YUGE CLM920 TD3 Parts list manual

Product Name
CLM920 TD3 LTE Module Hardware
Usage Guide
Number of Pages
79
Produce Version
V1.0
Date
2019/5/6
CLM920 TD3 LTE Module
Hardware Usage Guide
V1.0
Shanghai Yuge Information Technology co., LTD
All rights reserved

CLM920 TD3 LTE Module Hardware Usage Guide
Shanghai Yuge Information Technology co., LTD
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Update records
Version
Date
Author
Description
V1.0
20190506
David
Initial

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Contents
Chapter 1 Introduction............................................................................................................- 9 -
Chapter 2 Module review..................................................................................................... - 10 -
2.1 Module introduction............................................................................................... - 10 -
2.2 Module characteristics............................................................................................- 10 -
2.3 Module function..................................................................................................... - 14 -
Chapter 3 Interface application description..........................................................................- 16 -
3.1 Chapter overview....................................................................................................- 16 -
3.2 Module interface.....................................................................................................- 17 -
3.2.1 144-pin LCC interface.................................................................................- 17 -
3.2.2 Interface definition...................................................................................... - 17 -
3.3 Power interface.......................................................................................................- 28 -
3.3.1 Power supply design....................................................................................- 28 -
3.3.2 Power reference circuit................................................................................- 29 -
3.3.3 VDD_SDIO 1.8V/2.85V Voltage output..................................................... - 31 -
3.3.4 VDD_EXT 1V8 Voltage output...................................................................- 31 -
3.4 Switching machine reset mode...............................................................................- 31 -
3.4.1 Boot............................................................................................................. - 31 -
3.4.2 Boot timing..................................................................................................- 32 -
3.4.3 Power down................................................................................................. - 33 -
3.4.4 Reset control................................................................................................- 33 -
3.5 USB interface......................................................................................................... - 34 -
3.6 UART interface...................................................................................................... - 36 -
3.6.1 Main serial port............................................................................................- 36 -
3.6.2 Debug serial port......................................................................................... - 38 -
3.6.3 RI and DTR interface.................................................................................. - 38 -
3.7 USIM interface....................................................................................................... - 39 -
3.7.1 USIM card reference circuit........................................................................ - 40 -
3.7.2 UIM_DET Hot Swap Reference Design..................................................... - 41 -
3.8 General purpose GPIO interface............................................................................ - 41 -
3.9 Network status indication interface........................................................................ - 42 -
3.10 Module status indication.......................................................................................- 43 -
3.11 PCM digital voice interface..................................................................................- 44 -
3.12 I2C bus................................................................................................................. - 45 -

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3.13 SDIO interface......................................................................................................- 46 -
3.14 SPI interface / multiplexed I2S interface..............................................................- 51 -
3.15 MCLK interface....................................................................................................- 52 -
3.16 WLAN interface................................................................................................... - 53 -
3.17 SGMII interface....................................................................................................- 54 -
3.18 ADC interface.......................................................................................................- 56 -
3.19 RF interface.......................................................................................................... - 57 -
3.19.1 Main antenna interface.............................................................................. - 57 -
3.19.2 Diversity antenna interface........................................................................- 58 -
3.19.3 GNSS interface..........................................................................................- 58 -
3.19.4 RF trace reference......................................................................................- 60 -
3.19.5 RF connector size...................................................................................... - 61 -
Chapter 4 Overall technical indicators................................................................................. - 63 -
4.1 Chapter overview....................................................................................................- 63 -
4.2 GNSS reception performance.................................................................................- 63 -
4.3 Working frequency................................................................................................. - 64 -
4.4 Conducted radio frequency measurement.............................................................. - 65 -
4.4.1 Test environment......................................................................................... - 65 -
4.4.2 Test Standard............................................................................................... - 65 -
4.5 Conducted receiving sensitivity and transmit power..............................................- 65 -
4.6 Antenna requirements.............................................................................................- 67 -
4.7 Power consumption characteristics........................................................................ - 68 -
Chapter 5 Interface electrical characteristics........................................................................- 72 -
5.1 Chapter overview....................................................................................................- 72 -
5.2 Working storage temperature..................................................................................- 72 -
5.3 Module IO level......................................................................................................- 72 -
5.4 Power supply.......................................................................................................... - 72 -
5.5 Electrostatic property..............................................................................................- 73 -
5.6 Reliability index..................................................................................................... - 73 -
Chapter 6 Structural and mechanical properties...................................................................- 75 -
6.1 Chapter overview....................................................................................................- 75 -
6.2 Exterior................................................................................................................... - 75 -
6.3 CLM920 TD3 Module mechanical size................................................................. - 75 -
Chapter 7 Packaging and production....................................................................................- 78 -

