Allen-Bradley MicroLogix 1762-IQ8 User manual

1762-IN004A-US-P
Installation Instructions
MicroLogix™ 1762-IQ8 DC Input Module
Inside
Description.......................................................3
Installation........................................................4
Mounting..........................................................5
System Assembly.............................................7
Field Wiring Connections...................................7
I/O Memory Mapping......................................10
Specifications.................................................11
Hazardous Location Considerations ................13
Environnements dangereux.............................14

2MicroLogix™ 1762-IQ8 DC Input Module
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For More Information
If you would like a manual, you can:
•download a free electronic version from the internet:
www.ab.com/micrologix or www.theautomationbookstore.com
•purchase a printed manual by:
–contacting your local distributor or Rockwell Automation representative
–visiting www.theautomationbookstore.com and placing your order
–calling 1.800.963.9548 (USA/Canada)
or 001.330.725.1574 (Outside USA/Canada)
For Refer to this Document Pub. No.
Information on installing, wiring, and
operating a MicroLogix 1200
Programmable Controller
MicroLogix1200Programmable
Controllers User Manual 1762-UM001A-US-P
Installation guide for the MicroLogix
1200 Programmable Controller. MicroLogix1200Programmable Controllers Installation
Instructions
1762-IN006A-ML-P
Installation guide for the MicroLogix
1200 Memory Module and Real Time
Clock.
MicroLogix 1200 Memory
Module and/or RealTimeClock
Installation Instructions
1762-IN001A-US-P
Installation guide for the 1762-IA8
Discrete Input Module 1762-IA8 120V ac Input Module Installation Instructions 1762-IN002A-US-P
Installation guide for the 1762-OW8
Discrete Output Module 1762-OW8RelayOutputModule Installation Instructions 1762-IN003A-US-P
Installation guide for the 1762-IF2OF2
Analog I/O Module 1762-IF2OF2 Analog Input/ Output Module Installation
Instructions
1762-IN005A-US-P
More information on proper wiring and
grounding techniques. Industrial Automation Wiring and Grounding Guidelines 1770-4.1

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Description
Item Description
1a upper panel mounting tab
1b lower panel mounting tab
2I/OdiagnosticLEDs
3 module door with
terminal identification
label
4 bus connector
with male pins
5 bus connector cover
6 flat ribbon cable with bus
connector (female pins)
7 terminal block
8 DIN rail latch
9 pull loop
1a
1b
2
6
8
1a
1b
5
2
3
9
4
6
7

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Installation
1762 I/O is suitable for use in an industrial environment when installed in
accordance with these instructions. Specifically, this equipment is intended for
use in clean, dry environments (Pollution degree 2(1)) and to circuits not
exceeding Over Voltage Category II(2) (IEC 60664-1).(3)
Prevent Electrostatic Discharge
Remove Power
(1) Pollution Degree 2 is an environment where, normally, only non-conductive pollution occurs except that
occasionally a temporary conductivity caused by condensation shall be expected.
(2) Over Voltage Category II is the load level section of the electrical distribution system. At this level transient
voltages are controlled and donot exceed the impulsevoltage capability of the product’s insulation.
(3) Pollution Degree 2 and OverVoltage Category II are International Electrotechnical Commission (IEC)
designations.
!ATTENTION: Electrostatic discharge can damage integrated
circuits or semiconductors if you touch bus connector pins.
Follow these guidelines when you handle the module:
•Touch a grounded object to discharge static potential.
•Wear an approved wrist-strap grounding device.
•Do not touch the bus connector or connector pins.
•Do not touch circuit components inside the module.
•If available, use a static-safe work station.
•When not in use, keep the module in its static-shield box.
!ATTENTION: Remove power before removing or installing
this module. When you remove or install a module with power
applied, an electrical arc may occur. An electrical arc can cause
personal injury or property damage by:
•sending an erroneous signal to your system’s field devices,
causing unintended machine motion
•causing an explosion in a hazardous environment
•causing permanent damage to the module’s circuitry
Electrical arcing causes excessive wear to contacts on both the
module and its mating connector. Worn contacts may create
electrical resistance.

