Western Digital OpenFlex F3100 User manual

User Guide
OpenFlex™ F3100 and E3000
1ET2050
Version 1.0
October 2019

User Guide Table of Contents
Table of Contents
Copyright................................................................................................................................................................................... iv
Points of Contact....................................................................................................................................................................... v
Chapter 1. Overview........................................................................................................................................................................ 1
OpenFlex™ F3100 and E3000.................................................................................................................................................. 2
Servicing Features.............................................................................................................................................................. 3
Composable Infrastructures...............................................................................................................................................3
NVMe-oF..............................................................................................................................................................................4
Supported SKUs................................................................................................................................................................. 4
List of Compatible Devices............................................................................................................................................... 4
System Architecture Overview.................................................................................................................................................5
System High Speed Data Ingest Architecture.................................................................................................................5
System Thermal and Cooling............................................................................................................................................5
OpenFlex F3100 and E3000 Specification Summary.............................................................................................................. 7
Physical Design.........................................................................................................................................................................10
LEDs....................................................................................................................................................................................12
Cables................................................................................................................................................................................ 16
Restrictions and Limitations.....................................................................................................................................................16
Site Requirements.....................................................................................................................................................................17
Power Requirements.........................................................................................................................................................17
Rack Requirements............................................................................................................................................................17
Thermal and Cooling Requirements............................................................................................................................... 18
Servicing Requirements....................................................................................................................................................18
Chapter 2. Components...............................................................................................................................................................20
Chassis.......................................................................................................................................................................................21
Chassis Specifications.......................................................................................................................................................21
PSU............................................................................................................................................................................................ 22
PSU Specifications............................................................................................................................................................22
Fan Module............................................................................................................................................................................... 23
Fan Module Specifications............................................................................................................................................... 23
BMC Module............................................................................................................................................................................. 24
BMC Module Specifications.............................................................................................................................................24
Rails........................................................................................................................................................................................... 25
Rails Specifications........................................................................................................................................................... 25
i

User Guide Table of Contents
OpenFlexF3100......................................................................................................................................................................... 26
OpenFlexF3100 Specifications.........................................................................................................................................26
OpenFlex E3000 Fabric Device Blank.................................................................................................................................... 27
OpenFlex E3000 Fabric Device Blank Specifications.................................................................................................... 27
List of Field/Customer Replaceable Units.............................................................................................................................28
Chapter 3. Management............................................................................................................................................................... 29
OCGUI.......................................................................................................................................................................................30
Login Page........................................................................................................................................................................30
Dashboard.........................................................................................................................................................................30
Storage Device Page....................................................................................................................................................... 35
Chassis Device Page........................................................................................................................................................ 42
Basic Operational Functions............................................................................................................................................ 49
Power Cycling...................................................................................................................................................................74
Firmware Upgrade............................................................................................................................................................75
Part Replacement..................................................................................................................................................................... 81
Fan Module Replacement................................................................................................................................................82
PSU Replacement............................................................................................................................................................. 84
BMC Module Replacement..............................................................................................................................................88
OpenFlexF3100 Replacement...........................................................................................................................................91
Rails Replacement............................................................................................................................................................ 95
Chassis Replacement.......................................................................................................................................................113
Chapter 4. Safety......................................................................................................................................................................... 135
Electrostatic Discharge.......................................................................................................................................................... 136
Optimizing Location............................................................................................................................................................... 136
Power Connections................................................................................................................................................................ 136
Power Cords........................................................................................................................................................................... 136
Rackmountable Systems........................................................................................................................................................ 137
Restricted Access Location................................................................................................................................................... 137
Safety and Service..................................................................................................................................................................137
Safety Warnings and Cautions.............................................................................................................................................. 138
Chapter 5. Regulatory................................................................................................................................................................. 139
Europe (CE Declaration of Conformity)................................................................................................................................140
FCC Class A Notice............................................................................................................................................................... 140
ICES-003 Class A Notice—Avis NMB-003, Classe A........................................................................................................... 140
Japanese Compliance Statement, Class A ITE.................................................................................................................... 140
ii