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7.1 Chapter overview....................................................................................................- 78 -
7.2 Module packaging and storage...............................................................................- 78 -
7.3 Production welding.................................................................................................- 78 -
Chapter 8 Appendix..............................................................................................................- 80 -
8.1 Chapter overview....................................................................................................- 80 -
8.2 Abbreviations..........................................................................................................- 80 -
8.3 Encoding.................................................................................................................- 81 -
8.4 Safety and precautions............................................................................................- 84 -
Graph index
Figure 2-1 Functional block diagram of the CLM920 TD3 LCC module........................... - 15 -
Figure 3-1 LCC module interface definition........................................................................ - 17 -
Figure 3-2 GSM TDMA network burst current supply voltage drop................................... - 29 -
Figure 3-3 VBAT power supply........................................................................................... - 29 -
Figure 3-4 LDO linear power supply reference circuit........................................................ - 29 -
Figure 3-5 DC switching power supply reference circuit.................................................... - 30 -
Figure 3-6 PMOS tube control power switch reference circuit............................................- 30 -
Figure 3-7 Startup timing diagram....................................................................................... - 32 -
Figure 3-8 Power-on reference circuit..................................................................................- 33 -
Figure 3-9 Reset reference power.........................................................................................- 33 -
Figure 3-10 Reset timing diagram........................................................................................- 34 -
Figure 3-11 USB connection design circuit diagram........................................................... - 35 -
Figure 3-12 Full-featured serial port design.........................................................................- 37 -
Figure 3-13 UART serial port design................................................................................... - 37 -
Figure 3-14 Level conversion chip circuit............................................................................- 37 -
Figure 3-15 RI pin signal waveform.................................................................................... - 38 -
Figure 3-16 USIM design circuit diagram............................................................................- 40 -
Figure 3-17 Hot swap detection of the USIM card.............................................................. - 41 -
Figure 3-18 Network indicator circuit diagram....................................................................- 43 -
Figure 3-19 STATUS Pin Reference Circuit........................................................................ - 44 -
Figure 3-20 PCM short frame mode timing diagram........................................................... - 45 -
Figure 3-21 PCM to analog voice map.................................................................................- 45 -

