Ankom RF Manual

Service Procedure013
Revised 07/15/2014
ANKOM Technology • 2052 O’Neil Road • email: service @ankom.com• Phone: [phone] • Fax: [phone] page 1 of 4
Chip and Board Replacement
RF
This Service Procedure helps facilitate the easily replacement of a circuit board and/or chip in an RF1 or RF5 module
when the circuit board or chip is suspect or failing.
1.
To replace the circuit board and/or RF chip, you should have received a
replacement circuit board, part #7007, and/or a RF chip part #7013.
Reference Figure 1.
Figure 1
2.
Open the RF1 or RF5 module by removing the red lid, followed by the
removal of the battery to allow for easy access to the other components.
To remove the circuit board or the circuit board and chip, continue onto
step 3. To remove the chip, skip to step 9.
Figure 2
3.
As depicted in Figure 3, remove the temperature sensor from the circuit
board. Note: if your module is not equipped with a temperature sensor,
skip this step.
Figure 3
4.
Disconnect the three-wire pressure sensor connector from the circuit board
as shown in Figure 4.
Figure 4
7013
7007

Service Procedure013
Revised 07/15/2014
ANKOM Technology • 2052 O’Neil Road • email: service @ankom.com• Phone: [phone] • Fax: [phone] page 2 of 4
5.
For RF1 Modules disconnect the two-wire solenoid connector from the
circuit board. Note: RF5 Zero modules will not have this connector, so this
step may be skipped if the circuit board and chip are being replaced on an
RF5 Zero module. Refer to Figure 5.
Figure 5
6.
With all the connectors removed from the circuit board remove the two
screws holding the circuit board in the housing, as shown in Figure 6.
Figure 6
7.
As depicted in Figure 7, remove the old circuit board and chip and install
the replacement components.
Figure 7
8.
Repeat steps 6 through 3, in reverse order, screwing the circuit board back
in place, reconnecting the two-wire solenoid connector, the three-wire
pressure sensor connector and the temperature sensor. Set the battery
back in place, but do not plug in until ready for use. Reassembled module
should appear as shown in Figure 8. Module is now ready to be tested per
Service Procedure 171 (SP-171) which can be found at:
http://www.ankom.com/service-procedures-rf.aspx.
Figure 8

Service Procedure013
Revised 07/15/2014
ANKOM Technology • 2052 O’Neil Road • email: service @ankom.com• Phone: [phone] • Fax: [phone] page 3 of 4
9.
As depicted in Figure 9, lift gently on the underside of the front edge of the
chip near the antenna until the front edge lifts slightly from the circuit
board.
Figure 9
10.
Lift gently on the bottom left corner of the chip until the corner lifts
slightly from the circuit board.
Figure 10
11.
At this point, the chip should be dislodged enough from the circuit board
that you should be able to lift the chip from the circuit board by lifting
gently on the antenna. If the chip is still snug in the circuit board, repeat
steps 9 and 10, and try lifting up on other sides of the chip. Note: Pulling
too hard may break the antenna from the chip.
Figure 11
12.
Insert new chip on circuit board so both rows of pins on the back of the
chip connect into the outer rows of holes in the two rows of black sockets
on the circuit board. Be sure that each pin has a hole to mate with, and
that the bottom edge of the board is nearly flush with the white
Temperature Sensor connector. Press firmly on top of both rows of pins as
shown in Figure 12 to make sure the chip seats in the circuit board
properly.
Figure 12

Service Procedure013
Revised 07/15/2014
ANKOM Technology • 2052 O’Neil Road • email: service @ankom.com• Phone: [phone] • Fax: [phone] page 4 of 4
13.
Reassembled module should appear as shown in Figure 13. Module is now
ready to be tested per Service Procedure 171 (SP-171) which can be found
at: http://www.ankom.com/service-procedures-rf.aspx.
Figure 13