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Mounting
Minimum Spacing
Maintain spacing from
enclosure walls,
wireways, adjacent
equipment, etc. Allow
50.8 mm (2 in.) of space
on all sides for adequate
ventilation, as shown:
!ATTENTION: Do not remove protective debris strip until after
the module and all other equipment near the module ismounted and
wiring is complete. Once wiring is complete and the module is free
of debris, carefully remove protective debris strip. Failure to
remove strip before operating can cause overheating.
Note: 1762 expansion I/O may be mounted horizontally only.
!ATTENTION: During panel or DIN rail mounting of all devices,
be sure that all debris (metal chips, wire strands, etc.) is kept from
falling into the module. Debris that falls into the module could
cause damage when power is applied to the module.
MicroLogix
1200
1762 I/O 1762 I/O 1762 I/O
Side Side
Top
Bottom

6MicroLogix™ 1762-IQ8 DC Input Module
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DIN Rail Mounting
The module can be mounted using the following DIN rails: 35 x 7.5 mm
(EN 50 022 - 35 x 7.5) or 35 x 15 mm (EN 50 022 - 35 x 15).
Before mounting the module on a DIN rail, close the DIN rail latch. Press the
DIN rail mounting area of the module against the DIN rail. The latch will
momentarily open and lock into place.
Use DIN rail end anchors (Allen-Bradley part number 1492-EA35 or
1492-EAH35) for vibration or shock environments.
Panel Mounting
Use the dimensional template shown below to mount the module. The preferred
mounting method is to use two M4 or #8 panhead screws per module. M3.5 or #6
panhead screws may also be used, but a washer may be needed to ensure a good
ground contact. Mounting screws are required on every module.
Note:
For environments with greater vibration and shock concerns, use the
panel mounting method described below, instead of DIN rail
mounting.
End Anchor
End Anchor
MicroLogix 1200MicroLogix 1200
ControllerController
MicroLogix 1200MicroLogix 1200
Expansion I/OExpansion I/O
MicroLogix 1200MicroLogix 1200
Expansion I/OExpansion I/O
MicroLogix 1200MicroLogix 1200
Expansion I/OExpansion I/O
90
(3.54)
100
(3.94)
40.4
(1.59)
40.4
(1.59)
14.5
(0.57)
For more than 2 modules: (number of modules - 1) x 40 mm (1.58 in.)
NOTE: All dimensions
are in mm (inches).
Hole spacing
tolerance: ±0.4 mm
(0.016 in.).

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System Assembly
The expansion I/O module is attached to the controller or another I/O module by
means of a flat ribbon cable after mounting as shown below.
Field Wiring Connections
Grounding the Module
This product is intended to be mounted to a well-grounded mounting surface
such as a metal panel. Additional grounding connections from the module’s
mounting tabs or DIN rail (if used) are not required unless the mounting surface
cannot be grounded. Refer to Industrial Automation Wiring and Grounding
Guidelines, Allen-Bradley publication 1770-4.1, for additional information.
Note: Use the pull loop on the connector to disconnect modules. Do not pull
on the ribbon cable.
!ATTENTION: EXPLOSION HAZARD
•In Class I, Division 2 applications, the bus connector must be
fully seated and the bus connector cover must be snapped in
place.
•In Class I, Division 2 applications, all modules must be mounted
in direct contact with each other as shown on page 6. If DIN rail
mounting is used, an end stop must be installed ahead of the
controller and after the last 1762 I/O module.

8MicroLogix™ 1762-IQ8 DC Input Module
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Input Wiring
Basic wiring(1) of input devices to the 1762-IQ8 is shown below.
A write-on label is provided with the module. Mark the identification of each
terminal with permanent ink, and slide the label back into the door.
(1) Sinking/Sourcing Inputs - Sourcing/sinking describes the current flow between the I/O module and the
field device. Sourcing I/O circuits supply (source) current to sinking field devices. Sinking I/O circuits are
driven by a current sourcing field device. Fielddevicesconnectedto the negative side (DC Common) of
the field power supply are sinking field devices. Field devices connected to the positive side (+V) of the
field supply are sourcing field devices.
!ATTENTION: Be careful when stripping wires. Wire fragments
that fall into a module could cause damage when power is applied.
Once wiring is complete, ensure the module is free of all metal
fragments.
!ATTENTION: Miswiring of the module to an AC power source
will damage the module.
IN 7
IN 5
IN 3
IN 1
DC
COM
IN 6
IN 4
IN 2
IN 0
24V dc
DC
COM
Commons are
connected internally.
+DC (sinking)
-DC (sourcing)
-DC (sinking)
+DC (sourcing)

