YUGE LPM2100 bg Series Parts list manual

Product name
LPM2100 bg NB Module Hardware Usage
Guide
Number of pages
42
Hardware design version
V1.0
Document version
V15
Date
2019/11/5
LPM2100 bg
NB Module Hardware Usage Guide
V1.5
Shanghai Yuge Information Technology Co., Ltd.

LPM2100 bg NB Module Hardware Usage Guide
Shanghai Yuge Information Technology Co., Ltd.
- 2 -
Update record
Version
Date
Author
Description
V1.0
2019/3/21
John.zhang
Fix and add some configuration information
V1.1
2019/5/10
John.zhang
Modify some information about hardware V1.1
interface changes
V1.2
2019/6/11
John.zhang
Unified limit operating temperature
Modify information related to IO voltage domain
V1.3
2019/8/5
John.zhang
Modify some editing errors
V1.4
2019/9/5
John.zhang
Added B20/B28, software supported after V4.0
V1.5
2019/11/5
John.zhang
Increase B1 and increase the low voltage version
Modify boot item
Update appearance

LPM2100 bg NB Module Hardware Usage Guide
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Contents
Chapter 1. Introduction...........................................................................................................- 4 -
Chapter2. Module review....................................................................................................... - 5 -
2.1 Module introduction................................................................................................. - 5 -
2.2 Main performance.................................................................................................... - 6 -
2.3 Module functional block diagram............................................................................ - 7 -
2.4 Module working mode............................................................................................. - 8 -
Chapter 3. Interface application description...........................................................................- 9 -
3.1 Chapter overview......................................................................................................- 9 -
3.2 Module interface.......................................................................................................- 9 -
3.2.1 LPM2100 bg pin distribution map............................................................. - 9 -
3.2.2. Module pin description...............................................................................- 10 -
3.3 Power interface.......................................................................................................- 13 -
3.3.1 VBAT interface............................................................................................- 13 -
3.3.2 VDD_EXT Voltage output.......................................................................... - 13 -
3.4 Switching machine reset mode...............................................................................- 14 -
3.4.1 Boot............................................................................................................. - 14 -
3.4.2 Shut down....................................................................................................- 14 -
3.4.3 Reset............................................................................................................ - 15 -
3.5 UART interface...................................................................................................... - 16 -
3.5.1 Serial application circuit..............................................................................- 17 -
3.6 Power saving technology........................................................................................- 18 -
3.6.1 PSM............................................................................................................. - 18 -
3.6.2 DRX.............................................................................................................- 19 -
3.6.3 eDRX...........................................................................................................- 20 -
3.7 SIM interface.......................................................................................................... - 20 -
3.7.1 SIM card reference circuit........................................................................... - 21 -
3.7.2 SIM_DECT Hot Swap Reference Design *................................................ - 21 -
3.8 ADC interface.........................................................................................................- 23 -
3.9 SPI interface........................................................................................................... - 23 -
3.10 I2C bus................................................................................................................. - 24 -
3.11 Network indication interface*.............................................................................. - 24 -
3.12 General purpose GPIO interface.......................................................................... - 25 -
3.13 Other interface...................................................................................................... - 25 -

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3.13.1 WAKEUP interface....................................................................................- 25 -
3.13.2 WAKEUP_OUT interface*....................................................................... - 26 -
Chapter 4. Overall RF technical indicators.......................................................................... - 27 -
4.1 Chapter overview....................................................................................................- 27 -
4.2 Antenna design....................................................................................................... - 27 -
4.2.1 Main antenna............................................................................................... - 27 -
4.3 RF signal line routing guide................................................................................... - 28 -
4.4 RF connector.......................................................................................................... - 29 -
4.5 Working frequency................................................................................................. - 30 -
4.6 Conducted transmit power and receive sensitivity.................................................- 30 -
4.7 RF power consumption characteristics...................................................................- 31 -
Chapter 5. Interface electrical characteristics.......................................................................- 32 -
5.1 Chapter overview....................................................................................................- 32 -
5.2 Range of working temperature............................................................................... - 32 -
5.3 Module IO level......................................................................................................- 32 -
5.4 Power supply.......................................................................................................... - 32 -
5.5 Electrostatic property..............................................................................................- 33 -
5.6 Reliability index..................................................................................................... - 33 -
Chapter 6. Structural and mechanical properties..................................................................- 35 -
6.1 Chapter overview....................................................................................................- 35 -
6.2 Exterior................................................................................................................... - 35 -
Chapter 7. Production and packaging...................................................................................- 37 -
7.1 Chapter overview....................................................................................................- 37 -
7.2 Module packaging and storage...............................................................................- 37 -
7.3 Production welding.................................................................................................- 37 -
Chapter 8. Abbreviation........................................................................................................- 39 -

