Yamaha A5000 Editor User manual

HAMAMATSU,JAPAN
1.57K-859 I Printed in Japan2000.01
CONTENTS
SPECIFICATIONS ................................................................................3
PANEL LAYOUT ..................................................................................4
CIRCUITBOARDLAYOUT ...................................................................5
BLOCKDIAGRAM ...............................................................................6
DISASSEMBLY PROCEDURE ............................................................7
LSIPINDESCRIPTION ......................................................................10
IC BLOCK DIAGRAM .........................................................................16
TEST PROGRAM ............................................................................. 19
ERROR MASSAGE ...........................................................................31
MIDIDATAFORMAT ..........................................................................32
MIDIIMPLEMENTATIONCHART........................................................43
PARTSLIST
OVERALLCIRCUITDIAGRAM
CIRCUITBOARDS
SERVICE MANUAL
SY 011491
A500019991210-229000
A400019991210-149000
PROFESSIONAL SAMPLER

A5000/A4000
IMPORTANT NOTICE
This manual has been provided for the use of authorized Yamaha Retailers and their service personnel. It has been
assumed that basic service procedures inherent to the industry, and more specifically Yamaha Products, are
already known and understood by the users, and have therefore not been restated.
WARNING: Failure to follow appropriate service and safety procedures when servicing this product may
result in personal injury, destruction of expensive components and failure of the product to per
form as specified. For these reasons, we advise all Yamaha product owners that all service
required should be performed by an authorized Yamaha Retailer or the appointed service
repre sentative.
IMPORTANT: This presentation or sale of this manual to any individual or firm does not constitute authoriza-
tion, certification, recognition of any applicable technical capabilities, or establish a principal-
agent relationship of any form.
The data provided is believed to be accurate and applicable to the unit(s) indicated on the cover. The research
engineering, and service departments of Yamaha are continually striving to improve Yamaha products. Modifica-
tions are, therefor, inevitable and changes in specification sre subject to change without notice or obligation to
retrofit. Should any discrepancy appear to exist, please contact the distributor's Service Division.
WARNING: Static discharges can destroy expensive components. Discharge any static electricity your
body may have accumulated by grounding yourself to the ground buss in the unit (heavy gauge
black wires connect to this buss).
IMPORTANT: Turn the unit OFF during disassembly and parts replacement. Recheck all work before you
apply power to the unit.
WARNING: CHEMICAL CONTENT NOTICE!
The solder used in the production of this product contains LEAD. In addition, other electrical / electronic and / or
plastic (where applicable) components may also contain traces of chemicals found by the California Health and
Welfare Agency (and possibly other entities) to cause cancer and / or birth defects or other reproductive harm.
DO NOT PLACE SOLDER, ELECTRICAL / ELECTRONIC OR PLASTIC COMPONENTS IN YOUR MOUTH FOR ANY
REASON WHAT SO EVER!
Avoid prolonged, unprotected contact between solder and your skin! When soldering, do not inhale solder fumes or
expose eyes to solder / flux vapor!
If you come in contact with solder or components located inside the enclosure of this product, wash your hands
before handling food.
WARNING
Components having special characteristics are marked and must be replaced with parts having specification equal to those
originally installed.

