Asus AAEON GENE-EHL5 User manual

Last Updated: May 26, 2022
GENE-EHL5
3.5”Subcompact Board
User’s Manual 2nd Ed

Preface II
3.5
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Subcompact Board GENE-EHL5
Copyright Notice
This document is copyrighted, 2022. All rights are reserved. The original manufacturer
reserves the right to make improvements to the products described in this manual at
any time without notice.
No part of this manual may be reproduced, copied, translated, or transmitted in any
form or by any means without the prior written permission of the original
manufacturer. Information provided in this manual is intended to be accurate and
reliable. However, the original manufacturer assumes no responsibility for its use, or for
any infringements upon the rights of third parties that may result from its use.
The material in this document is for product information only and is subject to change
without notice. While reasonable efforts have been made in the preparation of this
document to assure its accuracy, AAEON assumes no liabilities resulting from errors or
omissions in this document, or from the use of the information contained herein.
AAEON reserves the right to make changes in the product design without notice to its
users.

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Acknowledgement
All other products’ name or trademarks are properties of their respective owners.
⚫Microsoft Windows is a registered trademark of Microsoft Corp.
⚫Intel, Pentium, and Celeron are registered trademarks of Intel Corporation
⚫Intel Core is a registered trademark of Intel Corporation
⚫ITE is a trademark of Integrated Technology Express, Inc.
⚫IBM, PC/AT, PS/2, and VGA are trademarks of International Business Machines
Corporation.
All other product names or trademarks are properties of their respective owners.

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Packing List
Before setting up your product, please make sure the following items have been
shipped:
Item
Quantity
GENE-EHL5
1
M16BT07020 (Heatsink)
1
If any of these items are missing or damaged, please contact your distributor or sales
representative immediately.

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About this Document
This User’s Manual contains all the essential information, such as detailed descriptions
and explanations on the product’s hardware and software features (if any), its
specifications, dimensions, jumper/connector settings/definitions, and driver installation
instructions (if any), to facilitate users in setting up their product.
Users may refer to the product page at AAEON.com for the latest version of this
document.

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Safety Precautions
Please read the following safety instructions carefully. It is advised that you keep this
manual for future references
1. All cautions and warnings on the device should be noted.
2. Make sure the power source matches the power rating of the device.
3. Position the power cord so that people cannot step on it. Do not place anything
over the power cord.
4. Always completely disconnect the power before working on the system’s
hardware.
5. No connections should be made when the system is powered as a sudden rush
of power may damage sensitive electronic components.
6. If the device is not to be used for a long time, disconnect it from the power
supply to avoid damage by transient over-voltage.
7. Always disconnect this device from any AC supply before cleaning.
8. While cleaning, use a damp cloth instead of liquid or spray detergents.
9. Make sure the device is installed near a power outlet and is easily accessible.
10. Keep this device away from humidity.
11. Place the device on a solid surface during installation to prevent falls
12. Do not cover the openings on the device to ensure optimal heat dissipation.
13. Watch out for high temperatures when the system is running.
14. Do not touch the heat sink or heat spreader when the system is running
15. Never pour any liquid into the openings. This could cause fire or electric shock.
16. As most electronic components are sensitive to static electrical charge, be sure to
ground yourself to prevent static charge when installing the internal components.
Use a grounding wrist strap and contain all electronic components in any
static-shielded containers.

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17. If any of the following situations arises, please the contact our service personnel:
i. Damaged power cord or plug
ii. Liquid intrusion to the device
iii. Exposure to moisture
iv. Device is not working as expected or in a manner as described in
this manual
v. The device is dropped or damaged
vi. Any obvious signs of damage displayed on the device
18. DO NOT LEAVE THIS DEVICE IN AN UNCONTROLLED ENVIRONMENT WITH
TEMPERATURES BEYOND THE DEVICE’S PERMITTED STORAGE TEMPERATURES
(SEE CHAPTER 1) TO PREVENT DAMAGE.