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Figure
Figure 2-1 Functional block diagram of the LPM2100 bg series module..............................- 8 -
Figure 3-1 LPM2100 bg pin assignment diagram..................................................................- 9 -
Figure 3-2 VBAT power supply........................................................................................... - 13 -
Figure 3-3 VDD_EXT power output timing diagram.......................................................... - 14 -
Figure 3-4 boot timing diagram............................................................................................- 14 -
Figure 3-5 Shutdown timing diagram...................................................................................- 15 -
Figure 3-6 Reset reference circuit........................................................................................ - 15 -
Figure 3-7 Reset timing diagram..........................................................................................- 16 -
Figure 3-8 Full-featured serial port design...........................................................................- 17 -
Figure 3-9 UART serial port design..................................................................................... - 18 -
Figure 3-10 UART level conversion circuit......................................................................... - 18 -
Figure 3-11 PSM power saving technology......................................................................... - 19 -
Figure 3-12 DRX power saving technology.........................................................................- 19 -
Figure 3-13 eDRX power saving technology.......................................................................- 20 -
Figure 3-14 SIM circuit design.............................................................................................- 21 -
Figure 3-15 SIM card hot swap detection circuit*............................................................... - 22 -
Figure 3-16 SPI read timing diagram................................................................................... - 23 -
Figure 3-17 SPI write timing diagram..................................................................................- 24 -
Figure 3-18 I2C interface reference circuit.......................................................................... - 24 -
Figure 3-19 Network indicator circuit diagram....................................................................- 25 -
Figure 3-20 WAKEUP wake-up module reference circuit................................................... - 26 -
Figure 3-21 WAKEUP_OUT Wakeup Host Reference........................................................- 26 -
Figure 4-1 Main antenna matching circuit diagram............................................................. - 28 -
Figure 4-2 Complete structure of the microstrip line........................................................... - 28 -
Figure 4-3 Reference ground is the third layer microstrip transmission line structure........ - 29 -
Figure 4-4 Complete structure of the strip line.................................................................... - 29 -
Figure 4-5 RF connector size chart...................................................................................... - 30 -
Figure 4-6 Antenna connector matching plug diagram........................................................ - 30 -
Figure 6-1 Appearance of the LPM2100 bg series module..................................................- 35 -
Figure 6-2 Front view and side view of the LPM2100 bg series module (unit MM).......... - 35 -
Figure 6-3 Bottom view of the LPM2100 bg series module (unit MM).............................. - 36 -
Figure 7-1 Reflow soldering temperature graph.................................................................. - 38 -