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Figure 3-22 I2C interface reference circuit diagram............................................................ - 46 -
Figure 3-23 SD card interface reference circuit diagram..................................................... - 50 -
Figure 3-24 I2S to analog voice map................................................................................... - 52 -
Figure 3-25 Wireless connection interface and YG30 reference design.............................. - 54 -
Figure 3-26 Schematic diagram of the Ethernet application solution.................................. - 56 -
Figure 3-27 SGMII interface and Ethernet PHY core AR8033 reference design................ - 56 -
Figure 3-28 Main antenna matching circuit......................................................................... - 57 -
Figure 3-29 Diversity Antenna Matching Circuit.................................................................- 58 -
Figure 3-30 GNSS passive antenna reference circuit...........................................................- 58 -
Figure 3-31 GNSS active antenna reference circuit............................................................. - 59 -
Figure 3-32 The complete structure of the two-layer PCB microstrip line..........................- 60 -
Figure 3-33 The complete structure of the multilayer PCB strip line.................................. - 60 -
Figure 3-34 Reference ground is the third layer PCB microstrip transmission line structure- 61 -
Figure 3-35 RF connector size chart.................................................................................... - 61 -
Figure 3-36 Antenna connector matching plug diagram...................................................... - 62 -
Figure 3-37 Matching coaxial RF line size.......................................................................... - 62 -
Figure 6-1 Appearance of the CLM920 TD3....................................................................... - 75 -
Figure 6-2 Front view and side view of the module (unit: mm).......................................... - 75 -
Figure 6-3 Bottom view of the module (unit: mm).............................................................. - 76 -
Figure 6-4 Recommended module package (unit: mm)....................................................... - 77 -
Figure 7-1 Reflow soldering temperature graph.................................................................. - 79 -
Table index
Table 2-1 List of module bands............................................................................................ - 10 -
Table 2-2 Key Features.........................................................................................................- 12 -
Table 3-1 Pin definitions...................................................................................................... - 17 -
Table 3-2 IO parameter definition........................................................................................ - 20 -
Table 3-3 Pin description......................................................................................................- 20 -
Table 3-4 Power pin definitions........................................................................................... - 28 -
Table 3-5 Switching machine pin definition........................................................................ - 31 -
Table 3-6 Boot timing parameters........................................................................................ - 32 -
Table 3-7 Reset foot definition............................................................................................. - 33 -
Table 3-8 RESET pin parameters......................................................................................... - 34 -

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Table 3-9 USB interface pin definition................................................................................ - 34 -
Table 3-10 UART serial port signal definition..................................................................... - 36 -
Table 3-11 Debugging serial port pin definitions................................................................. - 38 -
Table 3-12 SIM card signal definition..................................................................................- 39 -
Table 3-13 SIM card hot swap detection pin definition....................................................... - 41 -
Table 3-14 General GPIO Pin Definitions............................................................................- 41 -
Table 3-15 Network indicator pin definition........................................................................ - 43 -
Table 3-16 Network indication status...................................................................................- 43 -
Table 3-17 Module Status Pin Definitions........................................................................... - 43 -
Table 3-18 PCM pin definition.............................................................................................- 44 -
Table 3-19 PCM specific parameters................................................................................... - 44 -
Table 3-20 I2C pin definition............................................................................................... - 45 -
Table 3-21 SD card pin definition........................................................................................ - 46 -
Table 3-22 SPI Pin Definitions.............................................................................................- 51 -
Table 3-23 I2S pin definition................................................................................................- 51 -
Table 3-24 MCLK Pin Definitions....................................................................................... - 52 -
Table 3-25 WLAN pin definitions........................................................................................- 53 -
Table 3-26 SGMII interface pin definition...........................................................................- 55 -
Table 3-27 ADC Pin Definitions.......................................................................................... - 56 -
Table 3-28 Antenna interface pin definition.........................................................................- 57 -
Table 3-29 Main parameters of the RF connector................................................................ - 62 -
Table 4-1 Main parameters of GNSS................................................................................... - 63 -
Table 4-2 RF frequency table............................................................................................... - 64 -
Table 4-3 Test instruments....................................................................................................- 65 -
Table 4-4 2G3G RF indicators............................................................................................. - 65 -
Table 4-5 4G RF sensitivity indicators.................................................................................- 65 -
Table 4-6 4G RF transmit power indicators......................................................................... - 66 -
Table 4-7 Main set antenna indicator requirements............................................................. - 67 -
Table 4-8 GNSS antenna specifications............................................................................... - 68 -
Table 4-9 Sleep and idle power consumption of the three major operators (GNSS off)......- 68 -
Table 4-10 Call Power Consumption (GNSS Off)............................................................... - 69 -
Table 4-11 GPRS data transmission power consumption (GNSS off)................................. - 69 -
Table 4-12 EDGE Data Transmission Power Consumption (GNSS Off)............................ - 69 -
Table 4-13 HSDPA data transmission power consumption (GNSS off).............................. - 69 -