A5000/A4000
3
SPECIFICATION
Tone generation method
AWM2 tone generator
Maximum Polyphony
126 notes (64 notes on the A4000), 32 multi-timbre parts (16 parts on the A4000)
A/D conversion
20 bit 64-times oversampling
D/A conversion
24 bit 8-times oversampling
Digital I/O (only when AIEB1 I/O expansion board is installed)
Input/output DIGITAL connectors S/P-DIF (coaxial)
OPTICAL connectors S/P-DIF (optical)
Input frequency 48 kHz, 44.1 kHz, 32 kHz
Output frequency 44.1 kHz
Sampling frequency
Analog input 44.1, 22.05, 11.025 kHz, 5.5125 kHz (mono and stereo)
Digital input (only when AIEB1 I/O expansion board is installed)
48 kHz, 44.1 kHz, 32 kHz external synchronized recording
(stereo only)
1/2, 1/4 and 1/8 undersampling is supported
Internal sample memory capacity
Standard 4 Mbytes (installed on-board)
Maximum 128 Mbytes
(When four 32 Mbyte 72 pin SIMM modules are installed. The on-
board 4 Mbytes are unused only if memory has been expanded to the
maximum.)
Sampling time
Maximum sample length
32 Mbytes monaural
64 Mbytes stereo
Maximum sampling time (mono or stereo)
6 minutes 20 seconds (44.1 kHz)
12 minutes 40 seconds (22.05 kHz)
25 minutes 21 seconds (11.025 kHz)
50 minutes 43 seconds (5.5125 kHz)
Effects
6 effect blocks (3 on the A4000)
Total equalizer (4 bands)
Sample equalizer
Program
128 program
Sequencer
Real-time recording and playback
Front panel
POWER switch
INPUT L,R jacks (phone x 2)
REC VOLUME (L& R shared)
MASTER VOLUME (L&R shared, STEREO OUT & PHONES shared)
PHONES OUTPUT jack
Knobs (1 - 5)
Mode buttons (PLAY, EDIT, REC, DISK, UTILITY)
Function buttons (six buttons)
COMMAND/EXIT button
ASSIGNABLE button
AUDITION button
LCD (320 x 80 dot, LED backlight)
LCD contrast control
3.5" 2HD/2DD dual mode floppy disk drive
Rear panel
STEREO OUT L/MONO, R (phone jack x 2)
ASSIGNABLE OUT L, R (phone jack x 2)
MIDI IN-A/B, OUT, THRU-A/B (IN, OUT, THRU on the A4000)
SCSI (half-pitch, 50-pin)
Expansion board slot
Power supply connector (AC inlet)
Fan
Dimensions
Two-space rackmount unit
W 480 mm x D 461 mm x H 90 mm (18-7/8” x 18-1/8” x 3-9/16”)
Weight
8.0 kg (17l bs 10 oz)
Included items
Power cable x1
CD-ROM set
(See the separate “Guide for the Accompanying Disks” booklet)
FD x 4
Power Cable for Internal Hard Disk (long) x1
Power Cable for ZIP Drive (short) x 1
SCSI Cable for Internal Hard Disk x 1
IDE Cable for Internal Hard Disk x 1
Owner’s manual x1
Options (made by Yamaha)
AIEB1: I/O expansion board
Internal expansion devices (made by other manufacturers)
Expansion memory
(use a pair of identical-size 72pin SIMM modules of the following types)
Access time 70 ns or less
Bit Width x 32 (no parity) or x 36 bit (parity)
Fast Page or EDO, JEDEC standard.
Capacity 4 megabyte/8 megabyte/16 megabyte/32 megabyte
Internal hard disk drive (3.5 inch) performance requirements
Interface 50-pin SCSI or 40-pin IDE
Power supply +5V maximum840mA
+12 V maximum2400mA
Internal ZIP Drive
Interface 40-pin IDE (ATAPI)
Power supply +5V 0.8 A

A5000/A4000
4
PANEL LAYOUT
Front Panel
Rear Panel
1 AC inlet
2 Midi In-A, In-B, Out, Thru-A, Thru-B (A5000)
connectors / Midi In, Out, Thru (A4000) connectors
3 Assignable Out L, R jacks
4 Stereo Out L/Mono, R jacks
5 SCSI connector
6 Optical In, Out connectors
7 Digital In, Out connectors
8 Assignable Out jacks 1-6
1 Master Vol [Master Volume]
2 Rec Vol [Recording Volume]
3 Phones jack
4 Input L, Input R jacks
5 LCD Contrast
6 Display
7 Knobs 1-5
8 Mode buttons
9 Function buttons [F1]-[F6]
10 Command Exit button
11 Assignable button
12 Audition button
13 Floppy Disk Drive
14 Power switch

A5000/A4000
5
CIRCUIT BOARD LAYOUT

A5000/A4000
6
BLOCK DIAGRAM
28CA1-8815099

A5000/A4000
7
1. Top Cover
1-1 Remove the sixteen (16) screws marked [510] and slide the Top Cover to the back side. The top cover can be then
removed.
DISASSEMBLY PROCEDURE
2. Circuit Boards and Unit
After removing the top cover, remove the following screws. Each circuit board can then be removed.
Note: *1 Before removing the DM, remove the HDD Ass'y.
*2 Two for A4000.
*3 Before removing the FDD Ass'y and the PS cover Ass'y, remove the Push Rod.
*4 Before removing the PS and Fan Ass’y, remove the PS cover Ass’y.
(Fig.1)
Circuit Boards and Unit Ref.No. Screw Qty
HDDBracket
DM*1
FDD Bracket*3
PS Cover Ass'y
PS*4
Fan Ass’y*4
[220]
[120]
[130]
[140]
[150]
[190]
[90]
[100]
[30]
[50]
[60]
[L40]
[L50]
Bind Head Tapping Screw-B 3.0X6 MFZN2Y (EP600130) (fig.2)
Bind Head Tapping Screw-B 3.0X6 MFZN2Y (EP600130) (fig.3)
Bonding Head Screw-B 3.0X10 MFZN2BL (VQ049800)(fig.3)
Bind Head Tapping Screw-P 3.0X8 MFZN2BL (EP630220) (fig.3)
Pan Head Screw 2.5X6 SUS (VV342700)(fig.3)
Bind Head Tapping Screw-B 3.0X6 MFZN2Y (EP600130) (fig.2)
Bonding Head Screw-B 3.0X10 MFZN2BL (VQ049800)(fig.2)
Bind Head Tapping Screw-B 4.0X8 MFZN2BL (EG340190) (fig.2)
Bind Head Tapping Screw-B 3.0X6 MFZN2Y (EP600130) (fig.3)
Bind Head Tapping Screw-P 3.0X8 MFZN2BL (EP630220) (fig.2)
Bind Head Tapping Screw-B 4.0X8 MFZN2BL (EG340190) (fig.3)
Flat Head Screw 3.0X25 MFN133 (V4814400) (fig.3)
Hexagonal Nut 3.0 MFZN2Y (VA211900) (fig.3)
4
13
2
4(2)*2
2
4
3
2
7
2
1
4
4

