Yaesu FT-2200 Manual

FT-2200
TECHNICAL SUPPLEMENT
YAESU MUS EN CO., LTD.
C.P.O. Box 1500, Tokyo, Japan
YAESU U.S.A.
17210 Edwards Rd., Cerritos, California 90701,
U.S.A.
YAESU EUROPE B.V.
Snipweg3.1118AA Schipol, The Netherlands

-----------------
1. General Information
Introduction . . . . . . .
Case Disassembly & PCB Access
Chip Component Information .
Circuit Description . . . .
Block
Diagram . . . . . .
Interconnection
Diagram
2. Servicing
Contents
LCD, CNTL Unit Access & Pilot Lamp Replacement .
Lithium Backup Battery Replacement
Alignment
............ .
PLL VCV & Reference Oscillator
Transmitter Deviation
..... .
Receiver Interstage Transformers
Internal System AlignmentRoutine
3. Board Unit's (Schematics, Layout & Parts)
IF Unit ..
VCOUnit
APC Unit
MICAMPUnit
SRX-1 Unit.
PA Unit ..
LCD Unit
MUTE
Unit
MAIN Unit
CNTL Unit.
4. Mechanical
Exploded View
5. Accesson; Board Unit's (Specification, Layout & Parts)
FTS-27 CTCSS Tone Squelch Unit (option) ....
DVS-3 Digital Voice System Unit (option) . . ..
MW-2 Wireless Remote Microphone (accessory)
MH-26 series Microphone (accessory)
MH-27B8 Microphone (accessory)
........ .
-------~---
~
1-1
1-2
1-3
1-7
.
1-11
1-13
2-1
2-2
2-3
2-5-
2-5
2-6
2-7
3A-1
3B-1
3C-1
3D-1
3E-1
3F-1
3G-1
3I-I-1
. 3I-1
.
3J-1
................ 4-1
SA-l
SB-1
5C-1
SD-1
SE-1
~

-------------------------------------Introduction
,-,.
The information in this manual is intended
to supplement the FT-2200 Operating Manual,
for servicing the transceiver. Specifications
and
details of operation and options are provided
in the operating manual,
and are not reprinted
herein. Therefore, the manual is not intended
to serve as
an independent reference, but to be
used in conjunction with the information pro-
vided in the operating manual. The FT-2200 is
intended to
be serviced only by qualified tech-
nicians.
Two PCB layout diagrams are provided for
each double-sided circuit
board in the trans-
ceiver. Each side of the board is referred to
by
the type of the majority of components in-
stalled on that side("leaded"
or "chip-only").
In most cases one side has only chip compo-
nents,
and the other has either a mixture of
both chip and leaded components (trimmers,
coils, electrolytic
capacitors, ICs, etc.), or
leaded components only.
While
we believe the technical information
in this manual is correct, Yaesu cannot assume
liability for
any damage that may occur as a
result oftypographical
or othererrorsthatmay
be present. Your cooperation
in pointing out
any inconsistencies in the technical informa-
tion would be appreciated.
The technical information on this manual
supersedes all previously published informa-
tion
on this product. Where information is du-
plicated in this manual and the operating
manual, this manual should generally be con-
sidered more current.
Yaesu Musen reserves the right to make
changes
in the circuitry of this transceiver, in
the interest of technological improvement,
without obligation to owners.
-----------------------------1-1
FT-2200 Technical Supplement

Case Disassembly & PCB Access~~~~~-
Case Disassembly & PCB Access
Turn off the transceiver, and disconnect all
cables.
Main Unit Access ( top & botto1n)
0 Referring to figure 1, remove the eight
screws from the top cover to expose the sol-
der side of the Main Unit.
0 Remove the four screws from
the bottom
cover, to expose the component (PCB
unit's) side of
the Main Unit (Figure 2).
0 Unplug the speaker wire connector from
Jl006
on the Main Unit, and lift the loud-
speaker out of it's bracket, as shown in Fig-
ure 3.
0 Remove the screw affixing the speaker
bracket and remove the bracket.
PCB locations are indicated
in Figure 4.
Figure 1.
MAIN Unit
Figure 4.
Figure 2.
-~-IF Unit
MUTE Unit
'-'=*+--MIG AMP Unit
1-2------------------------------------------------~----------------
FT-2200 Technictll Supplement