CLM920 TD3 LTE Module Hardware Usage Guide
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Table 4-14 LTE data transmission power consumption (GNSS off)....................................- 70 -
Table 5-1 CLM920 TD3 module working storage temperature........................................... - 72 -
Table 5-2 Electrical Characteristics of CLM920 TD3 Module............................................ - 72 -
Table 5-3 Working voltage of CLM920 TD3 module.......................................................... - 72 -
Table 5-4 CLM920 TD3 ESD Features................................................................................- 73 -
Table 5-5 CLM920 TD3 reliability test................................................................................- 73 -
Table 7-1 Reflow process parameter table........................................................................... - 79 -
Table 8-1 Abbreviations....................................................................................................... - 80 -
Table 8-2 Time slot allocation table for different levels of GPRS/EDGE............................- 81 -
Table 8-3 Maximum GPRS rate........................................................................................... - 82 -
Table 8-4 Maximum EDGE Rate......................................................................................... - 82 -
Table 8-5 Maximum HSDPA rate.........................................................................................- 82 -
Table 8-6 Maximum HSUPA rate.........................................................................................- 83 -
Table 8-7 LTE-FDD DL maximum rate............................................................................... - 84 -
Table 8-8 LTE-FDD UL Maximum Rate............................................................................. - 84 -

CLM920 TD3 LTE Module Hardware Usage Guide
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Chapter 1 Introduction
This document is a hardware solution manual for the wireless solution product CLM920
TD3 module. It is intended to describe the hardware components and functional
characteristics of the module solution, application interface definition and usage instructions,
electrical performance and mechanical characteristics. Combined with this and other
application documents, users can quickly use this module to design wireless products.

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Chapter 2 Module review
2.1 Module introduction
The CLM920 TD3 module is an LCC package module. It is a wireless terminal product
that integrates various network standards and GPS positioning services such as FDD-LTD/
TDD-LTE/WCDMA/EDGE/GSM. The module is based on Qualcomm MDM9X07 chip
development, supports Cat4, uplink and downlink speeds up to 50Mbps/150Mbps, and fully
supports VOLTE and SRLTE, and supports embedded operating systems such as
Windows7/Windows8/Windows10/Android/Linux.
The CLM920 TD3 module can be used in the following applications:
Car Equipment
Wireless POS machine
Wireless advertising, multimedia
Remote monitoring
Smart meter reading
Mobile broadband
automated industry
Other wireless terminals, etc.
2.2 Module characteristics
Table 2-1 List of module bands
Network Type
Frequency band
Module series
CLM920 TD3_na
American version
CLM920 TD3_au
Australian version
GSM
GSM850
GSM900
GSM1800
GSM1900
LTE(FDD)
LTE FDD B1
LTE FDD B2
LTE FDD B3
LTE FDD B4
LTE FDD B5

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LTE FDD B7
LTE FDD B8
LTE FDD B12
LTE FDD B13
LTE FDD B17
LTE FDD B25
LTE FDD B26
LTE FDD B28
LTE FDD B66
LTE(TDD)
LTE TDD B40
LTETDDB41
(Narrow Band)
WCDMA
BAND 1
BAND 2
BAND 4
BAND 5
BAND 8
GNSS
GLONASS
GPS
BeiDou/Compass
The module does not support diversity, GPS, and voice functions by default.
The GNSS function is optional.
The diversity function is optional.
Voice function (digital voice).
The CLM920 TD3 supports CAT1 standard modules for customer-specific applications.
The CAT1 system has an uplink of 5 Mbps and a downlink of 10 Mbps.
The module supports Category4 by default. When the Category1 module needs to be
supported, the CLM920 TB3 cat1 is printed on the module label.
CAT1 does not support diversity.