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FCC Statement
This device complies with Part 15 FCC Rules. Operation is
subject to the following two conditions: (1) this device may not
cause harmful interference, and (2) this device must accept any
interference received including interference that may cause
undesired operation.
Caution:
There is a danger of explosion if the battery is incorrectly replaced. Replace only with the
same or equivalent type recommended by the manufacturer. Dispose of used batteries
according to the manufacturer’s instructions and your local government’s recycling or
disposal directives.
Attention:
Il y a un risque d’explosion si la batterie est remplacée de façon incorrecte.
Ne la remplacer qu’avec le même modèle ou équivalent recommandé par le constructeur.
Recycler les batteries usées en accord avec les instructions du fabricant et les directives
gouvernementales de recyclage.

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China RoHS Requirements (CN)
产品中有毒有害物质或元素名称及含量
AAEON Main Board/ Daughter Board/ Backplane
部件名称
有毒有害物质或元素
铅
(Pb)
汞
(Hg)
镉
(Cd)
六价铬
(Cr(VI))
多溴联苯
(PBB)
多溴二苯醚
(PBDE)
印刷电路板
及其电子组件
○
○
○
○
○
○
外部信号
连接器及线材
○
○
○
○
○
○
O：表示该有毒有害物质在该部件所有均质材料中的含量均在
SJ/T 11363-2006 标准规定的限量要求以下。
X：表示该有毒有害物质至少在该部件的某一均质材料中的含量超出
SJ/T 11363-2006 标准规定的限量要求。
备注：此产品所标示之环保使用期限，系指在一般正常使用状况下。

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China RoHS Requirement (EN)
Poisonous or Hazardous Substances or Elements in Products
AAEON Main Board/ Daughter Board/ Backplane
Component
Poisonous or Hazardous Substances or Elements
Lead
(Pb)
Mercury
(Hg)
Cadmium
(Cd)
Hexavalent
Chromium
(Cr(VI))
Polybrominated
Biphenyls
(PBB)
Polybrominated
Diphenyl Ethers
(PBDE)
PCB & Other
Components
O
O
O
O
O
○
Wires &
Connectors
for External
Connections
O
O
O
O
O
O
O：The quantity of poisonous or hazardous substances or elements found in each of the
component's parts is below the SJ/T 11363-2006-stipulated requirement.
X: The quantity of poisonous or hazardous substances or elements found in at least one of the
component's parts is beyond the SJ/T 11363-2006-stipulated requirement.
Note: The Environment Friendly Use Period as labeled on this product is applicable under normal
usage only

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Table of Contents
Chapter 1 - Product Specifications.......................................................................................... 1
1.1 Specifications............................................................................................................2
1.2 Block Diagram..........................................................................................................6
Chapter 2 –Hardware Information ........................................................................................7
2.1 Dimensions ...............................................................................................................8
2.2 Jumpers and Connectors......................................................................................10
2.3 List of Jumpers ........................................................................................................12
2.3.1 Clear CMOS Jumper (JP1) ...........................................................................12
2.3.2 Touch Screen 4, 5, 8 Wire Selection (JP2)................................................12
2.3.3 LVDS Port Backlight Inverter VCC Selection (JP3)..................................13
2.3.4 LVDS Port Operating VDD Selection (JP4) ..............................................13
2.3.5 LVDS Port Backlight Lightness Control Mode Selection (JP5) .............13
2.3.6Auto Power Button Enable/Disable Selection (JP6) ...............................13
2.3.7 COM2 Pin8 Function Selection (JP8) ........................................................14
2.3.8 COM3 Pin8 Function Selection (JP9) ........................................................14
2.3.9 SMBUS/I2C Connector (JP11)......................................................................14
2.4 List of Connectors...................................................................................................15
2.4.1 Battery (CN1)..................................................................................................17
2.4.2 Touch Screen Connector (CN2) .................................................................17
2.4.3 Audio I/O Port (CN3) ...................................................................................19
2.4.4 Amplifier R-channel output (CN4) ...........................................................20
2.4.5 Amplifier L-channel output (CN5)............................................................20
2.4.6 M.2 Slot (B-Key 3052) (CN6)......................................................................20
2.4.7 Nano SIM Card Socket (CN7)....................................................................24
2.4.8 M.2 Slot (B-Key 2242) (CN8)......................................................................24
2.4.9 LVDS/eDP Port Inverter / Backlight Connector (CN9) .........................28