User Guide Table of Contents
KCC Notice (Republic of Korea Only), Class A ITE............................................................................................................. 140
Taiwan Warning Label Statement, Class A ITE.....................................................................................................................141
iii

User Guide Copyright
Copyright
The following paragraph does not apply to the United Kingdom or any country where such provisions
are inconsistent with local law: Western Digital a Western Digital company PROVIDES THIS PUBLICATION
"AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED
TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. Some
states do not allow disclaimer or express or implied warranties in certain transactions, therefore, this
statement may not apply to you.
This publication could include technical inaccuracies or typographical errors. Changes are periodically made
to the information herein; these changes will be incorporated in new editions of the publication. Western
Digital may make improvements or changes in any products or programs described in this publication at any
time.
It is possible that this publication may contain reference to, or information about, Western Digital products
(machines and programs), programming, or services that are not announced in your country. Such references
or information must not be construed to mean that Western Digital intends to announce such Western Digital
products, programming, or services in your country.
Technical information about this product is available by contacting your local Western Digital representative
or on the Internet at: [e-mail]
Western Digital may have patents or pending patent applications covering subject matter in this document.
The furnishing of this document does not give you any license to these patents.
Long Live Data™ is a trademark of Western Digital, Inc. and its affiliates in the United States and/or other
countries.
Western Digital trademarks are authorized for use in countries and jurisdictions in which Western Digital
has the right to use, market and advertise the brands. Other product names are trademarks or registered
trademarks of their respective owners.
One MB is equal to one million bytes, one GB is equal to one billion bytes, one TB equals 1,000GB (one trillion
bytes) and one PB equals 1,000TB when referring to storage capacity. Usable capacity will vary from the raw
capacity due to object storage methodologies and other factors.
References in this publication to Western Digital products, programs or services do not imply that Western
Digital intends to make these available in all countries in which Western Digital operates.
Product information is provided for information purposes only and does not constitute a warranty.
Information is true as of the date of publication and is subject to change. Actual results may vary. This
publication is for general guidance only. Photographs may show design models.
Western Digital
5601 Great Oaks Parkway
San Jose, CA 95119
© 2019 Western Digital Corporation or its affiliates.
iv

User Guide Points of Contact
Points of Contact
For further assistance with a Western Digital product, contact Platform Engineering technical support. Please
be prepared to provide the following information: part number (P/N), serial number (S/N), product name
and/or model number, and a brief description of the issue.
Email:
[e-mail]
Website:
https://portal.wdc.com/Support/s/
v

Western Digital
Overview
In This Chapter:
- OpenFlex™ F3100 and E3000.......................2
- System Architecture Overview..................... 5
- OpenFlex F3100 and E3000 Specification
Summary........................................................... 7
- Physical Design............................................. 10
- Restrictions and Limitations........................ 16
- Site Requirements.........................................17
1

User Guide 1. Overview
1.1 OpenFlex™ F3100 and E3000
1.1 OpenFlex™ F3100 and E3000
The OpenFlex™ F3100 and E3000 is a 3U rack
mounted data storage enclosure built on the
OpenFlex platform. OpenFlex is Western Digital’s
architecture that supports Open Composable
Infrastructure (OCI). The OpenFlex F3100 and
E3000 are fabric devices that leverage this OCI
approach in the form of disagreggated data storage
using NVMe-over-Fabrics (NVMe-oF). NVMe-oF is
a networked storage protocol that allows storage
to be disaggregated from compute to make that
storage widely available to multiple applications
and servers. By enabling applications to share a
common pool of storage capacity, data can be easily
shared between applications, or needed capacity
can be allocated to an application regardless of location. Exploiting NVMe device-level performance,
NVMe-oF promises to deliver the lowest end-to-end latency from application to shared storage. NVMe-
oF enables composable infrastructures to deliver the data locality benefits of NVMe DAS (low latency, high
performance) while providing the agility and flexibility of sharing storage and compute.
The maximum data storage capacity is 614TB * when leveraging a full set of 10 F3100 fabric devices.
The enclosure runs on an input voltage of 200V - 240V and consumes ~1400W of power under typical
conditions. It requires a maximum of 1600W at full load.
Composable Infrastructure
An emerging category of
datacenter infrastructure that
seeks to disaggregate compute,
storage, and networking fabric
resources into shared resource
pools that can be available
for on-demand allocation (i.e.,
“composable”). Composability
occurs at the software level,
disaggregation occurs at the
hardware level using NVMe™-
over-Fabric—will vastly improve
compute and storage utilization,
performance, and agility in the
data center.
OpenFlex
OpenFlex is Western Digital’s
architecture that supports Open
Composable Infrastructure
through storage disaggregation
– both disk and flash natively
attached to a scalable fabric.
OpenFlex does not rule out
multiple fabrics, but whenever
possible, Ethernet will be used as
a unifying connect for both flash
and disk because of its broad
applicability and availability.
Open Composable API
Western Digital's new Open
Composable API is designed
for data center composability.
It builds upon existing industry
standards utilizing the best
features of those standards as
well as practices from proprietary
management protocols.
• 614TB * • 200V - 240V Input Voltages • Dual 1600W PSUs
• 12GBps NVMe-oF over QSFP28
Cables
• 3U Form Factor • Operational Temperature: 5°C to
35°C
• 68.5 kg / 151.1 lbs. • Hot-swappable PSUs and Fans • Dynamic Provisioning Supported
* Max storage capacity depends on device version and device configuration.
2

