSI connector labeled 'CSI3' on the top layer, which
can be used for connecng a 2-lane or 4-lane MIPI CSI camera. The pinouts of the MIPI CSI connector are
shown below.
1
30
CSI3
Figure 04: MIPI CSI connector 'CSI3'
Note:
The 4-lane MIPI CSI connector currently only supports the SONY IMX258 CMOS Image Sensor.

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VIA SOM-7000 User Manual
CSI3
Pin Signal Pin Signal
1 XCLK 16 MCN
2 DGND 17 DGND
3 Reset 18 MCP
4 MDN2 19 PAVDD 2.8V
5 NC 20 DGND
6 MDP2 21 AF AVDD 2.8V
7DOVDD1.8V 22 MDN0
8DGND 23 AFGND
9 AGND 24 MDP0
10 MDN3 25 DVDD 1.2V
11 DGND 26 DGND
12 MDP3 27 NC
13 SCL 28 MDN1
14 DGND 29 DGND
15 SDA 30 MDP1
Table 01: MIPI CSI connector 'CSI3' pinouts

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VIA SOM-7000 User Manual
2.2 I-PEX Antenna Connectors
The VIA SOM-7000 module comes with three I-PEX antenna connectors on the top layer, labeled 'WCON1
BT' for Bluetooth, 'WCON3 WF0' for Wi-Fi MAIN, and 'WCON4 WF1' for Wi-Fi AUX. The diagram of the I-PEX
antenna connectors is shown below.
WCON BT/WF
Figure 05: I-PEX antenna connectors

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VIA SOM-7000 User Manual
2.3 Audio-Out Connector
The VIA SOM-7000 module is equipped with a stereo audio-out connector labeled 'AUDIO_CON' on the top
layer. The audio cable bundled in the VIA SOM-7000 starter kit can be plugged into this connector and the VIA
SOMDB7 reference carrier board's audio-in connector.
Note:
See Appendix secon A.6.2 for informaon on the VIA SOMDB7 reference carrier board's audio-in connector.
The pinouts of the audio-out connector are shown below.
AUDIO_CON (OUT)
8
1
Figure 06: Audio-out connector 'AUDIO_CON'
AUDIO_CON (OUT)
Pin Signal
1 AVSS30_AUD
2 EAR_MIC_N
3 EAR_MIC_P
4 D_GND
5 AU_HP_R
6 AU_REFN
7AU_HP_L
8HP_EINT
Table 02: Audio-out connector 'AUDIO_CON' pinouts

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VIA SOM-7000 User Manual
3. Soware and Technical Support
3.1 Android and Yocto Support
The VIA SOM-7000 features a complete soware evaluaon image featuring the Android 11 and Yocto 4.0.6
operang systems.
3.2 Technical Support and Assistance
• For ulies downloads and the latest documentaon and informaon about the VIA SOM-7000,
please visit our website at hps://www.viatech.com/en/edge/SOM-7000/.
• For technical support and addional assistance, always contact your local sales representave or VIA
SOM-7000 distributor, or go to hps://www.viatech.com/en/support/drivers/ for technical support.
• For OEM clients and system integrators developing a product for long-term producon, other code
and resources may also be made available. Please visit our website at hps://www.viatech.com/en/
about/contact/ to submit a request.

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VIA SOM-7000 User Manual
Appendix A SOMDB7 Carrier Board Reference
A.1 SOMDB7 Specicaons
LVDS
• Chrontel CH7515 eDP/DP to LVDS Converter
Ethernet
• Realtek RTL8153 GbE USB 3.0 Ethernet Network Interface Controller
MCU
• STMicroelectronics STM32L011F4P6 32-bit MCU
Onboard I/O
• 1 x 4-Lane MIPI-DSI connector
• 2 x LVDS dual-channel connectors (up to QSXGA 2560 x 1440 @60Hz)
• 2 x MIPI CSI connectors (1 x 4-Lane, 1 x 2-Lane)
• 1 x touchscreen panel connector (I2C)
• 1 x SIM card slot
• 1 x M.2 B-key slot (supports PCIe x1/USB3.1/USB 2.0/SIM)
• 1 x ADC/GPIO pin header (for mulplexed Analog inputs/GPIOs)
• 1 x RTC baery connector
• 1 x Debug console connector
• 1 x 12V DC-in power connector
Front Panel I/O
• 1 x Download/Volume+ buon
• 1 x Volume- buon
• 1 x MicroSD card slot
Back Panel I/O
• 1 x HDMI port
• 2 x USB 3.1 ports
• 1 x Micro USB 2.0 port (for image download)
• 2 x GLAN ports
• 1 x 3.5mm phone jack (supports Headphone-out and MIC-in)
• 1 x Reset buon
• 1 x Power buon with LED
Power Supply
• 1 x 12V DC-in
Operang Temperature
• 0°C ~ 60°C

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VIA SOM-7000 User Manual
Operang Humidity
• 0% ~ 95% (relave humidity ; non-condensing)
Form Factor
• 151mm x 134mm (5.94" x 5.28")
Compliance
• CE, FCC, UKCA, TELEC