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2.4.10 LVDS/eDP Port (CN10) ................................................................................28
2.4.11 HDMI (CN11)..................................................................................................30
2.4.12 DP Port (CN13) ..............................................................................................31
2.4.13 LAN (RJ-45) Port1 (CN14) ...........................................................................33
2.4.14 LAN (RJ-45) Port2 (CN15)...........................................................................34
2.4.15 SATA Port (CN16)..........................................................................................34
2.4.16 +5V Output for SATA HDD (CN17)...........................................................35
2.4.17 Digital IO Port (CN18)..................................................................................35
2.4.18 Digital IO Port (CN19)..................................................................................36
2.4.19 USB 3.1 Ports (CN20)...................................................................................37
2.4.20 USB 2.0 Port (CN21).....................................................................................38
2.4.21 USB 2.0 Port (CN22)....................................................................................38
2.4.22 M.2 Slot (B-Key 2280) (CN25) ...................................................................39
2.4.23 M.2 Slot (E-Key 2230) (CN26)....................................................................42
2.4.24 COM Port 1~4 (CN27).................................................................................45
2.4.25 eSPI Debug Port (CN32).............................................................................47
2.4.26 CPU FAN (CN33) ..........................................................................................48
2.4.27 External Power Input (CN34) .....................................................................48
2.4.28 External Power Input (CN35) .....................................................................48
2.4.29 Front Panel Connector (CN36)..................................................................49
2.4.30 PSE Connector (CN37)................................................................................49
2.4.31 CAN BUS (CN38)..........................................................................................50
2.4.32 VGA Port (CN39)...........................................................................................51
2.4.33 External +5VSB Input (CN40)....................................................................52
2.4.34 LAN1 SDP Connector (CN43)....................................................................52
2.4.35 LAN2 SDP Connector (CN44)...................................................................53
2.4.36 DDR4 SO-DIMM (DIMM1)..........................................................................53
2.5 Thermal Solution ...................................................................................................54

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2.6 Electrical Specifications for I/O Port ..................................................................56
Chapter 3 - AMI BIOS Setup ................................................................................................ 57
3.1 System Test and Initialization ..............................................................................58
3.2 AMI BIOS Setup .....................................................................................................59
3.3 Setup Submenu: Main..........................................................................................60
3.4 Setup Submenu: Advanced..................................................................................61
3.4.1 CPU Configuration.......................................................................................62
3.4.2 PCH-FW Configuration...............................................................................63
3.4.2.1 Firmware Update Configuration....................................................64
3.4.3 Trusted Computing......................................................................................65
3.4.4 SATA Configuration......................................................................................68
3.4.5 Hardware Monitor .......................................................................................69
3.4.5.1 Smart Fan Mode Configuration.....................................................70
3.4.6 SIO Configuration........................................................................................72
3.4.6.1 Serial Port Configuration.................................................................73
3.4.7 Serial Port Console Redirection ................................................................74
3.4.8 SCS Configuration........................................................................................75
3.4.9 Power Management....................................................................................76
3.4.10 Digital IO Port Configuration.....................................................................77
3.5 Setup Submenu: Chipset .....................................................................................78
3.5.1 System Agent (SA) Configuration.............................................................79
3.5.1.1 Memory Configuration....................................................................80
3.5.1.2 LVDS Panel Configuration ................................................................81
3.6 Setup Submenu: Security.....................................................................................83
3.6.1 Secure Boot...................................................................................................84
3.6.1.1 Key Management..............................................................................85
3.7 Setup Submenu: Boot ..........................................................................................88
3.7.1 BBS Priorities.................................................................................................89

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3.8 Setup Submenu: Save & Exit...............................................................................90
Chapter 4 –Driver Installation ..............................................................................................91
4.1 Driver Download/Installation ..............................................................................92
Appendix A - I/O Information.............................................................................................. 94
A.1 I/O Address Map ...................................................................................................95
A.2 Memory Address Map .........................................................................................97
A.3 IRQ Mapping Chart...............................................................................................98
A.4 DMA Channel Assignments .............................................................................. 100
Appendix B –Mating Connectors and Cables...................................................................101
B.1 Mating Connectors and Cables........................................................................ 102

3.5
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Chapter 1
Chapter 1 - Product Specifications