User Guide 1. Overview
1.1 OpenFlex™ F3100 and E3000
1.1.1 Servicing Features
The OpenFlex F3100 and E3000 are equipped with several features that make servicing simpler and safer.
Every CRU component has been designed with toolless removal features.
The BMC Module, Fan Module, PSU, and F3100 devices are all hotswappable components. This document
provides full instructions on how these features operate in the Management (page 29) section.
1.1.2 Composable Infrastructures
An emerging category of datacenter infrastructure that seeks to disaggregate compute, storage, and
networking fabric resources into shared resource pools that can be available for on-demand allocation (i.e.,
“composable”). Composable occurs at the software level, disaggregation occurs at the hardware level.
Western Digital’s vision for Open Composable Infrastructures is based on four key pillars:
•Open
◦Open in both API and form factor
◦Designed for robust interoperability of multi-vendor solutions
•Scalable
◦Ability to compose solutions at the width of the network
◦Enable self-organizing systems of composable elements that communicate horizontally
•Disaggregated
◦Pools of resources available for any use case that is defined at run time
◦Independent scaling of compute & storage elements to maximize efficiency & agility
•Extensible
◦Inclusive of both disk and flash
◦Entire ecosystem of composable elements managed & orchestrated using a common API
framework
◦Prepared for yet-to-come composable elements – e.g., memory, accelerators
1.1.2.1 Open Composable
The Western Digital Open Composable Infrastructure (OCI) uses a common API to manage and
coordinate with all fabric-attached storage including pools of flash and disk. The infrastructure also
supports the management of networking and compute resources. The API is used for all managed
elements to accelerate the ability to use disaggregated resources where components are no longer sub-
components, but core elements connected to the network.
1.1.2.2 Open Composable API (OCAPI)
Western Digital’s Open Composable API is a RESTful interface for OpenFlex that enables a Unified Fabric
Control Plane for Storage Fabric Devices. This allows for composing disaggregated storage resources—
with compute, networking, and memory—into virtual systems in the future. These virtual systems will be
dynamically provided to the right application at the right time, ensuring SLAs can be met automatically.
•Volume management (create / modify / delete namespaces, format media)
3