A5000/A4000
8
3. Front Panel
3-1 Remove the knob marked [440], [450], [460].
3-2 Remove the three (3) screws marked [410]. And remove the Front Panel from the Lower Case Assembly.
(Fig.2)
(Fig.3)
(Fig.4)

A5000/A4000
9
4. Circuit Boards and Unit
After removing the front panel, remove the following screws. Each circuit board can then be removed.(Fig.5)
(Fig.5)
Ref.No. Screw Qty
JK
RE
VR
PNA
LCD
[S230]
[L170]
-
-
[L170]
[S140]
[S70]
[S110]
Hexagonal Nut 14X2 M12 (ES200210)
Bind Head Tapping-B 3.0X6 MFZN2Y (EP600130)
Washer
Nut
Bind Head Tapping-B 3.0X6 MFZN2Y (EP600130)
Bind Head Tapping-B 3.0X6 MFZN2Y (EP600130)
Cup Tapping Screw-B 3.0X6 MFZN2Y (V2644100)
Bind Head Tapping-B 3.0X6 MFZN2Y (EP600130)
3
2
5
5
2
4
4
4
Circuit Boards and Unit

A5000/A4000
10
LSI PIN DESCRIPTION
(IC507)TC203C760HF-002 (XS725A00) SWP30B (AWM Tone Generator coped with MEG) Standard Wave Processor
PIN
NO. NAME I/O FUNCTION PIN NO. NAME I/O FUNCTION
1Vss
(
Ground
)
121 VSS -
(
Ground
)
2 CA0 I 122 HMD0 I/O
3 CA1 I 123 HMD1 I/O
4 CA2 I 124 HMD2 I/O
5 CA3 I 125 HMD3 I/O
6 CA4 I 126 HMD4 I/O
7 CA5 I Address bus of internal re
g
ister 127 HMD5 I/O
8 CA6 I 128 HMD6 I/O Wave memor
y
data bus
(
Upper 16 bits
)
9 CA7 I 129 HMD7 I/O
10 CA8 I 130 HMD8 I/O
11 CA9 I 131 HMD9 I/O
12 CA10 I 132 HMD10 I/O
13 CA11 I 133 HMD11 I/O
14 VSS -
(
Ground
)
134 HMD12 I/O
15 CD0 I/O 135 HMD13 I/O
16 CD1 I/O 136 HMD14 I/O
17 CD2 I/O 137 HMD15 I/O
18 CD3 I/O 138 VSS -
(
Ground
)
19 CD4 I/O 139 HMA0 O
20 CD5 I/O 140 HMA1 O
21 CD6 I/O 141 HMA2 O
22 CD7 I/O 142 HMA3 O
23 CD8 I/O Data bus of internal re
g
ister 143 HMA4 O
24 CD9 I/O 144 HMA5 O
25 CD10 I/O 145 HMA6 O
26 CD11 I/O 146 HMA7 O
27 CD12 I/O 147 HMA8 O
28 CD13 I/O 148 HMA9 O
29 CD14 I/O 149 HMA10 O
30 VDD - (Power supply) 150 VDD - (Power supply)
31 VSS - (Ground) 151 VSS - (Ground)
32 CD15 I/O 152 HMA11 O
33 CSN I Chip select 153 HMA12 O Wave memor
y
address bus
34 WRN I Write strobe 154 HMA13 O
35 RDN I Read strobe 155 HMA14 O
36 VDD -
(
Power suppl
y)
156 HMA15 O
37 SYSH0 O 157 HMA16 O
38 SYSH1 O 158 HMA17 O
39 SYSH2 O 159 HMA18 O
40 SYSH3 O NSYS/LNSYS upper 16 bits output 160 HMA19 O
41 SYSH4 O 161 HMA20 O
42 SYSH5 O 162 HMA21 O
43 SYSH6 O 163 HMA22 O
44 SYSH7 O 164 HMA23 O
45 KONO0 O 165 HMA24 O
46 KONO1 O Ke
y
on data 166 VSS -
(
Ground
)
47 KONO2 O 167 MRASN O RAS when DRAM
(
s
)
is connected to wave memor
y
48 KONO3 O 168 MCASN O CAS when DRAM
(
s
)
is connected to wave memor
y
49 VSS -
(
Ground
)
169 MOEN O Wave memor
y
output enable
50 SYSL0 I/O 170 MWEN O Wave memor
y
write enable
51 SYSL1 I/O 171 VSS -
