Altos BrainSphere P330 F6 User manual

Altos
工作站/Workstaion
BrainSphere P330 F6
Altos P330 F6
P330 F6
User Manual
Revision 1.2

System setup
System notes
Thank you for purchasing your Altos Workstation. This user guide is intended as a reference for
experienced Workstation technicians and helps detail many of the features available in Altos
Workstations. For more detailed information about any particular component or software solution, you
may consult the technical specifications or the user manual for that application.
Note: Before opening or removing any components
please contact your local certified Altos service
representative
Warning: Any parts or components damaged
during replacement by a non-certified technician
are not covered by the warranty. For details,
please consult the warranty guide from your system.
Notice：
Rated Electrical Specifications:
⚫1200W Power Supply: 100-240V~, 12.5A-8A, 50-60Hz
Power Supply Spec
Model: PWS-1K26P-PQ, 1200W multi-output module, 80Plus Platinum level
Input:100-240Vac, 12.5-8A, 50-60HZ; 200-240Vac, 8A, 50-60Hz(Only for China);
Input:100-114.9Vac
Output:+3.3Vdc/20A,+5Vdc/20A, +12Vdc/83A,-12Vdc/0.3A,+5Vsb/3A, Max:1000W;
Input:114.9-240Vac
Output:+3.3Vdc/20A, +5Vdc/20A,+12Vdc/99A,-12Vdc/0.3A,+5Vsb/3A, Max:1200W;
+3.3Vdc,+5Vdc Max:120W, 50℃, 5000m Class I

System component identification
Overview:
Operating Environment
Operating Temperature: 10º to 40º C (50º to 95º F)
Non-operating Temperature: -40º to 60º C (-40º to 140ºF)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
System Overview
Processor Support
Supports a single Intel Xeon W-2400 (64L) series processor in Socket E1 LGA4677, with up to 24 CPU
cores and a thermal design power (TDP) of up to 225W.
Chipset
Intel PCH W790
Memory
Supports up to 512GB of ECC RDIMM and 2TB of 3DS RDIMM with speeds of up to 4800MT/s (1DPC) and
4400MT/s (2DPC) in eight ECC DDR5 (288-pin) SMD DIMM
slots
Note: Memory speed and capacity support depends on the processors used in the system.
Storage Support
Four fixed 3.5”or four 2.5" internal drive bays
Two 5.25” external peripheral bays (support DVD or mobile rack for additional drives) Two M.2 PCIe 5.0
x4 M-key 22110/2280 (PCIe 5.0 x4 via CPU)
Expansion Slots
Three PCIe Gen5 x16 slots One PCIe Gen4 x4
slot
Networking
Intel i210AT for one 1Gb Ethernet LAN port (shared IPMI port) Aquantia AQC113 for
one 10Gb Ethernet LAN port
I/O Ports
Front:
One power button, one Audio In, one MIC-in, two USB3.2 Gen1 Type A, one USB3.2 Gen2 Type C
Rear:
One 1Gb LAN (Intel i210AT), one 10Gb LAN (RJ45, AQC113C), one USB4.0 (40Gb)
Type C (optional), one USB3.2 Gen2 x2 (20Gb) Type C, four USB3.2 Gen2 x1 (10Gb) Type A, 7.1 HD Audio
Channel connector (Realtek ALC888S), one VGA, one COM port
System Cooling
One 12-cm rear fan One 12-cm
front fan
One active CPU heatsink (optional)
Power
One PS2 1200W Multi-output 80Plus Platinum Level power supply
Form Factor
Mid-Tower (WxHxD) 7.6 x 16.7 x 21.2 in. (193 x 424 x 536 mm)

System Front View:

System Rear View:
System Side View:

Rear I/O
Rear I/O Ports
#
Description
#
Description
#
Description
#
Description
1
COM1 Port
6
LAN2 (10GbE)
11
Surround Out
2
VGA Port (IPMI only)
7
USB4 (3.2 Gen. 2)
12
S/PDIF Out
3
LAN1 (1GbE)
8
USB5 (3.2 Gen. 2)
13
Line In
16
UID Switch / BMC Reset
Button
4
USB6 (3.2 Gen. 2)
9
USB8 (3.2 Gen. 2x2)
14
Line Out
5
USB7 (3.2 Gen. 2)
10
Center/LFE Out
15
Mic In

