Yaesu FT-2200 Manual

FT-2200

TECHNICAL

SUPPLEMENT

YAESU

MUS

EN

CO., LTD.

C.P.O. Box 1500, Tokyo,

Japan

YAESU U.S.A.

17210

Edwards

Rd.,

Cerritos,

California

90701,

U.S.A.

YAESU

EUROPE

B.V.

Snipweg3.1118AA

Schipol,

The

Netherlands

-----------------

1.

General Information

Introduction . . . . . . .

Case Disassembly & PCB Access

Chip

Component

Information .

Circuit Description . . . .

Block

Diagram

. . . . . .

Interconnection

Diagram

2.

Servicing

Contents

LCD, CNTL Unit Access & Pilot

Lamp

Replacement .

Lithium Backup Battery Replacement

Alignment

............

.

PLL VCV & Reference Oscillator

Transmitter Deviation

.....

.

Receiver Interstage Transformers

Internal

System AlignmentRoutine

3. Board Unit's (Schematics,

Layout

& Parts)

IF

Unit

..

VCOUnit

APC Unit

MICAMPUnit

SRX-1

Unit.

PA Unit

..

LCD Unit

MUTE

Unit

MAIN

Unit

CNTL

Unit.

4.

Mechanical

Exploded

View

5. Accesson; Board Unit's (Specification,

Layout

& Parts)

FTS-27

CTCSS

Tone

Squelch

Unit

(option)

....

DVS-3 Digital Voice System

Unit

(option) . .

..

MW-2 Wireless Remote

Microphone

(accessory)

MH-26 series Microphone (accessory)

MH-27B8 Microphone (accessory)

........

.

-------~---

~

1-1

1-2

1-3

1-7

.

1-11

1-13

2-1

2-2

2-3

2-5-

2-5

2-6

2-7

3A-1

3B-1

3C-1

3D-1

3E-1

3F-1

3G-1

3I-I-1

. 3I-1

.

3J-1

................

4-1

SA-l

SB-1

5C-1

SD-1

SE-1

~

-------------------------------------Introduction

,-,.

The information in this manual is intended

to supplement the

FT-2200

Operating Manual,

for servicing the transceiver. Specifications

and

details of operation

and

options are provided

in the operating manual,

and

are not reprinted

herein. Therefore, the manual is not intended

to serve as

an

independent reference,

but

to be

used in conjunction with the information pro-

vided

in the operating manual. The

FT-2200

is

intended to

be

serviced only

by

qualified tech-

nicians.

Two PCB layout diagrams are provided for

each double-sided circuit

board

in the trans-

ceiver. Each side of the board is referred to

by

the type of the majority of components in-

stalled on that side("leaded"

or

"chip-only").

In most cases one side has only chip compo-

nents,

and

the other has either a mixture of

both

chip

and

leaded components (trimmers,

coils, electrolytic

capacitors,

ICs, etc.),

or

leaded components only.

While

we

believe the technical information

in this manual is correct, Yaesu cannot assume

liability for

any

damage that

may

occur as a

result oftypographical

or

othererrorsthatmay

be present. Your cooperation

in

pointing

out

any

inconsistencies in the technical informa-

tion would be appreciated.

The technical information on this manual

supersedes all previously published informa-

tion

on

this product. Where information is

du-

plicated

in

this

manual

and

the

operating

manual, this manual should generally be con-

sidered more current.

Yaesu Musen reserves the right to make

changes

in

the circuitry of this transceiver, in

the

interest of technological

improvement,

without obligation to owners.

-----------------------------1-1

FT-2200 Technical Supplement

Case

Disassembly

& PCB

Access~~~~~-

Case

Disassembly

& PCB Access

Turn off

the

transceiver,

and

disconnect all

cables.

Main Unit

Access

(

top

&

botto1n)

0

Referring

to

figure

1,

remove

the

eight

screws from the

top

cover to expose the sol-

der

side of

the

Main

Unit.

