
CLM920_NC3 module hardware usage guide
Shang Hai YUGE Information Technology co., LTD
3.12 I2C bus...................................................................................................................... 43
3.13 SDIO interface.......................................................................................................... 44
3.14 SPI Interface / Multiplexed I2S Interface................................................................. 48
3.15 MCLK Interface........................................................................................................50
3.16 ADC interface............................................................................................................50
3.17 RF interface...............................................................................................................50
3.17.1 Main Set Antenna Interface............................................................................51
3.17.2 Diversity Antenna Interface........................................................................... 51
3.17.3 GNSS interface...............................................................................................52
3.17.4 RF Trace Reference........................................................................................53
3.17.5 RF Connector Size......................................................................................... 54
Chapter 4 Overall Technical Indicators.....................................................................................56
4.1 Overview of this chapter............................................................................................. 56
4.2 GNSS receiving performance..................................................................................... 56
4.3 Working frequency......................................................................................................57
4.4 Conducted RF measurements......................................................................................57
4.4.1 Test environment..............................................................................................57
4.4.2 Test Standards.................................................................................................. 57
4.5 Conducted Receive Sensitivity and Transmit Power.................................................. 58
4.6 Antenna requirements..................................................................................................59
4.7 Power consumption characteristics.............................................................................60
Chapter 5 Interface Electrical Characteristics...........................................................................64
5.1 Overview of this chapter............................................................................................. 64
5.2 Working storage temperature...................................................................................... 64
5.3 Module IO Level.........................................................................................................64
5.4 Power supply...............................................................................................................64
5.5 Electrostatic characteristics.........................................................................................65
5.6 Reliability Index..........................................................................................................65
Chapter 6 Structural and Mechanical Properties.......................................................................67
6.1 Overview of this chapter............................................................................................. 67
6.2 Appearance..................................................................................................................67
Chapter 7 Packaging and Production........................................................................................ 70
7.1 Overview of this chapter............................................................................................. 70
7.2 Module Packaging and Storage...................................................................................70