LPM2100 bg NB Module Hardware Usage Guide
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Table
Table 2-1 LPM2100 bg series models.................................................................................... - 5 -
Table 2-2 Key Features...........................................................................................................- 6 -
Table 2-3 Working mode........................................................................................................ - 8 -
Table 3-1 Pin Parameter Abbreviations................................................................................- 10 -
Table 3-2 Interface definition............................................................................................... - 10 -
Table 3-3 Boot timing parameters........................................................................................ - 14 -
Table 3-4 Shutdown timing parameters................................................................................- 15 -
Table 3-5 RESET pin parameters......................................................................................... - 15 -
Table 3-6 Serial port pin definitions.....................................................................................- 16 -
Table 3-7 Serial port logic levels..........................................................................................- 17 -
Table 3-8 SIM card signal definition....................................................................................- 20 -
=Table 3-9 SIM card hot swap detection pin definition....................................................... - 22 -
Table 3-10 ADC Signal Definition....................................................................................... - 23 -
Table 3-11 SPI Signal Definition..........................................................................................- 23 -
Table 3-12 I2C pin definition............................................................................................... - 24 -
Table 3-13 Network indicator pin definition........................................................................ - 24 -
Table 3-14 Network indication status...................................................................................- 25 -
Table 3-15 General GPIO Pin Definitions............................................................................- 25 -
Table 4-1 RF Pin Definitions................................................................................................- 27 -
Table 4-2 Main parameters of the RF connector.................................................................. - 30 -
Table 4-3 RF frequency table............................................................................................... - 30 -
Table 4-4 Conducted emission power indicators..................................................................- 30 -
Table 4-5 Conducted receiving sensitivity indicators.......................................................... - 31 -
Table 4-6 Power consumption.............................................................................................. - 31 -
Table 5-1 LPM2100 bg series module temperature range....................................................- 32 -
Table 5-2 Electrical Characteristics of the LPM2100 bg Series Module............................. - 32 -
Table 5-3 Operating voltage of the LPM2100 bg series module..........................................- 32 -
Table 5-4 LPM2100 bg ESD features.................................................................................. - 33 -
Table 5-5 Reliability test...................................................................................................... - 33 -
Table 7-1 Reflow process parameter table........................................................................... - 38 -
Table 8-1 Abbreviations....................................................................................................... - 39 -

LPM2100 bg NB Module Hardware Usage Guide
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Chapter 1. Introduction
This document is a hardware solution manual for the LPM2100 bg series module of the
wireless solution product. It is intended to describe the hardware components and functional
characteristics of the module solution, application interface definition and usage instructions,
electrical performance and mechanical characteristics. Combined with this and other
application documents, users can quickly use this module to design wireless products.

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Chapter2. Module review
2.1 Module introduction
LPM2100 bg series model
LPM2100 bg Physical characteristics
LPM2100 bg Application
Series model
Table 2-1 LPM2100 bg series models
LPM2100 bg series
Support method
Operating Voltage
Typical
voltage
LPM2100 bg_u
(B1,B3,B5,B8,B20,B28)
Low voltage version
Module supply voltage
（2.45~4.2V）
3.6V
LPM2100 bg
(B1,B3,B5,B8,B20,B28)
Standard version
Module supply voltage
（3.1~4.2V）
3.7V
LPM2100 bc
(B5,B8,B20,B28)
Standard version
Module supply voltage
（3.1~4.2V）
3.7V
Physical characteristics
The LPM2100 bg is a multi-band NB-IoT series module that complies with 3GPP
Release 13.
This series of modules has 98 pins, (23.6 ±0.15) mm ×(19.9 ±0.15) mm ×(2.2
±0.15) mm, which can meet almost all M2M requirements.
This series of modules is a chip module, which is packaged in LCC and provides
customers with a rich hardware interface.
The LPM2100 bg family of modules features low-power technology with less than 1mA
sleep standby power and 5uA in deep sleep.Supports 2.45V voltage.
Application
Smart city (smart parking, water/gas meters, street lights, smoke alarms, garbage bins,
manhole covers, containers, etc.)
Consumption and medical (wearing devices, VIP tracking, life support, remote clinical
tracking, etc.)
Industrial and agricultural intelligent monitoring (machine alarm, gas detection, irrigation,
soil pH, etc.)