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Table 2-2 Key Features
Characteristic
Description
Physical characteristics
32mm x 29mm x 2.4mm
Fixed way
LCC package, patch mount
Operating Voltage
3.3V - 4.2V Typical Voltage 3.7V
Energy saving current
Standby current < 5mA
Appli
cation
interfa
ce
Standard SIM interface
Support 3.0V/1.8V, support hot swap function
USB2.0
USB2.0 (High-Speed) (only supports slave mode),
data transfer rate up to 480Mbps
For AT commands, data transfer, GNSS NMEA output,
software debugging and software upgrades
USB driver: Support Windows XP, Windows Vista,
Windows 7, Windows 10, Windows CE 5.0/6.0/7.0
Linux 2.6 or higher
Android 2.3/4.0/4.2/4.4/5.0/6.0/7.1, etc.
Hardware reset interface
Used to reset the module, low effective
UART serial interface
Main serial port (8 lines):
For AT commands and data transfer
The baud rate is up to 921600bps and the default is
115200bps.
Support RTS and CTS hardware flow control
Debug serial port (2 lines):
Used to print module logs
PCM interface
For audio, requires an external codec chip
Supports 8-bit A-law, U-law and 16-bit linear
encoding formats
Support short frame mode
Support main mode
SPI interface
Maximum clock rate up to 26MHz
SPI can only be used as the master, the interface
voltage domain is 1.8V
Reusable I2S interface for external CODEC
SD card interface
4-bit SD/MMC interface
Clock frequency up to 50MHz

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Maximum capacity supports 32GB
Interface voltage domain is 1.8/2.95V, two voltages
are adjustable
Power interface
Support 3.3V-4.2V DC power supply
Network status
indication
Used to indicate the status of the module, the speed of
the light is on to indicate different module status
General purpose GPIO
interface
WAKEUP_IN sleep mode control, low level wake-up
module
AP_READY sleep state detection
W_DISABLE# flight mode control
Transmit power
LTE:
Class 3(23dBm±2dB)
UMTS:
Class 3(24dBm+1/-3dB)
GSM/GPRS:
Class 4(33dBm±2dB) GSM850/GSM900
Class 1(30dBm±2dB) DCS1800/PCS1900
Data service
GSM/EDGE:
GPRS: DL 85.6kbps/UL 85.6kbps
EDGE: DL 236.8kbps/UL 236.8kbps
WCDMA:
UMTS R99: DL 384kbps/UL 384kbps
DC-HSPA+: DL 42Mbps/UL 5.76Mbps
LTE:
LTE FDD:DL 150Mbps/UL 50Mbps@20M BW cat4
LTE TDD:DL 130Mbps/UL 35Mbps@20M BW cat4
LTE FDD:DL 10Mbps/UL 5Mbps@20M BW cat1
LTE TDD:DL 10Mbps/UL 5Mbps@20M BW cat1
Satellite positioning
GPS/BEIDOU/GLONASS
Protocol:NMEA
Diversity antenna
Support LTE diversity antenna
AT command
Support for standard AT instruction sets (Hayes 3GPP
TS 27.007 and 27.005)
Specific AT query CLM920 TD3 AT instruction set

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SMS business
Support Text and PDU mode
Support point-to-point MO and MT
SMS storage: USIM card / ME (default)
Virtual network card
Support USB virtual network card
Temperature range
Normal operating temperature -30 °C to +75 °C
Extreme operating temperature -40°C to +85°C
Storage temperature
-40°C to +85°C
Humidity
RH5%～RH95%
Module function distinction
On the label paper, M stands for the main set, D takes
the table diversity, and G stands for GPS.
When the temperature is in the range of –40°C to –30°C or +75°C to +85°C,
some RF indicators of the CLM920 TD3 module may not meet the 3GPP standards.
2.3 Module function
The CLM920 TD3 LCC module mainly contains the following circuit units:
Baseband processing unit
Power management unit
Memory unit
RF transceiver unit
RF front end unit
GPS RF receiving unit

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The functional block diagram of the CLM920 TD3 LCC module is shown below：
Figure 2-1 Functional block diagram of the CLM920 TD3 LCC module

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Chapter 3 Interface application description
3.1 Chapter overview
This chapter mainly describes the interface definition and application of this module.
Contains the following sections:
144 pin pin definition map
Interface definition
Power interface
USB interface
USIM interface
UART interface
Control interface
PCM/I2S voice interface
RF antenna interface
GPIO interface
WLAN interface
SGMII interface
Reserved
NC interface
SPI interface
SDIO interface