-----------Chip Component Information
Chip ComponentInformation
The diagrams below indicate some of the
distinguishing features of common chip com-
ponents.
Ceramic Capacitors
Tantalum Capacitors
Polarized. Unmarked
(determine value from layout
and Parts List)
Resistors
T
.-
Type
1/10
1/16
INDICATED LETTERS
1 2 3 4
5 &7 :
' D•
Type
3216
2125
1608
L
2.0
I. 6
L w
3.2
1. 6
2.0
1. 25
I. 6 0.8
w T
1.25 0.45
0.8 0.45
(Unit: mm)
T
0.45~0.60
0. 35~0. 50
0.65~0.95
Type RMC 1/lOW, 1/16W
Marking* 100,222,473· .. ···
1147311
____ .IJ L-1 __
1
Ten unit
0
1
2
3
4
5
6
7
8
9
One unit Multiplier code
0
1
2
3
4
5
6
7
8
9
Examples:
100=10!1
222 = 2.2k!1
473 = 47k!1
1 0°
1 0'
102
103
1 o·
10
1
106
1 0'
108
1 og
--------------------------------------------------------------1-3
FT-2200 Teclmical Supplement

Chip Component Information~~~~~~--~~~~
Replacing Chip Components
Chip components are installedat the factory
by a series of robots. The first one places a spot
of adhesive resin at the location where each
part is to be installed, and later robots handle
and place parts using vacuum suction.
For single-sided
boards, solder paste is ap-
plied and the board is then baked to harden the
resin
and flow the solder. For double-sided
boards, no solder paste is applied, but the
board is baked (or exposed to ultra-violet light)
to cure
the resin before dip soldering.
In our laboratories and service shops, small
quantities of chip components are mounted
manually by applying a spot of resin, placing
with tweezers, and then soldering by very
small dual streams of hot air (without physical
contact
during soldering). We remove parts by
first removing solder using a vacuum suction
iron,
which applies a light, steady vacuum at
the iron tip, and then breaking the adhesive
with tweezers.
Thespecial
vacuum soldering/ de-soldering
equipment is recommended if you expect to do
a lot ofchip replacements. Otherwise, it is usu-
.ally possible to remove and replace the chip
components usiing only a tapered, tempera-
ture-controlled soldering iron, a setoftweezers
and braided copper solder wick. Soldering
iron temperature should be below 280°C
(536°F).
Precautions for Chip Replacement
X Do not disconnect the chip forcefully, or the
foil pattern may peel off the board.
X Never re-use a chip component. Dispose of
all
removed chip components immediately
to avoid mixing with new parts.
X Limit soldering time to 3 seconds or less to
avoid damaging the component and board.
Removing Chip Components
Remove the solder at each joint, one joint at
a time, using solder wick wetted with non-acid
flux as
shown below. Avoid applying pressure,
and do not attempt to remove the tinning from
the chip's electrode.
Grasp the chip on both sides with tweezers,
and gently twist the tweezers back and forth
(to
break the adhesive bond) while alternately
heating each electrode. Be careful to avoid
peeling the foil traces from the board. Displ~
of the chip when removed.
After
removing the chip, use the copper
braid and soldering iron to wick away any
excess solder and smooth the land for instaP- ·
tion of the replacement part.
1-4----------------------------------------------------------
· FT-2200 Teclmical Supplement

------------Chip Component Information
-
Installing a Replacement Chip
As the value of chip components is not indi-
cated
on the body of the chip, be careful to get
the right part for replacement.
0
Apply a small amount of solder to the land on
one side where the chip is to be installed.
Avoid too
much solder, which may cause
bridging (shorting to other parts).
0
Hold the chip with tweezers in the desired
position,
and apply the soldering iron with a
motion line that is indicated by the arrow in
the line below.
Do not apply heat for more
than 3 seconds.
0 Remove thetweezers and solderthe electrode
on the other side in the manner justdescribed.
---------------------------------------------------------------1-5
FT-2200 Technical Supplement