Specification introduction:
CPU
Single Intel® Xeon® Sapphire Rapids W-2400 Processor (LGA4677), up to 24Core /
225W TDP
Chipset
Intel® W790
RAID
SATA RAID 0,1,5,10 (Windows OS only)
PCIe RAID 0, 1(Option VROC)
Memory
•8 DIMMs, 4-Channel, ECC RDIMM up to 2TB , DDR5 up to 4800 MHz
PCIe Expansion
4 PCI-E Slots
•3x PCI-E 5.0 x16 slots
•1x PCI-E 4.0 x4 slot
M.2
•2 x M.2 2280/22110 slot (M key, PCIe 5.0 x4)
Network
•2x LAN ports (1Gb with Intel i210AT share with IPMI & 10Gb with AQC113C)
BMC
•AST 2600
Media/Storage
bays
•[External bays] 2x 5.25“ ODD bay
•[Internal bays] 4x 3.5”, 4x2.5”(Optional)
I/O Ports
Front I/O
1x USB3.2 Gen 2x1 Type C, 2x USB3.2 Gen1 Type-A, 2x Audio jacks (Line-out/Mic-In)
Rear I/O
2x RJ45(10GB/1GB), 4x USB 3.2 Gen2x1, 1x USB3.2 Gen2x2(Type C), 1x VGA, 1x COM,
HD Audio 7.1 channel connector via Realtek ALC888S5-port Audio jacks (7.1 HD
Audio)+1x SPDIF port
Audio
•7.1 CH HD Audio (Realtek ALC888S-VD)
GPU Support
•Maximum RTX A6000/ RTX 4080
Power supply
•1200 80PLUS® Platinum PSU
Compliance
•CE, FCC, CB, BSMI
OS Support
Microsoft® Windows 11 Pro, Red Hat 8.6/9.0, Ubuntu 20.04/22.04

Motherboard Layout
Jumper
Description
Default Setting
JBT1
Clear CMOS (Onboard)
Contact Pads to Clear CMOS
JCMOS
Clear CMOS (Onboard)
Pins 1-2 (Normal)
JPAC1
HD Audio Enable / Disable
Pins 1-2 (Enabled)
JPL1, JPL2
LAN1/LAN2 Enable / Disable
Pins 1-2 (Enabled)
JPME2
Intel Manufacturing Mode
Pins 1-2 (Normal)
JPUSB1
USB6/7 Standby Power
Pins 1-2 (Enabled)
JWD1
Watch Dog Function Enable
Pins 1-2 (Reset)
LED
Description
Color/State
BMC_LED
BMC Heartbeat LED
Blinking Green: BMC Normal
LED8
Status Code LED
Digital Readout
M.2-C01/M.2-C02 LED
M.2 LEDs for M.2-C01 / M.2-C02
Blinking Green: Device Working
Power LED
Onboard Power LED
Solid Green: Power On
UID-LED
Unit Identifier (UID) LED
Blue On: Unit Udentified

System Block Diagram:

Maintenance and Component Installation
This chapter provides instructions on installing and replacing main system components. To prevent
compatibility issues, only use components that match the specifications and/or part numbers given.
Installation or replacement of most components require that power first be removed from the
system. Please follow the procedures given in each section.
Removing Power
Use the following procedure to ensure that power has been removed from the system.
1. Use the operating system to power down the system.
2. After the system has completely shut down, disconnect the AC power cord from the power
strip or outlet.
3. Disconnect the power cord from the power supply unit.

Accessing the System
The Chassis has removable side covers for interior access.
Caution: Except for short periods of time, do not operate the system without the cover in
place. The chassis covers must be in place to allow proper airflow and prevent overheating.
Removing the Side Cover
i. Begin by removing power from the system, follow instructions in Section 3.1.
ii. Remove the two screws securing the left side cover to the chassis.
iii. Slide the left cover toward the rear of the chassis.
iv. Lift the left cover from the chassis.
v. Remove the three screws securing the right side cover to the chassis.
vi. Slide the right cover toward the rear of the chassis
vii. Lift the right cover from the chassis.

