v
TABLE OF CONTENTS
1. INTRODUCTION...............................................................................................................................1
2.
UNPACKING AND SETUP.........................................................................................................
3
2.1
VISUAL INSPECTION .....................................................................................................................................
3
2.2
CARRYING CASES LAYOUT.........................................................................................................................
4
3.
HARDWARE STARTUP...............................................................................................................
5
3.1
CONNECTOR PLATES ....................................................................................................................................
5
3.2
INSTALLATION OF THE
DSP BOARD IN THE HOST COMPUTER.......................................................10
3.3
PUTTING THE BASIC SYSTEM TOGETHER.............................................................................................11
4.
SOFTWARE STARTUP...............................................................................................................14
4.1 S
OFTWARE INSTALLATION ................................................................................................................................14
4.2 E
DIT
ING THE CONFIGURATIO
N FILE
(A
CQUIRE
.
CFG
) .........................................................................................16
4.2.1
Changing the instrument type...................................................................................................................16
4.2.2
Running Research Acquire without instrument........................................................................................16
4.2.3
External Trigger address
setting..............................................................................................................17
5.
SHUTDOWN SEQUENCE AN
D SYSTEM PACKING.......................................17
6.
HANDLING AND CARE OF
HYGROSCOPIC MATERIA
LS....................19
6.1
INTRODUCTION............................................................................................................................................19
6.2
HYGROSCOP
IC MATERIALS......................................................................................................................19
6.3
HANDLING AND CARE................................................................................................................................ 21
6.3.1
Handling of components...........................................................................................................................21
6.3.2
Storage conditions....................................................................................................................................21
6.3.2.1
Optical materials..................................................................................................................................................... 21
6.3.2.2
Instrumentation....................................................................................................................................................... 22
6.3.3
Transport conditions ................................................................................................................................22
6.4
RELATIVE HUMIDITY ................................................................................................................................
.22
6.5
CONCLUSION ................................................................................................................................................24