Notes~~~~~~~~~~~------
1-6--------------------------------------------------------------~JV1T1'~-2~2WO~O~~;.ec~h~nd.k~a~JtS~u~p~plke~n~le~n1t

----------------Circuit Description
~Receive Signal Path
Incoming RF from the antenna jack is deliv-
ered to the PA Unit and passes through a low-
pass filter consisting of coils L703 & L704,
capacitorsC712 & C713 and antenna switching
diodes, D703 & D704 (both Ml308) to the
MAll\i l.Jnit. Signals within the trequency
range of the transceiver then enter a varactor-
tuned band pass filter consisting of diode
D1012 (1 T326) & T1005 before RF amplifica-
tion
by Q1004 (3SK131). The amplified RF is
then varactor-tuned band pass filtered again by
diodes D1005, D1006, D1007 & D1008 (all
1T362)
and T1003, T1004, T1006 & T1007 be-
fore impedance matching by T1001 and enter-
~ing the 1st mixer Q1001 & Q1003 (both
2SK302).
Buffered output from the VCO Unit is am-
plified by Q1011 (2SC2759) to provide a pure
1st local signal between 126.3 and 130.3MHz
for injection to the 1st mixer. The 17.7-MHz 1st
mixer
product then passes through dual mono-
lithic crystal filters XF1001 & XF1002 (both
17T15BU: ±7.5 kHz BW) to strip away all but
the desired signal, which is then amplified by
Q1002 (2SC2620).
The amplified 1st IF signal is applied to FM
IF
subsystemIC Q201 (MC3372ML) on the IF
Unit, which contains the 2nd mixer, 2nd local
oscillator, limiter amplifier, noise amplifier,
S-
,-.,meter amplifier and squelch gates. A 2nd local
signal is generated from 17.245MHz crystal
X201, to
produce the 455kHz 2nd IF when
mixed with the 1st IF signal within Q201. The
2nd IF then passes through ceramic filter CF
1001 (CFW455E) on the MAIN Unit, to strip
away unwanted mixer products, and is then
returned to the IF Unit and applied to the
limiter amplifier
in Q201, which removes am-
plitude variations in the 455kHz IF, before de-
tection of the speech by ceramic discriminator
CD201 (CDB455C7).
Detected
audio from Q201 is fed through
mute analog switch Q906 (2SC2812) on the
MUTE Unit and then enters the MIC AMP
UNIT for de-emphasis, high-and low- pass fil-
tering by Q501 (NJM2902M-1, -3) on the MIC-
AMP Unit before returning to the MAIN Unit.
Audio output levelis controlled by VOL poten-
tiometer VR2002 on the CNTL Unit and audio
amplifier Q1020 (AN5262) before application
to audio power amplifierQ1021 (TDA2003) for
up to 2 watts for the optional headphone jack
or 8-ohm loudspeaker.
Squelch Control
The squelch circuitry consists ofa noise am-
plifier, high-pass filter & squelch trigger within
Q201, and noise detector D201 (1 SS302), both
on the IF Unit, squelch gate Q506 on the MIC-
AMP Unit, and control circuitry within micro-
processor Q2001 (HD4074629H)
on the CNTL
Unit.
When no carrier is received, noise at the
output of the detector stage of Q201 (pin 11) is
detected by D201 (1 SS302) to provide a DC
control
voltage for squelch gate control. This
voltage is delivered to NOISE/I-I TEMP pin 2
of Q2001
on the CNTL Unit. With no carrier
present, pin 2 of Q2001 is high which signals
the microprocessor to activate squelch gate
Q506 (DTC323TK) on the MIC-AMP Unit,
pulling the audio line to ground, thus silencing
the receiver while no signal is being received.
Transmit Signal Path
Speech input from the microphone is deliv-
ered via the CNTL Unit to the MIC-AMP Unit,
where it passes through Mic Amplifier Q501
(NJM2902M-4)
and Mic Mute analog switch
Q503 (UPD4052BG).
To prevent over-devia-
tion, the audio is processed by IDC (instantane-
ous deviation control) Q501 (NJM2902M-2),
and then low-pass filtered by Q501
(NJM2902M-3) before delivery to the modula-
tor on the VCO Unit.
If a CTCSS tone is enabled for transmission,
the subaudible tone from microprocessor
Q2001 on the Control Unit is lowpass filtered
-------------------~--------------------------~---------1-7
FT-2200 Technical Supplement