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Wiring the Finger-Safe Terminal Block
When wiring the terminal block, keep the finger-safe cover in place.
1. Route the wire under the terminal pressure plate. You can use the stripped end
of the wire or a spade lug. The terminals will accept a 6.35 mm (0.25 in.)
spade lug.
2. Tighten the terminal screw making sure the pressure plate secures the wire.
Recommended torque when tightening terminal screws is 0.904 Nm
(8 in-lbs).
Wire Size and Terminal Screw Torque
Each terminal accepts up to two wires with the following restrictions:
Note:
If you need to remove the finger-safe cover, insert a screw driver into
one of the square wiring holes and gently pry the cover off. If you wire
the terminal block with the finger-safe cover removed, you will not be
able to put it back on the terminal block because the wires will be in the
way.
Wire Type Wire Size Terminal Screw Torque
Solid Cu-90°C (194°F) #14 to #22 AWG 0.904 Nm (8 in-lbs)
Stranded Cu-90°C (194°F) #16 to #22 AWG 0.904 Nm (8 in-lbs)
Note: Finger-safe cover not shown.

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I/O Memory Mapping
Input Data File
For each input module, the input data file contains the current state of the field
input points. Bit positions 0 through 7 correspond to input terminals 0 through 7.
r = read only, 0= always at a0 or OFF state
Addressing
The addressing scheme for 1762 Expansion I/O is shown below.
(1) I/O located on the controller (embedded I/O) is slot 0. I/O added to the controller (expansion I/O) begins
with slot 1.
Word
Bit Position
1514131211109876543210
000000000rrrrrrrr
I1:x.0/0
Input
Data File Slot Number (1) Word (always zero for this module)
Bit (0 - 7)
Bit Delimiter
Word Delimiter
Slot Delimiter

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Specifications
General Specifications
Specification Value
Dimensions 90 mm (height) x 87 mm (depth) x 40 mm (width)
height including mounting tabs is 110 mm
3.543 in. (height) x 3.425 in. (depth) x 1.575 in. (width)
height including mounting tabs is 4.33 in.
Approximate Shipping Weight
(with carton) 200 g (0.44 lbs.)
Storage Temperature -40°C to +85°C (-40°F to +185°F)
Operating Temperature 0°C to +55°C (-32°F to +131°F)
Operating Humidity 5% to 95% non-condensing
Operating Altitude 2000 meters (6561 feet)
Vibration Operating: 10 to 500 Hz, 5G, 0.030in. max. peak-to-peak
Shock Operating: 30G panel mounted
Agency Certification C-UL certified (under CSA C22.2 No. 142)
UL 508 listed
CEcompliant for all applicable directives
Hazardous Environment Class Class I, Division 2, Hazardous Location,Groups A, B, C, D
(UL 1604, C-UL under CSA C22.2 No. 213)
Noise Immunity NEMA standard ICS 2-230
Radiated and Conducted Emissions EN50081-2 Class A
Electrical /EMC: The module has passed testing at the following levels:
ESD Immunity (IEC1000-4-2) 4 kV contact, 8 kV air, 4 kV indirect
Radiated Immunity (IEC1000-4-3) 10 V/m, 80 to 1000 MHz, 80% amplitude modulation,
+900 MHz keyed carrier
Fast Transient Burst (IEC1000-4-4) 2 kV, 5 kHz
Surge Immunity (IEC1000-4-5) 2 kV common mode, 1 kV differential mode
Conducted Immunity (IEC1000-4-6) 10V, 0.15 to 80 MHz(1)
(1) Conducted Immunity frequency range may be 150 kHz to 30 MHz if the Radiated Immunity frequency
range is 30 MHz to 1000 MHz.