Processor and Heatsink Installation
The processor (CPU) and processor carrier should be assembled together first to form the
processor carrier assembly. This will be attached to the heatsink to form the processor heatsink
module (PHM) before being installed into the CPU socket. Before installation, be sure to perform the
following steps below:
•Please carefully follow the instructions given on the previous page to avoid ESD-related damages.
•Shut down the system and then unplug the AC power cord from all power supplies.
•Check that the plastic protective cover is on the CPU socket and none of the socket pins are bent.
If they are, contact your retailer.
•When handling the processor, avoid touching or placing direct pressure on the LGA lands (gold
contacts). Improper installation or socket misalignment can cause serious damage to the
processor or CPU socket, which may require manufacturer repairs.
•Thermal grease is pre-applied on a new heatsink. No additional thermal grease is needed.
•All graphics in this manual are for illustrations only. Your components may look different.
The 4th Gen. Intel Xeon W Processor
Intel Xeon W-2400 series CPU
(64L, MCC)

Overview of the Processor Carrier Assembly
The processor carrier assembly contains the Intel Xeon processor and a processor carrier.
4. Intel Xeon Processor
Intel Xeon W-2400 series CPU
(64L, MCC)
5. Processor Carrier
Carrier E1B (P/N: SKT-1424L-001B-LTS) For
MCC CPU
6. CPU Carrier Assembly (with CPU Seated inside the Carrier)
Carrier E1A with Intel Xeon W-2400 series CPU

Overview of the CPU Socket
The CPU socket is protected by a plastic protective cover.
1. Plastic Protective Cover
2. CPU Socket

Overview of the Processor Heatsink Module
The Processor Heatsink Module (PHM) contains a heatsink, a processor carrier, and the Intel
Xeon processor.
1. Heatsink with Thermal Grease
2. Processor Carrier
3. Intel Xeon Processor
4. Processor Heatsink Module (PHM)
Bottom View

Creating the Processor Carrier Assembly
To install a processor into the processor carrier, follow the steps below:
1. Before installation, make sure the lever on the processor carrier is pressed down as shown
below.
2. Hold the processor with the LGA lands (gold contacts) facing up. Locate the small, gold triangle
in the corner of the processor and the corresponding hollowed triangle on the processor carrier.
These triangles indicate pin 1. See the images below.
3. Use the triangles as a guide to carefully align and place one end of the processor into the
latch marked A, and place the other end of processor into the latch marked B as shown below.
4. Examine all corners to ensure that the processor is firmly attached to the carrier.
Make sure the lever is pressed down before
installing the processor.
Processor Carrier Assembly

Assembling the Processor Heatsink Module
After creating the processor carrier assembly for
the processor, mount it onto the heatsink to
create the processor heatsink module (PHM):
1. Turn the heatsink over. If this is a new
heatsink, the thermal grease has been pre-
applied. Otherwise, apply the proper
amount of thermal grease.
2. Hold the processor carrier assembly so the
processor's gold contacts are facing up.
3. Align the corner marked "a" on the
processor carrier assembly with the corner
of the heatsink marked "A", and align the
corners marked "b", "c", "d" on processor
assembly against the corners marked "B",
"C", "D" on the heatsink.
4. Press the processor carrier assembly down
until it snaps into place. The plastic clips of
the processor carrier assembly will lock at
the four corners.
5. Examine all corners to ensure that the
plastic clips on the processor carrier
assembly are firmly attached to the
heatsink.
Check each corner to ensure that the processor carrier is
firmly attached to the heatsink.
Processor Carrier Assembly
(Upside Down)
Pin 1
Thermal
grease

Preparing the CPU Socket for Installation
This motherboard comes with a plastic protective cover installed on the CPU socket. Remove it from
the socket to install the Processor Heatsink Module (PHM). Gently pull up one corner of the plastic
protective cover to remove it.
CPU Socket with Plastic Protective Cover
Remove the plastic protective
cover from the CPU socket.
Do not touch or bend
the socket pins.
Socket Pins

Installing the Processor Heatsink Module
After assembling the Processor Heatsink Module (PHM), install it onto the CPU socket:
1. Align pin 1 of the PHM with the printed triangle on the CPU socket. See the left image below.
2. Make sure all four holes of the heatsink are aligned with the socket, then gently place the
heatsink on top of the CPU socket.
3. Press all four rotating wires outwards and make sure that the heatsink is securely latched
into the CPU socket.
4. With a T30 Torx-bit screwdriver, gradually tighten the four screws to ensure even pressure. You
can start with any screw, but make sure to tighten the screws in a diagonal pattern. To avoid
damaging the processor or socket, do not use a force greater than 8 in-lbf when tightening the
screws.
5. Examine all corners to ensure that the PHM is firmly attached to the socke
T30 Torx Screwdriver
Use a torque
of 8 in-lbf
Printed
Triangle
Mount the Processor Heatsink Module onto
the CPU socket (on the motherboard).
Press the rotating wires outwards to latch the
PHM and then tighten the four screws.