Circuit Description---------
by Q2013 (NJM2902M-3) and mixed with the
IDC-processed speech audio. Also, DTMF
tones from the microprocessor are applied to
the transmit audio chain at the input of the IDC
stage. The microprocessor also disables micro-
phone audio at Mic Mute analog switch Q503
via Q505 (UPD4094BG) when necessary.
The modulated audio is delivered to varac-
tor diodes D303 & D304 (Both 1T363) on the
VCO Unit, frequency modulating the PLL car-
rier up to± 5kHz from the unmodulated car-
rier at the transmitting frequency. The
modulated signal from transmitter VCO Q303
(2SC4226) is buffered by Q305 (2SC2759) and
delivered to the Main Unit for amplification by
Q1010 (2SC2759), Q1009 (MMBR951 L) and
Q1008 (2SC2538). The low-level transmit sig-
nal is then applied to the PA Unit, where it is
finally amplified by PA module Q701
(M67781 L) up to 50 watts output power. The
transmit signal then passes through antenna
switch D702 (UM9415) and is low-pass filtered
to suppress away harmonic spurious radiation
before delivery to the antenna.
Automatic Transmit Power Control
RF power output from the final amplifier is
sampled by C715 and rectified by D705
(1 SS97) on the PA Unit. The resulting DC is
passed through high/medium/low power
controller Q404 (FMS1) on the APC Unit to
Automatic Power Controller Q1012
(2SB1134S) on the MAIN Unit, which regu-
lates supply voltage to transmitter RF amplifi-
ers Q1008
and Q701, to maintain stable high,
medium or low output power under varying
antenna loading conditions.
Spurious Suppression
Generation of spurious products by the
transmitter is minimized by the fundamental
carrier frequency being equal to the final trans-
mitting frequency, m.odulated directly in the
transmit VCO. Additional harmonic suppres-
sion is provided by low-pass filter consisting of
L701, L704, L705 and C706, C707, C708, C713,
C714,C722 and C723, resulting in more than 60
dB of harmonic suppression (for transmitting'-
frequencies in the amateur band) prior to de-
livery to
the antenna.
PLL Frequency Synthesizer
PLL circuitry on the 1vfain Unit consists o£
PLL subsystem IC Q1016 (MB1504), which
contains a reference oscillatorIdivider, serial-
to-parallel
data latch, programmable divider
and a phase comparator. Stability is main-
tained by a regulated 5-V supply via Q1018
(UPD7805H) to Q1016
and temperature com-
pensating capacitors associated with 12.8 MHz
frequency reference crystal X1001.
Receiver VCO Q301 (2SC4226) on the VCG-
Unit oscillates between 126.3 MI-Iz and
130.3MHz according to the programmed re-
ceiving frequency.
The VCO output is buffered
by Q305 (2SC2759) on the VCO Unit, and then
returned to the Main Unit where a sample of
the output is buffered by Q1015 (2SC2714) for
application to the prescalar /swallow counter
section of Q1016. There the VCO signal is di-
vided by 64 or 65, according to a control signal
from the data latch section of Q1016, before
being applied to the programmable divider
section in the PLL chip.
The data latch section of Q1016 also receives
serial dividing data from microprocessor
Q2001 on the Control Unit, which causes the
pre-divided VCO signal to be further divided'-"
by 25260 to 26060 in the programmable divider
section, depending upon the desired receive
frequency, so as to
produce a 5 kHz or 6.25 kHz
derivative of the current VCO frequency.
Meanwhile, the reference divider section in
Q1016 divides the 12.8 MI-Iz crystal reference
by 2560 (or 2048) to produce the 5kHz (or 6.25
kHz) loop reference (respectively).
The 5 kHz (or 6.25 kHz) signal from the
programmable divider (derived from the
VCO) and that derived from the crystal are
applied to the phase detector section in Q1016,
which produces a dualS V pulsed output with
pulse duration depending on the phase differ-
ence between the input signals.This pulse trair\-/
1-8--------------------------------------------------------------------
FT-2200 Teclmical Supplement