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Agriculture and the environment (agricultural applications, environmental monitoring,
etc.)
Logistics support (industrial assets, container tracking, location and status updates, etc.)
"*" indicates that it is under development.
"LPM2100 bg" refers to the collective name of the LPM2100 bg Nb-IoT series module in the
documentation.
2.2 Main performance
Table 2-2 Key Features
Characteristic
Description
Physical characteristics
(23.6mm×19.9mm×2.2mm) ±0.15mm
Application processor
192MHz MIPS processor with 16KB I-Cache and 16KB
D-Cache
Operating Voltage
Low voltage: 2.45V - 4.21V Typical voltage 3.6V
Standard pressure: 3.1V - 4.2V Typical voltage 3.7V
Power saving
PSM mode power consumption < 5uA
Standby
Sleep mode current < 1mA
Application interface
Power interface
Several general purpose GPIO interfaces
One-way standard SIM interface, support 3.0V/1.8V, support
hot swap function*
One way hardware reset interface
Three-way UART serial interface
One way SPI interface
One-way network status indication interface
All the way PSM_EINT# interface
One way ADC detection interface
Working frequency
Quad-frequency or multi-frequency: bc (B5, B8, B20, B28), bg
(B1, B3, B5, B8, B20, B28), bg_u (B1, B3, B5, B8, B20, B28)
The module can automatically search for the frequency band,
and the band selection can be set by the AT command. Need to

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correspond to a specific version
Network protocol feature
UDP/TCP/CoAP/LWM2M
PPP/SSL/DTLS/FTP
HTTP/MQTT/HTTPS
Data transmission
characteristics
Single-tone:25.5kbps(DL),16.7kbps(UP)
Multi-tone:25.5kbps(DL),62.5kbps(UP)
Antenna interface
Main antenna 50 ohm interface
Firmware upgrade
Serial port upgrade
Temperature range
Normal operating temperature –20°C to + 75°C
Extreme operating temperature –40°C to +85°C
Storage temperature: -45°C to + 90°C
AT command
Support for standard AT instruction sets (Hayes 3GPP TS
27.007 and 27.005)
2.3 Module functional block diagram
The functional block diagram of the LPM2100 bg series module mainly includes the
following units：
Baseband processing unit
Power management unit
RF transceiver unit
RF front end unit
Peripheral interface
The functional block diagram of the LPM2100 bg series module is shown below：

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Figure 2-1 Functional block diagram of the LPM2100 bg series module
2.4 Module working mode
Table 2-3 Working mode
Operating mode
Description
Shut down
Module does not work in shutdown
Flight mode
The module turns off the module RF circuit and cannot interact with
the network.
Sleep
The module turns off most of the functions and will be
synchronized with the network.
Idle
Power on and successfully register the network, in idle state
Data transmission
The module is working and has data interaction with the network.
PSM mode
After entering the PSM mode, the module can achieve the minimum
power consumption, and the internal power of the module is turned
off. The software except the RTC stops running, and the serial port
cannot be used.

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Chapter 3. Interface application description
3.1 Chapter overview
The LPM2100 bg series modules have a total of 98 pins and include the following partial
unit interface functions. The functions of each unit interface will be described in detail in later
chapters.
Power interface
USIM interface
UART interface
Network status indication interface
SPI interface
RF antenna interface
I2C interface
3.2 Module interface
3.2.1 LPM2100 bg pin distribution map
LPM2100 bg pin assignments are as follows：
Figure 3-1 LPM2100 bg pin assignment diagram

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①SIM card port level supports 1.8V and 3.0V。
②This module defines that the NC pin is floating and must not be used.
③The module WAKEUP (PSM_EINT) pin voltage domain is 1.1V.
3.2.2. Module pin description
The module interface pin definition is described below：
Table 3-1 Pin Parameter Abbreviations
Symbol sign
Description
IO
Input or output
PI
Power input
PO
Power Output
AI
Analog input
AO
Analog output
DI
Digital input
DO
Digital output
Table 3-2 Interface definition
Pin
Pin name
IO
Functional description
Remarks
Powered by
45,46
VBAT
PI
Module power supply
Input voltage
3.1~4.2V
(Low voltage
version: 2.45~4.2V)
26
VDD_EXT
PO
Internal regulated power
supply output 1.8V or 2.8V
(software can be
customized, default 1.8V)
IO voltage domain
supply
System switch control
15
RESET
DI
Hardware reset control,
active low
SIM interface
16
SIM_DECT*
DI
SIM card hot plug detection
Internal level has
been pulled up