User Guide 1. Overview
1.1 OpenFlex™ F3100 and E3000
•Monitor hardware sensors (temperatures, voltages, fan speeds, hardware state)
•Configure hardware (update firmware, reboot individual components or systems, assert LEDs)
•Monitor performance (statistics, bandwidth, IOPS, latency)
•Capture inventory data (serial number, part number, etc.)
•Capture log information
•Configure policies (user access lists, authentication, LUN masking, HTTPS/TLS encryption/security
with certificate/key settings)
•Self-discovery of other locally-available resources configurable using the Open Composable API for
OpenFlex
1.1.2.3 OCGUI
The Open Composable Graphical User Interface (OCGUI) is the graphical representation of all of the data
shared up to the fabric by the OCAPI. This GUI is presented to the user by browsing to the IP address
of any device on the fabric. The GUI has a "command-center" design layout that presents all vital health,
utilization, and performance statistics related to devices on the network at a glance.
1.1.3 NVMe-oF
Non-Volatile Memory Express over Fabric (NVMe-oF) is one of the primary enabling technologies for the
OpenFlex platform. NVMe-oF enables the high-speed, low-latency storage performance of NVMe over
a fabric switching network. OpenFlex products drive network communications across the fabric using
100Gb/s Ethernet protocol. This allows for a complex network of computing devices to all share the same
storage resources with very high performance.
1.1.4 Supported SKUs
The following table lists the versions of this Western Digital product that are supported by this document.
Table 1: List of Supported SKUs
Component Capacity SKU
OpenFlex E3000 Chassis 3U10 Enclosure N/A 1ES1778
OpenFlex F3100 Fabric Device 2x50GbE nTAA PCIe RI-2DW/D ISE 12.8TB 1EX2413
OpenFlex F3100 Fabric Device 2x50GbE nTAA PCIe RI-0.8DW/D ISE 15.36TB 1EX2416
OpenFlex F3100 Fabric Device 2x50GbE nTAA PCIe RI-2DW/D ISE 25.6TB 1EX2414
OpenFlex F3100 Fabric Device 2x50GbE nTAA PCIe RI-0.8DW/D ISE 30.72TB 1EX2417
OpenFlex F3100 Fabric Device 2x50GbE nTAA PCIe RI-2DW/D ISE 51.2TB 1EX2415
OpenFlex F3100 Fabric Device 2x50GbE nTAA PCIe RI-0.8DW/D ISE 61.44TB 1EX2418
1.1.5 List of Compatible Devices
4

User Guide 1. Overview
1.2 System Architecture Overview
Table 2: Devices
Device Volume Bandwidth * Drive Writes Encryption Part
Number
OpenFlex F3100 Fabric Device 12.8TB 12GB/s RI-2DW/D ISE 1EX2413
OpenFlex F3100 Fabric Device 15.36TB 12GB/s RI-0.8DW/D ISE 1EX2416
OpenFlex F3100 Fabric Device 25.6TB 12GB/s RI-2DW/D ISE 1EX2414
OpenFlex F3100 Fabric Device 30.72TB 12GB/s RI-0.8DW/D ISE 1EX2417
OpenFlex F3100 Fabric Device 51.2TB 12GB/s RI-2DW/D ISE 1EX2415
OpenFlex F3100 Fabric Device 61.44TB 12GB/s RI-0.8DW/D ISE 1EX2418
1.2 System Architecture Overview
1.2.1 System High Speed Data Ingest Architecture
The system main data ingest architecture uses two separate 50G Ethernet connections each on a dual
QSFP28 connector on the rear I/O of the chassis. This completes the connection from the device that is
inserted into a chassis slot, through the backplane into the QSFP connectors. The architecture supports
the hot swap nature of the devices and do not require any sort of shut down or disconnection before
servicing. Each 100G Ethernet connection is split in half at the QSFP28 connectors resulting in 50G per
connector allowing for dual port functionality with the device.
Figure 2: System High Speed Data Ingest
1.2.2 System Thermal and Cooling
The following image displays the thermal zones as viewed from the top of the enclosure. When viewing
the enclosure from the front, the right device zone is on the right-hand side and the left device zone is
on the left-hand side. When viewing the enclosure from the rear, the order is reversed. Each of the two
thermal zones contains major components that are thermally maintained within their specific zone.
* Bandwidth obtained by sequential read
5