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3.2 Module interface
3.2.1 144-pin LCC interface
Figure 3-1 LCC module interface definition
3.2.2 Interface definition
The CLM920_TD3 module interface is an LCC interface module. The module interface
is defined as shown in the following table.：
Table 3-1 Pin definitions
Pin
Pin name
Pin
Pin name
1
WAKEUP_IN
2
AP_READY
3
GPIO_1
4
W_DISABLE#

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5
GPIO_2
6
NET_STATUS
7
VDD_EXT
8
GND
9
GND
10
GND
11
DBG_RXD
12
DBG_TXD
13
USIM_DET
14
USIM_VDD
15
USIM_DATA
16
USIM_CLK
17
USIM_RST
18
RESERVED
19
GND
20
RESET_N
21
PWRKEY
22
GND
23
RESERVED
24
PCM_IN
25
PCM_OUT
26
PCM_SYNC
27
PCM_CLK
28
SDC2_DATA3
29
SDC2_DATA2
30
SDC2_DATA1
31
SDC2_DATA0
32
SDC2_CLK
33
SDC2_CMD
34
VDD_SDIO
35
ANT_DIV
36
GND
37
SPI_CS_N(I2S_D1)
38
SPI_MOSI(I2S_WS)
39
SPI_MISO(I2S_D0)
40
SPI_CLK(I2S_SCLK)
41
I2C_SCL
42
I2C_SDA
43
RESERVED
44
ADC1
45
ADC0
46
GND
47
ANT_GNSS
48
GND
49
ANT_MAIN
50
GND
51
GND
52
GND
53
GND
54
GND
55
RESERVED
56
GND
57
VBAT
58
VBAT
59
VBAT
60
VBAT
61
STATUS
62
RI
63
DCD
64
CTS
65
RTS
66
DTR
67
TXD
68
RXD

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69
USB_DP
70
USB_DM
71
USB_VBUS
72
GND
73
RESERVED
74
RESERVED
75
RESERVED
76
RESERVED
77
RESERVED
78
RESERVED
79
RESERVED
80
RESERVED
81
RESERVED
82
RESERVED
83
RESERVED
84
RESERVED
85
GND
86
GND
87
GND
88
GND
89
GND
90
GND
91
GND
92
GND
93
GND
94
GND
95
GND
96
GND
97
GND
98
GND
99
GND
100
GND
101
GND
102
GND
103
GND
104
GND
105
GND
106
GND
107
GND
108
GND
109
GND
110
GND
111
GND
112
GND
113
RESERVED
114
RESERVED
115
RESERVED
116
MCLK
117
RESERVED
118
WLAN_SLP_CLK
119
EPHY_RST_N
120
EPH_INT_N
121
SGMII_MDATA
122
SGMII_MCLK
123
SGMII_TX_M
124
SGMII_TX_P
125
SGMII_RX_P
126
SGMII_RX_M
127
WLAN_3.3V_EN
128
USIM2_VDD
129
SDC1_DATA3
130
SDC1_DATA2
131
SDC1_DATA1
132
SDC1_DATA0

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133
SDC1_CLK
134
SDC1_CMD
135
WAKE_WLAN
136
SDC1_EN
137
COEX_UART_RXD
138
COEX_UART_TXD
139
RESERVED
140
RESERVED
141
RESERVED
142
RESERVED
143
RESERVED
144
RESERVED
Table 3-2 IO parameter definition
Symbol sign
Description
IO
Two-way input and output
PI
power input
PO
Power Output
AI
Analog input
AO
Analog output
DI
Digital input
DO
Digital output
OD
Leaky open circuit
Table 3-3 Pin description
Power supply
Pin
Pin definition
IO
Functional description
Remarks
57
VBAT
PI
Module power input
Power supply
needs to
guarantee 2A
current
58
VBAT
PI
Module power input
59
VBAT
PI
Module power input
60
VBAT
PI
Module power input
7
VDD_EXT
PO
1.8V output
Can provide
pull-up
(maximum
50MA) for
external GPIO.
Please keep it
floating when not
in use.