Chapter 1 –Product Specifications 2
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1.1 Specifications
System
FORM FACTOR
3.5" SubCompact Board
CPU
Intel® Atom™ x6000E series, Intel® Pentium®,
and Celeron® N and J series processors
Intel® Atom™ x6425RE (4C/4T, 1.90GHz)
Intel® Atom™ x6425E (4C/4C, 2.00GHz, up to
3.00GHz)
Intel® Atom™ x6211E (2C/2T, 1.30GHz, up to
3.00GHz)
Intel® Pentium® J6426 (4C/4T, 2.00GHz, up to
3.00GHz)
Intel® Celeron® J6412 (4C/4T, 2.00GHz, up to
2.6GHz)
Intel® Celeron® N6210 (2C/2T, 1.20GHz, up to
2.6GHz)
(Intel® Atom™ x6427FE/x6200FE/x6212RE/
x6414RE/x6413E/N6415 by customer's request)
CPU TDP
6W：x6212RE/x6211E。6.5W：N6210
10W：J6426/J6412。12W：x6425RE/x6425E
CHIPSET
Integrated with Intel® SoC
MEMORY TYPE
DDR4 3200 Hz, SODIMM x 1, Up to 32GB, Support
IBECC (select SKUs)
BIOS
UEFI
WAKE ON LAN
Yes
WATCHDOG TIMER
255 Levels
SECURITY
TPM2.0

Chapter 1 –Product Specifications 3
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System
RTC Battery
Lithium Battery 3V/240mAh
DIMENSION (L X W)
5.75" x 4" (146mm x 101.7mm)
Power
POWER REQUIREMENT
+9-36V (Optional: +12V)
POWER SUPPLY TYPE
AT/ATX
CONNECTOR
Phoenix 2-pin Connector
POWER CONSUMPTION
TYPICAL:
Intel Atom™x6425E, DDR4 32GB, 3.26A @ +12V
MAX:
Intel Atom™x6425E, DDR4 32GB, 3.42A @ +12V
Display
CONTROLLER
Intel® UHD Graphics 10th Gen
LVDS/eDP
LVDS Dual Channel 18/24bit x 1
(Optional eDP 1.3 up to Full-HD)
Display Interface
HDMI 2.0b x 1, 4K @ 60Hz
DP1.4 x 1, 4K x 2K 60Hz (Optional: VGA x 1)
Multiple Display
3 Simultaneous Displays
Audio
CODEC
REALTEK ALC269
AUDIO INTERFACE
Line-in/Line-out/MIC
Speaker
2W Speaker
External I/O
ETHERNET
Intel® i210, 10/100/1000Base x 2

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External I/O
USB
USB3.2 Gen 2 x 2
SERIAL PORT
━
VIDEO
HDMI 2.0b x 1,DP1.4 x 1 (Optional VGA x 1)
Internal I/O
USB
USB2.0 x 4
SERIAL PORT
RS-232/422/485 x 4
VIDEO
LVDS/eDP x 1
SATA
SATA3.0 x 1,+5V SATA Power Connector x 1
AUDIO
Audio Header x 1
DIO/GPIO
16 Bits (8 In/8 Out)
SMBus/I2C
SMBus/I2C x1 (Default: SMBus)
Touch
4/5/8-wire Touch Controller x 1 (optional)
FAN
4 wire Smart Fan x 1
SIM
Nano SIM x 1
Front Panel
HDD LED, PWR LED, Power Button, Buzzer, Reset
Others
eMMC 5.1 32GB
CANBUS x 2, TX/RX (Celeron J6412 and Celeron
N6210 don’t support CANBUS)
Expansion
Mini PCI-E/mSATA
━
M.2
E-Key 2230 x 1 (PCIe, USB2.0)
B-Key 2242 x 1 (PCIe x2/PCIe/SATA x 1, USB2.0)
Default: PCIe x2, PCIe x 1 select by BIOS, SATA
select by BOM
B-Key 2280 x 1 (PCIe x1/PCIe x 2, USB2.0)

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Expansion
Default: PCIe x1, PCIe x 2 select by BIOS
B-Key 3052 x 1 (USB3.2 Gen2)
Others
━
Environment
OPERATING TEMPERATURE
32°F ~ 140°F (0°C ~ 60°C)
STORAGE TEMPERATURE
-40°F ~ 176°F (-40°C ~ 80°C)
OPERATING HUMIDITY
0% ~ 90% relative humidity, non-condensing
MTBF (HOURS)
335,427
EMC
CE/FCC Class A

Chapter 1 –Product Specifications 6
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1.2 Block Diagram