(
Ground
)
52 SYSL2 I/O 172 LMD0 I/O
53 SYSL3 I/O NSYS input/LNSYS output lower 8 bits 173 LMD1 I/O
54 SYSL4 I/O 174 LMD2 I/O
55 SYSL5 I/O 175 LMD3 I/O
56 SYSL6 I/O 176 LMD4 I/O
57 SYSL7 I/O 177 LMD5 I/O
58 KONI0 I 178 LMD6 I/O
59 KONI1 I Key on data input 179 LMD7 I/O Wave memory data bus (Lower 16 bits)
60 VDD - (Power supply) 180 VDD - (Power supply)
61 VSS - (Ground) 181 VSS - (Ground)
62 KONI2 I 182 LMD8 I/O
63 KONI3 I 183 LMD9 I/O
64 DAC0 O DAC output 184 LMD10 I/O
65 DAC1 O 185 LMD11 I/O
66 WCLK O DAC0/DAC1 word clock 186 LMD12 I/O
67 MELO0 O 187 LMD13 I/O
68 MELO1 O 188 LMD14 I/O
69 MELO2 O 189 LMD15 I/O
70 MELO3 O MEL wave data output 190 VSS -
(
Ground
)
71 MELO4 O 191 LMA0 O
72 MELO5 O 192 LMA1 O
73 MELO6 O 193 LMA2 O
74 MELO7 O 194 LMA3 O
75 VDD -
(
Power suppl
y)
195 LMA4 O
76 ADLR O ADC word clock 196 LMA5 O
77 MELI0 I 197 LMA6 O
78 MELI1 I 198 LMA7 O
79 MELI2 I 199 LMA8 O
80 MELI3 I MEL wave data input 200 LMA9 O
81 MELI4 I 201 LMA10 O
82 MELI5 I 202 LMA11 O
83 MELI6 I 203 VSS -
(
Ground
)
84 MELI7 I 204 LMA12 O
85 VSS -
(
Ground
)
205 LMA13 O Wave memor
y
address bus
(
Lower data memor
y)
86 RCASN O DRAM column address strobe
(
RAS si
g
nal
)
206 LMA14 O
87 RA8 O 207 LMA15 O
88 RA7 O 208 LMA16 O
89 RA6 O 209 LMA17 O
90 VDD - (Power supply) 210 VDD - (Power supply)
91 VSS - (Ground) 211 VSS - (Ground)
92 RA5 O DRAM address bus 212 LMA18 O
93 RA4 O 213 LMA19 O
94 RA3 O 214 LMA20 O
95 RA2 O 215 LMA21 O
96 RA1 O 216 LMA22 O
97 RA0 O 217 LMA23 O
98 RRASN O DRAM row address strobe
(
RAS si
g
nal
)
218 LMA24 O
99 RWEN O DARM write enable 219 VSS -
(
Ground
)
100 VSS -
(
Ground
)
220 SYO O S
y
nc.si
g
nal for master clock
101 RD7 I/O 221 SYOD O S
y
nc.si
g
nal for HCLK/QCLK
102 RD6 I/O 222 QCLK O 1/12 master clock
(
64Fs
)
103 RD5 I/O 223 HCLK O 1/6 master clock
(
128Fs
)
104 RD4 I/O 224 CK256 O 1/3 master clock
(
256Fs
)
105 RD3 I/O 225 SYSCLK O 1/2 master clock
(
384Fs
)
106 RD2 I/O 226 VDD -
(
Power suppl
y)
107 RD1 I/O 227 SYI I S
y
nc.clock
108 RD0 I/O 228 MCLKI I Master clock input
109 VSS -
(
Ground
)
229 MCLKO O Master clock output
110 RD17 I/O 230 VDD -
(
Power suppl
y)
111 RD16 I/O DRAM data bus 231 XIN I Cr
y
stal osc. input
112 RD15 I/O 232 XOUT O Cr
y
stal osc. output
113 RD14 I/O 233 VSS -
(
Ground
)
114 RD13 I/O 234 ICN I Initial clear
115 RD12 I/O 235 CHIP2 I 2 chips mode enable
116 RD11 I/O 236 SLAVE I Master/Slave select when 2 chipsmode
117 RD10 I/O 237 TESTON I
118 RD9 I/O 238 ACIN I Test pin
119 RD8 I/O 239 DCTEST I
120 VDD -
(
Power suppl
y)
240 VDD -
(
Power suppl
y)