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38
SIM_VDD
PO
Output to the SIM card
supply voltage
Keep away from
interference sources
39
SIM_RST
DO
SIM card reset output
Keep away from
interference sources
40
SIM_DATA
IO
SIM card bus data
Internal 10K pull-up
resistor
41
SIM_CLK
DO
SIM card clock output
Keep away from
interference sources
42
SIM_GND
SIM card ground
GND
Status indication
18
NETLIGHT
DO
Network status indication
IO voltage domain
Main serial interface
29
RXD
DI
Master data reception
IO voltage domain
30
TXD
DO
Master data transmission
IO voltage domain
Debug serial interface
19
DBG_RXD
DI
Module debug data
reception
Debug serial port
20
DBG_TXD
DO
Module debug data
transmission
Debug serial port
Secondary serial interface
27
RXD_AUX
DI
Data reception
IO voltage domain
28
TXD_AUX
DO
Data transmission
IO voltage domain
22
CTS_AUX
DI
Request to send
IO voltage domain
23
RTS_AUX
DO
Clear send
IO voltage domain
I2C interface
32
I2C1_SCL
DO
I2C bus clock output
Internal 10K resistor
pull-up
33
I2C1_SDA
IO
I2C bus data input and
output
Internal 10K resistor
pull-up
SPI interface
3
SPI_DI_1
DI
Host input slave output
IO voltage domain
4
SPI_DI_0
DO
Host output slave input
IO voltage domain

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5
SPI_CLK
DO
Serial clock signal
IO voltage domain
6
SPI_CS
DO
Chip select signal
IO voltage domain
ADC function pin
21
ADC
AI
Universal analog to digital
converter interface
IO voltage domain
Universal input and output interface
35
GPIO_14
IO
Universal input/output port
31
GPIO_15
IO
Universal input/output port
Antenna interface
53
RF_ANT
IO
RF antenna interface
50Ωcharacteristic
impedance
Other function pins
10
V_RTC
PO
Output supply voltage
Provide 1.1V
voltage domain
17
WAKEUP
(PSM_EINT)
PI
Hardware control PSM pull
high wake up
1.1V voltage
domain
34
WAKEUP_O
UT
DO
Wake up host
Reserved
1,7,8,9,11,12,
13,14,24,25,3
6,44,49,50,55
,56,57,58,67,
68,69,70,75,7
6,77,78,79,80
,84,85,86,87,
88,89,90,91
NC
NC
Leave empty when
not in use
2,43,47,48,51
,52,54,59,60,
61,62,63,64,
65,66,71,72,
73,74,81,82,
83,92,93,94,
95,96,97,98
GND
Ground signal

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3.3 Power interface
The LPM2100 bg series module power connector consists of two parts：
VBAT is the working power of the module;
VDD_EXT is the internal LDO output IO voltage domain (current load up to 50mA) for
external use.
3.3.1 VBAT interface
The power supply VBAT has a power-on voltage range of 3.1~4.2V(Low voltage version:
2.45~4.2V). The module powers the internal RF and baseband circuitry through the VBAT pin.
Under the premise of ensuring that the VBAT power supply is sufficient, it is recommended to
be close to the power input and put 10pF, 0.1uF,1uF ceramic capacitor and 100uF tantalum
capacitor. VBAT PCB traces are as short and thick as possible。
Figure 3-2 VBAT power supply
①To prevent damage to the module from surges and overvoltages, it is recommended
to connect a 5.1V/500mW Zener diode to the VBAT pin of the module.
②It is recommended to add multiple different capacitance capacitors (10pF, 1uF,
100nF, 100uF) to the VBAT pin and place them near the VBAT pin.
3.3.2 VDD_EXT Voltage output
After the LPM2100 bg series module is powered on normally, the 26th pin will output
the IO voltage domain, and the current load can be up to 50mA. The external master can read
the voltage of VDD_EXT to judge whether the module is powered on. VDD_EXT can also be
used as an external power supply, such as a level shifting chip.