0 Remove the four screws from

the

bottom

cover,

to

expose

the

component

(PCB

unit's) side of

the

Main

Unit

(Figure

2).

0

Unplug

the

speaker

wire connector from

Jl006

on

the

Main Unit,

and

lift

the

loud-

speaker

out

of it's bracket, as

shown

in Fig-

ure

3.

0

Remove

the

screw

affixing

the

speaker

bracket

and

remove

the

bracket.

PCB locations are indicated

in

Figure

4.

Figure

1.

MAIN

Unit

Figure

4.

Figure

2.

-~-IF

Unit

MUTE

Unit

'-'=*+--MIG

AMP

Unit

1-2------------------------------------------------~----------------

FT-2200

Technictll

Supplement

-----------Chip

Component Information

Chip ComponentInformation

The

diagrams

below

indicate

some

of

the

distinguishing

features

of

common

chip

com-

ponents.

Ceramic

Capacitors

Tantalum

Capacitors

Polarized.

Unmarked

(determine

value

from

layout

and

Parts

List)

Resistors

T

.-

Type

1/10

1/16

INDICATED LETTERS

1 2 3 4

5 &7 :

' D•

Type

3216

2125

1608

L

2.0

I. 6

L w

3.2

1.

6

2.0

1.

25

I. 6 0.8

w T

1.25

0.45

0.8 0.45

(Unit:

mm)

T

0.45~0.60

0.

35~0.

50

0.65~0.95

Type

RMC

1/lOW,

1/16W

Marking*

100,222,473·

..

···

1147311

____

.IJ

L-1

__

1

Ten

unit

0

1

2

3

4

5

6

7

8

9

One

unit

Multiplier

code

0

1

2

3

4

5

6

7

8

9

Examples:

100=10!1

222

= 2.2k!1

473

= 47k!1

1

0°

1

0'

102

103

1

o·

10

1

106

1

0'

108

1

og

--------------------------------------------------------------1-3

FT-2200 Teclmical Supplement

Chip

Component

Information~~~~~~--~~~~

Replacing Chip Components

Chip

components

are installedat the factory

by

a series

of

robots. The first

one

places a

spot

of

adhesive

resin

at

the location

where

each

part

is to

be

installed,

and

later

robots

handle

and

place

parts

using

vacuum

suction.

For single-sided

boards,

solder

paste

is

ap-

plied

and

the

board

is

then

baked

to

harden

the

resin

and

flow the solder. For double-sided

boards,

no

solder

paste

is

applied,

but

the

board

is

baked

(or

exposed

to ultra-violet light)

to cure

the

resin before

dip

soldering.

In

our

laboratories

and

service

shops,

small

quantities of chip

components

are

mounted

manually

by

applying

a

spot

of

resin, placing

with

tweezers,

and

then

soldering

by

very

small

dual

streams

of

hot

air

(without

physical

contact

during

soldering).

We

remove

parts

by

first

removing

solder

using

a

vacuum

suction

iron,

which

applies a light,

steady

vacuum

at

the

iron

tip,

and

then

breaking

the

adhesive

with

tweezers.

Thespecial

vacuum

soldering/

de-soldering

equipment

is

recommended

if

you

expect to

do

a lot ofchip replacements. Otherwise,

it

is

usu-

.ally possible to

remove

and

replace the chip

components

usiing

only

a

tapered,

tempera-

ture-controlled

soldering

iron, a setoftweezers

and

braided

copper

solder

wick.

Soldering

iron

temperature

should

be

below

280°C

(536°F).

Precautions for Chip Replacement

X Do

not

disconnect the chip forcefully,

or

the

foil

pattern

may

peel

off the

board.

X

Never

re-use a chip component. Dispose of

all

removed

chip

components

immediately

to

avoid

mixing

with

new

parts.

X Limit

soldering

time

to 3 seconds

or

less to

avoid

damaging

the

component

and

board.