User Guide 1. Overview
1.2 System Architecture Overview
Figure 3: System Thermal Zones
The E3000 uses a base algorithm, called a thermal algorithm, to control the overall thermal environment of
the system. The system is mechanically separated into two thermal zones to support efficient cooling of
the system components in order to achieve the intended performance of the system. The thermal zones
are split into device zones (the left and right side of the enclosure) and center zone when standing at the
front of the system. The device thermal zones contain up to ten devices or device blanks each that are
cooled by four fan modules that are located directly behind the devices. The four fan modules behind the
devices maintain the cooling for devices contained within the device slot installed into A through J. The
center thermal zone contains the BMC module that is cooled by the fans contained in the redundant PSUs
the are located directly behind the BMC module. The different thermal zones are designed to maintain
proper thermal cooling across the entire system. During servicing the system increases the speed of the
fan modules and PSU fans to maintain a balanced thermal load.
1.2.2.1 System Thermal Algorithm
The System Thermal Algorithm is designed to use temperature sensors and defined thresholds to
determine if the algorithm will select critical, increase, decrease, or no change as the device decision.
The System Thermal Algorithm uses the concept of priorities to ensure the proper function of the system.
As a result, any critical fault results in the system ramping the fans to maximum RPMs to protect the
hardware for the duration of the fault. The fault will remain in a critical state until the fault is fully resolved
and by bringing the temperature back within the specified defined thresholds.
The System Thermal Algorithm contains minimum and maximum thresholds related to the ambient
temperature of the system. The system is designed to maintain a maximum ambient temperature of 35°C.
Exceeding 35°C may result in damage to the hardware and potentially void the product warranty. These
thresholds allow for the best possible operating conditions. If the system goes outside of the minimum or
maximum threshold window, the BMC will adjust the fan speed to accommodate the issue and a fault will
be reported. The following table lists the Thermal Algorithm Thresholds along with the related fault levels
and threshold values.
6

User Guide 1. Overview
1.3 OpenFlex F3100 and E3000 Specification Summary
The following table lists the different severity of thermal algorithm critical faults that are reported to the
user.
Table 3: Thermal Algorithm Critical Faults
Component Critical Faults
Device Any sensor >= critical
Not installed FAN
Not installed PSU
Not installed Device or Blank
BMC
Not installed BMC
Any sensor >= criticalPSU
Any critical status on SMBus
The following table lists the device decision values that the system chooses from during operation. It
describes how the pulse width modulation (PWM) of the power that is being distributed to the cooling
fans reacts to different fault types.The fault will be reported based on the severity of the thermal issue.
Table 4: Thermal Algorithm Device Decision for Fan Control
Fault Sensor Value Fan Response
Critical Sensor >= Critical 100% PWM
Increase Sensor >= Max PWM + increase step
Decrease Sensor <= Min PWM - decrease step
No Change Min < Sensor < Max Hold PWM
1.3 OpenFlex F3100 and E3000 Specification Summary
Table 5: Environmental Specifications
Specification Non-Operational Operational
Temperature -30°C to 60°C 5°C to 35°C
Temperature Gradient 30°C per hour max 20°C per hour max
Temperature De-rating 1°C per 300m above 3000m 1°C per 175m above 950m
Relative Humidity 5-95% Non-Condensing 8-85% Non-Condensing
Relative Humidity Gradient 30% per hour maximum 30% per hour maximum
Altitude -300m to 12,000m / -984 ft. to
39,370 ft
-300m to 3048m / -984 ft. to 10,000
ft.
7