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Figure 3-3 VDD_EXT power output timing diagram
3.4 Switching machine reset mode
3.4.1 Boot
The LPM2100 bg series module VBAT is powered on automatically after power-on. The
user can check whether the module is powered on by querying the high and low levels of the
VDD_EXT pin.
The following picture shows the boot sequence diagram：
Figure 3-4 boot timing diagram
Table 3-3 Boot timing parameters
Symbol
Description
Min
Typical
Max
unit
Tdelay
TBD
-
s
Ton(status)
Boot time (according to status status)
TBD
-
s
Ton(uart)
Boot time (according to uart status)
TBD
-
s
3.4.2 Shut down
The LPM2100 bg series module can be powered off by the VBAT pin or by using the AT
“at+cpof”command.

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When the module is powered on, the VBAT pin stops the power supply module and shuts
down.
Figure 3-5 Shutdown timing diagram
Table 3-4 Shutdown timing parameters
Symbol
Description
Min
Typical
Max
unit
Toff
TBD
-
s
Toff(status)
Shutdown time (according to status status)
TBD
-
s
Toff(uart)
Shutdown time (according to uart status)
TBD
-
s
3.4.3 Reset
The PIN15 signal of the LPM2100 bg series module is the RESET reset pin. The
application detects that the module is abnormal. When the software does not respond, the
module can be reset. Pull the pin low for 100-450ms to reset the module. The RESET pin is
sensitive to interference. A 10 nF to 0.1μF capacitor can be placed near the signal for signal
filtering. Keep away from RF interference signals when routing.
Figure 3-6 Reset reference circuit
Table 3-5 RESET pin parameters

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Symbol
Description
Min
Typical
Max
unit
Treset
Low pulse width
100
600
ms
VIH
RESET input high level voltage
0.68
1.07
1.41
V
VIL
RESET input low level voltage
-0.3
0
0.68
V
Figure 3-7 Reset timing diagram
The LPM2100 bg series module supports AT command reset, and the AT command
AT+TRB can be used to restart the module. Detailed instructions can be found in the
"RDA_AT Command Manual" provided by the domain.
3.5 UART interface
The LPM2100 bg series modules provide three sets of UART interfaces. Main serial port,
debug serial port, auxiliary serial port. The serial port level is the IO output level value. The
module is a DCE (Data Communication Equipment) device.
The main serial port can realize AT interactive instructions and peripheral data
interaction.
Debug the serial port to upgrade the firmware, view log information, and so on.
The module serial port baud rate can be set to 4800, 9600, 19200, 38400, 57600, 115200,
230400, 460800, 921600bps baud rate, the default is 57600bps.
Table 3-6 Serial port pin definitions
Pin
Pin name
IO
Functional description
Remarks
Main serial interface
29
RXD
DI
Master data reception
IO voltage domain
30
TXD
DO
Master data transmission
IO voltage domain

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Debug serial interface
19
DBG_RXD
DI
Module debug data
reception
Debug serial port
20
DBG_TXD
DO
Module debug data
transmission
Debug serial port
Secondary serial interface
27
RXD_AUX
DI
Data reception
IO voltage domain
28
TXD_AUX
DO
Data transmission
IO voltage domain
22
CTS_AUX
DI
Request to send
IO voltage domain
23
RTS_AUX
DO
Clear send
IO voltage domain
Table 3-7 Serial port logic levels
Parameter
Minimum
Maximum
Unit
VIL
0
0.3*VDD_EXT
V
VIH
0.7*VDD_EXT
VDD_EXT
V
VOL
0
0.3*VDD_EXT
V
VOH
0.7*VDD_EXT
VDD_EXT
V
3.5.1 Serial application circuit
If you need to use a 4-wire serial port, you can refer to the following connection
methods:
Figure 3-8 Full-featured serial port design
If you need to use a 2-wire serial port, you can refer to the following serial port design.