12 MicroLogix™ 1762-IQ8 DC Input Module
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Input Specifications
Specification 1762-IQ8
Voltage Category 24V dc (sink/source)(1)
(1) Sinking/Sourcing Inputs - Sourcing/sinking describes the current flow between the I/O module and the
field device. Sourcing I/O circuits supply (source) current to sinking field devices. Sinking I/O circuits are
driven by a current sourcing field device. Fielddevicesconnectedto the negative side (DC Common) of
the field power supply are sinking field devices. Field devices connected to the positive side (+V) of the
field supply are sourcing field devices.
Operating Voltage Range 10 to 30V dc at 30°C (86°F)
10 to 26.4V dc at 55°C (131°F)
Number of Inputs 8
Bus Current Draw (max.) 50 mA at 5V dc (0.25W)
Heat Dissipation (max.) 3.7 Total Watts
Signal Delay (max.) On Delay: 8.0 ms
Off Delay: 8.0 ms
Off-State Voltage (max.) 5V dc
Off-State Current (max.) 1.5 mA
On-State Voltage (min.) 10V dc
On-State Current 2.0 mA min. at 10V dc
8.0 mA nominal at 24V dc
12.0 mA max. at 30V dc
Inrush Current (max.) 250 mA
Nominal Impedance 3K Ω
IECInput Compatibility Type 1+
Power Supply Distance Rating 6
Isolated Groups Group 1: inputs 0 to 7 (internally connected commons)
Input Group to Backplane
Isolation Verified by one of the following dielectric tests: 1200V ac for 1 sec. or 1697V dc for 1 sec.
75V dc working voltage (IEC Class 2 reinforced insulation)
Vendor I.D. Code 1
Product Type Code 7
Product Code 96

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Hazardous Location Considerations
This equipment is suitable for use in Class I, Division 2, Groups A, B, C, D or
non-hazardous locations only. The following ATTENTION statement applies to
use in hazardous locations.
!ATTENTION: EXPLOSION HAZARD
•Substitution of components may impair suitability for Class I,
Division 2.
•Do not replace components or disconnect equipment unless
power has been switched off.
•Do not connect or disconnect components unless power has
been switched off.
•This product must be installed in an enclosure.
•In Class I, Division 2 applications, the bus connector must be
fully seated and the bus connector cover must be snapped in
place.
•In Class I, Division 2 applications, all modules must be
mounted in direct contact with each other as shown on page 6.
If DIN rail mounting is used, an end stop must be installed
ahead of the controller and after the last 1762 I/O module.

14 MicroLogix™ 1762-IQ8 DC Input Module
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Environnements dangereux
Cet équipement est conçu pour être utilisé dans des environnements de Classe I,
Division 2, Groupes A, B, C, D ou non dangereux. La mise en garde suivante
s’applique à une utilisation dans des environnements dangereux.
!ATTENTION: DANGER D’EXPLOSION
•La substitution de composants peut rendre cet équipement
impropre à une utilisation en environnement de Classe I,
Division 2.
•Ne pas remplacer de composants ou déconnecter l'équipement
sans s'être assuré que l'alimentation est coupée.
•Ne pas connecter ou déconnecter des composants sans s'être
assuré que l'alimentation est coupée.
•Ce produit doit être installé dans une armoire.
•Pour les applications de Classe I, Division 2, le connecteur de
bus doit être correctement installé et son couvercle enclenché.
•Pour les applications de Classe I, Division 2, tous les modules
doivent être installés en contact direct les uns avec les autres,
comme indiqué page 6. Si on utilise le montage sur rail DIN,
une butée doit être placée à l'avant de l'automate et après la
dernière unité d'E/S 1762.

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´H'*g!¶Ai¨
Publication 1762-IN004A-US-P September 1999 PN 40071-071-01(A)
© (1999) Rockwell International Corporation. Printed in the U.S.A.
MicroLogix is a trademark of Rockwell Automation.