User Guide 1. Overview
1.3 OpenFlex F3100 and E3000 Specification Summary
Specification Non-Operational Operational
Cooling N/A 4 Fan Modules (N+1 Supported),
containing two fans per module
Table 6: Electrical Specifications
Specification Value
Max Power Consumption 1600W
Typical Power Consumption ~1400W
Input Voltage 200V - 240V
PSU Connector Type C16
Inrush Current Maximum (per PSU) AC line inrush current shall not exceed 40A peak,
for up to one-quarter of the AC cycle after which,
the input current should be no more than the
specified maximum input current.
PSU Efficiency 80 PLUS Platinum
Table 7: Mechanical Specifications
Specification Non-Operational Operational
Shock 20G, 7ms half sine; 3 positive
and 3 negative pulses in each
axis Z and Y. X axis- 15G, 7ms half
sine, 3 positive and 3 negative
pulses
5G, 11ms half sine; 3 positive and
3 negative pulses in each axis-
minimum 6 seconds between
shocks
Vibration Linear Random: 0.50Grms;
5-500Hz; 10 minutes each axis in
X, Y, and Z
Linear Random: 0.54Grms;
1-200Hz; 60 minutes in Z axis.
Linear Random: 0.80Grms; 2 -
200Hz; 15 minutes in Z axis
Swept Sine: 0.50G, 0 - peak
swept sine; 5 - 500Hz; 1
complete sweep @ 1/2 octave
per minute
Linear Random: 0.15 Grms 5-500
Hz 10 minutes each axis in X, Y
and Z
Swept Sine:0.17 G, 0 - peak,
5-500 Hz 0.5 octaves/min,
approx. 13 minutes each axis
Weight 68.5 kg / 151.1 lbs.
Dimensions W: 447.2 mm x L: 828.04 mm x H: 130.9 mm / W: 17.6 in. x L: 32.6 in.
x H: 5.2 in.
System Installation Length 778 mm / 30.6 in. from the front rack chassis mounts to the rear of
the system
Required Rack Depth 1000 mm (39.4 in.) of usable rack space, frame to frame
Required Rack Width 450mm (17.72in.) with 465mm (18.31in.) ± 1.5mm nominal hole
spacing. See EIA-310 Rack Standard
8

User Guide 1. Overview
1.3 OpenFlex F3100 and E3000 Specification Summary
Specification Non-Operational Operational
Rack Units (U) 3U
Vertical Rack Rail Spacing 718 mm – 850 mm / 28.26 in. – 33.46 in.
Table 8: Performance Specifications
Specification Value
Number of Device Slots 10 Dual-port Fabric Device Bays
Data Transfer Rates 12GBps NVMe-oF
Max Raw Data Storage Capacity 614TB *
Ethernet Ports 20 x 50Gbps QSFP28 ( 2 per Fabric Device)
1 x 10/100/1G Ethernet
Table 9: Performance Specifications by CRU P/N
CRU P/N 1EX2413 1EX2416 1EX2414 1EX2417 1EX2415 1EX2418
Capacity/
Endurance
12.8TB
1-2DWPD
15.36TB
0.8DWPD
25.6TB
2DWPD
30.72TB
0.8DWPD
51.2TB
0.8DWPD
61.44TB
0.8DWPD
Random Read
(4KB, QD=1024)
2199K
IOPs
2111K
IOPs
2164K
IOPs
2160K
IOPs
2176K
IOPs
2191K
IOPs1
Random Write
(4KB, QD=1024)
1493K
IOPs
1433K
IOPs
1431K
IOPs
1397K
IOPs
1464K
IOPs
1400K
IOPs1
Random Mixed
70R/30W
(4KB, QD=1024)
2199K
IOPs
2137K
IOPs
2183K
IOPs
2188K
IOPs
2227K
IOPs
2251K
IOPs
Sequential Read
(128KB, QD=320)
11.8 GB/s 11.7 GB/s 11.7 GB/s 11.7 GB/s 11.7 11.7 GB/s
Sequential Write
(128KB, QD=320)
9.9 GB/s 9.9 GB/s 9.9 GB/s 9.4 GB/s 9.4 GB/s 9.9 GB/s
Random Write
Latency
(4KB, QD=1, 99.99%)
33.9 us 33.7 us 33.7 us 33.9 us 33.7 33.5 us
Notes on Testing:
•Latency measured through a single Mellanox SN2700 switch
•K IOPs = IOPs x 1000
•Devices pre-conditioned with 2 full sequential fills
* Max storage capacity depends on device version and device configuration.
9