Removing

Chip Components

Remove

the

solder

at

each joint,

one

joint

at

a time,

using

solder

wick

wetted

with

non-acid

flux as

shown

below. Avoid

applying

pressure,

and

do

not

attempt

to

remove

the

tinning

from

the chip's electrode.

Grasp

the

chip

on

both

sides

with

tweezers,

and

gently

twist

the

tweezers

back

and

forth

(to

break

the

adhesive

bond)

while alternately

heating

each

electrode.

Be

careful to

avoid

peeling

the

foil traces from the board.

Displ~

of

the chip

when

removed.

After

removing

the

chip,

use

the

copper

braid

and

soldering

iron

to wick

away

any

excess

solder

and

smooth

the

land

for instaP- ·

tion

of

the

replacement

part.

1-4----------------------------------------------------------

·

FT-2200

Teclmical

Supplement

------------Chip

Component Information

-

Installing a Replacement Chip

As the

value

of chip components

is

not

indi-

cated

on

the

body

of

the

chip,

be

careful to get

the

right

part

for replacement.

0

Apply

a small

amount

of

solder

to the

land

on

one side

where

the chip is to be installed.

Avoid too

much

solder,

which

may

cause

bridging

(shorting to

other

parts).

0

Hold

the chip

with

tweezers in

the

desired

position,

and

apply

the soldering iron

with

a

motion

line

that

is indicated

by

the

arrow

in

the line below.

Do

not

apply

heat

for

more

than

3 seconds.

0 Remove thetweezers

and

solderthe electrode

on

the

other

side

in

the

manner

justdescribed.

---------------------------------------------------------------1-5

FT-2200 Technical Supplement

Notes~~~~~~~~~~~------

1-6--------------------------------------------------------------~JV1T1'~-2~2WO~O~~;.ec~h~nd.k~a~JtS~u~p~plke~n~le~n1t

----------------Circuit

Description

~Receive

Signal Path

Incoming

RF

from

the

antenna

jack is deliv-

ered

to the PA

Unit

and

passes

through

a low-

pass

filter consisting of coils L703 & L704,

capacitorsC712 & C713

and

antenna

switching

diodes,

D703 & D704

(both

Ml308) to

the

MAll\i l.Jnit.

Signals

within

the

trequency

range

of

the

transceiver

then

enter

a varactor-

tuned

band

pass

filter

consisting

of

diode

D1012

(1

T326) & T1005 before RF amplifica-

tion

by

Q1004 (3SK131).

The

amplified

RF is

then

varactor-tuned

band

pass filtered

again

by

diodes

D1005, D1006, D1007 & D1008 (all

1T362)

and

T1003, T1004, T1006 & T1007 be-

fore

impedance

matching

by

T1001

and

enter-

~ing

the

1st

mixer

Q1001

&

Q1003

(both

2SK302).

Buffered

output

from

the

VCO

Unit

is

am-

plified

by

Q1011 (2SC2759) to

provide

a

pure

1st local signal

between

126.3

and

130.3MHz

for injection to

the

1st

mixer. The 17.7-MHz 1st

mixer

product

then

passes

through

dual

mono-

lithic crystal filters XF1001 & XF1002 (both

17T15BU:

±7.5

kHz

BW)

to

strip

away

all

but

the

desired

signal,

which

is

then

amplified

by

Q1002 (2SC2620).

The

amplified

1st IF signal is

applied

to FM

IF

subsystemIC

Q201 (MC3372ML)

on

the

IF

Unit,

which

contains

the

2nd

mixer,

2nd

local

oscillator, limiter amplifier, noise amplifier,

S-

,-.,meter

amplifier

and

squelch

gates. A

2nd

local

signal

is

generated

from

17.245MHz crystal

X201, to

produce

the

455kHz

2nd

IF

when

mixed

with

the

1st IF signal

within

Q201. The

2nd

IF

then

passes

through

ceramic filter

CF

1001 (CFW455E)

on

the

MAIN

Unit, to

strip

away

unwanted

mixer

products,

and

is

then

returned

to

the

IF

Unit

and

applied

to the

limiter amplifier

in

Q201,

which

removes

am-

plitude

variations

in

the

455kHz

IF,

before

de-

tection of

the

speech

by

ceramic

discriminator

CD201 (CDB455C7).

