System component identification
Overview:
Operating Environment
Operating Temperature: 10º to 40º C (50º to 95º F)
Non-operating Temperature: -40º to 60º C (-40º to 140ºF)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
Supports a single Intel Xeon W-2400 (64L) series processor in Socket E1 LGA4677, with up to 24 CPU
cores and a thermal design power (TDP) of up to 225W.
Supports up to 512GB of ECC RDIMM and 2TB of 3DS RDIMM with speeds of up to 4800MT/s (1DPC) and
4400MT/s (2DPC) in eight ECC DDR5 (288-pin) SMD DIMM
slots
Note: Memory speed and capacity support depends on the processors used in the system.
Four fixed 3.5”or four 2.5" internal drive bays
Two 5.25” external peripheral bays (support DVD or mobile rack for additional drives) Two M.2 PCIe 5.0
x4 M-key 22110/2280 (PCIe 5.0 x4 via CPU)
Three PCIe Gen5 x16 slots One PCIe Gen4 x4
slot
Intel i210AT for one 1Gb Ethernet LAN port (shared IPMI port) Aquantia AQC113 for
one 10Gb Ethernet LAN port
Front:
One power button, one Audio In, one MIC-in, two USB3.2 Gen1 Type A, one USB3.2 Gen2 Type C
Rear:
One 1Gb LAN (Intel i210AT), one 10Gb LAN (RJ45, AQC113C), one USB4.0 (40Gb)
Type C (optional), one USB3.2 Gen2 x2 (20Gb) Type C, four USB3.2 Gen2 x1 (10Gb) Type A, 7.1 HD Audio
Channel connector (Realtek ALC888S), one VGA, one COM port
One 12-cm rear fan One 12-cm
front fan
One active CPU heatsink (optional)
One PS2 1200W Multi-output 80Plus Platinum Level power supply
Mid-Tower (WxHxD) 7.6 x 16.7 x 21.2 in. (193 x 424 x 536 mm)