User Guide 1. Overview
1.4 Physical Design
Table 10: Acoustic Specifications
Quantities Declared Idle
Mode
Operating
Mode
Fan Fail
Mode5Max Fan Mode
A-weighted sound power level1, LWAd {1 B = 10
dB}
8.5 8.5 9.6 9.6
Average A-weighted emission sound pressure
level2, LpAm (dB) {bystander position3}
66.0 66.0 74.9 76.2
Statistical adder for verification4, K (dB) 2.5 2.5 2.5 2.5
Notes on Acoustic Testing Methodology and Environment:
1 Declared A-weighted sound power level for a single machine, calculated per section 4.4.2 of ISO
9296-1988 and measured per ISO 3744
2 Declared A-weighted sound pressure level for a single machine, calculated per section 4.4.4 of
ISO-9296-1988 and measured per ISO 3744
3 The front and rear of the UUT were selected for the bystander location, due to access typically from the
cool or hot isle in a data center. This does not meet the four bystander positions as specified in ECMA-74
2012, but the microphones were adjusted to the preferred location.
4 The statistical adder, K, accounts for random measurement error, and is equal to 2.5 dB, which is
appropriate for a 5% risk of rejection for SR = 1.5 dB per section 4.4.2 of ISO 9296-1988.
5 At steady state condition, system/PSU fans reached 100% pwm speeds during fan fail mode testing.
•Background noise: <7dBA
•Environmental test conditions: ~23° C, 57% RH, 101.3 kPa
•Tested configuration: 3U NVMeOF VBOF device with 10 devices installed.
1.4 Physical Design
The OpenFlex F3100 and E3000 physical design emphasizes easy access to hot-swappable components,
maximization of data storage capacity in the rack, and bold aesthetic design.
10

User Guide 1. Overview
1.4 Physical Design
Figure 4: OpenFlex F3100 and E3000 Layout
The enclosure measures 447.2 mm/17.6 in. wide by 828.04 mm/32.6 in. long. It's height is 130.9 mm/5.2 in.
or 3U. The chassis installation length is 778 mm / 30.6 in. from the front rack chassis mounts to the rear of
the system.
Figure 5: OpenFlex F3100 and E3000 Dimensions
11

User Guide 1. Overview
1.4 Physical Design
1.4.1 LEDs
Chassis LEDs
Figure 6: Chassis Rear IO LEDs
Table 11: Chassis Rear IO LED Flash Patterns
LED Name Color Behavior
Ethernet Link/Activity Green Off: No Connection
Solid: Connected
Blink: Activity
Green Off: Operating at 10 Mbps
Solid: Operating at 100 Mbps
Ethernet Speed
Amber Off: Operating at 10 Mbps
Solid: Operating at 1Gpbs
Blink @ 1 Hz: Blinks only when Identification has
been activated. Will blink when any component
is identified, e.g. Fans, PSUs, etc.
Identification Blue
Off: Enclosure not being identified/located
Solid: Link operating at maximum speed
Blink (3Hz): Link activity
Green
Off: Default state
Solid: Link operating at a lower speed, 50G or
less
Blink (3Hz): Low speed link activity
QSFP28 LED
Amber
Blink (1Hz): On/Off - Identify
12

User Guide 1. Overview
1.4 Physical Design
LED Name Color Behavior
Power Green Solid:Enclosure is powered on
Off:Enclosure is powered off
Fault Amber Blink @ 2 Hz: Enclosure has a fault
Off: Enclosure has no fault
PSU LED
Figure 7: PSU LED Table 12: PSU LED Flash Patterns
LED Name Color Behavior
Green Solid: PSU is on and
reporting no faults
Blinking @ 2Hz: PSU
in firmware update
mode
Off: PSU is
disconnected from
power
Multi-
function LED
Amber Solid: PSU is
disconnected from
power or critical fault
causing a shutdown
failure
Blinking @ 0.5Hz: PSU
reporting warnings
Off: PSU is reporting
no faults
Fan Module LED
Figure 8: Fan Module LED Table 13: Fan Module LED Flash Patterns
LED Name Color Behavior
LED Amber Blinking @ 2 Hz: Fan is
reporting a fault
Blinking @ 1 Hz: Fan is
being identified
Off: Fan is on and
reporting no faults
13

User Guide 1. Overview
1.4 Physical Design
BMC Module LEDs
Figure 9: BMC Module LEDs Table 14: BMC Module LED Flash Patterns
LED Name Color Behavior
Identification Blue Blink @ 1 Hz:
Blinks only when
Identification has been
activated. Will blink
when any component
is identified.
Fault Amber Blink @ 2 Hz:
Enclosure has a fault
Off: Default State
Power Green Solid: Powered On
14