Detected

audio

from

Q201 is

fed

through

mute

analog

switch

Q906 (2SC2812)

on

the

MUTE Unit

and

then

enters

the

MIC

AMP

UNIT

for

de-emphasis,

high-and

low-

pass

fil-

tering

by

Q501 (NJM2902M-1, -3)

on

the MIC-

AMP

Unit before

returning

to

the

MAIN

Unit.

Audio

output

levelis

controlled

by

VOL

poten-

tiometer

VR2002

on

the CNTL

Unit

and

audio

amplifier Q1020 (AN5262) before application

to

audio

power

amplifierQ1021 (TDA2003) for

up

to 2

watts

for

the

optional

headphone

jack

or

8-ohm

loudspeaker.

Squelch Control

The

squelch

circuitry consists ofa noise

am-

plifier,

high-pass

filter &

squelch

trigger

within

Q201,

and

noise

detector

D201

(1

SS302),

both

on

the

IF Unit,

squelch

gate

Q506

on

the MIC-

AMP

Unit,

and

control

circuitry

within

micro-

processor Q2001 (HD4074629H)

on

the CNTL

Unit.

When

no

carrier is received, noise

at

the

output

of

the

detector stage of Q201 (pin

11)

is

detected

by

D201

(1

SS302)

to

provide

a DC

control

voltage

for squelch

gate

control. This

voltage

is

delivered

to NOISE/I-I TEMP

2

of Q2001

on

the

CNTL Unit. With no carrier

present,

2 of Q2001 is

high

which

signals

the

microprocessor

to activate

squelch

gate

Q506

(DTC323TK)

on

the

MIC-AMP

Unit,

pulling

the

audio

line to

ground,

thus

silencing

the

receiver

while

no

signal

is

being

received.

Transmit Signal Path

Speech

input

from

the

microphone

is deliv-

ered

via

the

CNTL

Unit

to

the

MIC-AMP Unit,

where

it

passes

through

Mic Amplifier Q501

(NJM2902M-4)

and

Mic

Mute

analog

switch

Q503 (UPD4052BG).

To

prevent

over-devia-

tion,

the

audio

is

processed

by

IDC (instantane-

ous

deviation

control) Q501 (NJM2902M-2),

and

then

low-pass

filtered

by

Q501

(NJM2902M-3) before

delivery

to

the

modula-

tor

on

the

VCO Unit.

If

a CTCSS

tone

is

enabled

for transmission,

the

subaudible

tone

from

microprocessor

Q2001

on

the

Control

Unit

is

lowpass

filtered

-------------------~--------------------------~---------1-7

FT-2200 Technical Supplement

Circuit

Description---------

by

Q2013 (NJM2902M-3)

and

mixed

with

the

IDC-processed

speech

audio.

Also,

DTMF

tones

from

the

microprocessor are

applied

to

the

transmit

audio

chain

at

the

input

of

the

IDC

stage. The microprocessor also disables micro-

phone

audio

at

Mic

Mute

analog

switch Q503

via

Q505 (UPD4094BG)

when

necessary.

The

modulated

audio

is

delivered

to varac-

tor

diodes

D303 & D304 (Both 1T363)

on

the

VCO

Unit, frequency

modulating

the

PLL car-

rier

up

to±

5kHz

from the

unmodulated

car-

rier

at

the

transmitting

frequency.

The

modulated

signal

from

transmitter

VCO Q303

(2SC4226) is buffered

by

Q305 (2SC2759)

and

delivered

to

the

Main

Unit

for amplification

by

Q1010 (2SC2759), Q1009 (MMBR951

L)

and

Q1008 (2SC2538). The low-level

transmit

sig-

nal

is

then

applied

to

the

PA

Unit,

where

it is

finally

amplified

by

PA

module

Q701

(M67781

L)

up

to 50

watts

output

power.

The

transmit

signal

then

passes

through

antenna

switch

D702 (UM9415)

and

is

low-pass filtered

to

suppress

away

harmonic

spurious

radiation

before

delivery

to the

antenna.

Automatic

Transmit

Power

Control

RF

power

output

from

the final amplifier is

sampled

by

C715

and

rectified

by

D705

(1

SS97)

on

the

PA Unit. The

resulting

DC is

passed

through

high/medium/low

power

controller Q404 (FMS1)

on

the

APC

Unit

to

Automatic

Power

Controller

Q1012

(2SB1134S)

on

the

MAIN

Unit,

which

regu-

lates

supply

voltage

to

transmitter

RF amplifi-

ers Q1008

and

Q701, to

maintain

stable

high,

medium

or

low

output

power

under

varying

antenna

loading

conditions.

Spurious Suppression

Generation

of

spurious

products

by

the

transmitter

is

minimized

by

the

fundamental

carrier

frequency

being

equal

to the final trans-

mitting

frequency, m.odulated directly

in

the

transmit

VCO.

Additional

harmonic

suppres-

sion

is

provided

by

low-pass

filter consisting of

L701, L704, L705

and

C706, C707, C708, C713,

C714,C722

and

C723,

resulting

in

more

than

60

dB of

harmonic

suppression

(for

transmitting'-

frequencies

in

the

amateur

band)

prior

to de-

livery to

the

antenna.

PLL Frequency

Synthesizer

PLL circuitry

on

the 1vfain Unit consists

o£

PLL

subsystem

IC Q1016 (MB1504),

which

contains a reference oscillatorIdivider, serial-

to-parallel

data

latch,

programmable

divider

and

a

phase

comparator.

Stability is

main-

tained

by

a

regulated

5-V

supply

via Q1018

(UPD7805H) to Q1016

and

temperature

com-

pensating

capacitors associated

with

12.8

MHz

frequency

reference crystal X1001.

Receiver VCO Q301 (2SC4226)

on

the

VCG-

Unit

oscillates

between

126.3

MI-Iz

and

130.3MHz

according

to

the

programmed

re-

ceiving frequency.

The

VCO

output

is

buffered

by

Q305 (2SC2759)

on

the

VCO Unit,

and

then

returned

to

the

Main

Unit

where

a

sample

of

the

output

is

buffered

by

Q1015 (2SC2714) for

application

to

the

prescalar

/swallow

counter

section

of

Q1016. There

the

VCO

signal

is di-

vided

by

64

or

65,

according

to a

control

signal

from

the

data

latch

section of Q1016, before

being

applied

to the

programmable

divider

section in

the

PLL chip.

The

data

latch section of Q1016 also receives

serial

dividing

data

from

microprocessor

Q2001

on

the

Control

Unit,

which

causes

the

pre-divided

VCO

signal

to

be

further

divided'-"

by

25260 to 26060

in

the

programmable

divider

section,

depending

upon

the

desired

receive

frequency, so as to

produce

a 5

kHz

or

6.25

kHz

derivative

of

the

current

VCO

frequency.

Meanwhile,

the

reference

divider

section

in

Q1016

divides

the

12.8 MI-Iz crystal reference

by

2560 (or 2048) to

produce

the

5kHz

(or 6.25

kHz)

loop

reference (respectively).

The

5

kHz

(or 6.25

kHz)

signal

from

the

programmable

divider

(derived

from

the

VCO)

and

that

derived

from the crystal are

applied

to

the

phase

detector

section

in

Q1016,

which

produces

a

dualS

V

pulsed

output

with

pulse

duration

depending

on

the

phase

differ-

ence

between

the

input

signals.This

pulse

trair\-/

1-8--------------------------------------------------------------------

FT-2200 Teclmical Supplement

Yaesu FT-2200 Manual

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